28nm fd-soi technology catalog
TRANSCRIPT
28nm FD-SOI Technology Catalog
Content
FD-SOI Technology .................................................................. 3The body-bias (bb) advantage ...................................................... 4Standard-cells ................................................................................ 5IO ................................................................................................... 6Memories ....................................................................................... 8Phase locked-loop (PLL) ................................................................. 9Oscillators .................................................................................... 10Analog-to-digital convertors (ADC) .............................................. 11Digital-to-analog convertors (DAC) .............................................. 12Embedded power-management IPs ............................................ 13One-time-programmable (OTP) IP: fuSE ....................................... 13Process-monitoring box (PMb) ...................................................... 14Voltage & thermal sensors ............................................................ 14Linear regulators .......................................................................... 15High-speed serial links .................................................................. 15
Consumer Multimedia
• OptimizedSoCintegration(Mixed-signal&RF)• Energy-efficientSoCunderallthermalconditions• Optimizedleakageinidlemode
3
Theuniqueadvantagesof28nmFD-SOItechnology,allowSoC/ASICdesignerstogainfullbenefitofbest-in-classPerformance,Power,andArea(PPA)inasingleprocess-technologyflavorwithouthavingtochoosemultipletechnologyvariants.
FD-SOI Technology
APPLICATION BENEFITS BY MARKET SEGMENT
A few of the advantages of 28nm FD-SOI technology:• At28nm,FD-SOIrequiresfewermaskstepsbecauseitisasimplerprocess.• InUTBBFD-SOItechnology,thechannelisquitethin,soitcanbeeffectivelycontrolledbytheGate,whichresultsinlowerleakagepower(instatic/stand-bypower).Fordesignoptimizationandflexibility,multiple Threshold Voltage (VT) flavorsofthetransistorareavailable,including:• RVTdeviceforregular-V
Torstandard-V
Tcircuits,
• LVTdeviceforlow-VThigh-speedcircuits.
• Body-BiasingisaneffectivefeatureinFD-SOItocontroltheVTofthetransistortoleveragedeviceelectrostaticsforspeedandleakage
optimization.• Wide operating voltage range,fordifferentapplicationswithcompetitivePPAadvantages:
• VerylowVDDforultra-lowpowerapplications,
• ReducedVDDforcompetitivespeedatreasonablepowerconsumption,
• NominalVDDforhigh-performanceapplications.
• Excellent device electrostatics,(a)lowleakage,leveragingUltra-ThinBodyandBox(UTBB)technology,(b)fasteroperation,duetothefullydepletedchannel,and(c)remarkablereliability
Networking Infrastructure
• Energy-efficientmulticore• Adaptperformance&powertoworkloadviaFBB• Excellentperformanceinmemories
Internet of Things, Wearable
• Ultra-low-voltageoperation• FBBoptimizespower/performance• EfficientRFandanalogintegration
Automotive
• Well-managedleakageinhigh-temperatureenvironments• Highreliabilitythankstohighly-efficientmemories
Baseline
RF
Ultra lowpower
Road
map
Prod
uctio
n
Power and energy efficiencyUltralowleakage,wideBody-Bias&operatingvoltagerangeAnalog performanceformixedsignal&RFdesignRobustnessformissioncriticalapplicationsCost effective platform
4
THE BODY-BIAS (BB) ADVANTAGEEffective lever to optimize between higher performance and lower leakage
BODY-BIASING: AN EXTREMELY POWERFUL AND FLEXIBLE CONCEPT IN FD-SOIBody-biasing,alsooftenreferredtoasbackbiasing,controlsthethresholdvoltage(V
T)
ofatransistortooptimize:• Drivecurrent(forhigherperformance)attheexpenseofincreasedleakagecurrent(ForwardBackBias,FBB)
• Or,leakagecurrent,withsomewhatlowerperformance(ReverseBackBias,RBB)
0 - 1.1 V
Body-biasing facilitates a wide Dynamic Voltage Frequency Scaling (DVFS) range (0.7 V – 1.1 V)• Performanceboostwhereverneeded• Reducepowerconsumptionatagivenperformancerequirement• Processcompensationreducingthemarginstobetakenatdesign• SeamlessinclusionintheEDAflow
FOUNDATION IP/LIBRARIES PORTFOLIO
Standard-Cells
• MultipleArchitectures• MultipleChannel-length(Poly-Biasing)options• Multiple-V
Toptions
• Richportfolioofcells
Memories
• LowVmin
• LowPoweroptions• Mono&Dualrailcompilers• Soft-ErrorRate(SER)robustness
Data Convertors (ADC & DAC)
• MultipleArchitectures• WideResolutionrange(upto24bits)• High-Speed(upto64Gsps)• Best-in-ClassPerformance,Power,Area
IO
• Wideportfolioforvariousapplications• OptimizedforCore/PadLimitedchipconfigurations• DifferentiatingsolutionsforLowPowerandAreaEfficiency• Programmabilityforvariedboard/packageandloadingenvironment
Clock Generators
• Wide-Portfolio• VariousPatentedArchitectures• Best-in-ClassPerformance,Power,Area
Specific IPs
• Body-BiasGenerator• OTPSecurityIP(Fuse)• ProcessMonitoringBlock(PMB),ThermalandVoltageSensors• Regulators• PowerManagementIPs
5
TheMainstreamlibraryandLow-PowerlibraryareavailablewithbothRVTandLVTthreshold-voltagesupportin12-Track(12T)and8-Track(8T)architectures.TheHigh-Performancelibraryhasboth12T&8TarchitecturesandLVTthreshold-voltageoptions.
Low Power
• Isolation• Level-Shifter• Retention/Always-ON
Mainstream
• GeneralPurposeCORE• Multi-BitFlip-Flop• Clock• ECO&PR
High.Performance
• High-PerformanceCORE• SkewedSequentialCells
STANDARD-CELLSSTMicroelectronicsoffersabroadportfolioofstandard-celllibrariesin28nmFD-SOItechnology.Thestandard-cellsdesignedin28nmFD-SOIofferuniqueadvantagestovariousSoC/ASICapplications.Themainstreamstandard-celllibraryisaugmentedbyspecializedlibrariesforlow-powerandhigh-performanceapplications.
....ClassificationbasedonapplicationMultiple tracks and architectures (12T/8T)Multi-threshold voltage (VT) support (LVT/RVT)Multi-channel length variants (Poly-Bias P0/P4/P10/P16)
Library8 Track 12 Track
LVT RVT LVT RVT
Low-Power
CORI (Core Isolation Library) • • • •
CORR (Core Retention Register Library) • • • •
SHIFT (Level Shifter Library) • • • •
CORBF (Core Multi-Bit Flip-Flop Library) • • - -
SYNC (Synchronizer Library) • • • -
CDMPR (Place & Route Library with CDM Protection) - - • •
CDMSHIFT (Level Shifter Library with CDM Protection) - - • •
Mainstream
CORE (Core Library) • • • •
CLK (Clock Library) • • • •
PR (Place & Route Library) • • • •
ECO (Engineering Change Order Library) • • • •
High-Performance
CORHP (High-Performance Core Library) • - • -
CORXT (Library with High-Speed Flip-Flops) • - • -
*OtherelectricalparameterswillbedisclosedunderNDA
6
TheIOsolutionsconsistsofversatilecellswithmultiplefeatures:• Widerangeoffunctionalities:interface functionalities,dedicatedIOfunctionalitiestoserveanalog IP blocks,power-supplyprovisioningtoanSoC,orprovisionofreliable ESD protection
• Multiple Metal Stacks options,Multiple Supply Voltages,and Chip-Layout Configurations(Core-Limited,Pad-Limited,andPad-in-Core)
• Differentiating solutions:Nointermediatesupplyrequiredin3.3VIO,significantlyfewersupplypadsusingcompensationstrategy,multiplepatentsinIOdesign
• IOoffersupports a variety of industry standardslikeI2C,USB,GPIO,MIPISlimbus,SDMMC,HSPROG,EMMCandotherspecifichigh-speedIOinterfaces
• AdvancedESDprotectioncomplianttoIEC 61000-4-2areavailableonrequest
IO28nmFD-SOIIOlibraryenablesflexible,effectiveandreliableinterfacinginSoCdesignwithstate-of-the-artfeaturesandPPAadvantages.Specialapproaches,suchasthecompensationstrategy,flexibilitybetweencompensatedanduncompensatedIO,andESDsolutions,providedifferentiationinSoC/ASICdesignswithapplicationsrangingfromlow-powerhand-helddevicestohigh-performancecomputing.
Inte
rfac
e vo
ltage
Interface speed (Mbps)
1.2 V
1.5 V
1.8 V
2.5 V
CF+/LED/PATA(12 Mbps) 5V Tolerant
(50 Mbps)
SD/MMC 3V3(104 Mbps)
SD/MMC 3V3(104 Mbps)
SD 1V8(240 Mbps)
SD 1V5(240 Mbps)
SD 1V2(240 Mbps)
HSIC(480 Mbps)
EMMC Failsafe(480 Mbps)
HSPROG3V3(150 Mbps)
HSPROG2V5(150 Mbps)
GPIO 3V3(60 Mbps)
GPIO 2V5(60 Mbps)
MIPI SLIMBUS(57.6 Mbps)
MIPI SLIMBUS(57.6 Mbps)
I2C 3V3 FS(6.8 Mbps)
I2C 2V5 FS(6.8 Mbps)
I2C 1V8 FS(6.8 Mbps)
IC_USB(12 Mbps)
3.3 V
5.0 V
10 10050 250 500
USIM(12 Mbps)
USIM(12 Mbps)
USIM(12 Mbps)
Multi-supply
7
Interface/Application Library name IO standard IO supply Features/Specification
General Purpose UART, JTAG
GPIO 1V8 1.8 V Programmable IO, Non-PVT Compensated
JESD76/JESD8-7 1.8 V•8-Level-DriveProgrammability•1V8FailsafeandNon-Failsafe•Support1V5and1V2operation
GPIO 3V33.3 V Programmable IO, Non-PVT Compensated
JESD76/JESD8-B 3.3 V•4-Level-DriveProgrammability•3.3VFailsafeandNon-Failsafe
GPIO 1V8_3V31.8 V & 3.3 V Programmable IO, Non-PVT Compensated
JESD76/JESD8-7JESD8-B
1.8 V3.3 V
•3.3VFailsafecell•Two-leveldrive/slewoptions
2V5_3V32.5V&3.3VProgrammableIO,Non-PVTCompensated
JESD80/JESD8-5JESD76/JESD8-B
2.5V3.3 V
•4-Level-Speedprogrammability
TESTMUX 1V81.8 V High-Performance IO, PVT Compensated
JESD76/JESD8-7 1.8 V•2-Level-Driveprogrammability•Cellswith2/4/6/8mAdrives•Support1.5Vand1.2Voperation
PROG 1V81.8 V High-Performance IO, PVT Compensated
JESD76/JESD8-7 1.8 V
•Isolation&Retentionfeature•2-Level-Driveprogrammability•Non-FailsafeandFailsafecells•Support1V5and1V2operation
PVT Compensation Block
COMPENSATION1V8PVTCompensated - 1.8 V •LibraryforPVTcompensationat1.8V
REFCOMPENSATION1V83V3PVTCompensated -1.8 V3.3 V
•LibraryforPVTcompensationat1.8V&3.3V
Printer/LED SRC 3V3Large transmission length slew rate controlled 3.3 V IO
JESD76/JESD8-B 3.3 V•SupportcriticalSignalIntegrityrequirements•Support6”to24”tracelength
SPI/SD/MMC/EMMC/Flash
SDMMC 1V8_3V31.8 V & 3.3 V SDMMC IO
SD3.01/JESD84A441.8 V3.3 V
•SupportTypeA(33Ω)andTypeB(50Ω)driver
EMMC 1V8 1.8 V EMMC Failsafe IO
JESD84B50 1.8 V
•SupporteMMCTYPE0(50),TYPE1(33), TYPE2(66),andTYPE3(100)•SupportseMMCHS200modeandeMMC HS400mode•SupportSDRandDDR
Digital Audio/MultiDrop
SLIMBUS 1V8 1.8 V Slimbus IO
MIPI Slimbus 1.1 1.8 V•IsolationandRetentionfeature•20cmtracelengthsupport
Interchip USBHSIC1V21.2VHSICIO
High Speed Interchip USB 1.0
1.2V•SlewrateandImpedancecontrol•10cmtransmissionlinesupport•Jitterlessthan365ps
HDMI/PMBus/ANDBus/Addressing/ SMBus/IPMI/LCD Drivers/RTC
I2C 1V8 1.8 V I2C Failsafe Open Drain IO
NXPUM10204
1.8 V•SupportStandardMode(100KHz), FastMode(400KHz),FastPlusMode(1MHz)•Programmablebuilt-inbuspull-upresistor
I2C 1V8 3V3TTFS 1.8 V I2C IO with 3.3 V tolerant and failsafe
1.8 V•SupportStandardMode(100KHz), FastMode(400KHz),FastPlusMode(1MHz)
I2C 3V33.3 V I2C Failsafe Open Drain IO
1.8 V•SupportI2C and SM Bus Mode•SupportI2C Standard Mode (100 KHz) and FastMode(400KHz)
I2C3V35VFSFT3.3 V I2CIOwith5VFailsafeandtolerantOpenDrainfeature
3.3 V•SupportI2C Standard Mode (100 KHz) andFastMode(400KHz)
PMBus/ANDBus/Reset/SMBus/LCD Drivers
OD 3V3Open Drain failsafe 3.3 V IO
JESD76/JESD8-B 3.3 V•Bidirectionalcell(200KHz), Outputcell(850KHz)•4mA/8mAoutputdrivecell
Video5VFSFT5VFailsafeTolerant3.3VIO
JESD36 3.3 V•4mAdrivepush-pullIO•40MHz
Analog Library
ANAF_ANA1.0 V1.8 V3.3 V
•AnalogIOcellswithminimizedparasitic capacitance•Includesbasiccellsenablinganoptimized analog IO ring construction
ANAF_ANA6V1.0 V1.8 V3.3 V
•AnalogFail-Safepadwith6Vsignal protection•RestrictedtoUSB2OTGapplicationonly
ANAF_3V3FS1.0 V1.8 V3.3 V
•Fail-safeANApadwith3.3V and5.0Vsignalprotection
ANAF_ANA_1V8FS 1.8 V •1.8VFail-SafeANApad
ESD, & Supplies Library
BASIC1.8 V3.3 V
•IncludesBasiccellsenablingtheIOring construction in Core-Limited, Pad-Limited or Pad in Core configurations
CORESUPPLY1.0 V1.8 V3.3 V
•DedicatedCoreSupplycells and ESD Core-Clamp
CDMKIT1.1 V1.8 V
•OptimizedCDMprotections
Packaging Library BUMP NA•AvailablewiththreeclassesofBUMPcells•ProvidesFlip-Chipstrategytoan IO library for high pin count
*OtherelectricalparameterswillbedisclosedunderNDA
8
• Body-biasingfeaturesupportforprocesscompensationandperformanceboost
• Low-powerfeaturesusinginputgating,standby,peripheryshutdownandarrayretention,andEmbeddedswitches
• Multiple power railfeatureforoperating-voltagereduction
• Multiple bank optionsofferinginterestingtiming-power-density-leakage trade-offs
• Embedded Test featuresincludingBISTmux,scanchains,andsynchronousbypasstoreducetesttimeandimprovetestcoverage
• Neutron Soft Error Rate (SER)lessthan10FIT/MbandImmunitytoAlphaSER
• Patented well structurestoenableUltra-Low-VoltageOperation.
• Multiple mux optionstoselectormodifytheaspectratio
• Speed modeselectiontoadjustthemarginsdependingonthevoltageofoperation
• Margin controlforself-timeandresetoperation
• Redundancytoimprovetheyieldattheproductionlevel
• Bit maskstopreservethecontent
Thecompilersarefurthercomplementedbyarichvarietyoffeatures,including:
MEMORIES28nmFD-SOIembeddedmemoryoffersversatilitytodesignersbyallowingthemtochoosefromawideportfolioofcompilers,withitsadvantageofhighperformanceandenergyefficiency,alongwithhighreliabilityandrobustness.FD-SOImemoriesprovidebest-in-classPPAandfiguresofmerit.TheofferincludesHigh-Performance,Low-Leakage,andLow-VoltageSRAMsandROMs,alongwithspecialmemories.
Single PortHigh Density
Single PortRegister
Read OnlyMemory
Low Leakage (LoLeak)
Single PortHigh Density
Single PortRegister
Dual PortHigh Density
Dual PortRegister
High Performance (HiPerf)
High DensityDual PortRegister
Special Memories
Single PortHigh Density
Single PortRegister
Dual PortHigh Density
Dual PortRegister
Body Bias Options
Compiler Name Description
Low leakage memory
SPHD_LOLEAK Single-port high-density compiler with best density, leakage trade-off
SPREG_LOLEAK Single-port register file optimized for leakage, speed, and density
ROM_LOLEAK Static ROM mainstream compiler
High performance memory
DPHD_HIPERF Dual-port compiler targeted for high-performance, density, and low-power applications
SPHD_HIPERF Single-port high-density compiler with best density and speed trade-off
DPREG_HIPERF Dual-port dual-rail register file with high-performance bitcell
SPREG_HIPERF Single-portregisterfilewithhighperformanceforCacheRAMapplications
BODYBIAS Memory
SPHD_BODYBIAS Single-port high-density compiler supporting forward body bias
SPREG_BODYBIAS Single-port register file supporting forward body bias for high-performance applications
DPHD_BODYBIAS Dual-port compiler targeted for high-performance, density, and low-power applications
DPREG_BODYBIAS Dual-port dual-rail register file with high-performance bitcell
Special Memory PRF2HD_BODYBIAS Area-optimised,dual-portregisterfileusingsingle-portbitcell
*OtherelectricalparameterswillbedisclosedunderNDA
9
The28nmFD-SOIPLLofferhasvariousfeatures:• On-the-fly switching(onrequest)• No dependence on supply
sequence(Inabsenceofanalogordigitalsupply,thePLLisautomaticallyinpower-downmode)
• Multiple operating modes:Normal,power-down,VCOstand-alone,Bypass
• Automatic Bandwidth tracking
• Compatibility with all metal stacks(usesonly5thinmetals)
• Clock de-skewingbyactingasanegativedelayelementtocompensatedclock-treedelay
PHASE LOCKED-LOOP (PLL)PhaseLocked-Loop(PLLs)areclockgeneratorsforfrequencysynthesis.Thestandardoffer(highlycustomizable)issupplementedwithhigh-performance,spread-spectrumandfractional-PLLoffers.
Fractional PLL
• Generatesoutput,whichisafractionalmultipleofinputfrequency
Standard PLL
• Generatesmultiplesofinputfrequency(FrequencySynthesis)• Highlycustomizable
Spread Spectrum PLL
• Spreadsenergyofoutputtoabandaroundit• ReducesElectromagneticInterference(EMI)
High Performance PLL
• Lowjitter,lowpower,lowareaPLLs• LCVCObasedPLLs
NameInput Frequency Output Frequency (MHz) VCO Frequency (MHz)
Min Max Min Max Min Max
PLL_FF_308MHZ 32.768KHz 32.768KHz 26 307.2 307.2 312.01
PLL_PF_960MHZ_B 1.92MHz 93 MHz 480.960 480.960 960 960
PLL_PF_960MHZ_32K 32.768KHz 32.768KHz 153.6 319.98 921.26 959.98
PLL_PF_1066MHZ 195MHz 1066 MHz 195 1066 780 1066
PLL_PF_1200MHZ 9.6 MHz 350MHz 9.52 1248 600 1248
PLL_PF_2132MHZ_7P 19.2MHz 52MHz 754(7phase) 2132(7phase) 754 2132
PLL_PF_3000MHZ_FR 24MHz 40MHz 31.25 3000 1500 3000
PLL_PF_3401MHZ 10 MHz 340MHz 106.25 3400 1700 3400
PLL_PF_4600MHZ_SSCG_FR 4.0MHz 350MHz 19.05 3000 2400 6000
PLL_PF_3200MHZ_SSCG_FR 4.0MHz 350MHz 12.7 1600 1600 3200
PLL_PF_5000MHZ_SSCG_FR 24MHz 40MHz 39.06 2500 2500 5000
PLL_PF_480MHZ_6P (for USB2.0) 2MHz 93 MHz 480(6phase) 480(6phase) 480 480
PLL_PF_6400MHZ 6 MHz 210MHz 50 3200 3200 6400
PLL_PF_4000MHZ 2MHz 372MHz 31.25 2000 2000 4000
PLL_PF_2920MHZ_8P 9.6 MHz 403MHz 1152(8phase) 2920(8phase) 1152 2920
*Area&PowerwillbedisclosedunderNDA
10
ON-CHIP CRYSTAL (XTAL) OSCILLATOR FEATURES:• FrequencyRange:32KHz,24MHz-30MHz• CompatiblewithMultiple-Metallization• ModesSupported:OscillationMode,IDDQMode,ForcethroughMode,StartupTestMode,BypassMode
ON-CHIP RC OSCILLATOR FEATURES:• FrequencyRange:30MHz,45MHz,90MHz
• MetalStack:7or8• ModesSupported:RawFrequencyMode,CalibrationMode,TrackingMode,IDDQMode,BypassMode
OSCILLATORSIn28nmFD-SOITechnology,acomprehensiveportfolioofoscillatorsisavailableenablingareacompetitiveness,multiplemetal-stackcompatibilityandwidefrequencyranges.Theoscillatorssupportvariousmodesofoperation.
Oscillators* FrequencyXTAL parameters
Max Rm Max CO CA/CB
32 KHz XTAL Oscillator
C28SOI_OSC_XO_32K_ULP_LLR_EG 32.768KHz 50KΩ 3.0 pF 18 pF ±20%
C28SOI_OSC_XO_32K_LR_EG 32.768KHz 50KΩ 3.5pF 28pF-32pF
24 MHz to 30 MHz XTAL Oscillator
C28SOI_OSC_XOA_24M_LR_EG 24-30MHz 50Ω 5pF 18 pF ±20%
C28SOI_OSC_XOA_30M_LR_EG 24-30MHz 50Ω
5pF 17 pF ±10%
7 pF 26pF±10%
9 pF 30 pF ±10%
RC Oscillator (FLL based)
C28SOI_RCOSCI_30M_32K_TRAC_LR_EG30 MHz45MHz90 MHz
- - -
*Area&PowerwillbedisclosedunderNDA
11
Reso
lutio
n (b
its)
Speed
6
8
10
12
14
16
18
20
24
∑∆
∑∆
SAR
Pipelined, Time Interleaved SAR
Flash ADC
Industrial control
AudioADC
Low speeddata acquisitionAutomotive,Battery Mgmt,Touch Screen,Microcontroller
GHz Data acquisitionRF application
High speed Data acquisitionLow Power Mobile, Cable Front End,Medical equipment, Wifi, WiMax, Set Top Box, WLAN
Low Speed/DC Audio Band 100 k - 5 Msps 5 - 250 Msps 250 - 500 Msps Gsps
ANALOG-TO-DIGITAL CONVERTORS (ADC)In28nmFD-SOITechnology,abroadportfolioofADCsisavailable,supportingmultipleresolutionsandspeedspecifications.
ADC No of bits Main features Type
AD12PP160MIQ_10 12Bits,ENOB10Bits 160Msps Pipelined
AD12PP500M_10 12Bits,ENOB10Bits 500Msps Pipelined
AD10PP160MIQ_10 10 Bits, ENOB 9 Bits 160Msps Pipelined
AD12PP5G_18 12Bits,ENOB10Bits 5Gsps Pipelined
AD12SA1MLA_18 12Bits,ENOB10Bits 1Msps SAR
AD9SA6G_18 9Bits,ENOB7.5Bits 6Gsps SAR
AD8SA64G_10 8Bits,ENOB6.5Bits 64Gsps SAR
AD14SA250K_18 14Bits,ENOB13Bits 250Ksps SAR
*Area&PowerwillbedisclosedunderNDA
Audio ADC No of bits Main features Type
AD18ASDSE_18 18 Bits SNR 98dB Sigma Delta
*Area&PowerwillbedisclosedunderNDA
• Best-in-classPPA• Multiplearchitecturesavailable
• Availableforvariousapplicationandcustomizableonrequest
• Highspeed(upto64Gsps)• HighResolution(upto24bits)
Thefollowingfeaturesaresupportedin28nmFD-SOIADCs:
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DIGITAL-TO-ANALOG CONVERTORS (DAC)ST’sDACportfoliofor28nmFD-SOITechnology,offersvariousresolutionsandspeedspecificationsformultipleapplications.
DAC No of bits Main features Type
DACI10HD3x1_1V8 10 Bits Outputcurrent=3.25mASFDR=54dBc@6MHz
Current Steering
DA10HD6X4_18_C28SOI8M 10 BitsOutputcurrent=6mASFDR=54dBc@6MHz
Fs = 160 MHzCurrent Steering
DAI10HD9X4CBLDET_1V8_EG8M 10 Bits
Outputcurrent=8.7mASFDR=54dBc@6MHz
Fs = 160 MHzwith cable detection
Current Steering
DACI10HF1DA3_1V8 10 BitsOutputcurrent=1.25mASFDR=60dBc@Nyquist
Q-switching Current Steering
DACI10HD17TO34X3_1V8_LLR_EG8M 10 BitsOutputcurrent=17mAto34mA
SFDR=54dBc@6MHzFs = 160 MHz
Current Steering
DACI10HF1OPC3_1V8_LLR_EG8M 10 BitsOutputcurrent=1.25mASFDR=60dBc@40MHz
Fs=640MHzCurrent Steering
DACI14HF3TO20DA4CAL_1V8_EG8M 14BitsOutputcurrent=3mAto20mASFDR=70dBc@210MHz
Fs=750MHzCurrent Steering
*Area&PowerwillbedisclosedunderNDA
Audio DAC No of bits Main features Type
DA24VASDLA_18 24Bits SNR 98 db Sigma Delta
*Area&PowerwillbedisclosedunderNDA
• Best-in-classPPA• Multiplearchitecturesavailable
• Availableforvariousapplicationandcustomizableonrequest
• Highspeed(upto10Gsps)• HighResolution(upto24bits)
Thefollowingfeaturesaresupportedin28nmFD-SOIDACs:Re
solu
tion
(bits
)
Speed
6
8
10
12
14
16
18
20
24∑∆
R-String
R-String
AudioADC
Instrumentation DACMedical/Scientific instrumentation
Transmission DACMulti-carrier,Multi-mode baseband/wideband applicationVideo DAC
Compliant to All VideoStandard specification
Servo DACCD/DVD player
Low Speed/DC Audio Band 100 k - 5 Msps 5 - 250 Msps 250 - 500 Msps
Static DACDC motor control,DC gain & bias control
Gsps
Current Steering
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ONE-TIME-PROGRAMMABLE (OTP) IP: FUSEOTPIPisaone-timeprogrammablememorybasedonananti-fusecellwithsynchronousinterfaceanddual-supplyvoltage.Itisanon-volatilememory,withembeddedprogrammingcapabilityandaspecificprogrammingsequence.In28nmFD-SOItechnology,memorycellssupportdatastorageusingdielectricbreakdownphenomena.Alllibrariesembedahigh-voltagechargepumpanddonotrequireanHVpad.
Library Name Key Features/Specification
FU_OTP_LLR_EG OTPanti-fuselibraryisdesignedin28nmFD-SOItechnology
*OtherelectricalparameterswillbedisclosedunderNDA
• Dual supply:1.1V&1.8V(includesaninternalpowerswitch)
• IPsinmultiple-metal stackarerespectivelyfullyblocked
• Storage capacityof1Kbit,2Kbit,4Kbit,8Kbit,and16Kbit.
• Maximum clock frequency(functional)is120MHz
• Wordsize:• Standard with ECC correction:32usefuldatabyword(Defaultmodenotincrementalprogramming)
• No ECC, correction is done by redundancy:16usefuldatabyword(onlyforwordrequiringincrementaldataprogramming)
• Maximum clock frequency(scantest)is100MHz
• Mean programming timeislessthan10us/bit
• Programming lockword-by-word.• Static16bitsdatawordavailableatpowerON
TheOTPIPprovidesthefollowingfeaturesinits28nmFD-SOItechnologyvariant:
EMBEDDED POWER-MANAGEMENT IPsEmbeddedpower-managementIPsenablepoweroptimizationinSoCandASICdesignsthroughBody-Biasing,PowerSwitches,andEmbeddedMetrologycells.
Power Management IPs Description
Body-Biasing IPs
BBGEN_LLR_EG Embedded Body Bias Generator with low power, low Vt and regular Vt process options
BBMUX21_LLR_EG Embedded Body Bias Multiplexer with low power, low Vt and regular Vt process options
Power Switches
EPOD_PLMEG_LLR_EG Peripheral Embedded Power Distribution IP with Power Line Multiplexing feature and switch device EG
EPOD_PSWFBMP_LLR_EG Peripheral Embedded Power Distribution IP with a switch device having Feedback and Modular Pre-charge features
Embedded Metrology Cells
EMET_BE Front-End embedded metrology structure
EMET_FE Back-End embedded metrology structure
*OtherelectricalparameterswillbedisclosedunderNDA
14
Sensor Features/Specification
Low Area Temperature Sensor
•Measureson-chiptemperature•Accuracy:±4ºC•Senserange:-40ºCto125ºC•SuitableforsmallSOCs,safetyfeatures
High-Performance Distributed Voltage & Temperature Sensor
•RemoteV&Tsensingwithcentralizedprocessing•Temperatureaccuracy:±1ºCover-40ºCto125ºC•Voltageaccuracy:±5mVover0.6V-1.25V•Temperature-independentvoltage-basedcalibration
*OtherelectricalparameterswillbedisclosedunderNDA
VOLTAGE & THERMAL SENSORSVoltageSensorlibraryallowstoembedvoltage-measurementfeatureinSoC,andThermalSensorprovidesdigitalmeasurementofthejunctiontemperature.
Theadvantagesofusingthesesensorsin28nmFD-SOItechnologyare:• DynamicFrequencyScaling(DFVS)forhighperformance
• ThermalandVoltageprofiling,security,thermal(fan)control
• IR-DropAnalysis,Smartpowermanagement
PROCESS-MONITORING BOX (PMB)Process-MonitoringSensorstracktheon-chipprocessfluctuationsfromfab-to-fab,wafer-to-wafer,andwithin-waferusingauniquedieprocessIDtoensurethechipiswithinthepre-definedprocesslimits(temperaturemonitoring,compensationanddebug,andfailureanalysis).
Library Name Description
Sensors
GO2_LR_OD_18 MonitorstheprocessofGO2OD18devicesGO1_LL Measures the SoC performance & helps to debug the failure analysis of chip, based on Low-Power & Low-Vt process optionGO1_LR Measures the SoC performance & helps to debug the failure analysis of chip, based on Low-Power & Regular-Vt process optionCPR8T_LL Contains 8-Track Critical-Path Replica (CPR) cells used for process compensation and voltage scaling
CPR_LLContains12-TrackCritical-PathReplica(CPR)cellsusedforprocesscompensationandvoltagescaling,with three dedicated sensors, based on Low-Power & Low-Vt process option
CPR_LRContains12-TrackCritical-PathReplica(CPR)cellsusedforprocesscompensationandvoltagescaling,with three dedicated sensors, based on Low-Power & Regular-Vt process option
RCM5_COUP_LL Monitors back-end process
Controllers
CONTROL8T_LL 8-Track Process-Monitoring Controller for on-chip compensation to save power, based on Low-Power & Low-Vt process optionCONTROL_LL 12-TrackProcess-MonitoringControllerforon-chipcompensationtosavepower,basedonLow-Power&Low-Vtprocessoption
CONTROL_LR12-TrackProcess-MonitoringControllerforon-chipcompensationtosavepower,based on Low-Power & Regular-Vt process option
CONTROL8T_LL_ASYNC 8-Track Process-Monitoring asynchronous controller with soft CPR, based on Low-Power & Low-Vt process optionCONTROL8T_LR_ASYNC 8-Track Process-Monitoring asynchronous controller with soft CPR, based on Low-Power & Regular-Vt process optionCONTROL_LR_ASYNC 12-TrackProcess-MonitoringasynchronouscontrollerwithsoftCPR,basedonLow-Power&Regular-VtprocessoptionWRAPPER_LL Contains controller logic for sensors used in process monitoring and on-chip compensation to save power
*OtherelectricalparameterswillbedisclosedunderNDA
15Interfaces PHYs Description
MIPIDPHY_MCNN_4MFAA_1500MBP_LR_EG MIPIDPHYMaster4DataLane
MIPIDPHY_SCNN_1SFAA_1500MBP_LR_EG MIPI DPHY Slave 1 DataLane
MIPIDPHY_SCNN_2SFAA_1500MBPS_LR_EG MIPIDPHYSlave2DataLane
USB2_1PHY PhysicallayerofUSB2Host&Deviceports
USB2_2PHY PhysicallayerofUSB2Host&Deviceports
USB2_3PHY PhysicallayerofUSB2Host&Deviceports
USB2PHY_S PhysicallayerofUSB2Host&Deviceports
OTG2 AddshostfunctionalitytoUSBperipherals
HDMITX_3G4_1V8_LL_EG Electrical layer of the HDMI Transmitter
HDMITX_6G0_1V8_LLR_EG Electrical layer of the HDMI Transmitter
MIPIDIGRF4GPHY_1TX2RX ElectricallayeroftheDIGRF4GPHYtransmitterandreceiver
LVDS1V8_EG Low Voltage Differential Signaling 1.8V IO in standard frame
DPTX_4L_IM5G4_1V8_LLR_EG AnalogphysicallayerofDisplayPorttransmitter
HDMIDPRX_5G4_3V3_LLR_EG DP/HDMI/DVI Combo Receiver
*OtherelectricalparameterswillbedisclosedunderNDA
Regulator Key Features/Specification
DC_LN_1V8TO1V0_PHY_EG•Generates1.0Voutputfrom3.3Vand1.8VinputsforvariousPHYIPs•Maininputsupplyisfrom3.3V±10%and1.8V±150mV•Regulatedoutputsupplyis1.0V±100mV
DC_LN_1V8TO1V0_USB_EG•Supportsmain/inputsupplyof1.65V-1.95Vanddigitalregulatedoutputsupply:1.0V±100mV•Nooff-chipcapacitorrequiredforregulatorstability
DC_LN_1V81V0_STBY_LR_EG•Generatesmultipleoutputs(1.8V,1.0V)from3.3Vand1.35Vinputs.•Theregulatedoutputsupplyis1.0V±100mV,whichcanbeprogrammeddownto0.6V,1.8V±150mV
DC_LN_2V51V81V0_LR_EG•Generatesmultipleoutputs(2.5V,1.8V,1.0V)from3.3Vand1.35Vinputs.•Main/inputsupply1:3.0V-3.6VandDDR4supply(1.2V-5%to1.8V+10%)•Regulatedoutputsupplyis1.0V±100mV,whichcanbeprogrammeddown
*OtherelectricalparameterswillbedisclosedunderNDA
HIGH-SPEED SERIAL LINKSAdedicatedportfolioofHigh-SpeedSerialLinksissupportedin28nmFD-SOItechnology.
LINEAR REGULATORS28nmFD-SOILinearRegulatorsofferflexibilitytodesignersintermsofgeneratedoutputsfromtherequiredinputsthusdeliveringcustomizedsolutions,withotherexcitingfeatures.
Regulatorfeaturesin28nmFD-SOItechnologyare:• Customizedsolutionforinput&outputvoltages
• Configurableloadcurrent• Lowdrop-out,<200mV
• Noexternalcapacitancerequired• Fast-transientresponse,HighPSR• Voltage-handlingcapacityhigherthandevicebreakdown
• Low-powermodeforStandby• SafetyFeatures:Power-on-Reset,Supplymonitoring,Over-currentprotection,SafeStartup
For more information on ST products and solutions, visit www.st.comOrder code: BRFDSOI0616
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