a dsp enabled microsystem for cochlear implants with hybrid lc clocking
DESCRIPTION
Telemetry coil, RF interface, ADC, voltage regulator. Hermetic vacuum package. Flexible polyimide cable. 128-site high density electrode array. Back-end electronics, current sources, communication interface. A DSP Enabled Microsystem for Cochlear Implants with Hybrid LC Clocking. - PowerPoint PPT PresentationTRANSCRIPT
NSF ERC for Wireless Integrated MicroSystems (WIMS)NSF ERC for Wireless Integrated MicroSystems (WIMS) 1
A DSP Enabled Microsystem for Cochlear Implants with Hybrid LC Clocking
Register Files
Decode Execute
Memory Management Unit
BootROM
32kBSRAM
USART
Hybrid LC + Ring Clock Source
128k
B E
xter
nal
Mem
ory
X2DSP
LoopCache/Timer
X3SPI
LUT
Fetch
SPIX2
Telemetry coil,RF interface, ADC,voltage regulator
Flexible polyimide
cable
Back-end electronics,
current sources,communication
interface
128-site high density
electrode array
Hermeticvacuumpackage
MicHPF
BPF 1 Rectifier LPFNonlinear
MapEl-1
BPF 2 Rectifier LPFNonlinear
MapEl-2
BPF n Rectifier LPFNonlinear
MapEl-n
BandpassFilters
Envelope DetectionCompression
VolumeControl
PulseModulation
NSF ERC for Wireless Integrated MicroSystems (WIMS)NSF ERC for Wireless Integrated MicroSystems (WIMS) 2
CIS DSP Core
• 16 channels• Expandable
architecture• Reduced datapath
width• 3MHz operation
with 22kHz front-end ADC
• 3,000 pulses per second per channel maximum
• Four operating modes– Programming– Stimulation– Test– Sleep
16
Control Unit
15 8
ADC Data
HP HPReg
BPBPRegBPReg
LP LPRegLP
Reg
LUT
LUTRegLUTReg Vol
VolRegVolReg
ModulatorFSM
addrreset clknew
samplesleep
sleep cascadechannel
Filter Cascade
MCU Interface
writedata
readdata
addr writedata
readdata
addrdata
coeffwe
coeffdata
ADCdata
requestsample
LUTdata
LUTaddr
addr
data
NSF ERC for Wireless Integrated MicroSystems (WIMS)NSF ERC for Wireless Integrated MicroSystems (WIMS) 3
Microsystem Measured Results
• TSMC 0.18m MM/RF bulk CMOS
• 1.79mW from 1.2V is lowest reported DSP power consumption
• Add 22kHz 16-bit ADC in future
3.03mm
45.64 4.97
9.62b
2.46a
7.83
25.73
100MHz
VDD = 1.8V
0.76c
2.46
0.12
1.63
DSP Modea Standby
DSP Modea1MHzStandby
1.67
0.18c
1.14a
0.04
0.31
VDD = 1.2V
1.79
0.18c
1.14
0.03
0.44
0.33
0.18c
0.06
0.03
0.06
1.32
0.76c
0.27
0.12
0.17
Total (mW)
Clock (mW)
DSP (mW)
Memory (mW)
Core (mW)
45.64 4.97
9.62b
2.46a
7.83
25.73
100MHz
VDD = 1.8V
0.76c
2.46
0.12
1.63
DSP Modea Standby
DSP Modea1MHzStandby
1.67
0.18c
1.14a
0.04
0.31
VDD = 1.2V
1.79
0.18c
1.14
0.03
0.44
0.33
0.18c
0.06
0.03
0.06
1.32
0.76c
0.27
0.12
0.17
Total (mW)
Clock (mW)
DSP (mW)
Memory (mW)
Core (mW)
a. DSP is operating at 3MHz. Other components operating at speed necessary to support DSP function.b. LC oscillator is operating, ring oscillator is off.c. Ring oscillator is operating, LC oscillator is off.
Component
OperatingCondition
Component
OperatingCondition