29

LSI

30

1) Ag 10 m

2)

Ag-Pd

Ag-Cu

Cu

プラスチック製基板への適用

31

32

Ag20 nm

AgCmH2m+1CO2Ag + CnH2n+1NH2

m=7 , 13, 17 n=8, 12, 18

Ag

20 nm

Entry Carboxylate Amine Metal / % Av. Diameter / nm

1 C7H15CO2 C8H17NH2 96 33.0 ± 11.0

2 C7H15CO2 C12H25NH2 97 33.0 ± 8.60

3 C7H15CO2 C18H37NH2 95 4.3 ± 0.86

4 C13H27CO2 C8H17NH2

85 3.8 ± 0.60

5 C13H27CO2 C12H25NH2 84 4.0 ± 0.40

6 C13H27CO2 C18H37NH2 74 3.8 ± 0.45

7 C17H35CO2 C8H17NH2 26

8 C17H35CO2 C12H25NH2 51 3.6 ± 0.45

9 C17H35CO2 C18H37NH2 62 3.4 ± 0.41

33

Ag

Ag /PI

AgC13H27CO2Ag + C8H17NH2

Ag NPs. C13Ag/C8NH2

: Terpineol

Ag

20 nm

Ag NPs:

250 30 min (

300 30 min ( )

: 2.3 m

cm

(Cf. cm )

Ag

34

Item Value

81.4wt%

108Pa s HBT 10rpm 25 ±1

2.8

Al2O3

0.006 /

2.46 cm

4 m

300 30min

処理基板上に塗布・焼成した銀ナノ粒子ペースト層の断面 像

界面緻密層の形成　 による焼結促進効果

プル強度に及ぼす基板前処理の影響処理で密着性向上

破断モードの変化　 界面破断 ペースト内破断

35

Ag

Ag UV

Cu

NAG-10P 100 C, 50 min / : 30 cm

Ag PET

36

10 m

Ag NAG-T06

: 30 nm 58%

590 mesh 13 m

10 m

= 10 m 208 m

45 mm/sec 0.15 MPa

500 100

37

JPCA-ET01

Ag

Ag

Ag-PdAg + Pd+ L2Ag-L1

-

Ag : Pd = a : b Ag : Pd = a : b

Ag Pd

4 6 nm

6.5 nm

Ag /Pd=85/15

38

Nanoparticles Av. Diameter / nm Metal Cont. / wt% Ag/Pd ratio

AgPd-NP01 6.53±0.98 72.2 Ag86.4/Pd13.6

(Ag85/Pd15)

AgPd-NP02 4.06±1.00 81.8 Ag74.7/Pd25.3

(Ag70/Pd30)

20 nm

AgPd-NP02

(Ag70/Pd30)

20 nm

AgPd-NP01

(Ag/Pd=85/15)

, m , cm

300 30 1.5 12.1

400 30 1.4 10.4

500 30 1.1 8.4

a) b)

Ag-PdSEM ( 300 C / 30 min

/

-

39

Ag NAG-10 AgPd

NAGNPD8515 300 30

0.75 mm

3.0 V DC

3 V DC

0.75 mm

water

40

N2+3%H2AircmmNCU-05

41

Av. 7.2nm

100nm

Cu2O

Cu (111)

(200)(220) (311)

(222)

42

Av. Diameter 7.2 nm

50nm

Cu, 82.6 mass%

43

Ag

+Cu

160 24h

Ag-Cu

85%

Ag:Cu 5.5:4.5

Ag:Cu 5:5

Ag4.2nm

8.5nm

Cu2O

Ag+Cu

Cu

20nm

Ag-Cu

44

Ag-Pd

Cu Ag-Cu

10 6 cm

10 m