a no-power mems shock sensor luke currano u.s. army research laboratory [email protected]...
TRANSCRIPT
Motivation
Shock monitoring is important for condition-based maintenance There are many MEMS accelerometers available, but all require
some constant operating power– Electrostatic accelerometers work by monitoring capacitance between a
fixed electrode and a spring-mounted electrode » Some circuitry is required to monitor capacitance changes and convert them
into voltages
– Piezoelectric accelerometers produce a charge as a result of acceleration-induced deformation
» No power needed to monitor deflections, but conditioning circuits which consume power are required to use the sensor output
Eliminating constant power consumption by MEMS accelerometer could increase battery lifetime significantly– 8μA constant current draw (100% duty cycle) at ~3V, for 24μW
continuous power draw Health monitoring of long-shelflife or long-lifetime systems without
changing batteries is needed– Some Army systems have 20-year shelflife combined with limited space
Requirements
Very low power/no power sensing of shock events Non-destructive (i.e. must be reusable/resetable) 3-axis sensing required, bidirectional (+/-) in each axis 5 levels desired over the range of 10g-150g
Designed and fabricated functional no-power MEMS shock sensors– Up to 7 acceleration threshold levels (one axis, bidirectional) per
1cm2 chip– Latching demonstrated between 25g and 150g
Designed and fabricated functional thermal reset actuators
Major Accomplishments
Shock Sensor Design
Mechanical latching threshhold sensor design approach Silicon MEMS fabrication process allows for very small devices
and very tight tolerances
Resettable latching no-power MEMS shock sensor Latch and release mechanism closeup.
Design Details Design set 4
– 4-spring design to make stiffer in z-axis– Narrowed springs to lower spring
constant– Added anti-stiction bumps to springs– Version with metal-coated latch to lower
resistivity in process– Pyrex cap wafer in process (this is main
impediment to getting test data)
Design Set 4 Shock Sensor (latched)
Platinum coated latch for lower resistivity
Shock Sensor Usage
Designed to be used as either:– Wakeup sensor
» Power supply connected to processor and other sensors through shock sensor
» Traditional high-resolution accelerometer used to record shock pulse after shock sensor wakes system up
» One or more trigger levels
– Mechanical memory» Shock event triggers device, device “remembers” event
» Interrogate sensor periodically or just before use (go / no go)
» The more trigger levels, the better the resolution
Either way power savings comes from having system off most of the time– Shock sensor itself does not draw any power except small
amount when interrogating/waking up system
Fabrication Process Flow for MEMS Shock Sensor
Starting material – SOI wafer with 20μm thick device layer, 2 μm oxide
1. Pattern and liftoff Cr/Au bondpads
2. Deep reactive ion etch device layer to define spring, mass, and latches
3. Isotropically etch the oxide layer to release the mass
Analytical Modeling Force balance:
Integrate equation 2, using the fact that: a dy = v dv:
Set v = 0 to find maximum travel:
For a given level of shock, two of three variables (mass spring constant and desired deflection to latch) picked by designer, the third is solved from (6)
Time to latch due to an impulse is determined by natural frequency of device:
Result: response time is dictated solely by latching distance given a threshold level
– Caveat: adding damping to the system allows for slowing the response time but not speeding it up
Response times of ARL designs 2.2ms or lower
21d
(1) 0)( kyyymr
mr (2) m
kyyy r
rm
(3) 22
22
m
kyyy
yr
rm
(4) 22
m
kyyyy r
rm
(5) 202
m
kyyyr (6)
2
k
ymy rL
)7(24
T
tlatch )8(222 r
Llatch y
y
k
mt
Experimental Results - Latch
Centrifuge test of devices designed to latch at static levels of 10G -75G Visually and electrically confirmed latching during centrifuge tests
– Factor of ~2 between designed trigger level and actual level– This is attributed to simplification in model – not including interaction of mass and
latch (friction and normal force both contribute to resist motion of mass once in contact)
– Complete nonlinear model is under development Shock table tests
– Large amount of out-of-plane vibration– Out-of-plane vibration caused devices to reset themselves– Cap chip needed – packaging process under development
Designed Trigger Level (G’s)
Centrifuge Actual Trigger Level (G’s)
10 25
25 57
50 95
75 142
Thermal Reset Actuator
• 15V, 125mA currently required to reset the devices• Pulse duration 10ms• Vacuum packaging or removing the substrate underneath the device will
decrease the power required by 75%• 20mA, 10.1V for 15μm deflection in air• 10mA, 5.1V for 15μm deflection at 250mT
Future Work
Packaging– Wafer-level encapsulation of devices is critical to produce chips
with 5 level, three axis shock sensors with a small enough form factor
– Also critical to produce any reasonable number of testable devices, since devices often fracture when cleaving wafer
– Lower voltage and power requirements of reset actuators through vacuum packaging
Modeling– Complete contact/friction model to more accurately predict
trigger level
Refine design for more robust, smaller sensors