adns-2620 - massachusetts institute of technology
TRANSCRIPT
ADNS-2620Optical Mouse Sensor
Data Sheet
Description
The ADNS-2620 is a new entry level, small form factor optical mouse sensor. It is used to implement a non-mechanical tracking engine for computer mice. Unlike its predecessor, this new optical mouse sensor allows for more compact and affordable optical mice designs.
It is based on optical navigation technology, which mea-sures changes in position by optically acquiring sequential surface images (frames) and mathematically determining the direction and magnitude of movement.
The sensor is housed in an 8-pin staggered dual inline package (DIP). It is designed for use with the HDNS-2100 Lens, HLMP-ED80-xx000, and the HDNS-2200 LED Clip, providing an optical mouse solu-tion that is compact and affordable. There are no moving parts, so precision optical alignment is not required, thereby facilitating high volume assembly.
The output format is a two wire serial port. The current X and Y information are available in registers accessed via the serial port.
Resolution is 400 counts per inch (cpi) with rates of motion up to 12 inches per second (ips).
Theory of Operation
The ADNS-2620 is based on Optical Navigation Technology. It contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP) and a two wire serial port.
The IAS acquires microscopic surface images via the lens and illumination system provided by the HDNS-2100, HDNS-2200, and HLMP-ED80-xx000. These images are processed by the DSP to determine the direc-tion and distance of motion.
Features
• Precise optical navigation technology• Small form factor
(10 mm x 12.5 mm footprint)• No mechanical moving parts• Complete 2D motion sensor• Common interface for general purpose controller • Smooth surface navigation• Programmable frame speed up to 3000 frames per
sec (fps)• Accurate motion up to 12 ips• 400 cpi resolution• High reliability• High speed motion detector• Wave solderable• Single 5.0 volt power supply• Conforms to USB suspend mode specifications• Power conservation mode during times of no move-
ment• Serial port registers
– Programming – Data transfer
• 8-pin staggered dual inline package (DIP)
Applications
• Mice for desktop PC’s, workstations, and portable PC’s• Trackballs• Integrated input devices
Pinout of ADNS-2620 Optical Mouse Sensor
Pin Number Pin Description 1 OSC_IN Oscillator input
2 OSC_OUT Oscillator output
3 SDIO Serial Port Data (input and output)
4 SCK Serial Port Clock (Input)
5 LED_CNTL Digital Shutter Signal Out
6 GND System Ground
7 VDD 5V DC Input
8 REFA Internal reference
Figure 2. Package outline drawing.
Figure 1. Mechanical drawing: top view.
5
6
7
8
LED_CNTL
GND
VDD
REFA
SCK
SDIO
OSC_OUT
OSC_IN
4
3
2
1
A26
20 X
YYW
WZ
CAUTION: It is advisable that normal static precautions should be taken in the handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Overview of Optical Mouse Sensor Assembly
NOTE: Pin 1 of optical mouse sensor should be inserted into the reference point of mechanical cutouts.
Figures 3 and 4 are shown with HDNS-2100, HDNS-2200 and HLMP-ED80-xx000.
Avago Technologies provides an IGES file drawing de-scribing the base plate molding features for lens and PCB alignment.
The components shown in Figure 5 interlock as they are mounted onto defined features on the base plate.
The ADNS-2620 sensor is designed for mounting on a through hole PCB, looking down. There is an aperture stop and features on the package that align to the lens.
The HDNS-2100 lens provides optics for the imaging of the surface as well as illumination of the surface at the optimum angle. Features on the lens align it to the sensor, base plate, and clip with the LED. The lens also has a large round flange to provide a long creepage path for any ESD events that occur at the opening of the base plate.
The HDNS-2200 clip holds the LED in relation to the lens. The LED’s leads must be formed first before inserting into the clip. Then, both LED and clip is loaded on the PCB. The clip interlocks the sensor to the lens, and through the lens to the alignment features on the base plate.
The HLMP-ED80-xx000 is recommended for illumination. If used with the bin table (as shown in Figure 8), sufficient illumination can be guaranteed.
Figure 5. Exploded view drawing.
Figure 3. Recommended PCB mechanical cutouts and spacing.
HDNS-2200 (Clip)
HLMP-ED80-xx000
ADNS-2620 (Sensor)
Customer supplied PCB
HDNS-2100 (Lens)
Customer supplied base platewith recommended alignment features per IGES drawing
Figure 4. 2D assembly drawing of ADNS-2620 shown with the HLMP-ED80 (top and side view).
BASE PLATE
PLASTIC SPRINGCLIP
BASE PLATE ALIGNMENT POSTSENSORPCB
ESD LENS RING
7.450.293
32.461.278
19.100.752
13.820.544
10.580.417
14.580.574
Dimensions in mm/in.
+X
+Y
(Top view)
(Side view)
φ
29.15
ALL DIMENSIONS0
1.148
11.100.437
12.600.496
1.250.049
MMINCH
1.350.053
4.910.193
7.450.293
13.730.541
3.50
Clear Zone
0.138
28.001.102
18.940.746
1.000.039
9.060.357
0
8X φ 0.800.031
Figure 6. Block diagram of ADNS-2620 optical mouse sensor.
SCK
SDIO
SERIALPORT
SERIAL PORT
IMAGE PROCESSOR
LED CONTROL
LED CONTROL
OSCILLATOR RESONATOR
OSC_IN
OSC_OUT
REFA
VOLT
AG
E R
EGU
LATO
RA
ND
PO
WER
CO
NTR
OL
VDD
GND
VOLTAGE REFERENCE
5 VOLT POWER
PCB Assembly Considerations
1. Insert the sensor and all other electrical components into PCB. Note: Pin 1 of the sensor should always be the reference point of mechanical cutouts.
2. Bend the LED leads 90° and then insert the LED into the assembly clip until the snap feature locks the LED base.
3. Insert the LED/clip assembly into PCB.
4. Wave solder the entire assembly in a no-wash solder process utilizing solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. The solder fixture is also used to set the reference height of the sensor to the PCB top during wave soldering (Note: DO NOT remove the kapton tape during wave soldering).
5. Place the lens onto the base plate.
6. Remove the protective kapton tape from optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. It is recom-mended not to place the PCB facing up during the entire mouse assembly process. The PCB should be held vertically for the kapton removal process.
7. Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The sensor ap-erture ring should self-align to the lens.
8. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment.
9. Install mouse top case. There MUST be a feature in the top case to press down onto the clip to ensure all components are interlocked to the correct vertical height.
Design Considerations for Improving ESD Performance
The flange on the lens has been designed to increase the creepage and clearance distance for electrostatic discharge. The table below shows typical values assum-ing base plate construction per the Avago supplied IGES file and HDNS-2100 lens flange.
Typical Distance Millimeters Creepage 16.0
Clearance 2.1
For improved ESD performance, the lens flange can be sealed (i.e. glued) to the base plate. Note that the lens material is polycarbonate and therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used.
PCB
Sensor
LED
Base Plate
Lens/Light Pipe
Clip
Surface
Figure 7. Sectional view of PCB assembly highlighting optical mouse components (optical mouse sensor, clip, lens, LED, PCB and base plate).
Figure 8. Circuit block diagram for a typical corded optical mouse using an Avago ADNS-2620 optical mouse sensor.
6 MHz(Optional)
10 9
P0.7
P0.6
XTALINXTALOUT
D+
D-
Vreg
P1.0
P1.1
P0.0
Vpp
VDD
GND
VDD
SDIO
SCK
LED_CNTL
SURFACE
1K ohms
100K ohmsR1
2N3906
HDNS2100Lens
InternalImageSensor
HLMP-ED80-xx000
OSC_IN Ceramic Resonaator
Murata CSALS24M0X53-B0TDK FCR24.0M2G
2.2 µF
24 MHz
OSC_OUT
REFA
7
13
8
5
14
1
12
VDD
D+
D-
GND
GND
1.3 K
0.1 µF 4.7 µF 0.1 µF
QA
QBVDD
R
Z LED
SHLDVDD
11
VSS
CYPR
ESS
CY7C
6372
3C-P
C ADNS
-262
0
P0.517
6 5
1
2
8
7
3
4
16
15
P0.3
P0.2
P0.1
4
3
2
6
L
M
R
ButtonsR1 VALUE
(Ohms)32.032.032.032.032.0 to 61.232.0 to 73.932.0 to 84.432.0 to 10332.0 to 130
KLMNPQRST
HLMP-ED80 Bin
Notes on Bypass Capacitors
• Caps for pins 6,7 and 8 to ground MUST have trace lengths LESS than 5 mm.
• The 0.1 uF caps must be ceramic. • Caps should have less than 5 nH of self inductance• Caps should have less than 0.2 ohms ESR• Surface mount parts are recommended
Regulatory Requirements
• Passes FCC B and worldwide analogous emission limits when assembled into a mouse with unshielded cable and following Avago recommendations.
• Passes EN61000-4-4/IEC801-4 EFTB tests when assem-bled into a mouse with shielded cable and following Avago recommendations.
• UL flammability level UL94 V-0.
• Provides sufficient ESD creepage/clearance distance to avoid discharge up to 15 kV when assembled into a mouse according to usage instructions above.
• For eye safety consideration, please refer to the tech-nical report available on the web site at www.Avago.com/semiconductors.
Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units Notes Storage Temperature TS -0 8 °C
Operating Temperature TA -1 °C
Lead Solder Temp 0 °C For 10 seconds, 1. mm below seating plane
Supply Voltage VDD -0. . V
ESD KV All pins, human body model MIL 88 Method 01
Input Voltage VIN -0. VDD +0. V SDIO, CLK, LED_CNTL
Input Voltage VIN -0. . V OSC_IN, OSC_OUT, REFA
Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units Notes Operating Temperature TA 0 0 °C
Power Supply Voltage VDD .1 .0 . Volts Register values retained for voltage transients below .10V but greater than .9V
Power Supply Rise Time VRT 100 ms
Supply Noise VN 100 mV Peak to peak within 0-100 MHz bandwidth
Clock Frequency fCLK .0 .0 .0 MHz Set by ceramic resonator
Serial Port Clock Frequency SCLK fCLK/1 MHz
Resonator Impedance XRES Ω
Distance from Lens Reference Z . . . mm Results in ±0. mm DOF Plane to Surface (See Figure 9)
Speed S 0 1 in/sec @ frame rate = 100 fps
Acceleration A 0. g @ frame rate = 100 fps
Light Level onto IC IRRINC 80 ,000 mW/m λ = 9 nm 100 0,000 λ = 87 nm
SDIO Read Hold Time tHOLD 100 µs Hold time for valid data (Refer to Figure )
SDIO Serial Write-write Time tSWW 100 µs Time between two write commands (Refer to Figure )
SDIO Serial Write-read Time tSWR 100 µs Time between write and read operation (Refer to Figure )
SDIO Serial Read-write Time tSRW 0 ns Time between read and write operation (Refer to Figure 7)
SDIO Serial Read-read Time tSRR 0 ns Time between two read commands (Refer to Figure 7)
Data Delay after PD deactivated tCOMPUTE .1 ms After tCOMPUTE, all registers contain data from first image after wakeup from Power-Down mode. Note that an additional 7 frames for AGC stabilization may be required if mouse movement occurred while Power Down. (Refer to Figure 10)
SDIO Write Setup Time tSETUP 0 ns Data valid time before the rising of SCLK (Refer to Figure 0)
Frame Rate FR 100 00 frames/s See Frame_Period register section
7
Figure 9. Distance from lens reference plane to surface.
AC Electrical SpecificationsElectrical Characteristics over recommended operating conditions. Typical values at °C, VDD = V, MHz, 100 fps.
Parameter Symbol Min. Typ. Max. Units Notes Power Down (PD) tPD 1. µs clock cycle minimum after setting bit in the Configuration register. (Refer to Figure 1)
Power Up after PD mode tPUPD 0 ms From PD mode deactivation to accurate reports deactivated 10 µs + 7 frames (Refer to Figure 10)
Power Up from VDD ↑ tPU 0 ms From VDD to valid accurate reports 10 µs + 0 frames
Rise and Fall Times SDIO tr 0 ns CL = 0 pF (the rise time is between 10% to 90%)
tf 1 ns CL = 0 pF (the fall time is between 10% to 90%)
Serial Port Transaction Timer tSPTT 90 ms Serial port will reset if current transaction is not complete within tSPTT (Refer to Figure 9)
Transient Supply Current IDDT 0 7 mA Max supply current during a VDD ramp from 0 to .0V with > 00 µs rise time. Does not include charging current for bypass capacitors
ADNS-2620
HDNS-2100
Z
OBJECT SURFACE
8
DC Electrical SpecificationsElectrical Characteristics over recommended operating conditions. Typical values at °C, VDD = V, MHz, 100 fps.
Parameter Symbol Min. Typ. Max. Units Notes Supply Current (mouse moving) IDD AVG 1 0 mA
Supply Current (mouse not moving) IDD 1 mA
Power Down Mode Current IDDPD 170 0 µA
SCK pin
Input Low Voltage VIL 0.8 V
Input High Voltage VIH .0 V
Input Capacitance CIN 10 pF
Input Resistance RIN 1 MΩ
SDIO pin VDD= V, Load = 0 pF, 80n s rise & fall
Input Low Voltage VIL 0.8 V
Input High Voltage VIH .0 V
Output Low Voltage VOL 0. V
Output High Voltage VOH 0.8 * VDD V
Drive Low Current IL .0 mA
Drive High Current IH .0 mA
Input Capacitance CIN 10 pF
Input Resistance RIN 1 MΩ
LED_CNTL pin
Output Low Voltage VOL 0.1 V
Output High Voltage VOH 0.8 * VDD V
Drive Low Current IL 0 µA
Drive High Current IH 0 µA
OSC_IN
Input Resistance RIN 00 kΩ
Input Capacitance CIN 1 pF
Input High Voltage VIH . V External clock source
Input Low Voltage VIL 0.8 V External clock source
9
PD Pin TimingNote: All timing circuits shown, from Figure 10 onwards, are based on the MHz resonator frequency.
Figure 10. Power up timing mode.
Figure 11. Details of wake-up timing after PD.
IDD
Power DownDeactivation
Power Down deactivated
(610) µs
tCOMPUTE (See Figure 11)
t pupd
75 frames
LEDCURRENT
OscillatorStart
Power DownDeactivation
Power Down deactivated
250 µs
ResetCount
360 µs
Initialization New Acquisition
2410 µs
SCLK
Optional SPI transactionswith old image data
610 µs
tcompute
SPI transactionswith new image data
At default frame rate
10
Power-down Mode (PD) and Timing
ADNS-2620 can be placed in a power-down mode by setting bit 6 in the configuration register via a serial I/O port write operation. Note that while writing a “1” to bit 6 of the configuration register, all other bits must be written with their original value in order to keep the current configuration. After setting the configuration register, wait at least 32 system clock cycles. To get the chip out of the power-down mode, clear bit 6 in the configuration register via a serial I/O port write operation. (CAUTION! In power-down mode, the SPI timeout (tSPTT) will not
function. Therefore, no partial SPI command should be sent. Otherwise, the sensor may go into a hang-up state). While the sensor is in power-down mode, only the bit 6 data will be written to the configuration register. Writing the other configuration register values will not have any effect. For an accurate report after power-up, wait for a total period of 50 ms before the microcontroller is able to issue any write/read operation to the ADNS-2620. The sensor register settings, prior to power-down mode, will remain during power-down mode.
Figure 13. Power-down configuration register writing operation.
Setting the power down bit simply sets the analog cir-cuitry into a no current state.
Note: LED_CNTL, and SDIO will be tri-stated during power down mode.
Figure 12. Power-down timing.
The address of the configuration register is 1000000.
Assume that the original content of the configuration register is 0x00.
CLK
SCK
SDIO
IDD
32 clock cycles min
1 A6 A5 A4 A3 D5 D4 D3 D2 D1 D0
tPD
Configuration Register Address
1 1 0 0 0 0 0 0 0 0 0 0 0 0 01
Configuration Register Data (0x40)Write
SCK
SDIO
Operation
11
Typical Performance CharacteristicsPerformance characteristics over recommended operating conditions. Typical values at °C, VDD = V, MHz, 100 fps.
Parameter Symbol Min. Typ. Max. Units Notes Path Error (Deviation) PError 0. % Path Error (Deviation) is the error from the ideal cursor path. It is expressed as a percentage of total travel and is measured over standard surfaces.
The following graphs (Figures 14-18) are the typical performance of the ADNS-2620 sensor, assembled as shown in the 2D assembly drawing with the HDNS-2100 Lens/Prism, the HDNS-2200 clip, and the HLMP-ED80-xx000 (See Figure 4).
z (mm)
Figure 14. Typical Resolution vs. Z (comparative surfaces)
DPI
-1
500
400
300
200
100
0-0.8 -0.6 -0.4 -0.2 -0 0.2 0.4 0.6 0.8 1
Burl FormicaWhite PaperManilaBlack CopyBlack Walnut
VELOCITY (ips)
Figure 15. Typical Resolution vs. Velocity @ 1500 fps.
DPI
1
500
400
300
200
100
03 5 7 9 11 13 15
White PaperManilaBlack Copy
WAVELENGTH (nm)
REL
ATI
VE R
ESPO
NSI
VITY
400 1000700500 900800600
1.0
0.8
0.6
0.4
0.2
0
Figure 16. Wavelength Responsivity[1].
Notes:1. The ADNS-2620 is designed for optimal
p e r fo r m a n ce w h e n u s e d w i t h t h e HLMP-ED80-xx000 (red LED 639 nm). For use with other LED colors (i.e., blue, green), please consult factory. When using alter-nate LEDs, there may also be performance degradation and additional eye safety considerations.
2. Z = Distance from Lens Reference plane to Surface.
3. DOF = Depth of Field.
z (mm)
Figure 17. Typical Resolution vs. Height at different LED currents on manila.
DPI
-1
500
400
300
200
100
0-0.6 -0.2 0.2 0.6 1
100%75%50%
z (mm)
Figure 18. Typical Resolution vs. Height at different LED currents on black.
DPI
-1
600
500
400
300
200
100
0-0.6 -0.2 0.2 0.6 1
100%75%50%
1
Figure 19. Write operation.
Synchronous Serial Port
The synchronous serial port is used to set and read parameters in the ADNS-2620, and also to read out the motion information.
The port is a two wire, half duplex port. The host micro-controller always initiates communication; the ADNS-2620 never initiates data transfers.
SCK: The serial port clock. It is always generated by the master (the microcontroller).
SDIO: The data line.
Write Operation
Write operations, where data is going from the micro-controller to the ADNS-2620, is always initiated by the microcontroller and consists of two bytes. The first byte contains the address (seven bits) and has a “1” as its MSB to indicate data direction. The second byte contains the data. The transfer is synchronized by SCK. The microcon-troller changes SDIO on falling edges of SCK. The ADNS-2620 reads SDIO on rising edges of SCK.
SCK
SDIO
SDIO Driven by Microcontroller
1 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16SCK
Cycle #
DON'TCARE
Figure 20. SDIO setup and hold times SCK pulse width.
SCK
SDIO
tsetup = 60 ns, min
250 ns, min
250 ns 250 ns
1
NOTE: The 250 ns high state of SCK is the minimum data hold time of the
ADNS-2620. Since the falling edge of SCK is actually the start of the next read or write command, the ADNS-2620 will hold the state of D0 on the SDIO line until the falling edge of SCK. In both write and read operations, SCK is driven by the microcontroller.
Read Operation
A read operation, meaning data that is going from the ADNS-2620 to the microcontroller, is always initiated by the microcontroller and consists of two bytes. The first byte that contains the address is written by the microcon-troller and has a “0” as its MSB to indicate data direction. The second byte contains the data and is driven by the ADNS-2620. The transfer is synchronized by SCK. SDIO is changed on falling edges of SCK and read on every rising
edge of SCK. The microcontroller must go to a High-Z state after the last address data bit. The ADNS-2620 will go to the High-Z state after the last data bit. Another thing to note during a read operation is that SCK needs to be delayed after the last address data bit to ensure that the ADNS-2620 has at least 100 µs to prepare the requested data. This is shown in the timing diagrams below (See Figures 21 to 23).
Figure 21. Read operation.
SDIO Driven by Microcontroller SDIO Driven by ADNS-2620
1 2 3 4 5 6 7 8SCK
Cycle #
SCK
SDIO 0 A 6 A 5 A 4 A 3 A 2 A 1 A 0 D6 D5 D4 D3 D2 D1 D0D7
9 10 11 12 13 14 15 16
Detail "A" Detail "B"
250 ns, max
Microcontrollerto ADNS-2620SDIO handoff
Detail "A"
A 0
250 ns, min
SCK
SDIO Hi-Z
0 ns, min
A 1
250 ns, max
D 7
160 ns, min
D 6
60 ns, min
t HOLD
100 µs, min
ADNS-2620 toMicrocontrollerSDIO handoff
Detail "B"
SCK
SDIO
250 ns, min
D0
160 ns, max
R/W bit of next address
Released by ADNS-2620 Driven by microcontroller
Figure 22. Microcontroller to ADNS-2620 SDIO handoff.
Figure 23. ADNS-2620 to microcontroller SDIO handoff.
1
Figure 24. SDIO Hi-z state and timing.
Forcing the SDIO Line to the Hi-Z State
There are times when the SDIO line from the ADNS-2620 should be in the Hi-Z state. For example, if the micro-processor has completed a write to the ADNS-2620, the SDIO line will go into a Hi-Z state, because the SDIO pin was configured as an input. However, if the last operation from the microprocessor was a read, the ADNS-2620 will hold the D0 state on SDIO until a falling edge of SCK.
To place the SDIO pin into a Hi-Z state, activate the power-down mode by writing to the configuration register. Then, the powerdown mode can stay activated, with the ADNS-2620 in the shutdown state, or the power-down mode can be deactivated, returning the ADNS-2620 to normal operation. In both conditions, the SDIO line will go into the Hi-Z state.
Another method to put the SDIO line into the Hi-Z state, while maintaining the ADNS-2620 at normal mode, is to write any data to an invalid address such as 0x00 to address 0x77. The SDIO line will go into the Hi-Z state after the write operations.
SDIO 10 ns, max
PDActivated
Hi-Z
32clockcycles
PDTiming
1
Figure 26. Timing between write and read commands.
Figure 27. Timing between read and either write or subsequent read commands.
If the rising edge of SCK for the last address bit of the read command occurs before the 100 µs required delay, then the write command may not complete correctly.
The falling edge of SCK for the first address bit of either the read or write command must be at least 250 ns after the last SCK rising edge of the last data bit of the previous read operation.
Required Timing between Read and Write Commands (tsxx)
There are minimum timing requirements between read and write commands on the serial port.
If the rising edge of the SCK for the last data bit of the second write command occurs before the 100 µs required delay, then the first write command may not complete correctly.
Figure 25. Timing between two write commands.
SCLK
Address Data
tSWW
≥100 µs
Write Operation
Address Data
Write Operation
SCK
Address Data
Write Operation
Address
Next ReadOperation
tSWR
≥100 µs
Data
t1
≥100 µs
Address
tSRW and tSRR >250 ns
Next Read orWrite Operation
Address
SCK
Read Operation
1
Error Detection and Recovery
1. The ADNS-2620 and the microcontroller might get out of synchronization due to ESD events, power supply droops or microcontroller firmware flaws.
2. The ADNS-2620 has a transaction timer for the serial port. If the sixteenth SCK rising edge is spaced more than approximately 90 milliseconds from the first SCK edge of the current transaction, the serial port will reset.
3. Invalid addresses:
– Writing to an invalid address will have no effect. Reading from an invalid address will return all zeros.
4. Collision detection on SDIO
– The only time that the ADNS-2620 drives the SDIO line is during a READ operation. To avoid data collisions, the microcontroller should relinquish SDIO before the falling edge of SCK after the last address bit. Then the ADNS-2620 begins to drive SDIO after the next rising edge of SCK. Next, the ADNS-2620 relinquishes SDIO within 160 ns of the falling SCK edge after the last data bit. The microcontroller can begin driving SDIO any time after that. In order to maintain low power consumption in normal operation or when the PD bit is set high, the microcontroller should not leave SDIO floating until the next transmission (although that will not cause any communication difficulties).
5. In case of synchronization failure, both the ADNS-2620 and the microcontroller may drive SDIO. The ADNS-2620 can withstand 30 mA of short circuit current and will withstand infinite duration short circuit condi-tions.
6. The microcontroller can verify a successful write opera-tion by issuing a read command to the same address and comparing the written data to the read data.
7. The microcontroller can verify the synchronization of the serial port by periodically reading the product ID from status register (Address: 0x41).
Notes on Power-up and the Serial Port
The sequence in which VDD, SCK and SDIO are set during powerup can affect the operation of the serial port. The diagram below shows what can happen shortly after powerup when the microprocessor tries to read data from the serial port.
This diagram shows the VDD rising to valid levels, at some point the microcontroller starts its program, sets the SCK and SDIO lines to be outputs, and sets them high. Then, the microcontroller waits to ensure the ADNS-2620 has powered up and is ready to communicate. The micro-processor then tries to read from location 0x41, Status register, and is expecting a value of 0x0b010XXXXX. If it receives this value, then it knows that the communication to the ADNS-2620 is operational.
The problem occurs if the ADNS-2620 powers up before the microprocessor sets the SCK and SDIO lines to be outputs and high. The ADNS-2620 sees the raising of the SCK as a valid rising edge, and clocks in the state of the SDIO as the first bit of the address (sets either a read or a write depending upon the state).
In the case of a SDIO low, a read operation will start. When the microprocessor actually begins to send the address, the ADNS-2620 already has the first bit of an address. When the seventh bit is sent by the microprocessor, the ADNS-2620 has a valid address, and drives the SDIO line high within 250 ns (see detail “A” in Figure 19 and Figure 20). This results in a bus fight for SDIO. Since the address is wrong, the data sent back will be incorrect.
In the case of a SDIO high, a write operation will start. The address and data will be out of synchronization, causing the wrong data written to the wrong address.
Solution
One way to solve the problem is by waiting for the serial port timer to time out.
Figure 28. Power-up serial port sequence.
Don't Care State
Data = 0x0b010XXXXXAddress = 0x41
SCK
SDIO
VDD >t SPTT
17
If the microprocessor waits at least tSPTT from VDD valid, it will ensure that the ADNS-2620 has powered up and the timer has timed out. This assumes that the microprocessor and the ADNS-2620 share the same power supply. If not, then the microprocessor must wait for tSPTT from ADNS-2620 VDD valid. Then when the SCK toggles for the address, the ADNS-2620 will be in sync with the microprocessor.
Resync Note
If the microprocessor and the ADNS-2620 get out of sync, then the data either written or read from the registers will be incorrect. An easy way to solve this is to use watchdog timer timeout sequence to resync the parts after an incor-rect read.
Power-up
ADNS-2620 has an on-chip internal power-up reset (POR) circuit, which will reset the chip when VDD reaches the valid value for the chip to function.
Soft Reset
ADNS-2620 may also be given the reset command at any time via the serial I/O port. The timing and transactions are the same as those just specified for the power-up mode in the previous section.
The proper way to perform soft reset on ADNS-2620 is:
1. The microcontroller starts the transaction by sending a write operation containing the address of the configura-tion register and the data value of 0x80. Since the reset bit is set, ADNS-2620 will reset and any other bits written into the configuration register at this time is properly written into the Configuration Register. After the chip has been reset, very quickly, ADNS-2620 will clear the reset bit so there is no need for the microcontroller to re-write the Configuration Register to reset it.
2. The digital section is now ready to go. It takes 3 frames for the analog section to settle.
Don't Care State
Data = 0x0b010XXXXXAddress = 0x41
SCK
SDIO
VDD >t SPTT
Figure 29. Power-up serial port timer sequence.
Serial Port Timer Timeout
Figure 30. ADNS-2620 soft reset sequence timing.
Figure 31. Soft reset configuration register writing operation.
Soft reset will occur when writing 0x80 to the configura-tion register.
CLK
SCK
SDIO
Reset Occurs
1 A6 A5 A4 A3 D5 D4 D3 D2 D1 D0
here
Configuration Register Address
1 1 0 0 0 0 0 0 0 0 0 0 0 01
Configuration Register DataWrite
SCK
SDIO
Operation
0
18
Programming Guide
Registers
The ADNS-2620 can be programmed through registers, via the serial port, and configuration and motion data can be read from these registers.
Register Address Notes Configuration 0x40 Reset, Power Down, Forced Awake, etc
Status 0x41 Product ID, Mouse state of Asleep or Awake
Delta_Y 0x42 Y Movement
Delta_X 0x43 X Movement
SQUAL 0x44 Measure of the number of features visible by the sensor
Maximum_Pixel 0x45
Minimum_Pixel 0x46
Pixel_Sum 0x47
Pixel Data 0x48 Actual picture of surface
Shutter_Upper 0x49
Shutter_Lower 0x4A
Frame Period 0x4B
19
Configuration Address: 0x40 Access: Read/Write Reset Value: 0x00
Bit 7 1 0
Field C7 C C C C C C1 C0
Data Type: Bit field
USAGE: The Configuration register allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values.
Field Name Description C7 Reset 0 = No effect 1 = Reset the part
C Power down 0 = Normal operation 1 = power down all analog circuitry
C LED Shutter Mode 0= Shutter mode off (LED always on even if no motion up to 1 sec) 1= Shutter mode on (LED only on when electronic shutter is open)
C – C1 Reserved
C0 Forced Awake Mode 0 = Normal, fall asleep after one second of no movement (1500 frames/s) 1 = Always awake
Status Address: 0x41 Access: Read Reset Value: 0x41
Bit 7 1 0
Field ID ID1 ID0 Reserved Reserved Reserved Reserved Awake
Data Type: Bit Field
USAGE: Status information and type of mouse sensor, current state of the mouse.
Field Name Description ID - ID0 Product ID (010 for ADNS-0)
Reserved Reserved for future
Awake Mouse State 0 = Asleep 1 = Awake
0
Delta_Y Address: 0x42 Access: Read Reset Value: 0x00
Bit 7 1 0
Field Y7 Y Y Y Y Y Y1 Y0
Data Type: Eight bit ’s complement number.
USAGE: Y movement is counted since last report. Absolute value is determined by resolution. Reading clears the register.
Delta_X Address: 0x43 Access: Read Reset Value: 0x00
Bit 7 1 0
Field X7 X X X X X X1 X0
Data Type: Eight bit ’s complement number.
USAGE: X movement is counted since last report. Absolute value is determined by resolution. Reading clears the register
1
The focus point is important and could affect the SQUAL value. Figure 32 shows another setup with various z-heights. This graph clearly shows that the SQUAL value is dependent on focus distance.
Note: The data is obtained by getting multiple readings over different heights.
SQUAL Address: 0x44 Access: Read Reset Value: 0x00
Bit 7 1 0
Field SQ7 SQ SQ SQ SQ SQ SQ1 SQ0
Data Type: Upper 8 bits of a 9-bit integer.
USAGE: SQUAL (Surface QUALity) is a measure of the number of features visible by the sensor in the current frame.
Number of Features = SQUAL Register Value x .
The maximum value is . Since small changes in the current frame can result in changes in SQUAL, variations in SQUAL when looking at a surface are expected. The graph below shows 0 sequentially acquired SQUAL values, while a sensor was moved slowly over white paper. SQUAL is nearly equal to zero when there is no surface below the sensor.
1.50
1.25
1.00
0.75
0.50
0.25
0
NO
RM
ALI
ZED
SQ
UA
L VA
LUE
DELTA FROM NOMINAL FOCUS (mm)
Figure 32. Typical Mean SQUAL vs. z (white paper).
-1.0 -0.6 -0.2 0.2 0.6 1.0
σ
σ
3
3
–
+
XXX
Maximum_Pixel Address: 0x45 Access: Read Reset Value: 0x00
Bit 7 1 0
Field 0 0 MP MP MP MP MP1 MP0
Data Type: Six bit number.
USAGE: Maximum Pixel value in current frame. Minimum value = 0, maximum value = . The maximum pixel value may vary from frame to frame. Shown below is a graph of 0 sequentially acquired maximum pixel values, while the sensor was moved slowly over white paper.
Minimum_Pixel Address: 0x46 Access: Read Reset Value: 0x3f
Bit 7 1 0
Field 0 0 MP MP MP MP MP1 MP0
Data Type: Six bit number.
USAGE: Minimum Pixel value in current frame. Minimum value = 0, maximum value = . The minimum pixel value may vary from frame to frame.
Min Pixel on White Paper
test number
64
48
32
16
01 16 31 46 61 76 91 106 121 136 151 166 181 196 211 226 241 256
Min
pix
el
Max Pixel on White Paper
test number
64
48
32
16
01 16 31 46 61 76 91 106 121 136 151 166 181 196 211 226 241 256
Max
pix
el
Pixel_Sum Address: 0x47 Access: Read Reset Value: 0x00
Bit 7 1 0
Field PS7 PS PS PS PS PS PS1 PS0
Data Type: Upper 8 bits of a 1-bit unsigned integer.
USAGE: This register is used to find the average pixel value. It reports the upper 8 bits of a 1-bit unsigned integer, which sums all pixels in the current frame. It may be described as the full sum divided by 18. The formula to calculate the average pixel value is as below:
Average Pixel = Register Value x 18 /
= Pixel_Sum x 0.9
The maximum register value is 19 ( x / 18 truncated to an integer). The minimum is 0. The pixel sum value may vary from frame to frame.
Pixel Data Address: 0x48 Access: Read/Write Reset Value: 0x00
Bit 7 1 0
Field SOF Data_Valid PD PD PD PD PD1 PD0
Data Type: Two status bits, six bit pixel data.
USAGE: Digital Pixel data. Minimum value = 0, maximum value = . Any writes to this register resets the pixel hardware so that the next read from the Pixel Data register will read pixel #1 and the StartOfFrame bit will be set. Subsequent reads will auto increment the pixel number.
To dump a complete image, set the LED to forced awake mode, write anything to this register, then read times where the DataValid bit is set. On the th read, the StartOfFrame bit will be set indicating that we have completed one frame of pixels and are starting back at pixel 1.
It takes at least frames to complete an image as we can only read 1 pixel per frame.
The pixel hardware is armed with any read or write to the Pixel Data register and will output pixel data from the next available frame. So, if you were to write the Pixel Data register, wait seconds then read the Pixel Data register; the reported pixel data was from seconds ago.
Field Name Description SOF Start of Frame 0 = Not start of frame 1 = Current pixel is number 1, start of frame
Data_Valid There is valid data in the frame grabber
PD –PD0 Six bit pixel data
Pixel Map (sensor is facing down, looking through the sensor at the surface)
First Pixel
Last Pixel
Pixel Dump Pictures
The following images are the output of the Pixel Data command. The data ranges from 0 for complete black, to 63 for complete white. An internal AGC circuit adjusts the shutter value to keep the brightest feature (max pixel) in the mid 50’s.
(a) White Paper (b) Manila Folder
(c) Burl Formica (d) USAF Test Chart
Note: This graph is obtained by getting multiple readings over dif-ferent heights.
Shutter_Upper Address: 0x49 Access: Read Reset Value: 0x01
Bit 7 1 0
Field S1 S1 S1 S1 S11 S10 S9 S8
Shutter_Lower Address: 0x4A Access: Read Reset Value: 0x00
Bit 7 1 0
Field S7 S S S S S S1 S0
Data Type: Sixteen bit word.
USAGE: Units are clock cycles; default value is 0x0100HEX. Read Shutter_Upper first, then Shutter_Lower. They should be read consecutively. The sensor adjusts the shutter to keep the average and maximum pixel values within normal operating ranges. The shutter value may vary with every frame. Each time the shutter changes, it changes by ±1/16 of the current value.
1.50
1.25
1.00
0.75
0.50
0.25
0
NO
RM
ALI
ZED
SH
UTT
ER V
ALU
E (C
ount
s)
DISTANCE FROM NOMINAL FOCUS (mm)
Figure 33. Typical Mean Shutter vs. z (white paper).
-1.0 -0.6 -0.2 0.2 0.6 1.0
σ
σ
3
3
–
+
XXX
Frame_Period Address: 0x4b Access: Read/Write Reset Value: 0xc2
Bit 7 1 0
Field FP7 FP FP FP FP FP FP1 FP0
Data Type: Eight bit ’s complement number that represents the upper 8 bits of a 1 bit counter.
USAGE: The frame period counter counts up until it overflows. Units are clock cycles. The formula is:
Clock Rate = Counts (decimal) --> Counts (hex) --> Counts (2’s complement hex) Frame Rate
Frame Rate Clocks/Frame Clocks/Frame (frames/sec) Decimal (2’s complement hex) 9 0 O
11 187 C
000 8000 E0
Note:
To optimize tracking performance on dark surfaces, it is recommended that an adaptive frame rate based on shutter value be implemented for frame rates greater than 100.
Changing the frame rate results in changes in the maximum speed, acceleration limits, and dark surface performance.
The maximum value of the shutter is dependent upon the clock frequency. The formula for the maximum shutter value is:
clock freq Max shutter value = – 3476 Frame Rate
For a clock frequency of 24 MHz, the following table shows the maximum shutter value. 1 clock cycle is 41.67 nsec.
Frames/second Max Shutter Shutter Decimal Hex Upper Lower 000 0x11AC 11 AC
11 197 0x0D 0 D
9 1 0xF07C F0 7C
<-- Default Max Shutter
Ordering Information
Specify part number as follows:
ADNS-2620 = 8-pin staggered dual inline package (DIP), 40 per tube.
<-- Maximum Frame Time
<-- Nominal Frame Time
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