300k w transmitter
TRANSCRIPT
Presentation on
Thales 300 kW MW transmitter
by
R.Narasimha Swamy,
Superintending Engineer, AIR, Bangalore
C o n n e c t io n o f mo d u le s in s e rie s
1
2
3
4
5
V
V
V
1
2
3
4
nV n
V n
V 2
V 1
Vo
C o n n ec tio n o f m o d u les as s em b liesin p ar allel
O u t p ut
M 1 M 1 2 8
M 1 2 9 M 2 5 5
90 O
1 2 0O ut p ut
Vse
ries
Out
put
Principle of RF power generation
TYPE SERIAL PARALLEL MIXED
O P E R A T IO N
M O D UL E VO L T A G E A D D E DSA M E C UR R E NT
M O D UL E C UR R E NT AD D EDS AM E VO L T A G E
M O D UL E VO L T A G E A NDC UR R E NT
AD D E D A ND C O M B INE D
S T A B IL IT Y W IT H O NE O RM O R E M O D UL E O UT O F
O R D ER
ST A BL EPO W E R D E C R E A SE S
UNS T AB L EPO W E R R E M A INS C O NST A NT
S T A BL E UND ER C O ND IT IO NSM AL L UNB AL A NC ED VO L T AG E
D IF F E R ENC E
D ISAB L ED M O D UL EM O D UL E F AUL T A L L O W E D
S HO R T -C IR C UITT HE NO R M AL T R ANS IS T O R
F AIL UR E M O D E
O P EN C IR C UITNE E D A D D IT IO NAL
PR O T E C T IO N
S HO R T C IR C UIT L IM IT E DNUM BE R O F F A UL T Y M O D UL E
L IM IT ED
L IM IT A T IO N HIG H V O L T AG E L INE L E NG T HL O A D VA R IA T IO N
HIG H C UR R ENTL O W IM P ED A NC E
INC R E AS E D L O S S ES
VO L T A G E ANDC UR R E NT C O M BINED
T HO M C AS T S O L UT IO N1 2 0 T O 1 6 0 M O D UL E S
IN SE R IA L1 5 0 kW
NIL2 L INES O F 1 2 8 M O D UL E S IN
S ER IA L4 0 0 kW
P HA SE VA R IA T IO N A L L O W ED F O R BID D E N A L L O W ED
Choice of combiners
Functional Blocks• High current, HT DC power supply units for powering the
MOSFETs of the PA and low voltage regulated DC power supplies for the control electronics
• RF Pilot source and RF Driver amplifier units
• Array of 255 RF Power amplifiers connected in series/parallel combination and associated control, distribution and monitoring electronics.
• RF Adaptation Unit for matching and combining the left and right RF lines
• Low pass RF Filter unit for reducing the spurious harmonics.
• Modulation Encoder for controlling the switching of all the 255 modules.
Contd.,
Functional blocks Contd.,
• Control and management electronics consisting of embedded 16-bit microprocessor, digital input/output boards, signal-conditioning circuits, fast blocking boards etc for data acquisition and overall control and supervision.
• Various types of sensors, instrumentation and associated signal conditioning electronics for monitoring the health of transmitter and sub systems.
• Interlocking and grounding arrangement for safety measure.
• Man machine interfaces for annunciation and control.
• Water-cooling (Hydraulics) for PA MOSFETS and high power rectifier diodes and sophisticated processor based ventilation system for air cooling.
• 800 kW Dummy load and associated heat exchanger.
RF 1
RF 2
EX TRF
EN CO D ER
EN CO -D ER
AM P LIF -IER
EXCI
TER
D EM ULT IP LE-X ER
P O W ERIN T ERF A C E
D IGIT A LH O LD
LA T C H
O P T OCO U-P LER
RF 1 IN
RF O UT
RF 2 IN
EX T .
M 1J 2
J 1
EM ER G EN CY M O D ULE CUT O F F
CLO C K
RF F O R P HAS E
D AUG HT ER BO ARD
M3 1
M OD U LE 1
D ED ICAT ED M O D ULE CO M M AN D
M O D U L E O N
C U T O F FJ1 5
4 S T A T EM O D U L EO N /O F F
C O M M AN D
T H
T1
T 2
REM O T ED IS T RIBUT IO N
R F 1
R F 2
D M 1
P ILO T -1
P ILO T -2
P ILO TC/O
J1 3
16
1732
J1 1
1 2J
1 2J
1 2J
16
17
R F 1
D MM 3 2
RF flow
L E F TD I S T R I B U T I O N
B O A R D
241
225240
129144
145
161176
177
193208
209
113
11797
17
161
49
4633
81
8065
SP A R E
L E F TD I S T R I B U T I O N
B O A R D
L E F TD I S T R I B U T I O N
B O A R D
L E F TD I S T R I B U T I O N
B O A R D
R FA M P L IF IE R M O D U L E S
L E F T C H A N N E L
R I G H TD I S T R I B U T I O N
B O A R D
R I G H TD I S T R I B U T I O N
B O A R D
R I G H TD I S T R I B U T I O N
B O A R D
R I G H TD I S T R I B U T I O N
B O A R D
EN C O D ER
A M P L I .A S S E M B L Y
D
A M P L I .A S S E M B L Y
C
A M P L I .A S S E M B L Y
B
A M P L I .A S S E M B L Y
A
GES M O D R A C KM O D U L E S
C O M M A N D
R I G H T C H A N N E L
RA
CK
4(6
4 M
OD
ULE
S)R
AC
K 3
(64
MO
DU
LES)
RA
CK
2(64 M
OD
ULES)
RA
CK
1(64 M
OD
ULES)
D M : D ED ICAT ED M O D ULE
A M P L I FI ER M O D UL E D I S TR I B UTI O N ( 98 /0 3 0 7 A )
A M P L IF IE R B L O C K L A Y O U T
256D M
192D M
160D M
32D M
64D M
96D M
128D M
224D M
B O T T O M T O P
B L O C K S C H E M A T I C O F 3 0 0 K W T R A N S M I T T E R
T r. T r.
11 K V/ 415V750K VA
T R F -2
11K V
P O W ERT R A N S F O R M ER
P A#17M A N A GEM EN T
A N DC O N T RO L
E N C O D E RA M P L I F I E R
C I R C U I T
B L O C KM M I E X C I T E R
REM O T E M M I
R EM O T ED IS T RIB U T IO N C IR CU IT
LEF T LIN E
A D A P T A T IO N U N IT
P A # 1
H Y D R A U L ICS Y S T E M
REC T IF IER
M A INREC T IF IER
A U X IL IA R YR E C T IF IE R
M A L T A N DL O C K I N GSY ST E M
RF F ILT ER
R F C H A N G E O V E RS W IT C H
D U M M Y LO A D
M A T C H IN GU N IT
50K WM W
V E N T I L A T O R# 2
V E N T I L A T O R# 1
900K VA A VR
125 K VAD G S ET
P O W ER S U P P LYEN C LO S U R E
A M P LIF IER B LO C K
P ILO T -1 P ILO T -2S ELECT IO N B O A R D
RFC M D S
R FS IGN A L
B LO C KIN T ERN A L P O W ER S U P P LIES
VLVP O W ER
S U P P LIES
410V
LV IN P U T
ELC T R O T EC H N ICA L R A C K
F A U LTCO M M A N D
H Y D R A U L I C SY ST E MV E N T I L A T I O N SY ST E M VEN T ILA T O R
EX H A U S T
RF S IGN A LLEF T T H E
R F S IGN A LR IGH T LIN E
A M P L IF IE R M O D U L E S A S S E M B L IE S
-Vin t
330V 330V
330V
LV IN
PU
T T
OEL
ECT
ROT
ECH
NIC
AL
RACK
R FT R A N S F O R M ER
1200A
LVG
PS
EXTE
RNA
L
P A # 16 P A # 32
T R F -180 0A
800A50K W LT R O O M
T x HALLHEAT IN G
1200
A
630A
1600
A
1200
A
100A
SPAR
E
AUD
IO R
ACK
HYD
RAU
LICS
DU
MM
Y LO
AD
VEN
TILA
TO
R
FR O M O UT S ID E
F R O M E T
R A C K
Functions of distribution board Distributes the RF signal received from the RF Exciter board to 31
numbers of individual PAs used for coarse RF power generation. Routes the RF signal received from the Encoder board to the
dedicated PA module for fine control. Routes the VINT DC power supply to the individual PAs for MOSFET
H-bridge control. On command from the control system, health status of the PA
modules on the basis of presence of +330V and VINT DC power supply on the MOSFETs and forwards it to control system through 4253 card #1 by polling method.
The daughter board mounted on the distribution board decodes the 4th state command signals received from the Encoder board and distributes the command to the individual PAs after providing necessary optical isolation.
Features of PA • Designed to produce 2.34 kW of RF power under dynamic
operating conditions. • They are used as high speed RF switches working in class D
mode. Hence power conversion efficiency of these amplifiers is very high.
• Employs industry standard reliable MOSFET of reputed make in H-bridge topology as switching elements.
• During normal operation, they dissipate around 400 Watt of heat to be extracted by circulating water through their heat sink.
• Simple electronic design ensures ease of servicing.• Reliable mechanical design ensures efficient heat extraction.• Provided with ultra fast fuse to isolate the H-bridge in case
of failure of MOSFET to prevent over loading of drain power supply (+330V).
Principle of H bridge
R EL A Y(A )
+ 1 2
.+ -
G R O UND(C O M M O N)
+ -
+ 1 2
R EL A Y .
R EL A Y
R EL A Y.
R EL A Y
R EL A Y .
(A )
(C )
(B )
(D )
+ 1 2 + 1 2
.+ -
.
+ -
+ 1 2
(A ) (B )
(C ) (D )
PNP
NPN
G R O UND
+ 1 2
PNP
NPN
G R O UND
F I G UR E : R F AM P L I F I E R F UL L Q UAD BR I D G E D O P E R AT I O N
- +
C O M B IN E RT R A N S F O R M E R
O F F O N
+ 3 3 0 V
Q 1 0 1 & Q 1 0 2 Q 2 0 1 & Q 2 0 2
+ 3 3 0 V
(A ) Q 1 0 1 , Q 1 0 2 , Q 2 0 3 & Q 2 0 4 O F F Q 2 0 1 , Q 2 0 2 , Q 1 0 3 & Q 1 0 4 O N
-+
C O M B IN E RT R A N S F O R M E R
+ 3 3 0 V + 3 3 0 V
Q 1 0 1 & Q 1 0 2O N
Q 1 0 3 & Q 1 0 4O F F
Q 2 0 1 & Q 2 0 2O F F
Q 2 0 3 & Q 2 0 4O N
(B ) Q 1 0 1 , Q 1 0 2 , Q 2 0 3 & Q 2 0 4 O N Q 2 0 1 , Q 2 0 2 , Q 1 0 3 & Q 1 0 4 O F F
O F FQ 2 0 3 & Q 2 0 4
O NQ 1 0 3 & Q 1 0 4
(C ) O U T P U T W A V E F O R M S
+ V
0
+ V
T O R R O I D A LT R A N SFO R M E R
PI L O T B O A R D 2
PI L O T B O A R D 1
PI L O T C O M M A ND B O A R D
S A F ETY D EV I C EM EA S UR EM ENT B O A R D
Micro Proces s or B oard (S B C 33 0)
FA S T B L O C K I NG B O A R D( C B R )
I /O B O A R D M PL 4 2 5 3
ETH ER NET C O NNEC TI O N B O A R D (L A N)
I /O B O A R D M PL 4 2 5 3
I /O B O A R D M PL 4 2 5 5
I /O B O A R D M PL 4 2 5 5
ENC O D ER B O A R D
BACKPLANE
BOARD
Trans mitter
G96
GESBUSBOARD
E N C O D E R A M P L I F I E RC I R C U I T
VLV PO W E RS U PPL I E S
R F FI L TER
P O W E R S U P P L YE N C L O S U R E
A D A P T A T I O N U N I T
G R O U N D A N D I N T E R L O C K I N GS Y S T E M
RF EXCITER
Elec
tro
tech
nica
l Rac
k
B LO C KM M I
E X T E R N A L
R e m o te M M I
H Y D R A U L I C C I R C U I T
V E N T I L A T I O N S Y S T E M
P O W E R U N I T
D ig ita l a u dio in pu t
A n a lo ga u dio in pu t
Signal Source
RHS header current phase Sensors mounted at the output of each RF header lineLHS header current phase
VINT DC power supply voltage
From PS rack
Incoming 3, LT voltage
+330V DC PS current Hall effect sensor in PS cabinet
+330V DC PS voltage Voltage divider in PS cabinet
RHS header current Sensors mounted at the output of each header lineLHS header current
Output RF power Directional coupler
Output RF VSWR Directional coupler
Exciter RF output voltage
Sample of Exciter voltage
Functions of Encoder board
• Number of modules to be switched depends on:
Instantaneous amplitude of the modulating audio signal.
Audio attenuation level set by the user.Modulation type i.e. AM-DSB/DCC chosen
by the user.Number of faulty module in the
transmitter
Dedicated module Number
Module position
Proportionate output
1 32 5.1 0.3
2 160 4.7 0.3
3 64 3.8 0.3
4 192 3.1 0.3
5 96 2.3 0.3
6 224 1.6 0.3
7 128 1.0 0.3
8 256 (not used)
0
Modul at ion St r at egy Funct ional Ar chit ect ur e
N(t ) - N( t + 1 )
MemoryDelay
R o ta t io nC lo ck
Pro ce s s in g S t ra t e g y
5
R o ta t io n C lo ck
En v e lo pePro ce s s in g
B a n k A B R o t a t io n pro ce s s in g+ C o m pu ta t io n N( t ) - N( t+ 1 )
B a n k C D R o ta t io n pro ce s s in g+ C o m pu t a t io n N( t ) - N(t + 1 )
B a n kA B C D
R e pa rt it io n
R FPro ce s s in g
R F
S lo peProce s s in g
N (t+n )N (t)
S tandard M odulesM (1 - 124)
Envelope
RA M D P A
RA M D P B
RA M D P C
RA M D P D
Fro m co n t ro l S y s t e m ( G e s m o d) R e a l t im e t a ble o fO pe ra t io n R F M o du le s
2 x 31
2 x 31
2 x 31
2 x 31
D e d ic a t e d m o d u le s m (1-7) C lo ck M
C lo ck M
S +
S -
M UX mDis tributor
pos ition S lopeproces s ing and phas e delay
optimis er7
S lope S ign Contro l
Neg ative S lopeproces s ing and phas e delay
optimis er
3
21
4
7
3
6
6
6
1 11 08
9
9
6
M O D U L E O N
M O D ULE O N
D IR E C T IO N O FR O T A T IO N
N E X T M O D U L E T O B E S W IT C H "O F F "
N E X T M O D U L E T O B E S W IT C H "O N "
Module rotation
The next module to be switched ON is the one which has been OFF for the longest time.The next module to be switched OFF is the one which has been ON for the longest time.The principle ensures equal distribution of thermal and electrical stress over the modules.
Fault reports compiled from
• Imphal• Sri Nagar• Jodhpur• Indore
Normal faults
• PA failure• Failure of opto couplers• Failure of polling mechanism due to
problem in distribution board• Faults due to cooling
Maintenance tips• Keep transmitter free from dust and suit• Ensure proper connectivity• Air conditioning is must• Introduce surge protectors on mains• Keep a watch on the feeds and investigate the
matter immediately, in case of abnormality • Do not ignore faults which includes tripping of
the transmitter without indication
Abnormal faults
• Failure of Encoder card connectivity• Problems in daughter board• Failure of PS of driver module• Problem in VCC (PS 323, A1, +5V) of
Encoder board• Micro switch problem of KM1 and KM2