3d embedded substrate technologies increase density and performance of power supplies
TRANSCRIPT
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Significant Developments and Trends in 3D Packaging with
Focus on Embedded Substrate Technologies
Presented by PSMA Packaging Committee
Brian Narveson and Ernie Parker, Co-Chairmen
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Thank you for our sponsor
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Before We Start
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Aimee Kalnoskas Design World / EE Network
Moderator
Brian Narveson Co-chairman PSMA
Packaging Committee Narveson Consulting
Significant Developments and Trends in 3D Packaging with Focus on Embedded Substrate Technologies
Meet your presenters
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Technology Report Commissioned • Why: Phase 1 Technology Report on 3D Power Packaging determined
the power industry was interested in and beginning to manufacture Embedded Substrate power products
• Methodology: Ltec Corporation commissioned to create Technology Report: o Researched 740 published articles from industry, government and academia o Interviewed 30 Industry and Academic Experts o Attended 10 trade shows, conferences and seminars
• Purpose: To determine the availability of imbedded substrate technology usable by the Power Industry
PSMA 3D Power Packaging Phase IIA Special Project of the
PSMA Packaging Committee
TECHNOLOGY REPORT
Current Developments in 3D PackagingWith Focus on Embedded Substrate Technologies
LTEC CorporationLouis BurgyanYuji KakizakiYukata Hama
Hideki Nakagawa
Anagenesis, Inc.Arnold Alderman
Fraunhofer-‐Institute for Reliability and Microintegration
Lars BöettcherThomas Löher
Authors:
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What is 3D Power Packaging • Power supply products derived from the use of the z axis • Incorporation of a variety of technologies to reduce footprint • Solutions that increase power density (W/cm3) • Manufacturing solutions that can print or construct interconnects or
circuit layers
Embedding Actives or Passives in Substrate
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What is Embedded Substrate Technology • A 3D Embedded Power Module is a “systems that use a combination
of at least one controller/driver IC, at least one active component in the power train, and associated interconnect means, embedded in a single package.”
• Component embedding is “the inclusion of at least one active or passive electrical component within the top and bottom conductive layers of a substrate.”
• A substrate is defined for this study as “a planar structure having multiple conductive and insulating layers.”
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Embedded Power Market Drivers • Digital functionality and power consumption increasing at a rate of
“More than Moore” o CMOS has hit the wall, transistor efficiency is not increasing, and processor clock
speeds are stagnating. o Advanced deep submicron semiconductor technology has hit a cost barrier o Barrier overcome with a paradigm shift in digital semiconductor packaging o Leading technologies are wafer thinning, through-silicon vias (TSV) and 2.5D and
3D integration o Power requirements increasing 2 to 5 times, within the same footprint, in one
generation
• Power density and efficiency improvement with wide gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) are facing a “construction barrier” o Optimum performance can only be achieved with packaging free of bond wires o Embedded substrate technology is a disruptive technology that can lead to large
increases in power density and efficiency
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Why is Embedded 3D Packaging Important • What you told us: Motivation for using embedded packaging.
% of Available Score
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At what Power Levels are you Interested in Embedded 3D Packaging
• What you told us:
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Technology Areas Studied • PCB’s and Inorganic Substrates • High Temperature Die Attach, High-lead Solder Substitution
• Passives – Resistors – Capacitors – Magnetics
• Interposers • Packaging Technologies • Thermal Management • Additive Manufacturing • The report is 10 Chapters, 335 pages, with 394 Publications cited and 172 links provided
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Benefits of Embedded Substrate Technology • Performance • Reliability • Ease of use • Solution size • Thermal management • EMI shielding • Reduced need for product-specific tooling • Reduced need for additional packaging • Fast time to market • Cost?
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Standards for Embedded Substrate Technology • Substrates and Components
o IPC-2316: Design Guide for Embedded Passive Device Printed Boards o IPC-4811: Specification for Embedded Passive Device Resistor Materials
for Rigid and Multilayer Printed Boards o IPC-4821: Specification for Embedded Passive Device Capacitor
Materials for Rigid and Multilayer Printed Boards. o IPC-4101: Specification for Base Materials for Rigid and Multilayer
Printed Boards o IPC-6012: Qualification and Performance Specification for Rigid Printed
Boards o IPC-7092: Design and Assembly Process Implementation for Embedded
Components (being written) o JCPA – EB01-2013: Parts Built-in Electronic Circuit Board (Component
Built-in Board) Data Format Design Guide – 2nd Edition o JPCA – EB02-2013: Standard on Device Embedded Substrate
Terminology / Reliability / Test / Design Guide 4th Edition
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AT&S Embedded Component Packaging
(ECPTM) Process Flow
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GaN devices of GaN Systems Inc.
embedded in AT&S (ECPTM) process
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TDK SESUB Process
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General Electric’s Power Overlay Technology
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Infineon’s DrBladeTM 2 Package
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Schweizer’s P2-PAK approach
p² Pack® module assembly with logic
PCB
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Semikron’s Sintered SKiNTM PROCESS
Power Module with 3 Sintered Joints
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Shinko Electric’s Molded Core
Embedded Package (MceP®)
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Embedded Components Formed Passives Inserted Passives Active Devices
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Component Types and Processes
Example of an embedded assembly Source: IPC International Technology Roadmap
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Resistors • Formed Technologies
Source: Micro Consulting Services
• Inserted-Suppliers of embeddable resistors – KOA Speer Electronics, Inc – Aeroflex (A Cobham Company) – Panasonic – Stackpole Electronics, Inc. – Vishay Intertechnology, Inc – Ohmega Technologies, Inc.
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Capacitors • Formed Technologies
Capacitance range for formed capacitor materials Source: IPC-2316
• Inserted-Suppliers – AVX Corporation – Murata Electronics – Kemet Corporation – IPDiA – Taiyo-Yuden Company – TDK
1 pF 10 pF 100 pF 1 nF 10 nF 100 nF 1 mF
Planar Capacitance Laminates
Polymer Thick Films
Ceramic Thick Films
Ceramic Filled Photopolymer
Capacitance Range
IPDiA’s deep trench silicon capacitor
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Inductors • Formed Technologies
-NEC-Tokin flake magnetic material -Bel Fuse embedded transformers -Planar Magnetics
• Inserted-Suppliers of embeddable inductors – Taiyo Yuden Co., Ltd – Coilcraft, Inc. – NTI Components Corporation – TDK-EPC – Kemet Electronics, Inc. – KOA Speer Electronics, Inc. – NEC-Token
TDK thin film inductor
Bel Fuse Internal embedded multiple transformer construction
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Challenges • Electrical Test
• Yield
• Who owns the failure
• How do share the losses
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Summary • The digital world is going 3D to increase capability in the same footprint
• Digital 3D will greatly increase the need for power but not increase the available space to implement it
• Embedded Substrate technology is a viable path to increase power density
• Multiple substrate and semiconductor technologies are available at many power levels
• Both formed and inserted components are available from multiple suppliers
• Multiple power manufactures are shipping product utilizing embedded technology
• Less than 5% of the material in the report has been presented. Contact PSMA to find out how to get a copy.
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Aimee Kalnoskas Contributing Editor Design World / EE Network [email protected]
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Brian Narveson Co-chairman PSMA Packaging Committee Narveson Consulting [email protected]
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Questions?
Significant Developments and Trends in 3D Packaging with Focus on Embedded Substrate Technologies
@DW_Aimee
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