7 th acfa, h.j.kim intermediate tracker h. j. kim, knu h. j. kim, knu 2004/11/09 7 th acfa workshop...
TRANSCRIPT
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7th ACFA, H.J.Kim
Intermediate TrackerIntermediate Tracker
H. J. Kim, KNUH. J. Kim, KNU
2004/11/09 72004/11/09 7thth ACFA workshop ACFA workshop
1.1. IntroductionIntroduction2.2. Intermediate trackers/FTD for LCIntermediate trackers/FTD for LC3.3. Simulation study Simulation study 4.4. Outside Si-tracker optionOutside Si-tracker option5.5. Silicon strip R&D for the intermediate tracker Silicon strip R&D for the intermediate tracker 6.6. SummarySummary
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▣ Why VTX and tracking important?Why VTX and tracking important?
• recoil mass reconstruction - importance of tracking resolution
q qbar ( b bbar -> Vertex! )
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General view ofGeneral view of Three detector option Three detector option
GLD(Huge)
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*To improve1) the linking efficiency of a main track to the corresponding VTX hits,2) the reconstruction efficiency of low-momentum tracks and of particles which decay between the VTX and the Main tracking system3) the momentum resolution of tracks.
* * If the beam background is very severe, you If the beam background is very severe, you can turn off the HV of inner layers of TPC can turn off the HV of inner layers of TPC without serious performance losswithout serious performance loss
*Trigger and/or Time stamping capability
*Standalone tracking
Purpose of Intermediate Tracker
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Silicon Tracking for SiD (Jaros’s talk)Silicon Tracking for SiD (Jaros’s talk)
Why silicon microstrips? SiD starting point Why silicon microstrips? SiD starting point Robust against beam haloRobust against beam halo showers showers
Thin, even for forward tracks.Thin, even for forward tracks. Won’t degrade ECAL Won’t degrade ECAL
Stable alignment and calibration.Stable alignment and calibration. No wandering T to D. No wandering T to D.
Excellent momentum resolution (Excellent momentum resolution (p/pp/p22~2 x 10~2 x 10-5-5))
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TESLA TESLA tracking systemtracking system
from TESLA TDR
cos()=.995
Magnetic field: 4 Tesla
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From Behnke’s talkFrom Behnke’s talk
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From Behnke’s talkFrom Behnke’s talk
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Typical “Typical “Large/Large/Huge” models under considerationHuge” models under consideration
SiVTX pixel(cold version)
HCAL(Pb(Fe)/scinti or digital)
W/Scinti ECAL
TPC(Jet chamber as option)
Si intermedi.-Trk
SC-coil
SiVTX pixel
Pb/scinti HCAL
Pb/Scinti ECAL
Jet chamber
Si intermedi.-Trk
SC-coil
“GLC” design (ACFA) “Large/Huge”
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• stand-alone tracking capability
▣ Intermediate Tracker Configuration
• 5 layers at r = 9 to 37 cm• angular coverage |cosΘ|<0.9• spatial resolution σ = 10 μm• thickness of a layer: 0.6% Xo
Huge detector concept:TPC: Rmin = 40 cm
Do not expect much changes in IT
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Intermediate Tracker DesignIntermediate Tracker Designfor GLCfor GLC - Double-sided silicon microstrip detectors- Double-sided silicon microstrip detectors i. excellent spatial resolution i. excellent spatial resolution ii. well-established technology ii. well-established technology
Layout of the IT surrounding the VTX.Layout of the IT surrounding the VTX.
- The distance between the last layer of VTX and the first layer of Trackeris - The distance between the last layer of VTX and the first layer of Trackeris about 39cm in Large detector design.about 39cm in Large detector design.
i. 5 layers of coaxial cylinders at 9, 16, 23, 30 and 37cmi. 5 layers of coaxial cylinders at 9, 16, 23, 30 and 37cmii. covers | |<0.90 coinciding with the region covered by VTXii. covers | |<0.90 coinciding with the region covered by VTXcos
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r = 10, 20, 30, 40 w/ std. design parameters
Momentum Resolution /Pt Pt .vs Pt( )
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Linking Efficiency
Linking efficiency is able to be measured by “Residual” which is defined as a precision from the difference of distance between the position of extrapolate track of main tracking & the hit position on IT or VTX layers
( )ext hitdrphi r
ext hitdz z z CDC
IT5
Figure. The definition of Residuals.
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7th ACFA, H.J.Kim
Residuals for a single pion
Residuals vs. generation energy for a single pion
For a single pion, a linking efficiency with IT+VTX is improved by ~20 % compared to that with VTX only.
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7th ACFA, H.J.Kim
Why Si Tracker ?Why Si Tracker ? (Sugimoto’s tal (Sugimoto’s talk)k)
• 5x105x10-5-5 does not satisfy the design does not satisfy the design criteria if the beam energy spread is criteria if the beam energy spread is 0.1%0.1%
• The performance goal should be 2x10The performance goal should be 2x10-5-5
• How? How?
Outside Outside Si Tracker for a Si Tracker for a HugeHuge Detector ???Detector ???
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The Detector ModelThe Detector Model
• Si Vertex DetectorSi Vertex Detector– 5 layers, t=705 layers, t=70m, m, =3=3mm– coscos< 1 (non-realistic)< 1 (non-realistic)
• Si Inner TrackerSi Inner Tracker– 3 layers (12, 24, 36 cm), t=3003 layers (12, 24, 36 cm), t=300m, m, =7=7mm– coscos <1 (non-realistic) <1 (non-realistic)
• TPCTPC– 40cm < R < 200cm, Z<235cm40cm < R < 200cm, Z<235cm– Ar gas, 220 samples, Ar gas, 220 samples, =150=150mm
• Si Outer TrackerSi Outer Tracker– R=205cm(barrel)/Z=250cm(EC), R=205cm(barrel)/Z=250cm(EC), =7=7mm
• Momentum resolution is calculated following Momentum resolution is calculated following Gluckstern’s methodGluckstern’s method– No sophisticated method such as Kalman filter is usedNo sophisticated method such as Kalman filter is used
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PerformancePerformance
Pt (GeV/c)
Pt/Pt2
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PerformancePerformance
cos
P/P2 (M.S. not included)
FTD?
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▣ Silicon sensor R&D Silicon sensor R&D <- Details by B.G.Cheon<- Details by B.G.Cheon
Metal 1 and metal 2 contact (VIA) Metal 1 and metal 2 contact (VIA)
n+ ohmic n+ ohmic sideside
p+ p+ junction junction
sideside
11stst metal metal
22ndnd metal readout line metal readout line
• double sided silicon strip• tree metal process- implant strips in ohmic side are orthogonal to those in junction side-readout strips in junction side have the same direction as that of ohmic side
Front Side: - brown: implanted n+ - blue: p-stop - sky blue: SiO2 - gray: Al for readout
Back Side: - blue: implanted p+ - first gray: 1st metal - sky blue: SiO2 - vertical gray: VIA - second gray: 2nd metal
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7th ACFA, H.J.Kim
512ch 100um pitch sensor Without hour glass
512ch 100um pitch sensorWith hour glass
1cm PIN Diode
For SDD R&D
PIN Diode array
16ch 100um pitch sensor
16ch 100um pitch SSD
32ch 100um pitch sensor
64ch 100um pitch sensor
▣ MASK Design : P SideMASK Design : P Side
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▣ Silicon Sensor
n+ implantedp-stop in atoll
via in hourglassreadout pad in staggering
guard ring
p+ implanted readout strip
N side P side
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▣ Measurements
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0 20 40 60 80 100 120
1E-8
1E-7
1E-6
Leak
age
curr
ent (
A)
Reverse bias voltage(V)
LOT4_1_T1 LOT4_4_T1 LOT4_4_T3
These aredisappearedafter insulatingwafer edges
▣ Measurements of the sensor
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▣ Sensor Readout
FADC
Control Signal
DSSD
RC chip
VA-TA
FPGA
USB2DAQ
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USB2 with 25Mhz 12bit FADC for Readout USB2 with 25Mhz 12bit FADC for Readout R&DR&D
FX2 FADCCPLD
Flash RAMSRAM
31 FPGA I/O for R&D
trigger
input
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Radiation hardness beamtest with protonRadiation hardness beamtest with proton
•Radiation damage problem -> Signal reduction -> Noise increase -> Depletion voltage increase -> Sensor damage
• Radiation damage Measurement -> 30-50MeV Cyclotron proton, neutron beam irradiation (Korean cancer center hospital, Seoul, Korea) -> Leakage current measurement -> Capacitance measurement -> Signal measurement
• Processing improvement -> Radiation damage characteristics study -> Radiation hardness improvement
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IIntermediatentermediate TTracker R&D Activities in racker R&D Activities in KoreaKorea
√ linking and reconstruction efficiency (Fast Simulation) √ track momentum resolution (Full Simulation) √ DSSD simulation/design/fabrication Electronics(RC chip, VA1TA, FADC), DAQ √ S/N ratio measurement and beam test
- Kyungpook National University - Korea University - Seoul National University - Chunnam National University - Sungkyunkwan University
Sensor designProcess chart
KNU / SNU
Simulation(process and device)
KNU/SKKU
DAQ/Electronics/Test
KNU/KU/CNU
Sensor
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7th ACFA, H.J.Kim
SummarySummary
• Intermediate Tracker is necessary to improve momentum rIntermediate Tracker is necessary to improve momentum resolution and track linking efficiencyesolution and track linking efficiency
• TPC+Si Tracker System in GLD including SOT TPC+Si Tracker System in GLD including SOT will satisfy the original design criteria even will satisfy the original design criteria even for for Eb=0.1% in wide angular range (|cosEb=0.1% in wide angular range (|cos||<0.9). <0.9).
• Double (single) side silicon strip sensor R&D is ongoing in Double (single) side silicon strip sensor R&D is ongoing in KoreaKorea
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Study issueStudy issue
• Intermediate tracker geometry optimization Intermediate tracker geometry optimization
• FTD geometry optimizationFTD geometry optimization • Double side vs Single side strip senorDouble side vs Single side strip senor
• Intermediate tracker trigger?Intermediate tracker trigger?
• Time stamping (Separation of bunches)Time stamping (Separation of bunches)
• Radiation hardness Radiation hardness
• Mechanical structureMechanical structure
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Backup slide
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▣ Cleaning Room
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512ch 50um pitch sensor
1cm PIN Diode
For SDD R&D
64ch 50um pitch sensor
32ch 50um pitch sensor
16ch 50um pitch sensor
Backside of SSD
PIN Diode array
▣ MASK Design : N MASK Design : N SideSide
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Radiation damage by n, p and Radiation damage by n, p and ee
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• Require good σrΦ and σz
• Reasonable (moderate) cost
TypeType σσrrΦΦ σσzz
MSGCMSGC
+GEM+GEM
3030μμ 3030μμmm Fast SignalFast Signal
SSDSSD 10 10 μμmm 20 20 μμmm
Straw ChamberStraw Chamber 50 50 μμmm 1mm1mm
Fiber TrackerFiber Tracker 50 50 μμmm 1mm1mm Fast SignalFast Signal
Inner DCInner DC 80 80 μμmm 1mm1mm
▣ Intermediate Tracker Option
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Pt/PtPt/Pt2 2 : Measurement Term: Measurement Term
SiDSiD GLDGLD((SiSi=7=7m)m)
GLDGLD((SiSi=10=10m)m)
TESLATESLA((SiSi=10=10m)m)
TESLATESLA((SiSi=7=7m)m)
TPCTPC 1.2x101.2x10-4-4 1.2x101.2x10-4-4 1.5x101.5x10-4-4 1.5x101.5x10-4-4
VTX+TPCVTX+TPC 4.6x104.6x10-5-5 4.6x104.6x10-5-5 5.2x105.2x10-5-5 5.2x105.2x10-5-5
VTX+SIT+TPCVTX+SIT+TPC 2.9x102.9x10-5-5 3.4x103.4x10-5-5 4.1x104.1x10-5-5 3.5x103.5x10-5-5
VTX+SIT+TPC+SVTX+SIT+TPC+SOTOT
1.9x101.9x10-5-5 2.3x102.3x10-5-5 2.6x102.6x10-5-5 2.2x102.2x10-5-5
VTX+SIT+SOTVTX+SIT+SOT 2.1x102.1x10-5-5 2.4x102.4x10-5-5 3.2x103.2x10-5-5 3.7x103.7x10-5-5 2.8x102.8x10-5-5
VTX=3m in all cases