2 sanmina sn100c spanish

20
50μm Copper laminate Solder fillet Solder resist Sn-3.0Ag-0.5Cu 250°C, 3.3 seconds Copper Erosion Copper Erosion During Wave Soldering

Upload: napoleon-torres

Post on 02-Jun-2018

218 views

Category:

Documents


0 download

TRANSCRIPT

Page 1: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 1/20

50μm 

Copper laminate 

Solder fillet 

Solder resist 

Sn-3.0Ag-0.5Cu

250°C, 3.3 seconds

Copper ErosionCopper Erosion During Wave Soldering

Page 2: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 2/20

Sn-3.0Ag-0.5Cu

250°C, 3.3 seconds

50μm 

Solder fillet 

Copper laminate 

Copper ErosionCopper Erosion During Wave Soldering

Page 3: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 3/20

After 6 Passes Wave Soldering

105°C Preheat, 256°C Solder Temperature, 4 seconds contact time

Original Pad

18μm Copper

Sn-37Pb Sn-3.0Ag-0.5Cu SN100C

Copper ErosionCopper Erosion During Wave Soldering

Page 4: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 4/20

After 6 Passes Wave Soldering

105°C Preheat, 256°C Solder Temperature, 4 seconds contact time

Original Pad

18μm Copper

Sn-37Pb Sn-3.0Ag-0.5Cu SN100C

Copper ErosionCopper Erosion During Wave Soldering

Page 5: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 5/20

Copper

Erosion

(μm)

Number of Times

Wave Soldered

EXTENT of Cu EROSION on SOLDER SIDE PADS

as a FUNCTION of the NUMBER of TIMES WAVE SOLDERED

OSP Finish

Kyoden Ltd (Japan) Cu Erosion Study

Copper ErosionCopper Erosion During Wave Soldering

SAC305

SN100C

Page 6: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 6/20

Copper

Erosion

(μm)

Number of Times

Wave Soldered

EXTENT of Cu EROSION on INSIDE WALL of THROUGH HOLES

as a FUNCTION of the NUMBER of TIMES WAVE SOLDERED

OSP Finish

Ref: Kyoden Ltd

Kyoden Ltd (Japan) Cu Erosion Study

Copper ErosionCopper Erosion During Wave Soldering

SAC305

SN100C

Page 7: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 7/20

Repaired 5 times

 

Tip temperature: 35 ℃ 

Spec of the board 

Pad depth:  16μm

 

Pad width : 0 165

mm

 

Distance between pads

:  0 165mm 

SAC305

SN100C

Disappearance of

Cu tracks due to

erosion

Copper ErosionCopper Erosion During Rework

Page 8: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 8/20

What has been the experience with SAC Alloys?

Stainless Steel Erosion

Page 9: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 9/20

Stainless Steel Erosion

Page 10: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 10/20

Stainless Steel Erosion

Page 11: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 11/20

ENVIRONMENTAL IMPACT

Environmental Impact of Silver

Page 12: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 12/20

Environmental Impact of Silver

Page 13: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 13/20

Better

Worse

Page 14: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 14/20

Environmental Impact of Silver

Page 15: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 15/20

What is the electronics industrygoing to use

after SAC305?

SAC305

The real question….. 

After ?

Page 16: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 16/20

What is the alternative to Sn-Ag-Cu Lead-free Solders?

Sn-Ag- CuAdvantages of Sn-Cu

• Lowest raw material cost

• Low environmental impact

• Raw material readily available

Does not complicate recycling ofelectronic assemblies

• Simple so easy to manage

Page 17: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 17/20

There is a convenient eutectic in

the Sn-Cu System

Cu6Sn5

Eutectic at 0.7Cu

Page 18: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 18/20

Sn-0.7%Cu

Cooling Rate ~50C/sec

But the solidification behaviour is nearly as bad as SAC305

Page 19: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 19/20

Sn-0.7Cu

Primary β-Sn

dendrites

Cooling rate ~ 5°C/sec

The Sn-0.7Cu alloy does not freeze as a eutectic

Page 20: 2 Sanmina SN100c Spanish

8/11/2019 2 Sanmina SN100c Spanish

http://slidepdf.com/reader/full/2-sanmina-sn100c-spanish 20/20

Primary β-Sn

Dendrites

EutecticMatrix

The Sn-0.7Cu alloy does not freeze as a eutectic