a 20/30 gbps cmos backplane driver with digital pre-emphasis
DESCRIPTION
A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis. Paul Westergaard, Timothy Dickson, and Sorin Voinigescu University of Toronto Canada. Outline. Motivation Design Goals Circuit Description and Design Experimental Results Summary and Conclusion. Motivation. Application - PowerPoint PPT PresentationTRANSCRIPT
A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis
•Paul Westergaard, Timothy Dickson, and Sorin Voinigescu•University of Toronto•Canada
Outline
• Motivation• Design Goals• Circuit Description and Design • Experimental Results• Summary and Conclusion
MotivationApplication • Serial inter-chip communications over
backplanes at 20-Gb/s. Unfulfilled Needs • CMOS implementation over 10-Gbps• > 30 dB dynamic range, low-power • Programmable width and height pre-
emphasis to increase receiver simplicityPrior Art• Previous CMOS backplane drivers have
only achieved 10 Gb/s data rate.
Design Goals • 30-Gb/s main path operation without pre-emphasis • 20-Gb/s fully featured operation with
– ‘digital’ pre-emphasis – eye-crossing– output swing control
• High Sensitivity (<10 mVpp per side)• Large output swing (>350 mVpp per side)• 50-Ohm input/output matching• 1.5 V supply• 130 nm CMOS implementation
Circuit Design and Description
Biasing for peak fT and NFMIN
Peak fT bias
0.3mA/um
Min. NFMIN
0.15mA/um
Multi-stage amplifiers with signal path transistors biased at half peak fT
Circuit Architecture
• Multi-stage amplifier implementation• Input stage biased and sized for high
gain and low noise• Inductive broad-banding in every
inverter stage to reduce power and increase speed
• Main (higher-speed) and pre-emphasis paths are parallelized
Block Diagram
InputMatching
& Comparator
PulseWidth
Control
Vin
DelayBuffers Digital
Differentiator
Vout
OutputDriver
InputMatching
& Comparator
PulseWidth
Control
Vin
DelayBuffers Digital
Differentiator
Vout
OutputDriver
VinPVinN
VoutPVoutN
IbiasM1 M2
160 ohm 160 ohm
80 ohm 80 ohm 90 ohm 90 ohm
400 pH 400 pH 400 pH 400 pH
M1, M2 w = 36um, l = 0.13um Finger widths = 2um
12 mA
Input Matching and Low-Noise
Comparator
Eye-crossing Control
inN inP Voffset+ -
VmidDIFF
Vout+
-
Ibias = 1.2mA M1 M2 M3 M4 M5 M6
4.8mA Ioffset = 4.8mA 12mA
Vdd = 1.5V
100 ohm
700 pH
100 ohm
700 pH
110 ohm
900 pH
110 ohm
900 pH
M1 - M4 w = 24um, l = 0.13umM5, M6 w = 32um, l = 0.13um
Finger width = 2um
InputMatching
& Comparator
PulseWidth
Control
Vin
DelayBuffers Digital
Differentiator
Vout
OutputDriver
*D. S. McPherson, S. Voinigescu et alIEEE GaAs IC Symp. - Oct. 2002
Digital Pre-emphasis Delay Circuit Input
Matching& Comparator
PulseWidth
Control
Vin
DelayBuffers Digital
Differentiator
Vout
OutputDriver
DelayBuffers Digital
Differentiator
Vout
OutputDriver
++
Digital Differentiator
VoutN
Vdd
VoutP
IN IN IN IN
INdly INdlyINdly INdly
Vdd
Ibias = 2mA
Iswch = 10mAIswch = 10mA
M1 M2 M3 M4 M5 M6
M7 M8 M9 M10
Vdd = 1.5V
50 ohm50 ohm
M1 to M10 w = 32um, l = 0.13umM11, M12 w = 10um, l = 0.13um
Finger widths = 2um
InputMatching
& Comparator
PulseWidth
Control
Vin
DelayBuffers Digital
Differentiator
Vout
OutputDriver
IN
INdly
IN
INdly
VoutP
VoutN
VoutP
VoutNIN.INdly
IN.INdly
IN.INdly
IN.INdly
Inductor design considerations
• Inductor broadband “2-” model model extracted for design from ASITIC simulations.
• Multi-layer ( 2 or 3 metals) design used to minimize inductor area (400, 700, 900 pH used)
• Largest inductor side is 44 um (900 pH)
Experimental Results
Chip Photograph
1.0 mm
0.5
mm
DigitalDifferentiator
DelayBuffers
OutputDriver
InputMatching
& Comparator
PulseWidth
Control
Input/Output Return Loss
Measured Eye-diagrams: 0.3Vp-p output
20 Gb/s 25 Gb/s
30 Gb/s
Sensitivity
20 Gb/s 30 Gb/s
Input: 21mVpp one side onlyOutput: 80mVpp per side
20-Gbs Eye with Pre-emphasis
Output Swing Control @20Gbps
Input: 200mVpp one side only
Output: 170mVpp Output: 340mVpp
Output Swing Control @30 Gbps
Output: 170mVpp Output: 270mVpp
(Gain at 30 Gb/s!)
Input: 200mVpp one side only
30%-70% Crossing Control @20 Gbs
70%30%
50%
40%-60% Crossing Control @ 25 Gbs
60%40%
50%
Summary and Conclusion
Performance SummaryParameter Measured val.
Technology 130nm CMOSSupply Voltage 1.5 VPower Dissipation 150 mWOutput Swing @ 20 Gb/s 170-350 mVp-pPre-emphasis @ 20 Gb/s 30%/10%Crossing Control @ 20Gb/s 30% to 70%Eye sensitivity @ 20 Gb/s 20(10) mVppDynamic Range @ 20 Gb/s 30 dBNoise Figure(10GHz,15GHz) 16.5 dB, 17 dBS11/S22 up to 50 GHz <-12 dB
Conclusion• First CMOS driver above 20 Gb/s• Novel digital pre-emphasis• High sensitivity, dynamic range• Large output swing• Eye-crossing control• Communications between chips and
backplanes is feasible at 20 Gb/s in 130-nm CMOS technology
Acknowledgements
• Rudy Beerkens and Boris Prokes of STMicroelectronics Ottawa
• STMicroelectronics for fabrication• Micronet and Gennum Corporation
for financial support• Quake Technologies for access to 40
Gb/s BERT