aerospace product line - escies
TRANSCRIPT
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MCM and MCGA625 status
AEROSPACE Product LineDominique de Saint RomanMicrocontroller Business UnitAerospace Marketing ManagerTel: +33 2 4018 1802Mobile: +33 6 8037 [email protected]
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Content
� MCMØ Rationales
Ø MCM SRAM status
Ø MCM industrial capability
Ø MCM spin off products
� MCGA625 contract status
� Packaging roadmap
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MCM
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Rationales for going MCM
� DSM technologies are more and more expensive making the ROI in space more questionable
� MCM allows:Ø Either to mix various technologies and/or functionalities
Ø To bridge the time gap between the availability of the next technology products
Ø To test the market for the next generation of products
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AT68166F/FT MCM SRAM description
� MQFPF_T68 package, 4 of 512Kx8 SRAM AT60142F/FT
� 1 sided cavity Kyocera package
� Same die bonding as all other products (Cyanat Ester) in one pass
� Same wire bonding (32µm Al wire) in one pass
� Same sealing process: 1 Kovar lid with Au.Sn. (80/20) pre-form
� Samples delivered
� FM with Atmel qualification July 06
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MCM SRAM: cavity layout
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MCM SRAM: bonding diagram
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MCM SRAM: raw material
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MCM with die bonded
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MCM with wire bonding
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MCM sample in its packing
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MCM SRAM: outline (1)
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MCM SRAM: outline (2)
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16Mb SRAM MCM: AT68166F/FT (1)
� 4 off 512Kx8 SRAM die (F and/or FT) which can be used as either 1 off 512Kx32, 2 off 512Kx16, or 4 off 512Kx8
� QFP68 pins, 1 sided cavity package for optimized power dissipation
� 3.3+/-0.3V specification, w.o. or w. 5V tolerant Inputs
� 25 ns address access time sampled
� Further improvements will bring the speed down to 20 ns in a first step, and later on, to 15-17 ns
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16Mb SRAM MCM: AT68166F/FT (2)
� Latch up immune, tested up to 300Krads
� No MBU
� 2.5 mA stand by current
� 720/680 mA @ 15/17 ns & 3.3V
� ESCC & QML V (5962-06229 available for 25 ns 5V Tol)
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MCM wire bonder
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� Die bonding:Ø ESEC type MICRON equipmentØ Allows for any rotation for each dieØ Up to 4 different types of dieØ Cavity size: 70x70mm max
� Wire bonding:Ø Kulicke & Sofa KS8060 equipmentØ Allows for any rotation for each dieØ 32µm Al wire bondingØ 63.5 x 63.5 mm for automatic bonding
MCM industrial capability
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MCM spin off products
� EEPROM
� SRAM and EEPROM
� DPR & FIFO
� µP with caches
� Customized
� Guidelines:Ø Low die countØ Heterogeneous die MCM size must remain within the limit
of the main chip (processor and caches should result in a package size of the processor’s one)
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MCGA625
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MCGA625 contract status
� CTB-HYB-DAD 3.14.03 kicked off in December 05
� 1 mm pitch 625 MCGA
� Package design completed and samples received at Grenoble
� Daisy chain proposal sent and agreed by Astrium Velizy
� List of beta customers approved by the ESA contract technical officer:Ø SESØ ASTRIUMØ A2S
� A joint evaluation plan to be coordinated by Astrium and approved by end of May
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MCGA625 contract content
� Work package 1: Design and specify an MCGA625 with embedded daisy chain of connections Completed
� Work package 2: Check the feasibility of the SCI mounting on the CLGA Just started
� Work package 3: Ø Procure prototypes and define the screening flow (test
socket insertion, burn-in temperature…)Ø Deliver daisy chain to beta customers
� Work package 4: Develop a cavity compatible with the biggest ATC18RHA ASIC size, the ATC18RHA95_504
� Work package 5: Final report
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MCGA625 sampling plan
� Alcatel Alenia Space:Ø Alcatel Alenia Space, Toulouse , France 8#
Ø Alcatel Alenia Space, Roma, Italy 8#
Ø Alcatel Alenia Space, Charlerois, Belgium 8#
� Astrium, in Velizy, France 16#
� Saab Ericsson Space 16#
� TOTAL 56#
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Schedule
========================New cavity design
Work package 4
======Final report
Work package 5
==Daisy chain assembly
Work package 3
=Daisy chain sent to beta
==Daisy chain test
==Electrical tests
===Report validation
=RX inspection
===SCI attachment
===Centering tool design
===Reflow profile definition
Work package 2
============Fabrication of LGA
============Fabrication of SCI
=Definition of LGA & SCI
Work package 1
01/0712/0611/0610/0609/0608/0607/0606/0605/0604/0603/0602/0601/06
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MCGA625 bottom view
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MCGA625 top view
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Daisy chain connection table
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MCGA625 daisy chain physical layout
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Ceramic packages offering and roadmap
Pin/pad count
MG2/MH1
Den
sity
& p
rice
effic
ienc
y
Screened dice
MG2RTPATC18M/RHA ATC13
1.27-1 mm MCGA 625/06349
MQFP68 352
500 600 700 800Pin count / year of introduction
CSP with Flip-Chip350/07 800/09
1mm MCGA with Flip-Chip 900/09350/07
MCM62 350/06
Screened die/Flip-Chip350/07 1000/08
110 µm 95 µm double ringdouble ring
arrayPad pitch