4/8/2002, monday scientists
DESCRIPTION
4/8/2002, Monday Scientists. Interfacial Fracture. Interfacial Fracture (Scientists). J.W. Hutchinson J.R. Rice Z. Suo. Complex Singular Stress Field. Stress Oscillation. Mode Mixty. Electronic Packaging. MEMS Packaging. MicroElectroMechanical Systems. Processing. - PowerPoint PPT PresentationTRANSCRIPT
4/8/2002, Monday
Scientists
Interfacial Fracture
Interfacial Fracture (Scientists)
J.W. HutchinsonJ.R. RiceZ. Suo
Complex Singular Stress Field
€
σ yy+iσ xy =(K I +iK II )r
iε
2πr
€
ε=12π
log
ν1
G1
+1G2
1G1
+ν2
G2
⎡
⎣
⎢ ⎢ ⎢ ⎢
⎤
⎦
⎥ ⎥ ⎥ ⎥
Stress Oscillation
Mode Mixty
Electronic Packaging
MEMS Packaging
MicroElectroMechanical Systems
Processing
Very Small Peripheral Array (VSPA)
Thin Film
Nix
Thin Film Technology
Thin Film Processing
Film Growth
Zuqiang QiBo Shi
Electroceramics
Z. Suo
Damage Mechanics
Jean-Louis Chaboche
Voyiadjis, G.Z. and Robert DorganGradient formulation in coupled damage-plasticityArchives of Mechanics, 53, 565-597
Composite Toughness
EFFECTS OF PULL-OUT ON THE MECHANICAL-PROPERTIES OF CERAMIC-MATRIX COMPOSITES
THOULESS MD, EVANS AG
ACTA METALLURGICA, 36 (3): 517-522, 1988
Fiber Pull-out
Amol Jadhav