40 years - allwin21 corp-rtp asher etcher sputter thin
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Proven Qualified
40 Years
AW-1008 Plasma Stripper Asher Equipment
All specification and information here are subject to change without notice and cannot be used for purchase and facility plan. All legacy equipment trademarks belong to O.E.M.. © 2021 Allwin21 Corp. All Rights Reserved.
Proven Qualified
Production24/7
All specification and information here are subject to change without notice and cannot be used for purchase and facility plan. All legacy equipment trademarks belong to O.E.M.. © 2021 Allwin21 Corp. All Rights Reserved.
AW-1008 Plasma Stripper Asher Equipment
Originated FromThe Dominant
Plasma Stripper Asherof 4-6” Single Wafer in 80’s,90’s
Proven Qualified
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies
3-axis Integrated Solid Robotic
Wafer Transfer
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies
AW-1008 Plasma Stripper Asher Equipment
CLTC(Closed Loop Temperature Control)
TC Recipe Drive 1000W Lamps
Advanced Technologies
Industrial Grade Computer with Large Hard Disk Driver
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies
AW-1008 Plasma Stripper Asher Equipment
Special Quartz Tray for Multiple Wafers
•3” & 4”•4” & 6”
Advanced Technologies
• Fixed Cassette Station
• With Sensors (Optional)
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies Allwin21 Software
Recipe Edit Factory Set Up
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies Allwin21 Software
Board Test Pressure Calibration
AW-1008 Plasma Stripper Asher Equipment
Substrate Capability:
• 4”,5”,6”
• Round
• Multiple wafer sizes without hardware change
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Microwave Power:
• 2.45 GHz
• 1000W
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Temperature:
• 150-250°C for Descum, No
Control
• 250-350°C Thermocouple with
RTP Control Technologies
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Gases:
• 1-4 Gases
• MFC
• Customized. Typical Gases are O2,N2
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
GEM/SEC II Function:
• Optional
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Asher Rate Capability
•~1000 A/min (Descum) •~3.5 um/min(Asher)•Process Dependent•Process Support if necessary.
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Uniformity Capability
• <±10-20%
• Process Dependent
• 6” wafer
Configurations and Typical Processes
AW-1008 Plasma Stripper Asher Equipment
Advanced Technologies Small Footprint
•Width: 32”
•Depth: 32”
•Height: 64”
AW-1008 Plasma Stripper Asher Equipment
Let’s All win in the 21st Century
Email: [email protected]
Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010AW-1008 Plasma Stripper Asher Equipment