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ith cell phoneto make ourt where the py. Now the isgies like micro
olding technicnot every inindustry. It’s any has becom
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ronically mic
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ldKnow
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en around a25 years agoears or so why for their ne
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ir grey, “Brig and into ournsive to buyclusive .
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e needs to exindustry sincpassed its prem more like dassessable anhave their ow
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here the use ext generation
gy has not onrow things as Today you co trouble at a
hat it took…
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plain what’s ce 1983. Theedecessors andevices that nd are no lown phone.
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phone indusent trend seehe same foot
ong as the “o electronics of micro plan products.
nly helped shs well. Who can have a 5all.
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telephone ts big, clunkymore expensi
happen to the functionalitnd today’s phwere once lionger an exc
h each new dstry seems toms to be gointprint? That’s
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1.The
The first tyou are tomany equmicro mo
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Part desigparts haveID of the t
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d of the day tion is to helps the DESIGN
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thing we thino maximize youations the colding since ev
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he amount of
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nd thing to non critical to uring world he time to des
r make that n
xt dream a re of micro mg what it canan take your d
you have to p you underst that wins th
Understan
nk everyone sour design, knoncept of, “Stven the slight
u’re talking an whether thns and stack change beco
of its final fufor changes. change. There
ote here is thknow you hahas done wonsign, create, t
Today mtakes tophones
bigger…
So what
In many
the samdevice
ext compone
eality the resmolding we do for you, hdeign is essen
design a funtand how bese creative bat
ndingthe
should know nowing what tart with the test design ch
bout a projece part will fitolerances aromes more of
nctionality caFor example,
efore, the lim
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micro technoo build thingsmore powe
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t does this all
y ways we’reme things. less invasive,ent do more i
t of the convbelieve everhow you can ntial in maxim
nctional prodst to approacttle.
Approach
about micro
you can and end in mind”
hange along th
ct with a .005ll. Resin chanre nothing nef a limiting fac
an have adve, if you’re desmit of what th
y which your acturable patspeed, creatose.
logy has shrus bigger. The er give big better.
l mean to you
e all trying tMake that , make that n less space.
versation willryone shouldtake full adv
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o molding is ucan’t get aw” is familiar. The way can d
5” wall thicknnges can alsoew to part dector.
erse effect if signing a parte OD of your
parts are ma
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l focus on thed know. Likevantage of theue.
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understandin
ay with is theThis can be ederail a projec
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y with prototin the desighas freed us
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set off as oneets.
blem is tha
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r database ontact our favomay be more d
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on much largght we see aom a resin veended gate ll based on tearly see the molded part
ceiving startiour part is noesign processhing the limits
42:1 Asp e
fficult enougomes when ymoldable into e limits, the m
of resins tryinorite resin supdifficult than
hin section is ate and ejectend, a full 42:
mally; with
ata sheet ger parts. a common ndor. The size, flow this much gate as it t only 800
ing point. Thot moldable s can end at s you’re boun
3.24mm
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h when it coou’ve finally the shape yomore difficult
ng to match pplier to get ait seems how
76µm or .003ion locations 1 aspect.
e frustrating and either gthis step on nd to run into
76µm
5
Gate
Location
omes to choodecided whiou need. At t this task can
up what theadvice on whwever.
3” thick. The to maximize
thing is yougive up or alsome occasi a few barrie
.08mm
osing what wich material wthe micro len be.
part calls fohat materials
To de
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ately come tect in a nonn’t always hav
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r your d you more
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o this n‐ideal ve to.
Part
Next we decided to ask the resin experts themselves for their advice. Certainly they know their materials and what may or may not work. Here are a few of the responses we got back when we asked them what material they would recommend to mold this part.
– “The wall thickness would require an increase of 5x to 10x the current .003” in order to fill.”
– “Molding the part thicker and grind it down to the desired thickness.”
– “In looking at the part, the .003” section will not fill any of the listed materials. In fact, I believe
you will be hard pressed to find a thermoplastic material that would fill that .0127” long, .003”
wall.”
– “I do believe you would need to be in the .015” wall thickness zone.”
– “We would suggest increasing the .003” wall thickness to at least .015” or, better yet, .030” in
order to improve moldability.
– “In my opinion filling this geometry would not be possible in a production environment. I would
consider trying to mold a PP at approximately .016” ‐ .018” and an Acetal 9 melt at .025”.
Again this can be a discouraging step if you’re convinced now your part is not moldable as is.
We push on…
We chose 11 different materials that we see every day and put them to the test to see how each material would fill the thin sections. Many of these are highly engineered resins, some with glass or other fillers as well.
1. Polyethylene (PE)
2. Polypropylene (PP)
3. Polyamide w/ 30% Glass Fill (Nylon)
4. Polycarbonate (PC)
5. Polysulfone (PSU)
6. Polyoxymethylene (POM)
7. Polybutylene Terephthalate (PBT)
8. Polymethyl Methacrylate (PMMA)
9. Polyether Ether Ketone (PEEK)
10. Polyetherimide (PEI, Ultem)
11. Liquid Crystal Polymer (LCP)
As you ca42:1 distadidn’t go
Now herethickness
outcome perform tsheets, re
This is wmolder amaterial ssome case
For examwith a 70when it sometime
creating s
Poly
Poly s
Polyet h
n see there wance! Some oterribly far at
e is where it . It was simall by itself. Tthis way. Youesin suppliers
why we recomt the early cselection keees it just migh
ple the pictuµm through hcomes to fies allow evesmall details.
yethylene (PE)
sulfone (PSU)
her Ether Ketone (PEEK)
42:1
14:1
3:1
was a wide vaof the rest wt all.
can get difficmply to comp
The test was aur results areand your par
mmend you concept stagp you from yht not be a pr
re at the righhole. As we slling small aen stubborn
Poly p
Polyo x
Polye t
ariety of resuwent well pas
cult. This testpare how malso not a det very much trt design can
work with yes of designour ideal partroblem after a
ht is an Ultemsaw Ultem caareas. Part dmaterials a
propylene (PP)
xymethylene (PO M
therimide (PEI)
10:1
42:1
42:1
ults. Four of thst the guideli
t wasn’t to seaterial selectermination ttied to your dbe at odds.
your micro . Don’t let t design. In all.
m (PEI) part n be tough design can chance at
Poly
M) Po
Terep
Liqui d
he chosen reine of 6:1 an
ee how far otion can grehat in all situdesign. But y
yamide (Nylon)
olybutylene phthalate (PBT)
d Crystal Polyme r(LCP)
18:1
42:1
25:1
esins actually nd some, like
one could puseatly determations the ma
you can clear
Poly c
Polyme t
r
made it the ee PEEK and U
sh PEEK at a ine the mol
aterials will arly see where
carbonate (PC)
thyl Methacrylate (PMMA)
26:1
70µm
14:1
entire Ultem,
.003” ldable always e data
3.Prot
The third
Here agaPrototypi
one migh
material cphase.
If you’ve material smicro parachieve wisn’t just commerc
Now this are a verprototype
push the
We tried We sent t
L .200” x W
Ø .020”
Ø .010”
totyping:T
thing we thin
in is anotheng as you knt need to prcompatibility
ever sent ouselection resprts or featureswhat you neea “try it” kinially available
study was nory effective. e. However wlimits with m
to approach the part out fo
W .200” x H .125”
TheChall
nk everyone s
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ot to judge thIn some casewe wanted to olding it’s go
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ork Height .001”
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L .015” xW .006”
e
L .005” xW .0025”
ototyping.
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Case 1:
This tinneeded
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r the project. atures with th
a barrier in yess about theequire custo
t
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more of a phil
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ny part, mad
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has a tri‐lobeottom to re
er fiber.
ber holder nght tolerances, it also refinish and co be succe
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ng on orking
are a at the
(PEI), everal age. It with a and a posite. slot at 25µm
quires small
optical e light Ultem uilding
case wheinjection u
or three s
ere the custounit to make
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mer’s ideal wit happen.
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Case 3:
Here’s limits wpart, abcomple
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:
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ated compon
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e of pushingmolding. The ng, is an extre
part wit
tal inserts. top has 5 dis
pecially withombining thethe different and shut‐of
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