3D IC Support Infrastructure

2013-10-2

Ir Dr. HL Yiu

Head, Electronic Cluster

HKSTPC

3D-IC Applications

3D-IC can be widely applied to various electronics products from consumer electronics to biomedical electronics, from wireless communication to internet of things, from aerospace electronics to automotive electronics:

0

5

10

15

20

25

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015

Waf

er V

olum

e ( x

Mill

ion)

CMOS Image Sensor MEMS Wireless 3D-SiP Stacked Memories Embedded Memories Logic 3D-SiP LED

High Density Memory Stacking; High Performance Micro-systems (e.g. automotive, transportations, communications, etc.); Special Function Systems (LED, Image Sensors, etc.).

Source: Yole Development 2009

Moore’s Law

3

Source: http://www.hindawi.com/journals/acisc/2013/426962/fig15/

Stacking increases density

4

How 3D IC improve performance?

5

6

Source: ASE Group

HKSTPC 3D IC Services

IC Companies in Science Park

Over 80 companies of electronics cluster in Science Park

Expanding HKSTPC Lab Services

Green Tech Biotech Precision

Engineering IT/Telecom Electronics

Biotech Support Lab

Solar Energy Technical Support Centre

IC Design Centre

IP Servicing Centre

Probe & Test Centre

Failure Analysis Lab

Reliability Lab

Materials Analysis Lab

Wireless Communications

Test Lab

Solid State Lighting Lab

3D SiP Lab

3D WLP Lab

NEW !!!

All laboratories are within 15 minutes

walking distance in HKSP

> 500 manyears of experience!

Completing the IC Lab Services

Electronics

IC Design Centre

IP Servicing Centre

(by MPW)

Probe & Test Centre

Failure Analysis Lab

Reliability Lab

3D SiP & 3D WLP Lab

Packaging

2013/10/4

11

3D SiP Lab and Pilot Line (Phase 1)

Lead frame Packages. BGA on Organic Substrate Packages. MCM and COB on Laminate/Ceramics Substrate.

Die Attach （Placement 15μm @3sigma）

Plasma clean （Ar/N2 gas）

Wire bond （Placement 10μm @3sigma）

Transfer mold （Thermal set）

Liquid encapsulation

(High/ low viscosity)

T/F Press Trim & Singulation

(10 Tons Hydraulic)

Wafer Saw

Key Technologies of 3D WLP

3D-IC WLP

TSV Forming

Via Filling

Micro Bumping

Wafer Thinning

C2C/C2W/W2W Bonding

12

3D WLP Lab and Pilot Line (Phase 2)

Bumping Bonder

Wafer Thinning PECVD

Plasma DRIE Aligner

Spin Coater

Sputtering System

Metal Electroplating

National IC Design Base

Failure Analysis Thermal, stress,

molding, wiring failures

IC Design and IP Service EDA, Secure Virtual IP

Chamber

3D SiP / WLP Package Design

Package Design, CAD Tools

Reliability Test Qualification, Life

Testing

Wafer Testing Pilot Production

Test program development, wafer sort, final test

香港国家集成电路設計产业化基地

Design Testing Reliability Analysis

15

3D-IC Challenges

Hong Kong 3D-IC Capability

Source : ASTRI

Green Energy

Li-ion Battery Anode Materials CPV Module

Green Energy

Li-ion Battery Anode Materials CPV Module

LED

LED Chip, Packaging, Lighting & Control

Touch & Intelligent Display

3D Pico-projectors

SiP / 3D Packaging TPMS

Anti-counterfeit Identification

Printed Electronics

Healthcare Electronics

Optical Anti-shaking, Auto-focus & Zoom Camera Modules

Packaging & Sensing

SiP / 3D Packaging TPMS

Anti-counterfeit Identification

Printed Electronics

Healthcare Electronics

Optical Anti-shaking, Auto-focus & Zoom Camera Modules

Packaging & Sensing

3DIC Packaging &

Micro-fabrication

3DIC Packaging &

Micro-fabrication

3D SiP Lab Schedule

Approval Jun 2012 Move-in Apr 2013 Operation Commenced

2013/10/4

17

3D WLP Lab Schedule

Approval Mar 2013 Move-in Mar-Dec 2014 Operation Commence

Partial May 2014 Full Dec 2014

2013/10/4

18

Thank you!

19