SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Qualified for Automotive Applications

ESD Protection Exceeds 2000 V PerMIL-STD-883, Method 3015; Exceeds 200 VUsing Machine Model (C = 200 pF, R = 0)

Triple Supervisory Circuits for DSP andProcessor-Based Systems

Power-On Reset Generator with FixedDelay Time of 200 ms, No ExternalCapacitor Needed

Temperature-Compensated VoltageReference

Maximum Supply Current of 40 µA

Supply Voltage Range . . . 2 V to 6 V

Defined RESET Output from V DD ≥ 1.1 V

SO-8 Package

Temperature Range . . . −40°C to 125°C

typical applications

Figure 1 lists some of the typical applications for theTPS3307 family, and a schematic diagram for aprocessor-based system application. Thisapplication uses TI part numbers TPS3307−18 andTMS470R1Vxxx.

SENSE 1

SENSE 2 RESET

TPS3307-18

SENSE 3

VDD

GND

100 nF

RESET

VDD

GND

1.8 V3.3 V2.5 V

470 kΩ

620 kΩ

• Automotive applications using DSPs,Microcontrollers or Microprocessors

Industrial Equipment Programmable Controls Automotive Systems

Figure 1. Applications Using the TPS3307-18

TMS470R1Vxxx

description

The TPS3307-18 is a micropower supply voltage supervisor designed for circuit initialization primarily inautomotive DSP and processor-based systems, which require more than one supply voltage.

The TPS3307-18 is designed for monitoring three independent supply voltages: 3.3 V/1.8 V/adj,. The adjustableSENSE input allows the monitoring of any supply voltage >1.25 V.

The various supply voltage supervisors are designed to monitor the nominal supply voltage as shown in thefollowing supply voltage monitoring table.

Copyright 2008, Texas Instruments Incorporated !" #!$% &"'&! #" #" (" " ") !"&& *+' &! #", &" ""%+ %!&"", %% #""'

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

1

2

3

4

8

7

6

5

SENSE1SENSE2SENSE3

GND

VDDMRRESETRESET

D PACKAGE(TOP VIEW)

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description (continued)

SUPPLY VOLTAGE MONITORING

DEVICENOMINAL SUPERVISED VOLTAGE THRESHOLD VOLTAGE (TYP)

DEVICESENSE1 SENSE2 SENSE3 SENSE1 SENSE2 SENSE3

TPS3307-18 3.3 V 1.8 V User defined 2.93 V 1.68 V 1.25 V†

† The actual sense voltage has to be adjusted by an external resistor divider according to the application requirements.

During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V. Thereafter, thesupply voltage supervisor monitors the SENSEn inputs and keeps RESET active as long as SENSEn remainbelow the threshold voltage VIT+.

An internal timer delays the return of the RESET output to the inactive state (high) to ensure proper system reset.The delay time, td typ = 200 ms, starts after all SENSEn inputs have risen above the threshold voltage VIT+. Whenthe voltage at any SENSE input drops below the threshold voltage VIT–, the RESET output becomes active (low)again.

The TPS3307-18 incorporates a manual reset input, MR. A low level at MR causes RESET to become active.In addition to the active-low RESET output, the TPS3307-18 includes an active-high RESET output.

The device is available in a standard 8-pin SO package, and is characterized for operation over a temperaturerange of −40°C to 125°C.

ORDERING INFORMATION

TA PACKAGE ‡ ORDERABLEPART NUMBER

TOP-SIDEMARKING

−40°C to 125°C Small Outline (D) Tape and Reel TPS3307-18QDRQ1 30718Q

† For the most current package and ordering information, see the Package Option Addendum at the end ofthis document, or see the TI web site at http://www.ti.com.

‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.

FUNCTION/TRUTH TABLES

MR SENSE1>VIT1 SENSE2>VIT2 SENSE3>VIT3 RESET RESET

L X X X L H

H 0 0 0 L H

H 0 0 1 L H

H 0 1 0 L H

H 0 1 1 L H

H 1 0 0 L H

H 1 0 1 L H

H 1 1 0 L H

H 1 1 1 H L

X = Don’t care

PowerPAD is a trademark of Texas Instruments Incorporated.

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

functional block diagram

_+

_+

_

+

R4

R2

R1

R3

ReferenceVoltage

of 1.25 V

RESETLogic + Timer

Oscillator

14 kΩ

VDD

MR

SENSE 1

SENSE 2

GND

SENSE 3

RESET

RESET

TPS3307

timing diagram

tdtd

td

RESET Because of SENSE Below V ITRESET Because of MR

RESET Because of SENSE Below V IT−RESET Because of SENSE Below V IT−

SENSEnV(nom)

VIT−

MR1

0

1

0

RESET

t

t

t

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted) †

Supply voltage, VDD (see Note1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . All other pins (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum low output current, IOL 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum high output current, IOH −5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input clamp current, IIK (VI < 0 or VI > VDD) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output clamp current, IOK (VO < 0 or VO > VDD) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature range, TA −40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Soldering temperature 260C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values are with respect to GND. For reliable operation the device must not be operated at 7 V for more than t = 1000 hcontinuously.

DISSIPATION RATING TABLE

PACKAGETA ≤ 25°C

POWER RATINGDERATING FACTORABOVE TA = 25°C

TA = 70°CPOWER RATING

TA = 85°CPOWER RATING

TA = 125°CPOWER RATING

D 725 mW 5.8 mW/°C 464 mW 377 mW 145 mW

recommended operating conditions at specified temperature range

MIN MAX UNIT

Supply voltage, VDD 2 6 V

Input voltage at MR and SENSE3, VI 0 VDD+0.3 V

Input voltage at SENSE1 and SENSE2, VI 0 (VDD+0.3)VIT/1.25V V

High-level input voltage at MR, VIH 0.7xVDD V

Low-level input voltage at MR, VIL 0.3×VDD V

Input transition rise and fall rate at MR, ∆t/∆V 50 ns/V

Operating free-air temperature range, TA −40 125 °C

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unlessotherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VDD = 2 V to 6 V, IOH = −20 µA VDD– 0.2V

VOH High-level output voltage VDD = 3.3 V, IOH = −2 mA VDD– 0.4V VVOH High-level output voltage

VDD = 6 V, IOH = −3 mA VDD– 0.4V

V

VDD = 2 V to 6 V, IOL = 20 µA 0.2

VOL Low-level output voltage VDD = 3.3 V, IOL = 2 mA 0.4 VVOL Low-level output voltage

VDD = 6 V, IOL = 3 mA 0.4

Power-up reset voltage (see Note 2) VDD ≥ 1.1 V, IOL = 20 µA 0.4 V

Negative-going input threshold voltageVSENSE3

VDD = 2 V to 6 V,1.2 1.25 1.29 V

VIT−Negative-going input threshold voltage

(see Note 3)VSENSE2

VDD = 2 V to 6 V,

TA = −40°C to 125°C1.6 1.68 1.73

VVIT− (see Note 3)

VSENSE1TA = −40°C to 125°C

2.8 2.93 3.02V

VIT− = 1.25 V 2 10 30

Vhys Hysteresis at VSENSEn input VIT− = 1.68 V 2 15 40 mVVhys Hysteresis at VSENSEn input

VIT− = 2.93 V 3 30 60

mV

MR MR = 0.7 × VDD, VDD = 6 V −130 −180

IH High-level input currentSENSE1 VSENSE1 = VDD = 6 V 5 8

AIH High-level input currentSENSE2 VSENSE2 = VDD = 6 V 6 9

µA

SENSE3 VSENSE3 = VDD −1 1

IL Low-level input currentMR MR = 0 V, VDD = 6 V −430 −600

AIL Low-level input currentSENSEn VSENSE1,2,3 = 0 V −1 1

µA

IDD Supply current 40 µΑ

Ci Input capacitance VI = 0 V to VDD 10 pF

NOTES: 2. The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 µs/V3. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic 0.1 µF) should be placed close to the supply terminals.

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

timing requirements at V DD = 2 V to 6 V, RL = 1 MΩ, CL = 50 pF, TA = 25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tw Pulse widthSENSEn VSENSEnL = VIT− −0.2 V, VSENSEnH = VIT+ +0.2 V 6 10 µs

tw Pulse widthMR VIH = 0.7 × VDD, VIL = 0.3 × VDD 100 150 ns

switching characteristics at V DD = 2 V to 6 V, RL = 1 MΩ, CL = 50 pF, TA = 25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNIT

td Delay timeVI(SENSEn) ≥ VIT+ + 0.2 V,MR ≥ 0.7 × VDD, See timing diagram

140 200 280 ms

tPHLPropagation (delay) time,

high-to-low level output

MR to RESET

MR to RESET VI(SENSEn) ≥ VIT+ +0.2 V,200 600 ns

tPLHPropagation (delay) time,

low-to-high level output

MR to RESET

MR to RESET

VI(SENSEn) ≥ VIT+ +0.2 V,VIH = 0.7 × VDD, VIL = 0.3 × VDD

200 600 ns

tPHLPropagation (delay) time,

high-to-low level outputSENSEn to RESET

VIH = VIT+ +0.2 V, VIL = VIT− −0.2 V,1 5 s

tPLHPropagation (delay) time,

low-to-high level outputSENSEn to RESET

VIH = VIT+ +0.2 V, VIL = VIT− −0.2 V,MR ≥ 0.7 × VDD

1 5 µs

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TYPICAL CHARACTERISTICS

Figure 2

1

0.999

0.997

0.995−40 −15 10 35N

orm

aliz

ed In

put T

hres

hold

Vol

tage

− V

IT(T

A),

VIT

(25

)

1.002

1.003

NORMALIZED SENSE THRESHOLD VOLTAGEvs

FREE-AIR TEMPERATURE AT V DD1.005

60 85

VDD = 2 VMR = Open1.004

1.001

0.998

0.996

C°

TA − Free-Air Temperature − °C

Figure 3

4

0

−6

−10−0.5 0 0.5 1 2.5 3 3.5

− S

uppl

y C

urre

nt − 8

14

SUPPLY CURRENTvs

SUPPLY VOLTAGE18

4 5 6 7

16

12

10

6

2

−2

−4

−8

1.5 2 4.5 5.5 6.5I D

DA

µ

VDD − Supply Voltage − V

SENSEn = VDDMR = OpenTA = 25°C

TPS3307−33

Figure 4

−400

−500

−700

−900−1−0.5 0 1 1.5 2.5 3

− In

put C

urre

nt −

−200

−100

INPUT CURRENTvs

INPUT VOLTAGE AT MR100

3.5 4 5.5 6.5

0

−300

−600

−800

0.5 2 4.5 5 6

VI − Input Voltage at MR − V

I IA

µ

VDD = 6 VTA = 25°C

Figure 5

5

4

2

00 100 200 300 400 500 600

− M

inim

um P

ulse

Dur

atio

n at

7

9

MINIMUM PULSE DURATION AT SENSEvs

THRESHOLD OVERDRIVE10

700 800 900 1000

8

6

3

1

SENSE − Threshold Overdrive − mV

t wV

sens

e −

sµ

VDD = 6 VMR = Open

SGLS136A − NOVEMBER 2002 − REVISED APRIL 2008

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TYPICAL CHARACTERISTICS

Figure 6

1

0.5

00 −0.5 −1 −1.5 −2 −2.5 −3

− H

igh-

Leve

l Out

put V

olta

ge −

V

1.5

2

HIGH-LEVEL OUTPUT VOLTAGEvs

HIGH-LEVEL OUTPUT CURRENT2.5

−3.5 −4 −5 −6−4.5 −5.5

IOH − High-Level Output Current − mA

V OH

85°C

−40°C

VDD = 2 VMR = Open

Figure 7

− H

igh-

Leve

l Out

put V

olta

ge −

V

HIGH-LEVEL OUTPUT VOLTAGEvs

HIGH-LEVEL OUTPUT CURRENT

IOH − High-Level Output Current − mA

V OH

3.5

3

2

00 −5 −10 −15 −20 −25 −30

4.5

6

6.5

−35 −40 −45 −50

85°C

−40°C

5.5

5

4

2.5

1.5

1

0.5

VDD = 6 VMR = Open

Figure 8

85°C

−40°C

VDD = 2 VMR = Open

1

0.5

00 0.5 1 1.5 2 3 3.5

− Lo

w-L

evel

Out

put V

olta

ge −

V

1.5

2

LOW-LEVEL OUTPUT VOLTAGEvs

LOW-LEVEL OUTPUT CURRENT2.5

4 4.5 5.5 62.5 5IOL − Low-Level Output Current − mA

V OL

Figure 9

3.5

3

1.5

00 5 10 15 20 30 35

4.5

5.5

6.5

40 50 55 60

85°C

−40°C

VDD = 6 VMR = Open

− Lo

w-L

evel

Out

put V

olta

ge −

V

LOW-LEVEL OUTPUT VOLTAGEvs

LOW-LEVEL OUTPUT CURRENT

IOL − Low-Level Output Current − mA

V OL

6

5

4

2.5

2

1

0.5

25 45

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins Package Qty Eco Plan(2)

Lead/Ball Finish MSL Peak Temp(3)

Op Temp (°C) Top-Side Markings(4)

Samples

TPS3307-18QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 30718Q

TPS3307-18QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 30718Q

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS3307-18-Q1 :

• Catalog: TPS3307-18

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 2

• Enhanced Product: TPS3307-18-EP

• Military: TPS3307-18M

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

• Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TPS3307-18QDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Mar-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS3307-18QDRQ1 SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Mar-2013

Pack Materials-Page 2

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