1692mse r3[1].2a technical handbook

3AL 97869 AAAA ED.01

Technical Handbook

Alcatel 1692MSE

8 Channels CWDM System

1692MSE REL.3.2A

3AL 97869 AAAA ED.01

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1692MSE REL.3.2A TECHNICAL HDBK

CONTENTS

HANDBOOK GUIDE ........................................................................................................... 13

1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK ........................................... 14

1.1 General information ......................................................................................................... 14 1.2 Handbook applicability ..................................................................................................... 14 1.3 Product-release handbooks............................................................................................... 15 1.4 Handbook Structure.......................................................................................................... 17 1.5 Handbook configuration check.......................................................................................... 18

1.5.1 List of the editions and modified parts........................................................................ 18 1.5.2 Notes on Release 1.0 ED.01...................................................................................... 19 1.5.3 Notes on Release 1.1 ED.01...................................................................................... 19 1.5.4 Notes on Release 1.2A ED.01 ................................................................................... 19 1.5.5 Notes on Release 1.2A1 ED.01 ................................................................................. 20 1.5.6 Notes on Release 1.4 ED.01...................................................................................... 20 1.5.7 Notes on Release 3.0 ED.01...................................................................................... 20 1.5.8 Notes on Release 3.1 ED.01...................................................................................... 21 1.5.9 Notes on Release 3.2A ED.01 ................................................................................... 21

2 COMPLIANCE WITH EUROPEAN NORMS. .................................................................... 22

2.1 Electromagnetic Compatibility (EMC) ................................................................................. 23 2.2 Safety............................................................................................................................... 23 2.3 Environmental constraints ................................................................................................. 23

3 SAFETY NORMS AND LEBELS ....................................................................................... 24

3.1 First aid for electric shock.................................................................................................. 24 3.2 Safety Rules...................................................................................................................... 26

3.2.1 General rules ........................................................................................................... 26 3.2.2 Labels indicating Danger, Forbiddance, Command.................................................... 27 3.2.3 Dangerous electrical voltages.................................................................................... 28 3.2.4 Harmful optical signals ............................................................................................. 29 3.2.5 Risks of explosions .................................................................................................... 31 3.2.6 Moving mechanical parts .......................................................................................... 31 3.2.7 Heat-radiating mechanical parts ............................................................................... 31 3.2.8 Specific safety rules in this handbook ......................................................................... 32

4 OTHER NORMS AND LABELS ....................................................................................... 33

4.1 Electromagnetic Compatibility ........................................................................................... 33 4.1.1 General norms - Installation...................................................................................... 33 4.1.2 General norms - Turn-on, Tests & Operation ............................................................. 33 4.1.3 General norms - Maintenance................................................................................... 34

4.2 Electrostatic Dischargers (ESD)........................................................................................... 34 4.3 Suggestions, notes and cautions ........................................................................................ 35 4.4 Labels affixed to the Equipment ......................................................................................... 35

5 LIST OF ABBREVIATIONS............................................................................................. 40

6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION............................................... 43

6.1 Products, product-releases, versions and Customer Documentation..................................... 43 6.2 Handbook supply to Customers......................................................................................... 43 6.3 Aims of standard Customer Documentation ....................................................................... 43

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6.4 Handbook Updating......................................................................................................... 44 6.4.1 Changes introduced in the same product-release (same handbook P/N) ..................... 44 6.4.2 Changes due to a new product-release...................................................................... 45

6.5 Customer documentation supply on CD-ROM.................................................................... 45 6.5.1 Contents, creation and production of a CD-ROM....................................................... 45 6.5.2 Use of the CD-ROM.................................................................................................. 45 6.5.3 CD-ROM identification.............................................................................................. 46 6.5.4 CD-ROM updating ................................................................................................... 46

DESCRIPTIONS ................................................................................................................... 48

1 FUNCTIONAL DESIGN ................................................................................................. 49

1.1 Basic equipment configurations ......................................................................................... 51 1.1.1 Line terminal ............................................................................................................ 51 1.1.2 Optical Add and Drop Multiplexer (OADM)................................................................ 51 1.1.3 Regenerator ............................................................................................................. 53 1.1.4 CPE ......................................................................................................................... 53

1.2 Network architectures ....................................................................................................... 54 1.2.1 Ring networks........................................................................................................... 54 1.2.2 Point to point links .................................................................................................... 54 1.2.3 CPE configuration in ring network.............................................................................. 55 1.2.4 CPE configuration in point to point links..................................................................... 55

1.3 Network protection ........................................................................................................... 56 1.4 Description of the functions ............................................................................................... 56

1.4.1 Main function in different configuration...................................................................... 56 1.4.2 Description of the functions ....................................................................................... 61

1.5 Device description ............................................................................................................ 72 1.5.1 Shelf list ................................................................................................................... 72 1.5.2 Shelf and boards designation and reference .............................................................. 73 1.5.3 Slot allocations ......................................................................................................... 78

1.6 System Configuration........................................................................................................ 80 1.6.1 Configuration criteria................................................................................................ 80 1.6.2 Terminal configuration.............................................................................................. 80 1.6.3 OADM configuration ................................................................................................ 85 1.6.4 Regenerator configuration......................................................................................... 87 1.6.5 CPE configuration..................................................................................................... 89

1.7 Optical safety ................................................................................................................... 91 1.7.1 General information ................................................................................................. 91

1.8 1692MSE System characteristics ........................................................................................ 92 1.8.1 Power supply ............................................................................................................ 92 1.8.2 Equipment and shelf control ...................................................................................... 93 1.8.3 Management and monitoring interfaces..................................................................... 93

1.9 Environmental characteristics ............................................................................................ 95 1.9.1 ETSI compliancy........................................................................................................ 95 1.9.2 Environmental constraints ......................................................................................... 96

2 MECHANICAL DESCRIPTION...................................................................................... 101

2.1 Rack design.................................................................................................................... 101 2.2 CO shelf ........................................................................................................................ 102

2.2.1 Shelf organization................................................................................................... 102 2.2.2 Shelf dimensions .................................................................................................... 103

2.3 Compact shelf ................................................................................................................ 103 2.3.1 Shelf organization................................................................................................... 104 2.3.2 Shelf dimensions .................................................................................................... 104

2.4 Unit front view................................................................................................................ 105

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2.5 Power consumption and weight ....................................................................................... 108 2.5.1 Maximum power consumption and weight of the boards and units............................ 108 2.5.2 Maximum power consumption of the equipment ...................................................... 108

2.6 FIT of 1692 MSE............................................................................................................. 109 2.7 Equipment connections ................................................................................................... 110

2.7.1 Optical connections ................................................................................................ 110 2.7.2 Management connections ....................................................................................... 112 2.7.3 Power supply connections........................................................................................ 115

3 UNITS DESCRIPTION.................................................................................................. 116

3.1 Wavelength Adapter ....................................................................................................... 116 3.1.1 Description............................................................................................................. 117 3.1.2 Optical interfaces ................................................................................................... 118 3.1.3 WLA configurations................................................................................................. 119 3.1.4 Performance monitoring ......................................................................................... 124 3.1.5 Front panel description ........................................................................................... 125

3.2 10 Gbps Optical Channel Card (OCC10) ....................................................................... 128 3.2.1 Description............................................................................................................. 128 3.2.2 OCC10 configuration............................................................................................. 129 3.2.3 Optical characteristics............................................................................................. 131 3.2.4 Front panel description ........................................................................................... 132

3.3 2XGE-FC Unit ................................................................................................................ 134 3.3.1 Description............................................................................................................. 134 3.3.2 Optical interfaces ................................................................................................... 134 3.3.3 2XGE-FC configuration ........................................................................................... 134 3.3.4 Front panel description ........................................................................................... 136

3.4 MUX/DEMUX units (C-MDX)............................................................................................ 138 3.4.1 C-MDX-E-U-S......................................................................................................... 138 3.4.2 C-MDX-U............................................................................................................... 142 3.4.3 C-MDX-B-S ............................................................................................................ 146 3.4.4 C-MDX-B ............................................................................................................... 149

3.5 MUX/DEMUX units (C-MDX2).......................................................................................... 152 3.5.1 C-MDX2-E-U-S....................................................................................................... 152 3.5.2 C-MDX2-U............................................................................................................. 153 3.5.3 C-MDX2-E-1-S ....................................................................................................... 154 3.5.4 C-MDX2-E-2-XX-S .................................................................................................. 157

3.6 OADM units (C-OAD)..................................................................................................... 161 3.6.1 C-OAD-E-U-1-XX-S ................................................................................................ 161 3.6.2 C-OAD-U-1-XX ...................................................................................................... 165 3.6.3 C-OAD-E-U-2-XXXX-S............................................................................................. 168 3.6.4 C-OAD-U-2-XXXX................................................................................................... 172 3.6.5 C-OAD-B-1-XX-S .................................................................................................... 175 3.6.6 C-OAD-B-1-XX....................................................................................................... 179

3.7 OADM2 units (C-OAD2)................................................................................................. 182 3.7.1 C-OAD2-E-U-1-XX-S .............................................................................................. 182 3.7.2 C-OAD2-U-1-XX .................................................................................................... 184 3.7.3 C-OAD2-E-U-2-XXXX-S........................................................................................... 185 3.7.4 C-OAD2-U-2-XXXX................................................................................................. 186 3.7.5 C-OAD2-E-U-4-XXXXXXXX-S.................................................................................... 187 3.7.6 C-OAD2-U-4-XXXXXXXX.......................................................................................... 191

3.8 ESC-LC board ................................................................................................................ 195 3.8.1 Front panel description ........................................................................................... 196

3.9 C-4xANY card................................................................................................................ 198 3.9.1 Description............................................................................................................. 198 3.9.2 C-4xANY optical characteristics ............................................................................... 201

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3.9.3 Front panel description ........................................................................................... 204 3.10 OSC unit........................................................................................................................ 206

3.10.1 Description…………………………........................................................................... 206 3.10.2 Functional description of the configurations.............................................................. 206 3.10.3 Optical characteristics............................................................................................. 207 3.10.4 Front panel description ........................................................................................... 208

3.11 OMSP unit...................................................................................................................... 209 3.11.1 Description…………………..................................................................................... 209 3.11.2 Optical characteristics............................................................................................. 209 3.11.3 Front panel description ........................................................................................... 210 3.11.4 Front panel wiring .................................................................................................. 210

3.12 I-LINK-S unit................................................................................................................... 211 3.12.1 Description………………….. ................................................................................... 211 3.12.2 Front panel description ........................................................................................... 212

3.13 General user interfaces................................................................................................... 214 3.13.1 Power Supply Card ................................................................................................. 214 3.13.2 Power Management Unit (PMU)............................................................................... 215 3.13.3 Housekeeping board (HK)....................................................................................... 219 3.13.4 Rack Alarm Interface board (RAI) ............................................................................. 220 3.13.5 LAN-Q board…………….. ...................................................................................... 222

3.14 FANS unit....................................................................................................................... 224 3.14.1 FAN-CO unit………….. .......................................................................................... 224 3.14.2 FAN unit………. ..................................................................................................... 224 3.14.3 LEDs signification.................................................................................................... 225

MAINTENANCE ................................................................................................................ 227

4 MAINTENANCE .......................................................................................................... 228

4.1 Maintenance introduction................................................................................................ 228 4.1.1 General safety rules ................................................................................................ 228 4.1.2 General rules ......................................................................................................... 228 4.1.3 Maintenance - definitions ........................................................................................ 228 4.1.4 Instruments And Accessories.................................................................................... 229

4.2 Preventive maintenance .................................................................................................. 229 4.2.1 Routine maintenance every year .............................................................................. 229 4.2.2 Routine maintenance of fan filter ............................................................................. 229

4.3 Corrective maintenance (troubleshooting) ........................................................................ 230 4.4 Set of spare parts ........................................................................................................... 230

4.4.1 Suggested Spare Parts............................................................................................. 230 4.4.2 General rules on spare parts management .............................................................. 230 4.4.3 Particular rules on spare parts management ............................................................ 231

4.5 Operating advices .......................................................................................................... 231 4.6 Repair Form ................................................................................................................... 232

DISMANTLING & RECYLING............................................................................................. 234

5 DISMANTLING & RECYCLING .................................................................................... 235

5.1 WEEE general information .............................................................................................. 235 5.2 How to disassembly equipment ....................................................................................... 237

5.2.1 Waste codes detailed information............................................................................ 237 5.2.2 Tools necessary for disassembly .............................................................................. 242 5.2.3 Subrack disassembly............................................................................................... 242 5.2.4 Unit disassembly..................................................................................................... 249 5.2.5 Hazardous materials and components..................................................................... 255

5.3 Eco declaration .............................................................................................................. 257

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FIGURES Figure 1 Labels for units with stiffening bar...........................................................................36 Figure 2 Labels for units without stiffening bar ......................................................................37 Figure 3 Label identifying label on catalogue .......................................................................37 Figure 4 Label specifying serial No. .....................................................................................37 Figure 5 Labels on the SFP ..................................................................................................38 Figure 6 SFP label description..............................................................................................38 Figure 7 SFP label example .................................................................................................38 Figure 8 CE label ................................................................................................................38 Figure 9 WEEE label............................................................................................................38 Figure 10 Electrostatic label...................................................................................................39 Figure 11 Labels on shelf ......................................................................................................39 Figure 12 1692MSE R3.2A in line terminal configuration ........................................................51 Figure 13 1692MSE R3.2A in OADM configuration ................................................................52 Figure 14 1692MSE R3.2A in back to back terminal configuration...........................................53 Figure 15 1692MSE R3.2A in regenerator configuration .........................................................53 Figure 16 Block diagram of CPE ............................................................................................53 Figure 17 1692MSE in ring networks .....................................................................................54 Figure 18 1692MSE in point to point configuration.................................................................54 Figure 19 1692MSE in ring networks with CPE .......................................................................55 Figure 20 1692MSE in point to point links with CPE ................................................................55 Figure 21 Functional synopsis in unidirectional Line Terminal configuration .............................56 Figure 22 Functional synopsis in bi-directional Line Terminal configuration ..............................57 Figure 23 Functional synopsis in unidirectional OADM configuration .......................................57 Figure 24 Functional synopsis in bi-directional OADM configuration........................................58 Figure 25 Functional synopsis in regenerator configuration (use MUX/DMUX) ..........................59 Figure 26 Functional synopsis in regenerator configuration (use OADM)..................................59 Figure 27 One-channel CPE configuration .............................................................................60 Figure 28 Two-channel CPE configuration..............................................................................60 Figure 29 Transponder function.............................................................................................61 Figure 30 TDM concentration function....................................................................................62 Figure 31 CWDM MUX side...................................................................................................63 Figure 32 8:1 MUX used as MUX/DMUX................................................................................63 Figure 33 CWDM DMUX side ................................................................................................63 Figure 34 1 ch Add/drop function in unidirectional transmission .............................................64 Figure 35 2 ch Add/drop function in unidirectional transmission .............................................64 Figure 36 1 ch add/drop function in bi-directional transmission ..............................................65 Figure 37 4 ch add/drop function ..........................................................................................65 Figure 38 1310nm circulator .................................................................................................66 Figure 39 1310nm broadband filter ......................................................................................66 Figure 40 Optical supervisory channel management in line terminal and OADM configuration.66 Figure 41 OMSP application without OADM...........................................................................67 Figure 42 OMSP application with OADM ...............................................................................67 Figure 43 SNCP in a ring network..........................................................................................68 Figure 44 Electrical SNCP......................................................................................................68 Figure 45 Optical SNCP ........................................................................................................69 Figure 46 BSNCP+EPS using two WLA3C...............................................................................69 Figure 47 C-4xANY with O-SNCP (use WLA-P) .......................................................................70 Figure 48 C-4xANY with O-SNCP (use OMSP)........................................................................70 Figure 49 C-4xANY with E-SNCP ...........................................................................................70 Figure 50 16 channels upgradable ........................................................................................71 Figure 51 Four compact shelves used in a NE (front view) .......................................................72 Figure 52 One CO shelf used in a NE (front view) ..................................................................73 Figure 53 An example for slot allocations in unidirectional application (only WLA)....................81

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Figure 54 An example for slot allocations in unidirectional application (using compact shelves, only C-4xANY)...................................................................................................................82

Figure 55 An example for slot allocations in unidirectional application (using CO shelves, only C-4xANY)..........................................................................................................................83

Figure 56 An example for slot allocations in unidirectional application (using CO shelves, mixed WLA and C-4xANY) ...........................................................................................................84

Figure 57 Slot allocations in bi-directional application ............................................................85 Figure 58 An example for slot allocations in unidirectional OADM application (1 channel

add/drop) .........................................................................................................................85 Figure 59 An example for slot allocations in unidirectional OADM application (2 channels

add/drop) .........................................................................................................................86 Figure 60 An example for slot allocations in unidirectional OADM application (4 channels

add/drop) .........................................................................................................................86 Figure 61 An example for slot allocations in bi-directional OADM application..........................87 Figure 62 An example for slot allocations in regenerator applications (MUX/DMUX).................88 Figure 63 An example for slot allocations in regenerator application (OADM)..........................89 Figure 64 An example for slot allocations in one-channel CPE application ...............................90 Figure 65 An example for slot allocations in two-channel CPE application................................90 Figure 66 1692MSE input power stage (same as PSC2) ..........................................................92 Figure 67 Equipment and shelf control ...................................................................................93 Figure 68 Climatogram for hazard level 1.2: no temperature controlled storage location .........97 Figure 69 Climatogram for hazard level 3.2: partly temperature controlled locations ...............99 Figure 70 Rack description ..................................................................................................101 Figure 71 Shelf organization................................................................................................102 Figure 72 Shelf front view with cover ....................................................................................102 Figure 73 Shelf dimensions .................................................................................................103 Figure 74 1692MSE single shelf...........................................................................................103 Figure 75 1692 MSE compact shelf mechanical structure ......................................................104 Figure 76 Shelf dimension and shelf partitioning ..................................................................104 Figure 77 ESC-LC front view................................................................................................105 Figure 78 LAN-Q board front view.......................................................................................105 Figure 79 PSC2 board front view .........................................................................................105 Figure 80 FAN board front view...........................................................................................105 Figure 81 FAN-CO board example......................................................................................105 Figure 82 OSC board front view ..........................................................................................106 Figure 83 OMSP board front view........................................................................................106 Figure 84 WLA3C board front view......................................................................................106 Figure 85 WLA3COP board front view .................................................................................106 Figure 86 OCC10-NA board front view ...............................................................................106 Figure 87 2XGE-FC board front view ...................................................................................106 Figure 88 C-OAD-E-U-1-6161-S board front view................................................................106 Figure 89 C-OAD2-E-U-4-55575961-S board front view......................................................106 Figure 90 C-MDX-E-U-S board front view.............................................................................106 Figure 91 C-4xANY board front view ...................................................................................106 Figure 92 HK board front view.............................................................................................107 Figure 93 RAI board front view ............................................................................................107 Figure 94 I-LINK-S board front view.....................................................................................107 Figure 95 LC optical connectors...........................................................................................110 Figure 96 LC optical connectors...........................................................................................110 Figure 97 MU optical connectors .........................................................................................111 Figure 98 MU optical connectors .........................................................................................111 Figure 99 MU optical connectors .........................................................................................111 Figure 100 Block diagram of WLA3C boards .........................................................................116 Figure 101 Block diagram of WLA3COP boards.....................................................................117 Figure 102 Add and drop matrix configuration.......................................................................120

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Figure 103 Local loopback matrix configuration .....................................................................120 Figure 104 Remote loopback matrix configuration..................................................................121 Figure 105 Local-remote loopback matrix configuration .........................................................121 Figure 106 Electrical SNCP matrix configuration .....................................................................122 Figure 107 Optical SNCP matrix configuration .......................................................................123 Figure 108 B-SNCP matrix configuration in one WLA3C .........................................................124 Figure 109 Front panel of WLA3C board ...............................................................................125 Figure 110 Front panel of WLA3COP board...........................................................................126 Figure 111 Block diagram of OCC10 board ..........................................................................128 Figure 112 Add/Drop configuration of OCC10 board ............................................................129 Figure 113 Client loopback configuration of OCC10 board....................................................130 Figure 114 Line loopback configuration of OCC10 board ......................................................130 Figure 115 Front panel of OCC10 board...............................................................................132 Figure 116 Block diagram of 2XGE-FC board ........................................................................134 Figure 117 Communication between two 2XGE-FC board (example) .......................................135 Figure 118 Local loopback configuration of 2XGE-FC board...................................................135 Figure 119 Remote loopback configuration of 2XGE-FC board ...............................................135 Figure 120 Front panel of 2XGE-FC board.............................................................................136 Figure 121 C-MDX-E-U-S block diagram ...............................................................................138 Figure 122 Front panel of C-MDX-E-U-S board ......................................................................140 Figure 123 C-MDX-U block diagram .....................................................................................142 Figure 124 Front panel of C-MDX-U board ............................................................................144 Figure 125 C-MDX-B-S block diagram...................................................................................146 Figure 126 Front panel of C-MDX-B-S board..........................................................................147 Figure 127 C-MDX-B block diagram......................................................................................149 Figure 128 Front panel of C-MDX-B board.............................................................................150 Figure 129 C-MDX2-E-U-S block diagram .............................................................................152 Figure 130 C-MDX2-U block diagram ...................................................................................153 Figure 131 C-MDX2-E-1-S block diagram..............................................................................154 Figure 132 Front panel of C-MDX2-E-1-S board ....................................................................155 Figure 133 C-MDX2-E-2-XX-S block diagram.........................................................................157 Figure 134 Front panel of C-MDX2-E-2-XX-S board................................................................159 Figure 135 C-OAD-E-U-1-XX-S block diagram.......................................................................161 Figure 136 Front panel of C-OAD-E-U-1-XX-S board..............................................................163 Figure 137 C-OAD-U-1-XX block diagram.............................................................................165 Figure 138 Front panel of C-OAD-U-1-XX board....................................................................166 Figure 139 C-OAD-E-U-2-XXXX-S block diagram ...................................................................168 Figure 140 Front panel of C-OAD-E-U-2-XXXX-S board..........................................................170 Figure 141 C-OAD-U-2-XXXX block diagram .........................................................................172 Figure 142 Front panel of C-OAD-U-2-XXXX board................................................................173 Figure 143 C-OAD-B-1-XX-S block diagram ..........................................................................175 Figure 144 Front panel of C-OAD-B-1-XX-S board .................................................................177 Figure 145 C-OAD-B-1-XX block diagram .............................................................................179 Figure 146 Front panel of C-OAD-B-1-XX board ....................................................................180 Figure 147 C-OAD2-E-U-1-XX-S block diagram.....................................................................182 Figure 148 C-OAD2-U-1-XX block diagram...........................................................................184 Figure 149 C-OAD2-E-U-2-XXXX-S block diagram .................................................................185 Figure 150 C-OAD2-U-2-XXXX block diagram .......................................................................186 Figure 151 C-OAD2-E-U-4-XXXXXXXX-S block diagram..........................................................187 Figure 152 Front panel of C-OAD2-E-U-4-XXXXXXXX-S board.................................................189 Figure 153 C-OAD2-U-4-XXXXXXXX block diagram................................................................191 Figure 154 Front panel of C-OAD2-U-4-XXXXXXXX board.......................................................193 Figure 155 Front panel of ESC-LC board ...............................................................................196 Figure 156 C-4xANY block diagram......................................................................................198 Figure 157 VC-4 allocation ...................................................................................................199

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Figure 158 Front panel of C-4xANY board.............................................................................204 Figure 159 OSC board in Line Terminal configuration............................................................206 Figure 160 OSC board in OADM or back to back configuration .............................................207 Figure 161 Front panel of OSC board ...................................................................................208 Figure 162 OMSP block diagram...........................................................................................209 Figure 163 Front panel of OMSP board .................................................................................210 Figure 164 I-LINK-S block diagram........................................................................................211 Figure 165 Front panel of I-LINK-S board ..............................................................................212 Figure 166 PMU cabling scheme ...........................................................................................215 Figure 167 PMU block diagram.............................................................................................216 Figure 168 Minimum configuration of the batteries in 1692MSE R3.0, rack version ..................217 Figure 169 Maximum configuration of the batteries in 1692MSE R3.0, table version ................217 Figure 170 PMU front panel ..................................................................................................217 Figure 171 Block diagram of control HK board ......................................................................219 Figure 172 Block diagram of RAI unit.....................................................................................220 Figure 173 Block diagram of control LAN-Q board ................................................................222 Figure 174 LAN-Q board settings ..........................................................................................223 Figure 175 Fan shelf description and rack partitioning............................................................224 Figure 176 FAN description and Shelf partitioning..................................................................224 Figure 177 Repair form.........................................................................................................232 Figure 178 Put on the market date.........................................................................................236 Figure 179 Waste code interpretation ....................................................................................237 Figure 180 Subrack front view ...............................................................................................242 Figure 181 Subrack rear view ................................................................................................242 Figure 182 Top cover removing.............................................................................................243 Figure 183 Back cover removing ...........................................................................................244 Figure 184 Back board removing ..........................................................................................245 Figure 185 Guides removing .................................................................................................246 Figure 186 Dummy front panels and fixing bars removing ......................................................247 Figure 187 Side wall removing ..............................................................................................248 Figure 188 Unit view.............................................................................................................249 Figure 189 Bottom cover removing ........................................................................................250 Figure 190 Levers removal ....................................................................................................251 Figure 191 Front panel, fibers and gasket removing ...............................................................252 Figure 192 Heat sink removing..............................................................................................253 Figure 193 Barket removing ..................................................................................................254

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TABLES Table 1 Handbooks related to the product’s hardware.........................................................15 Table 2 Handbook related to the specific product SW management and local product control ...

............................................................................................................................15 Table 3 Handbooks common to Alcatel network elements using 1320CT Rel.3.x platform .....16 Table 4 Documentation on CD-ROM ..................................................................................16 Table 5 Handbook configuration check...............................................................................18 Table 6 References and standards ......................................................................................22 Table 7 IEC 950 -Table 16: Over-temperature limits, Part 2.................................................32 Table 8 Label references ....................................................................................................35 Table 9 Frequency conversion of CWDM wavelengths .........................................................49 Table 10 Relationship between protection and network application ........................................56 Table 11 Shelf and boards designation and reference ...........................................................73 Table 12 Slot allocations for compact shelves in 1692MSE release 3.2A .................................78 Table 13 Slot allocations for CO shelf in 1692MSE release 3.2A............................................79 Table 14 Wavelength combination for unidirectional application............................................86 Table 15 Wavelength combination for unidirectional application............................................86 Table 16 Wavelength combination for a bi-directional application .........................................87 Table 17 Valid tests and compliance criteria for immunity ......................................................95 Table 18 Requirements for RF emission .................................................................................95 Table 19 Main climatic conditions.........................................................................................97 Table 20 Main climatic conditions.........................................................................................98 Table 21 Main climatic conditions.......................................................................................100 Table 22 Maximum power consumption of the units ............................................................108 Table 23 Estimated maximum power consumption of the equipment ....................................108 Table 24 FIT of 1692 MSE..................................................................................................109 Table 25 Optical connections in 1692MSE..........................................................................110 Table 26 Connector access ................................................................................................112 Table 27 Pins SUB-D connect access...................................................................................113 Table 28 Pins RJ11 connector access ..................................................................................113 Table 29 RJ 45 connector access ........................................................................................114 Table 30 Connector access ................................................................................................114 Table 31 Connector access ................................................................................................114 Table 32 Connector access ................................................................................................115 Table 33 Power supply 1 and 2: connector access ...............................................................115 Table 34 Optical parameters for SFP transceivers used in the user side.................................118 Table 35 Optical parameters for SFP transceivers used in the line side..................................119 Table 36 Alarms usage in add and drop configuration ........................................................119 Table 37 Alarms usage in the auto E-SNCP configuration ....................................................122 Table 38 Alarms usage in the auto O-SNCP configuration ...................................................123 Table 39 Alarms usage in the auto B-SNCP configuration ....................................................123 Table 40 Front panel wiring of WLA3C board .....................................................................127 Table 41 Front panel wiring of WLA3COP board.................................................................127 Table 42 Meaning of WLA board front panel LEDs ..............................................................127 Table 43 OCC10-NA optical characteristics ........................................................................131 Table 44 OCC10-EC optical characteristics ........................................................................131 Table 45 Front panel wiring of OCC10 board.....................................................................133 Table 46 Meaning of OCC10 board front panel LEDs .........................................................133 Table 47 Front panel wiring of 2XGE-FC board...................................................................137 Table 48 Meaning of 2XGE-FC board front panel LEDs .......................................................137 Table 49 C-MDX-E-U-S optical characteristics .....................................................................139 Table 50 Front panel wiring of C-MDX-E-U-S board ............................................................141 Table 51 Meaning of C-MDX-E-U-S board front panel LEDs.................................................141 Table 52 C-MDX-U optical characteristics ...........................................................................143

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Table 53 Front panel wiring of C-MDX-U board ..................................................................145 Table 54 Meaning of C-MDX-U board front panel LEDs.......................................................145 Table 55 C-MDX-B-S optical characteristics .........................................................................146 Table 56 Front panel wiring of C-MDX-B-S board................................................................148 Table 57 Meaning of C-MDX-B-S board front panel LEDs ....................................................148 Table 58 C-MDX-B optical characteristics ............................................................................149 Table 59 Front panel wiring of C-MDX-B board...................................................................151 Table 60 Meaning of C-MDX-B board front panel LEDs .......................................................151 Table 61 C-MDX2-E-1-S optical characteristics....................................................................154 Table 62 Front panel wiring of C-MDX2-E-1-S board ..........................................................156 Table 63 Meaning of C-MDX2-E-1-S board front panel LEDs ...............................................156 Table 64 Optical parameter of C-MDX2-E-2-XX-S ...............................................................158 Table 65 Front panel wiring of C-MDX2-E-2-XX-S board......................................................160 Table 66 Meaning of C-MDX2-E-2-XX-S board front panel LEDs ..........................................160 Table 67 1-channel C-OAD module for unidirectional application .......................................162 Table 68 C-OAD-E-U-1-XX-S optical characteristics.............................................................162 Table 69 Front panel wiring of C-OAD-E-U-1-XX-S board ...................................................164 Table 70 Meaning of C-OAD-E-U-1-XX-S board front panel LEDs ........................................164 Table 71 C-OAD-U-1-XX optical characteristics...................................................................165 Table 72 Front panel wiring of C-OAD-U-1-XX board .........................................................167 Table 73 Meaning of C-OAD-U-1-XX board front panel LEDs ..............................................167 Table 74 2-channel C-OAD modules for unidirectional applications.....................................169 Table 75 C-OAD-E-U-2-XXXX-S optical characteristics .........................................................169 Table 76 Front panel wiring of C-OAD-E-U-2-XXXX-S board................................................171 Table 77 Meaning of C-OAD-E-U-2-XXXX-S board front panel LEDs ....................................171 Table 78 C-OAD-U-2-XXXX optical characteristics ...............................................................172 Table 79 Front panel wiring of C-OAD-U-2-XXXX board......................................................174 Table 80 Meaning of C-OAD-U-2-XXXX board front panel LEDs ..........................................174 Table 81 C-OAD modules for bi-directional application ......................................................175 Table 82 C-OAD-B-1-XX-S optical characteristics ................................................................176 Table 83 Front panel wiring of C-OAD-B-1-XX-S board .......................................................178 Table 84 Meaning of C-OAD-B-1-XX-S board front panel LEDs............................................178 Table 85 C-OAD-B-1-XX optical characteristics ...................................................................179 Table 86 Front panel wiring of C-OAD-B-1-XX board ..........................................................181 Table 87 Meaning of C-OAD-B-1-XX board front panel LEDs...............................................181 Table 88 1-channel C-OAD2 module for unidirectional application .....................................183 Table 89 2-channel C-OAD2 module for unidirectional application .....................................185 Table 90 4-channel C-OAD2 module for unidirectional application .....................................187 Table 91 Add & Drop Channels Sequence ..........................................................................188 Table 92 C-OAD2-E-U-4-XXXXXXXX-S board optical characteristics ......................................188 Table 93 Front panel wiring of C-OAD2-E-U-4-XXXXXXXX-S board.......................................190 Table 94 Meaning of C-OAD2-E-U-4-XXXXXXXX-S board front panel LEDs ...........................190 Table 95 4-channel C-OAD2 modules for unidirectional application....................................191 Table 96 Add & Drop channels Sequence ...........................................................................192 Table 97 C-OAD2-U-4-XXXXXXXX board optical characteristics ............................................192 Table 98 Front panel wiring of C-OAD2-U-4-XXXXXXXX board.............................................194 Table 99 Meaning of C-OAD2-U-4-XXXXXXXX board front panel LEDs .................................194 Table 100 Front panel connectors of the ESC board ..............................................................197 Table 101 Meaning of ESC front panel LEDs signification ......................................................197 Table 102 Relation between alarm severity terminology displayed on C.T./O.S. and alarm severity

terminology used for the ESC-LC LEDs and ETSI market rack (TRU).....................................197 Table 103 Allowed drawers association in each 2xANY .........................................................200 Table 104 Client Data Type configuration for drawer.............................................................201 Table 105 User Rx specification 1310nm ..............................................................................201 Table 106 User Rx specification 1310nm ..............................................................................202

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Table 107 User Rx specification (850nm) ..............................................................................202 Table 108 User Tx specification (850nm) ..............................................................................203 Table 109 Meaning of C-4xANY card front panel LEDs .........................................................205 Table 110 Rx specification....................................................................................................207 Table 111 Tx specification ....................................................................................................207 Table 112 Meaning of OSC board front panel LEDs..............................................................208 Table 113 Absolute maximum ratings ...................................................................................209 Table 114 Front panel wiring of OMSP board .......................................................................210 Table 115 Meaning of OMSP board front panel LEDs............................................................210 Table 116 Front panel connectors of the I-LINK-S board........................................................213 Table 117 Meaning of I-LINK-S front panel LEDs signification ................................................213 Table 118 Meaning of Power Supply Card LEDs signification .................................................214 Table 119 Meaning of PMU LEDs signification.......................................................................218 Table 120 Meaning of HK board LEDs signification ...............................................................219 Table 121 Meaning of RAI board LEDs signification...............................................................221 Table 122 Meaning of LAN-Q board LEDs signification .........................................................223 Table 123 Meaning of FAN/FAN-CO board LEDs signification...............................................225 Table 124 Items waste codes list ...........................................................................................238 Table 125 List of hazardous materials and components present in the equipment ...................255

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HANDBOOK GUIDE

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1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK

1.1 General information

ALCATEL makes no warranty of any kind with regards to this manual, and specifically disclaims the implied warranties of merchantability and fitness for a particular purpose. ALCATEL will not be liable for errors contained herein or for damages, whether direct, indirect, consequential, incidental, or special, in connection with the furnishing, performance, or use of this material. NOTICE The product specification and/or performance levels contained in this document are for information purposes only and are subject to change without notice. They do not represent any obligation on the part of ALCATEL. COPYRIGHT NOTIFICATION The technical information of this manual is the property of ALCATEL and must not be copied, reproduced or disclosed to a third party without written consent.

1.2 Handbook applicability

This handbook applies to the following product-release:

Product Release Version ANV P/N Factory P/N 1692MSE 3.2A 01 3AL 97502 CCAA

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1.3 Product-release handbooks

The standard Customer Documentation in the English language for the equipment whose product-release-version is stated on the manual’s front page consists of the following handbooks:

Table 1 Handbooks related to the product’s hardware

Ref Handbook ANV Part No. Factory Part No.

This HDBK

1692MSE Rel.3.2A Technical Handbook 3AL 97869 AAAA

[1] Provides information regarding Equipment description, Maintenance, Hardware setting documentation.

1692MSE Rel.3.2A Installation Handbook 3AL 97869 ABAA

[2] Provides step by step procedural instructions for unpacking, inspecting, Alcatel Part Number, assembling, mounting and wiring bays, sub-frames, I/O panels, ancillary items, and cabling.

1692MSE Rel.3.2A Turn-up & Commissioning Handbook

3AL 97869 ACAA

[3] Provides procedures to support visual inspection, module installation, Alcatel Part Number and provisioning; and local network element verification tests and generic network tests.

Table 2 Handbook related to the specific product SW management and local product control


This HDBK

1692MSE Rel.3.2A Operator’s Handbook 3AL 97869 ADAA

[4] Provide information regarding maintenance using the craft terminal.

The list of handbooks given here below is valid on the issue date of thisHandbook and

Some of the handbooks listed here below may not be available on the issue date of this Handbook.

The list of handbooks given here below is valid on the issue date of thisHandbook and

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Table 3 Handbooks common to Alcatel network elements using 1320CT Rel.3.x platform


This HDBK

1320CT Rel.3.x Basic Operator’s Handbook 3AL 79551 AAAA

[5] Provides general information and operational procedures common to all 1320CT(Craft terminal) of Alcatel Info-Model Network Elements.

1330AS Rel.6.5 Operator’s Handbook 3AL 88876 AAAA

[6] Provides detailed information and operational procedures regarding the alarm Surveillance software embedded in the 1320CT software package.

ELB Rel.2.x Operator’s Handbook 3AL 88877 AAAA

[7] Provides detailed information and operational procedures regarding the Event Log Management software embedded in the 1320CT software package.

Table 4 Documentation on CD-ROM


This HDBK

1692MSERel.3.2A CD-ROM-DOC EN 3AL 97869 AEAA [8] Contains, in electronic format, the following handbooks: REF. [1] to [4]

Envisaged after the release of all handbooks

1320CT Rel.3.x CD-ROM-DOC EN 3AL 79552 AAAA [9] Contains, in electronic format, the following handbooks: REF. [5] to [7]

Envisaged after the release of all handbooks

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1.4 Handbook Structure

This handbook has been edited according to the suggestions given by the ”Code Of Practice” for Instruction Handbooks issued by the European Broadcasting Union (EBU RECC. R29/82). This handbook is divided into the following main topics as described in the table of contents: HANDBOOK GUIDE: This section gives information on the whole handbook application,

composition and evolution. Moreover it lists the handbooks that the Operator should have in order to carry out the tasks allowed by the specific product-release this handbook refers to. It contains general information on safety norms, EMC and type of labels that might be affixed to the equipment.

DESCRIPTION: It contains all the equipment’s general and detailed system features including its application in the telecommunication network. Furthermore, it supplies the equipment description and specifications (i.e., system, mechanical, electrical and/or optical).

MAINTENANCE: It contains all the details for periodic checks, fault location and

repair procedures and restoration to normal operation through the removal of faulty units and their replacement with spares.

DISMANTLING & RECYLING: It contains information for subrack/units dismantling and recycling,

list of hazardous materials and waste code.

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1.5 Handbook configuration check

1.5.1 List of the editions and modified parts

The following table indicates the handbook parts new or modified with respect to the previous edition. Legend “N” =New part “M” =Modified part “ ” =Not changed

Table 5 Handbook configuration check

EDITION R1.0 01

R1.1 01

R1.2A 01

R1.2A1 01

R1.4 01

R3.0 01

R3.1 01

R3.2A 01

DESCRIPTIONS N M M M M M M M 1 FUNCTIONAL DESIGN N M M M M M M 2 MECHANICAL DESCRIPTION N M M M M M 3 UNITS DESCRIPTION N M M M M M M MAINTENANCE N M M M M 4 MAINTENANCE N M M M M DISMANTLING & RECYCLING N M 5 DISMANTLING & RECYCLING N M

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1.5.2 Notes on Release 1.0 ED.01

Release 1.0 Ed.01, created on May 15th, 2003, is the first validated and officially released issue. This document contains the technical documentation and the user manual for the 1692MSE release 1.0.


Release 1.1 ED.01, created on January 3rd, 2004, is the third validated and officially released issue for 1692MSE system. This document contains the technical documentation and the user manual for the 1692MSE release 1.1. The release 1.1 contains the same features contained in 1.0A3, plus the following features: Intershelf link master and intershelf link slave management New Wavelength adapter management New OMDX and OADM management Multi-shelves managed as one NE B&W SFP module used in C-4xANY Performance monitoring Back to back configuration as 1 NE Security management MIB Backup & Restore Alarm Severity configurability

The following contents have been modified compared to Release 1.0A3: Configuration in Operator’s handbook Alarm handling in Operator’s handbook Function design and system configuration in technical handbook

1.5.4 Notes on Release 1.2A ED.01

Release 1.2A ED.01, created on August 10th, 2004, is the fourth validated and officially released issue for 1692MSE system. This document contains the technical documentation and the user manual for the 1692MSE release 1.2A. The release 1.2A contains the same features contained in the release 1.1, plus the following features: The application of low cost WLA (named as WLA1A) The application of Centre Office shelf (for short: CO shelf) Laser forced on/off WEEE information

The following contents have been modified compared to Release 1.1: Configuration in Operator’s handbook Function design and system configuration in technical handbook

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1.5.5 Notes on Release 1.2A1 ED.01

Release 1.2A1 ED.01, created on December 10th, 2004, is a new validated and officially released issue for 1692MSE system. This document contains the technical documentation and the user manual for the 1692MSE release 1.2A1. The release 1.2A1 contains the same features contained in the release 1.2A, plus the following features: The application of B-SNCP The application of user defined SFP

The following contents have been modified compared to release 1.2A: Functional design Operator’s handbook


Release 1.4 ED.01, created on March 10th, 2005, is a new validated and officially released issue for 1692MSE system. This document contains the technical documentation and the user manual for the 1692MSE release 1.4. The release 1.4 contains the same features contained in the release 1.2A1, plus the following features: Abnormal conditions List (Protection, Loopback and Laser State) Editing field (39 bytes long) for all the SFP Display indication about main and spare ports of protection Loopback warning message for adding/removing confirmation The application of WLA2 in CO shelf

The following contents have been modified compared to release 1.2A1: About the Graphical User Interface in Operator’s handbook Configuration in Operator’s handbook Alarm handling in Operator’s handbook


Release 3.0 ED.01, created on September 6th, 2005, is the first validated and officially released issue for 1692MSE system. This document contains the technical documentation and the user manual for the 1692MSE release 3.0. The release 3.0 contains the same features contained in the release 1.4, plus the following features: Support SFP modules with DDM function on WLA1A(-P) and WLA2(-P). Security management

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16 ch upgradable ESC-LC replace ESC Light RM management

The following contents have been modified compared to release 1.4: Mechanical and Unit description in Technical handbook Configuration in Operator’s handbook


Release 3.1 ED.01, created on April 6th, 2006, is the first validated and officially released issue for 1692MSE system. This document contains the technical documentation for the 1692MSE release 3.1. The release 3.1 contains the same features contained in the release 3.0, plus the following features: Support 10 GbE signal transmission Introduce new SFPs and board

The following contents have been updated compared to release 3.0: Unit description Optical parameter for units

1.5.9 Notes on Release 3.2A ED.01

Release 3.2A ED.01, created on July 6th, 2006, is the first validated and officially released issue for 1692MSE system. This document contains the technical documentation for the 1692MSE release 3.2A. The release 3.2A contains the same features contained in the release 3.1, plus the following features: SDH B1 PM is supported on the line side of C-4xANY board Introduce new items: L16.1, L16.2 and a SDH/SONET drawer Introduce new boards: PSC3, 2XGE-FC, WLA3C and WLA3COP

The SDH/SONET drawer (P/N. 3AL86673AA**), C-WLA1(-P), C-WLA1a(-P) and C-WLA2-M(-P) are cancelled in this release. The following contents have been updated compared to release 3.1: Unit description Optical parameter for units Performance monitoring description

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2 COMPLIANCE WITH EUROPEAN NORMS.

Table 6 References and standards Ref. Standard document Date Description

[1] ITU-T Recommendation G.652 04/97 Characteristics of single mode optical fiber cable

[2] ITU-T Recommendation G.653 04/97 Characteristics of dispersion shifted optical fiber cable

[3] ITU-T Recommendation G.654 04/97 Characteristics of a cut-off shifted single mode optical fiber cable

[4] ITU-T Recommendation G.655 10/96 Characteristics of non-zero dispersion shifted optical fiber cable

[5] ITU-T Recommendation G.664 03/99 Optical safety procedures and requirements for optical transport systems

[6] ITU-T Recommendation G.681 10/96 Functional characteristics of inter-office and long-haul line systems using optical amplifiers, including optical multiplexing

[7] ITU-T Recommendation G.691 06/97 Optical interfaces for single channel SDH systems with optical amplifiers, and STM-64 systems

[8] ITU-T Recommendation G.692 10/98 Optical interfaces for multi-channel systems with optical amplifiers

[9] ITU-T Recommendation G.695 10/2003 Optical interfaces for coarse wavelength division multiplexing applications.

[10] ITU-T Recommendation G.671 01/2005 Transmission characteristics of optical components and subsystems.

[11] ITU-T Recommendation G.709-DRAFT

Network node interface for the optical transport network


06/99 Characteristics of optical transport network hierarchy: equipment functional blocks

[13] ITU-T Recommendation G.805 11/95 Generic functional architecture of transport networks

[14] ITU-T Recommendation G.813 08/96 Timing characteristics of SDH equipment slave clocks (SEC)

[15] ITU-T Recommendation G.825 03/93 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH)


Framework for Optical Networking Recommendations

[17] ITU-T Recommendation G.872 02/99 Architecture of Optical Transport Networks

[18] ITU-T Recommendation G.873- DRAFT

03/99 Optical Transport Networks requirements

[19] ITU-T Recommendation G.874- DRAFT

06/99 Management aspect of the optical transport network element

[20] ITU-T Recommendation G.694.2 05/02 Spectral Grids for WDM Applications: CWDM Wavelength Grid

[21] ITU-T Recommendation G.957 07/95 Optical interfaces for equipment and systems relating to the Synchronous Digital Hierarchy

[22] ITU-T Recommendation G.958 11/94 Digital line systems based on the Synchronous Digital Hierarchy for use on optical fiber cables

[23] ITU-T Recommendation G.959.1 Optical network physical node interface

[24] ETS 300 019-1-1 05/94 Environmental conditions and environmental tests for telecommunication equipment

[25] ETS 300 119 01/94 European Telecommunication Standards for Equipment Practice

[26] ETS 300 232 A1 06/93 Transmission and multiplexing: Optical interfaces for equipment and systems relating to the Synchronous Digital Hierarchy

[27] ETS 300 386 12/94 Public Telecommunication Network Equipment - Electro-Magnetic Compatibility Requirements

[28] IEC 825-1 08/93 Safety of Laser Products - Equipments classifications, requirements and user's guide

[29] IEC 950 04/99 Safety of Information Technology Equipments

[30] IEEE802.3 98 Carrier sense multiple access with collision detection (CSMA/CD) access method and physical layer specifications

[31] GR - 63 - CORE 10/95 Network Equipment - Building System (NEBS) Requirements: Physical Protection

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[32] GR - 1089 - CORE 10/97 Electromagnetic Compatibility and Electrical Safety - Generic Criteria for Network Telecommunication Equipment

[33] GR - 253 - CORE 02/99 Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria

[34] SMPTE 292M-1998 98 Television - Bit Serial Digital Interface for High-Definition Television Systems

[35] SMPTE RP184-1996 96 Specification of Jitter in Bit-Serial Digital Systems

[36] T11/98 - 055 98 Fiber Channel - Methodologies for Jitter Specification

2.1 Electromagnetic Compatibility (EMC)

The CE markings printed on the product denote compliancy with the following Directives: 89/336/EEC of May 3rd, 1989 (EMC directives), amended:

By the 92/31/EEC Directive issued on April 28Th, 1992 By the 93/68/EEC Directive issued on July 22Nd, 1993

Compliancy to EMC Norms is claimed in that the equipment satisfies standardized Norms Issue requisites: EN 55022 “Limits and methods and measurement of radio disturbance

characteristics of information technology equipment”, August 1994 edition. Compliancy Class: B

Immunity requisites: EN 50082-1 “Electromagnetic compatibility-Generic immunity standard, Part 1: Residential, commercial and light industry”, January 1992 edition.

The equipment operates in the following environment: Telecommunication center. WARNING This is a class B product. In domestic, residential and light industry environments, this product may cause radio interference in which case the user may be required to take adequate measures.

2.2 Safety

Compliancy to Safety Norms is claimed in that the equipment satisfies standardized Norms: IEC 60950 (1993) +A1 +A2 +A3 + A4

2.3 Environmental constraints

Compliancy to Environmental Norms is claimed in that the equipment satisfies standardized Norms: ETS 300 019-1-2 1992, hazard level 1.2: Storage ETS 300 019-1-1 1992, hazard level 2.2: Transportation ETS 300 019-1-3 1992, hazard level 3.2: Climatic

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3 SAFETY NORMS AND LEBELS

3.1 First aid for electric shock

Do not touch the victim with bare hands until the circuit has been opened. Open the circuit by switching off the line switches. If that is not possible, protect yourself with dry material and free the victim from the conductor. ARTIFICIAL RESPIRATION It is important to start mouth-to-mouth resuscitation at once and seek medical help immediately. TREATMENT OF BURNS This treatment should be used after the victim has regained consciousness. It can also be employed while the artificial respiration is being applied (in this case there should be at least two persons present). WARNING: Do not attempt to remove his clothing from the burnt parts.

Apply dry gauze on the burns.

Do not apply ointments or other oily substances.

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Mouth to mouth resuscitation method

1

Lie the victim supine with his arms parallel with the body. If the victim is lying on an inclined plane, make sure that his stomach is slightly lower than his chest. Open the victim’s mouth and check that there are no extraneous objects in his mouth (dentures, chewing-gum etc.).

2

Kneel beside the victim level with his head. Put a hand under the victim’s head and one under his neck (see fig.) Lift the victim’s head and let it recline backwards as far as possible

3

Shift the hand from the victim’s neck to his chin: place your thumb between his chin and his mouth, the index finger his jawbone, and keep the other fingers closed together (see fig.). While performing these operations take a good supply of oxygen by taking deep breaths with your mouth open.

4

With your thumb between the victim’s chin and mouth keep his lips together and blow into his nasal cavities (see fig.)

5

While performing these operations observe if the victim’s chest rises (see fig.) If not, it is possible that his nose is blocked: in that case open the victim’s mouth as much as possible by pressing on his chin with your hand, place your lips around his mouth and blow into his oral cavity. Observe if the victim’s chest heaves. This second method can be used instead of the first while the victim’s nose is kept closed by pressing the nostrils together using the hand you were holding his head with. The victim’s head must be kept sloping backwards as much as possible.

6

Start with ten rapid exhalations; hence continue at a rate of twelve/fifteen exhalations per minute. Go on like this until the patient has regained consciousness, or until a doctor has determined his death.

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3.2 Safety Rules

3.2.1 General rules

Before carrying out any installation, turn-on, tests & operation and maintenance functions carefully read the relevant Handbooks and chapters.

Observe safety rules

While equipment is operating no one is allowed to have access to the equipment parts that are protected by Cover Plate Shields that are removable with tools.

In the case of absolute need to have access to the equipment parts while it is operating. Only service personnel are allowed such access. By service personnel or technical assistance it means:

”Personnel which have adequate technical knowledge and experience necessary to be aware of the danger that they might face in carrying out an operation and of the necessary measure to reduce or minimize the danger to themselves and to others”.

The Service Personnel can only replace the faulty units with spare parts. The Service Personnel are not allowed to repair: hence the access to the parts not specified is not prohibited.

The keys and/or the tools used to open doors or hinged covers to remove parts which give access to compartments in which there are highly dangerous voltages present must belong exclusively to the service personnel.

For the eventual cleaning of the external parts of the equipment, absolutely do not use any inflammable substance, which in some way may alter the markings, inscriptions etc. It is recommended to use a slightly damp cleaning cloth.

The Safety Rules stated in the handbook describe the operations and/or precautions to observe to safeguard service personnel during the working phases and to guarantee equipment safety, i.e., not exposing persons, animals, and things to the risk of being injured/damaged.

Whenever the safety protection features have been impaired, REMOVE POWER.

To cut off power, switch off the power supply units as well as cut off the power station upstream (rack or station distribution frame).

Unless fitted into the equipment, an external protection device on power supply will be provided

in the building installation. The breaking capacity of the device will be adequate to the maximum short circuit current which can flow.

The safety rules described in this handbook are distinguished by the following symbol and

statement:

SAFETY RULES

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3.2.2 Labels indicating Danger, Forbiddance, Command

It is of utmost importance to follow the instructions printed on the labels affixed to the units and assemblies. The labels are fully compliant with International Norms ISO 3846-1984. The symbols or statements are enclosed in geometric shapes: ISO 3864-1984.

The labels have been affixed to indicate a dangerous condition. They may contain any standard-known symbol or any statement necessary to safeguard users and service personnel against the most common dangers, specifically: Dangerous electrical voltages

Harmful optical signals

Risk of explosion

Moving mechanical parts

Heat-radiating mechanical parts

Pay attention to the information stated in the following, and proceed as instructed

CONTAINS A SYMBOL STATEMENT INDICATES FORBIDDANCE (WHITE BACKGROUND WITH RED RIM–BLACK SYMBOL OR STATEMENT) IT IS A COMMAND (BLUE BACKGROUND–WHITESYMBOL OR STATEMENT).

CONTAINS A SYMBOL INDICATES WARNING OR DANGER (YELLOW BACKGROUND–BLACK SYMBOL AND RIM)

CONTAINS A STATEMENT PROVIDING INFORMATION OR INSTRUCTION. (YELLOW BACKGROUND–BLACK STATEMENT AND RIM)

The symbols presented in para.3.2.3 through 3.2.7 are all the possible symbols that could bepresent on Alcatel equipment, but are not all necessarily present on the equipment thishandbook covers.

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3.2.3 Dangerous electrical voltages

3.2.3.1 Labeling

The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60 Vdc). If it is a Class 1 equipment connected to mains, then the label associated to it will state that the equipment will have to be grounded before connecting it to the power supply voltage, e.g.:

3.2.3.2 Electrical safety: general rules

DANGER! Possibility of personal injury: Carefully observe the specific procedures for installation / turn-up and commissioning / maintenance of equipment parts where A.C. or D.C. power is present, described in the relevant installation / turn-up and commissioning / maintenance documents and the following general rules: a) Personal injury can be caused by -48 V dc (or by 220 V ac if envisaged in the equipment). Avoid touching powered terminals with any exposed part of your body.

b) Short circuiting, low-voltage, low-impedance, dc circuits can cause severe arcing that can result in burns and/or eye damage. Remove rings, watches, and other metal jewelry before working with primary circuits. Exercise caution to avoid shorting power input terminals.

WARNING! Ground protect the equipment before connecting it to mains Make sure that power has been cut off before disconnecting ground protection.

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3.2.4 Harmful optical signals

3.2.4.1 Labeling

If the assembly or unit is fitted with a LASER, the labels must comply with the IEC 825-1-1993 International Norms.

The symbol indicates the presence of a LASER beam. Danger level is stated within a rectangular label:

If the LASER is a class 1 product, the label depicting the symbol within a triangle is not compulsory. The rectangular shaped label bears all the information needed, i.e.: LASER class

Power emitted

Wavelength

Ref. Norm

Precautionary measures taken depend on LASER class

Indications given on openings, panels and safety interlocks

CAUTION LASER RADIATION WHEN OPEN

DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

LASER RADIATION DO NOT STARE INTO BEAM OR VIEW

DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 3A LASER PRODUCT

P.MAX=31m...... =1300mm. IEC 825 1993

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3.2.4.2 Optical safety: general rules

When handling optical equipments or units or cables always check that laser labels are properly affixed and that the system complies with applicable optical standards.

DANGER! Possibility of eyes damage: Invisible infrared radiations emitted by the fiber optic transmitters can cause eyes damage. Carefully observe the specific procedures for installation / turn-up and commissioning / maintenance of units containing laser devices or cables transporting optical signals, described in the relevant installation / turn-up and commissioning / maintenance documents and the following general rules: a) Laser radiation is not visible by the naked eye or with laser safety glasses. Although it cannot be

seen, laser radiation may be present. b) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable,

unless it is absolutely known that no laser radiation is present. c) Never look at an optical fiber splice, cable or connector, unless it is absolutely known that no

laser radiation is present. d) All optical connectors, terminating either fibers or transmitters/receivers, are provided with

protective covers that must always be used, as soon as possible, when any optical link is disconnected for installation/test/maintenance purposes or whatever operation.

e) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable

by means of magnifiers/microscopes, unless it is absolutely known that no laser radiation is present. A magnifier/microscope greatly increases the damage hazard to the eyes.

f) Never point a not terminated optical fiber splice, cable or connector at other persons, unless it is

absolutely known that no laser radiation is present. g) Always remove electrical power from near and far optical transmitters before disconnecting

optical links between the transmitter and the receiver. h) Wearing of laser safety goggles or eye shields is recommended for every person working on

optical devices, whenever the above listed rules cannot be followed.

3.2.4.3 Optical safety: equipment specific data

Refer to para. 1.7.

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3.2.5 Risks of explosions

3.2.5.1 Labeling and safety instructions

This risk is present when batteries are used, and it is shown as the following label:

Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses to down flow (battery-emitted hydrogen). A 417-IEC-5641 Norm. A compliant label is affixed next to it indicating that the openings must not be covered up.

3.2.6 Moving mechanical parts


The following warning label is affixed next to fans or other moving mechanical parts:

Before carrying out any maintenance operation see that all the moving mechanical parts have stopped.

3.2.7 Heat-radiating mechanical parts


The presence of heat-radiating mechanical parts is indicated by the following warning label in compliancy with IEC 417 Norm, Fig.5041:

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As stated by IEC 60950 Norm, para.1.4.7, the touchable mechanical parts carrying the above

depicted warning label, are those whose temperature T exceeds the limits established by the following formula (temperatures in ℃ ):

(T-Tamb) ＜(ΔTmax + 25°-Tmra) Where:

T Temperature of the mechanical part measured at ambient temperature Tamb.

Tamb Ambient temperature during the test.

ΔTmax Value defined by IEC 950 Norm, Table 16 part 2a, para.5.1, and specified in the table below.

Tmra The maximum room ambient temperature permitted by the equipment specification or 25℃, whichever is greater.

Table 7 IEC 950 -Table 16: Over-temperature limits, Part 2

Maximum over-temperature (℃) Operator-accessible Parts

Metal Glass, Porcelain

Plastic, Rubber

Handle knob, etc., held or touched for short periods 35 45 60

Handles, knobs, etc., regularly held 30 40 50 Outer surface of the equipment that can be touched 45 55 70

Inner surface of the equipment that can be touched 45 55 70

DANGER! Possibility of personal injury: Carefully observe the specific procedures for installation / turn-up and commissioning / maintenance of equipment parts where heat-radiating mechanical parts are present, described in the relevant installation / turn-up and commissioning / maintenance documents and the following general rule: Personal injury can be caused by heat. Avoid touching powered terminals with any exposed part of your body.

3.2.8 Specific safety rules in this handbook

Specific safety rules are specified in the following paragraphs: Para. 1.7.

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4 OTHER NORMS AND LABELS

4.1 Electromagnetic Compatibility

The equipment’s EMC norms depend on the type of installation being carried out (cable termination, grounding etc.) and on the operating conditions (equipment, setting options of the electrical/electronic units, presence of dummy covers, etc.). Before starting any installation, turn-on, tests & operation and maintenance work refer to the

relevant Handbooks and chapters.

The norms set down to guarantee EMC compatibility are distinguished inside this handbook by the symbol and term:

4.1.1 General norms - Installation

All connections (towards the external source of the equipment) made with shielded cables should use only cables and connectors suggested in this technical handbook or in the relevant Plant Documentation, or those specified in the Customer’s ”Installation Norms” (or similar documents).

Shielded cables must be suitably terminated.

Install filters outside the equipment as required.

Ground connect the equipment utilizing a conductor with proper diameter and impedance.

Mount shields (if utilized), previously positioned during the installation phase, but not before

having cleaned and degreased it.

Before inserting the shielded unit, proceed to clean and degrease all peripheral surfaces (contact springs and connection points, etc.).

Screws fasten the units to the shelf.

To correctly install EMC compatible equipment, follow the instructions given.

4.1.2 General norms - Turn-on, Tests & Operation

Preset the electrical units as required to guarantee EMC compatibility. Check that the equipment is operating with all the shields properly positioned (dummy covers,

ESD connector protections, etc.).

To properly use EMC compatible equipment observe the information given.

ATTENTION EMC NORMS

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4.1.3 General norms - Maintenance

Before inserting the shielded unit, which will replace the faulty or modified unit, proceed to clean and degrease all peripheral surfaces (contact springs and connection points, etc.).

Clean the dummy covers of the spare units as well.

Screws fasten the units to the shelf.

4.2 Electrostatic Dischargers (ESD)

Before removing the ESD protections from the monitors, connectors etc., observe the precautionary measures stated. Make sure that the ESD protections have been replaced after having terminated the maintenance and monitoring operations.

Most electronic devices are sensitive to electrostatic discharges. To address this concern the following warning label has been affixed:

Observe the precautionary measures stated when having to touch the electronic parts during the installation/maintenance phases. Workers are supplied with antistatic protection devices consisting of:

An elastic band worn around the wrist.

A coiled cord connected to the elastic band and to the stud on the shelf.

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4.3 Suggestions, notes and cautions

Suggestions and special notes are marked by the following symbol:

Cautions to avoid possible equipment damage are marked by the following symbol:

(Caution to avoid equipment damage)

Statement…

4.4 Labels affixed to the Equipment

This paragraph indicates the positions and the information contained on the identification and serial labels affixed to the equipment.

Table 8 Label references

Ref. No. Name of Label

1 Label specifying item on catalogue (P/N)

2 Serial number of item specified on catalogue

3 Final test certificate

4 SFP label

5 Simple label adhered on extraction handle

6 Label identifying compliancy with CE and WEEE Directives

7 Electrostatic label

On contract basis, customized labels can be affixed to the equipment. Standard labels can be affixed to any position on the equipment, as required by the customer. However, for each of the above are applied the rules defined by each individual customer.

Suggestion or note…

Title…

Labeling depicted hereafter is for indicative purposes and could be changed without any notice.

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Figure 1 Labels for units with stiffening bar

1

3

2 5

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Figure 2 Labels for units without stiffening bar

Bar code of ANV + ICS P/N

ANV + ICS P/N

Figure 3 Label identifying label on catalogue

Bar code of the serial No.

Serial No.

Figure 4 Label specifying serial No.

2

1

3

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Figure 5 Labels on the SFP

Figure 6 SFP label description

Field Field Name A Part number B Alcatel Code C Bar Code Alfa 39 (+*start, stop)

Figure 7 SFP label example

Figure 8 CE label

Figure 9 WEEE label

4

01 21,5 28

035,56,5

BC

A BB

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Figure 10 Electrostatic label

Figure 11 Labels on shelf

7 6

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5 LIST OF ABBREVIATIONS

ACO Alarm Cut Off

A/D Add and Drop functionality BER Bit Error Rate B&W Black and White CD-ROM Compact Disk Read Only Memory Ch Channel CO Centre Office CPE Customer Premise Equipment CT Craft Terminal CWDM Coarse Wavelength Division Multiplex DB Database DDM Digital Diagnostic Monitoring DMUX Demultiplexing EC Equipment Controller ECT Equipment Craft Terminal EEPROM Electrically Erasable Programmable Read Only Memory EMC Electromagnetic Compatibility EOL End of Life ESC-LC Low Cost Equipment and Shelf Controller ESD Electrostatic Discharges ETSI European Telecommunication Standard Institute E-SNCP Electrical SubNetwork Connection Protection FPGA Field Programmable Gate Array Gbit/s Giga bit per second HDBK Handbook HK Housekeeping

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HW Hardware IEC International Electro-technical Commission IND Indeterminate IS-IS Intermediate System-to-Intermediate System I/O Input/Output ILOS Input Loss of Signal IP Internet Protocol ISO International Standard Organization ISPB Intra Shelf Parallel Bus ISSB Intra Shelf Serial Bus ITU-T International Telecommunication Union -Telecommunication LAN Local Area Network LAT Lamp Test LED Light Emitting Diode MAC Medium Access Control NE Network Element NES Network Element Synthesis OAD Optical Add and Drop OADM Optical Add and Drop Multiplexer OCH Optical Channel OCC10 10Gbps Optical Channel Card OMDX Optical Multiplexer and Demultiplexer OMS Optical Multiplex Section OMSP Optical Multiplex Section Protection OS Operation System OSC Optical Supervisory Channel O-SNCP Optical SubNetwork Connection Protection PC Personal Computer

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PCB Printed Circuit Board PDU Power Distribution Unit PSC Power Supply Card Q3 Interface with Protocol Q3 QECC Interface with Q protocol for Embedded Control Channel RECT Remote Craft Terminal RAM Random Access Memory RAI Remote Alarm Interface card RI Remote Inventory RX Receiver SC Shelf Controller SD Shutdown SDH Synchronous Digital Hierarchy SNCP Sub-Network Connection Protection SNMP Simple Network Management Protocol SPI Serial Peripheral Interface TMN Telecommunication Management Network TRU Top Rack Unit TX Transmitter USM User Service Manager WDM Wavelength Division Multiplex WEEE Waste of Electrical and Electronic Equipment WLA Wavelength Adapter Board

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6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION

6.1 Products, product-releases, versions and Customer Documentation

A ”Product” is defined by the network hierarchical level where it can be inserted and by the whole of performance and services for which it is meant. A ”Product” evolves through successive ”Product-releases” which are the real products marketed for their delivery at a certain ”Product-release” availability date. Therefore, a ”Product-release” defines a set of hardware components and a software package that, as a whole, identify the possible network applications and the equipment performance which the specific ”Product-release” has been designed, engineered and marketed for. In some cases a ”Product-release” has further development steps, named ”Versions”, that are developed to improve or add some performance (mainly software) with respect to the previous version, or for bug correction purposes. A ”Product-release” has its own standard Customer Documentation, composed of one or more handbooks. A new ”Version” of a ”Product-release” may or may not produce a change in the status of the Customer Documentation set, as described in para.6.4.

6.2 Handbook supply to Customers

Handbooks are not automatically delivered together with the equipment they refer to. The number of handbooks per type to be supplied must be decided at contract level.

6.3 Aims of standard Customer Documentation

Standard Customer Documentation, referred to hereafter, must be always be meant as plant-independent. Plant-dependent documentation, if envisaged by the contract, is subjected to commercial criteria as far as contents, formats and supply conditions are concerned (plant-dependent documentation is not described here). Standard hardware and software documentation is meant to give the Customer personnel the possibility and the information necessary for installing, commissioning, operating and maintaining the equipment according to Alcatel Laboratory design choices. In particular: the contents of the handbooks associated to the software applications focus on the explanation of the man-machine interface and of the operating procedures allowed by it; maintenance is described down to faulty PCB location and replacement. Consequently, no supply to the Customers of design documentation (like PCB hardware design and production documents and files, software source programs, programming tools, etc.) is envisaged.

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6.4 Handbook Updating

The handbooks associated to with the “Product-release” are listed in para.1.3. Each handbook is identified by: The name of the ”Product-release” (and ”Version” when the handbook is applicable to the

versions starting from it, but not to the previous ones). The handbook name The handbook P/N The handbook edition (usually first edition=01) The handbook issue date. The date on the handbook does not refer to the date of print but to the

date on which the handbook source file has been completed and released for the production.

6.4.1 Changes introduced in the same product-release (same handbook P/N)

The edition and date of issue might change on future handbook versions for the following reasons: Only the date changes (pointed out in the Table of Contents) when modifications are made to the

editorial system resulting no change the technical contents of the handbook. The edition, hence the date, is changed because modifications made concern technical contents.

In this case: The chapters modified with respect to the previous edition are listed in Table 5. In affected chapters, revision bars on the left of the page indicate modifications in text

and drawings.

Changes concerning the technical contents of the handbook cause the edition number increase (e.g. from Ed.01 to Ed.02). Slight changes (e.g. for corrections) maintain the same edition but with the addition of a version character (e.g. from Ed.02 to Ed.02A). Version character can be used for draft or proposal editions.

Handbooks (or part of the handbook) relevant to software applications (typically the Operator’s Handbooks) are not modified unless the new software ”Version” distributed to customers implies man-machine interface changes or in case of slight modifications not affecting the understanding of the explained procedures. Moreover, should the screen prints included in the handbook contain the product-release’s ”Version” marking, they are not replaced in the handbooks related to a subsequent version, if the screen contents are unchanged.

6.4.1.1 Supplying updated handbooks to customers

Supplying updated handbooks to Customers who have already received previous issues is submitted to commercial criteria. By updated handbook delivery it is meant the supply of a complete copy of the new handbook (supplying errata-corrige sheets are not envisaged).

NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE APPLICATIONS

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6.4.2 Changes due to a new product-release

A new product-release change the handbook P/N and the edition start from 01. In this case the modified parts of the handbook are not listed.

6.5 Customer documentation supply on CD-ROM

In the following “CD-ROM” means “Customer Documentation on CD-ROM”.

6.5.1 Contents, creation and production of a CD-ROM

In most cases, a CD-ROM contains the documentation of one product-release (-version) in a certain language. In some other cases, the same CD-ROM can contain the documentation of different product-release (-version) s in a certain language. As a general rule: CD-ROMs for Network Management products do not contain:

The Installation Guides. The documentation of system optional features that customers could not buy from Alcatel

together with the main applicative SW.

CD-ROMs for Network Elements products do not contain: The documentation of system optional features (e.g. System Installation Handbooks

related to racks that customers could not buy from Alcatel together with the main equipment).

The Installation and Turn-up & Commissioning handbooks. A CD-ROM is obtained collecting various handbooks and processing them by Interleaf-World-View-Press after the manual addition of some hyperlinks, which make the navigation through the various handbooks easier. No additional information is added to each handbook; so that the documentation present in the CD-ROMs is exactly the same the customer would receive on paper. The files processed in this way are then transferred on a PC where the viewer (Interleaf-World-View) is added and a master CD-ROM is recorded. Suitable checks are made in order to have a virus-free product. After a complete functional check, the CD-ROM image is electronically transferred to the archive of the Production Department, so that the CD-ROM can be produced and delivered to customers.

6.5.2 Use of the CD-ROM

The CD-ROM can be used both in PC and Unix environments. The minimum configuration for World View (rel.2.2.2) utilization on a PC is: Operative System: Windows 2000 Processor: Pentium RAM: 128Mbyte Free disk space: 20Mbyte

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The set-up procedure is present in the booklet included in the CD-ROM box. After the set-up procedure, which installs the viewer in the PC or Unix WS environment, the customer is allowed to read the handbooks on the PC/WS screen, using the navigation and zooming tools included in the viewer, and to print selected parts of the documentation through a local printer. N.B. Copyright notification WorldView: Copyright 1981-1996

INTERLEAF Inc. All rights reserved. The use of WorldView is permitted only in association with the files contained in the CD-ROMs officially supplied by Alcatel.

Alcatel documents: All rights reserved. Passing and copying of documents and files contained in the CD-ROMs officially supplied by Alcatel, use and communication of its contents are not permitted without written authorization from Alcatel.

6.5.3 CD-ROM identification

Each CD-ROM is identified: a) By the following external identifiers, that are printed both on the booklet and the CD-ROM

upper surface:

- The name of the ”Product-release(s)” (and ”Version” when the CD-ROM is applicable to. - The versions starting from it, but not to the previous ones). - A writing indicating the language(s) - The CD-ROM P/N - The CD-ROM edition (usually first edition=01)

b) And, internally, by the list of the source handbooks and documents (P/Ns and editions) by

whose collection and processing the CD-ROM itself has been created.

6.5.4 CD-ROM updating

The list of source handbook/document P/Ns-editions indicated in section 6.5.3 point 2), in association with the CD-ROM’s own P/N-edition, is also loaded in the Alcatel-Information-System as a structured list. Whenever a new edition of any of such handbooks/documents is released in the Alcatel archive system, the Alcatel-Information-System automatically raises a warning toward the Customer Documentation Department, indicating the list of CD-ROMs that must be updated to include the new editions of these handbooks/documents. This causes the planning and creation of a new edition of the CD-ROM. Updating of CD-ROMs always follows, with a certain delay, the updating of the single handbooks composing the collection.

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DESCRIPTIONS

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1 FUNCTIONAL DESIGN

The 1692MSE product release 3.2A is CWDM equipment intended for the METRO ACCESS, enterprise and METRO CORE in the small cities. It is compliant with both ETSI and NEBS (level3) standards. It is designed for a small number of channels (8 in this version) and for very low cost application, without amplifiers. The 1692MSE is organized from transponder cards to which the user accesses are connected to optical Mux/Demux cards to perform the main CWDM signal (combined signal) and launch into the fiber. The 1692MSE release 3.2A has been designed to offer the following functions: Multiple configurations and multiple network architectures

The 1692MSE R3.2A can be configured as a line terminal, a back to back terminal, a CPE, an Optical Add and Drop Multiplexer (OADM) or Regenerator. These basic configurations cover both point to point and ring network applications.

Multi-rate client signals The 1692MSE R3.2A is equipped with multi-rate transponders. It supports both low bitrate signals (from 125Mbps to 2.5Gbps) and high bitrate signals (9.95Gbps and 10.31Gbps).

Up to 8 optical channels in a single NE There are up to 8 optical channels in a single NE. Each channel is associated to a CWDM channel. The channels are 1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm and 1610nm.

N.B. Normally, the central wavelengths of laser under normal temperature (25 degree C) are 1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm and 1610nm. Due to the specific technology of CWDM, no temperature control, the wavelength of system under the whole temperature range (0-70 degree C) should be 1471nm, 1491nm, 1511nm, 1531nm, 1551nm, 1571nm, 1591nm and 1611nm with ± 7nm deviation.

Table 9 Frequency conversion of CWDM wavelengths

Wavelength (nm) Frequency (THz) 1470 203.94 1490 201.20 1510 198.54 1530 195.94 1550 193.41 1570 190.95 1590 188.55 1610 186.21

Support up to four compact shelves or one CO shelf in a single NE

In 1692MSE R3.2A, a main shelf and up to three slave shelves or one CO shelf can be supported in one NE.

Supervision

An extra channel at 1310nm, the Optical Supervision Channel (OSC), can be added to the aggregate signal before being launched into the fiber.

Support unidirectional and Bi-directional transmission Unidirectional transmission on single fiber is that 8 channels signal is transmitted in one direction, while bi-directional transmission on single fiber are 4 channels in each direction.

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Client signals TDM concentration Up to 4 client signals may be concentrated by Time Division Multiplexing, on a unique STM-16 transponder access, in order to optimize the use of each wavelength.

Protection In unidirectional transmission, the 1692MSE R3.2A offers the Sub-Network Connection Protection (SNCP) at the channel level and the Optical Multiplex Section Protection (OMSP); while in bi-directional transmission, only SNCP protection is offered.

Performance Monitoring

Monitoring of the performances of the client signals and the WDM transmission is available for SDH and GbE frames.

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1.1 Basic equipment configurations

The 1692MSE R3.2A design, allows these basic configurations of the equipment: Line Terminal Optical Add and Drop Multiplexer (OADM) Regenerator CPE

1.1.1 Line terminal In line terminal configuration, the 1692MSE R3.2A connects client signals to an optical fiber CWDM line. In this configuration, the equipment takes place at both ends of point to point links.

TPDs

CWDM signals

Client signals

MDX

Up to 8 User channels

Up to 8

a） Unidirectional transmission

TPDs

CWDM signals

Client signals

MDX

b） Bi-directional transmission Figure 12 1692MSE R3.2A in line terminal configuration

1.1.2 Optical Add and Drop Multiplexer (OADM) In OADM configuration, the 1692MSE R3.2A may add and drop a part of the traffic of an optical CWDM line, in both directions. In this configuration the equipment takes the place of a linear add and drop multiplexer in: Point to point links Ring networks

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OAD OAD

TPD

West line East line

Client signals

1 Add & dropchannel

1 Add & dropchannel

OAD

TPD

OAD

TPD

n (up to 8)CWDM signal

West line

n (up to 8)CWDM signal

East line

x Add & dropchannels


n-x express channels

Client signals

Client signals

a) Unidirectional transmission with x(x=1, 2 or 4) channels add & drop

b) Bi-directional transmission

Figure 13 1692MSE R3.2A in OADM configuration N.B. In this document, the definition about “East” and “West” is as follows: East: From west to east; West: From east to west; “East” is on the right side of pages, while “West” on the left side. The OADM configuration, especially in ring network, allows the Sub-Network Connection Protection (SNCP) of the added and dropped channels. Particular Case: When all the CWDM line channels are added and dropped, the 1692MSE R3.2A is a back to back terminal or a hub node. There is no pass through channel. SNCP may be performed on all the CWDM line channels.

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MuxDmux

TPDs

MuxDmux

nλ(up to 8)CWDM signal

West line

nλ(up to 8)CWDM signal

East line


Client signals

TPDs

Figure 14 1692MSE R3.2A in back to back terminal configuration

1.1.3 Regenerator In the regenerator configuration, the CWDM line signals can be regenerated.

Mux

Dmux

TPDs

Dmux

Mux

CWDM signals CWDM signals

Figure 15 1692MSE R3.2A in regenerator configuration

1.1.4 CPE For the CPE application, there are two different configurations: one-channel and two-channel CPE. The OSC signal is used in both configurations.

T P D1 o r 2 c lie n ts ig n a l(s )

M D X M ixe d s ig n a ls

O S C s ig n a l

O S C s ig n a l Figure 16 Block diagram of CPE

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1.2 Network architectures 1.2.1 Ring networks A two-fiber ring network is obtained with 1692MSE equipment in back to back terminal and OADM configurations.

OADM OADM

OADM

B-TO-B

Client Add & drop traffic

Client end traffic

ClientAdd & drop

traffic

ClientAdd & drop

traffic

Figure 17 1692MSE in ring networks

1.2.2 Point to point links A point to point link, based on 1692MSE, is obtained with: A 1692MSE in line terminal configuration at each end of the link. Eventually, one or more 1692MSE in OADM configuration.

Lineterminal

LineterminalOADM OADM

Clientend

traffic

Client Add and Drop traffic

Clientend

traffic

Lineterminal

Lineterminal

OADM OADM

Clientend

traffic

Clientend

traffic


a) Unidirectional transmission

b) Bi-directional transmission

Figure 18 1692MSE in point to point configuration

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1.2.3 CPE configuration in ring network

OADM OADM

OADM

B-TO-B

Client end traffic

ClientAdd & drop

traffic

ClientAdd & drop

traffic

Client end traffic

CPE

Clientdroptraffic

Clientadd

traffic

Figure 19 1692MSE in ring networks with CPE

1.2.4 CPE configuration in point to point links

Lineterminal

Lineterminal

OADM OADMClient

end traffic

Clientend

traffic


CPE

Client end traffic

Client end traffic

Figure 20 1692MSE in point to point links with CPE

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1.3 Network protection Two protection levels can be provided. The first one is SNCP, and the other one is OMSP. SNCP can be divided into E-SNCP and O-SNCP. See the following table to know the relationship between protection and network application.

Table 10 Relationship between protection and network application Network Protection Comments

Unidirectional application

Point to point OMSP, E-SNCP or O-SNCP

Ring OMSP, E-SNCP or O-SNCP

OMSP and SNCP can be offered at the same time, but only one SNCP can be configured In one transponder.

Bi-directional application

Point to point O-SNCP or E-SNCP Only one protection is available at one time In one transponder.

1.4 Description of the functions This section describes the main functions of 1692MSE. 1.4.1 Main function in different configuration 1.4.1.1 Terminal configuration In line terminal configuration (unidirectional and bi-directional), these functions are the following: Transponder TDM concentrator MUX DMUX Supervision management (in option) OMSP (in option, only for unidirectional line terminal) Equipment and shelf control Power supply

Equipment andshelf control

Powersupply

Supervision

Clientsignals

MUX

DMUX

Station

batteries

3.6V

5.5V

48V

Toborads

NE managementapplication

LAN

To borads

SPI bus

OSCinsertion

OSCextraction

OSC 1310nm

CWDMline

OMSPTransponders

TDMconcentrator

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Figure 21 Functional synopsis in unidirectional Line Terminal configuration

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Equipment and

shelf controlPowersupply

Supervision

Transponders

Clientsignals MUX

Station

batteries

3.6V

5.5V

48V

Toborads

NE management application

LAN

To borads

SPI bus

OSCinsertion

OSCextraction

OSC 1310nm

CWDMline

TDMconcentrators

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Figure 22 Functional synopsis in bi-directional Line Terminal configuration

1.4.1.2 OADM configuration In line OADM configuration (unidirectional and bi-directional), these functions are the following: Transponder TDM concentrator OADM Supervision management (in option) OMSP (in option, only for unidirectional line terminal) Equipment and shelf control Power supply

Client signals

CWDMline

(west)

Equipmentand

shelf control

Powersupply

Supervision

Stationbatteries

3.6V

5.5V

48V

Toborads


LAN

Toborads

SPIbus

OSCinsertion

OSCextraction

OSC1310nm

CWDMline

(East)OSC

extraction

OSCinsertion

Pass throughtraffic

West: 1, 2 or 4channels

Add & Drop

OSC1310nm

OMSP OMSP

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Transponders

TDMconcentrator

East: 1, 2 or 4channels

Add & Drop

Figure 23 Functional synopsis in unidirectional OADM configuration

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N.B. 3, 5 or 7 channels OADM can be realized via the combination of 1, 2 or 4 channels OADM.

Client signals


Powersupply

Supervision

Station

batteries

3.6V

5.5V

48V

Toborads


LAN

To borads

SPI bus

OSCinsertion

OSCextraction

OSC1310nm

CWDMline

(East)

OSCextraction

OSCinsertion

Pass through traffic

West: 1 channelAdd & Drop

CWDMline

(West)

OSC1310nm

East: 1 channelAdd & Drop

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Transponders

TDMconcentrator

Figure 24 Functional synopsis in bi-directional OADM configuration

1.4.1.3 Regenerator configuration In line regenerator configuration, these functions are the following: Transponder MUX/DMUX or OADM Supervision management (in option) Equipment and shelf control Power supply

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CWDMline

(west)


Powersupply

Supervision

Station

batteries

3.6V

5.5V

48V

Toborads


LAN

To borads

SPI bus

OSCinsertion

OSCextraction

OSC 1310nm

OSCextraction

OSCinsertion

OSC 1310nm

DMUX

DMUXMUX

MUX

CWDMline

(East)

TPD

LEGEND:

Optical link

Electrical link

Optionalfunction

Figure 25 Functional synopsis in regenerator configuration (use MUX/DMUX)

N.B. Up to 8 channels can be regenerated per direction in this configuration.

CWDMline

(west)


Powersupply

Supervision

Station

batteries

3.6V

5.5V

48V

Toborads


LAN

To borads

SPI bus

OSCinsertion

OSCextraction

OSC 1310nm

OSCextraction

OSCinsertion

OSC 1310nm

DROP

DROPADD

ADD

CWDMline

(East)

TPD

LEGEND:

Optical link

Electrical link

Optionalfunction

Figure 26 Functional synopsis in regenerator configuration (use OADM)

N.B. Only up to 4 channels can be regenerated in per direction in this configuration.

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1.4.1.4 CPE configuration In the CPE configuration, these functions are the following: Transponder TDM concentrator MUX/DMUX Supervision management Equipment and shelf control Power supply

a) One-channel CPE configuration


Powersupply

Clientsignal

Stationbatteries

3.6V

5.5V

48V

Toborads


LAN

To borads

SPI bus

OSCinsertion

OSCextraction CWDM

lineTransponders

TDMconcentrator

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Supervision

OSC 1310nm

Figure 27 One-channel CPE configuration

b) Two-channel CPE configuration


Powersupply

2 Clientsignals

MUX

DMUX

Station

batteries

3.6V

5.5V

48V

Toborads


LAN

To borads

SPI bus

OSCinsertion

OSCextraction CWDM

lineTransponders

TDMconcentrator

LEGEND:

Optical link

Electrical link

Optionalfunction

Functionor

Supervision

OSC 1310nm

Figure 28 Two-channel CPE configuration

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1.4.2 Description of the functions 1.4.2.1 Multi-rate transponder function The transponder function is built with Wavelength Adapter Cards (WLA), one for two-client signal. The role of this function is: At the transmitting side (from client to CWDM line)

To adapt the client incoming optical signals to a dedicated wavelength and deliver those optical signals to the multiplexer (MUX) function.

At the receiving side (from CWDM line to client) To return the client optical signals from the signal delivered by the demultiplexer (DEMUX) function.

User Tx User Tx User Rx User Rx

WDM Rx WDM Rx WDM Tx WDM Tx

Client Signals

To MUX functionFrom DMUX function

8X8 Matrix

Figure 29 Transponder function

The typical client signals accepted by the WLA of the 1692MSE are: 125 Mbit/s signal: Fast Ethernet / FDDI 155.52 Mbit/s signal: STM-1 / OC-3 200 Mbit/s signal: ESCON 270 Mbit/s signal: Digital Video channel - HDTV 622.08 Mbit/s signal: STM-4 / OC-12 1.0625 Gbit/s signal: Fiber channel / FICON 1.25 Gbit/s signal: Gigabit Ethernet 1.24416Gbps: OC-24 2.125Gbps: 2 Fiber channel 2.48832 Gbit/s signal: STM-16 / OC-48 2.5Gbps: 2 Gigabit Ethernet

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2.66606 Gbit/s signal: OC-48 (with FEC is 2666.06Mbps) The 1692MSE supports up to 8 channels unidirectional transmission or 4-channel bi-direction transmission on single fiber. The channels are 1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm and 1610nm. The transponder boards of the 1692MSE, also called Wavelength Adapter Cards (WLA), support two channels each. 4 different WLAs are sufficient to cover the 8 channels. 1.4.2.2 TDM client signal concentrating (C-4xANY) The aim of the C-4xANY TDM concentration is to save transponders and to optimize the use of each WDM channel. Client signals from 100 Mbit/s to 1.25 Gbit/s can be concentrated in one STM-16. For example, 4 STM-1 client signals can be concentrated on a unique STM-16 signal and applied on a unique WDM channel.

Up to 4Client signals

C-4xANYTDM

Concent

1 WDMOptical channel

1 Concentrator

Figure 30 TDM concentration function

The available client signal accesses and their maximum number are: Low bit rate

4 x Fast Ethernet 4 x FDDI 4 x ESCON 4 x Digital Video

SDH

4 x STM-1 3 x STM-4

High bit rate

2 x Gigabit Ethernet 2 x Fiber Channel or FICON

The following mixes are also possible: 3 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 2 x (FDDI or FE or DV or ESCON or STM-1) + 2 x STM-4 2 x (FDDI or FE or DV or ESCON or STM-1) + 1 x (FC or GbE or FICON) 1 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 +1 x (FC or GbE or FICON) 2 x (FC or GbE or FICON)

Low bit rate and High bit rate signal is available at 1310nm and 850nm. SDH bit rate signal is only available at 1310nm.

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1.4.2.3 Wavelength division multiplexing/demultiplexing The optical multiplexer receives the colored optical channels signal from the transponders, and multiplexes them into a fiber. The optical demultiplexer receives the CWDM line signal; demultiplexes this signal and sends the recovered optical channels signal to the transponders. a) Optical multiplexing The multiplexer function may be obtained with the following 8:1 optical MUX:

Figure 31 CWDM MUX side

The multiplexer is able to multiplex 8 channel signals (in CWDM grid) issued from the transponder function into one multi-wavelength single fiber transmission. This device is a 9 fibers passive optic component: 8 channels add inputs, 1 output (common). The multiplexer can be used in a unidirectional line terminal configuration. Particular Case: The 8:1 multiplexer can also be used in a bi-directional line terminal configuration to multiplex/demultiplex signals, see the following figure.

Add channels:1...4

Drop channels:5...8

COM

Figure 32 8:1 MUX used as MUX/DMUX

b) Optical demultiplexing The demultiplexer function may be obtained with the following 1:8 optical DMUX:

Figure 33 CWDM DMUX side

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The demultiplexer is able to demultiplex an input aggregate signal (n channels) into 8 channels signals (in CWDM grid) and send to the transponder. 1.4.2.4 Optical add drop Multiplexing In line OADM configuration, 1692MSE support unidirectional or bi-directional transmissions. 1 ch add/drop, 2 ch add/drop or 4 ch add/drop; a OADM module can be used in a unidirectional transmission, while only a 2 ch add/drop OADM module can be used in a bi-directional transmission. a) 1 ch add/drop The 1 ch add/drop OADM function may be obtained with the following scheme.

From West side

Mux

Demux

Ch x

Demux

Mux

Ch x

From East side

To East side

To West side

Figure 34 1 ch Add/drop function in unidirectional transmission

This scheme has been chosen to implement the extraction and the insertion of chX from and into the WEST or EAST side of a CWDM protected network. In the figure only the OADM working on the WEST side is shown. b) 2 ch add/drop The 2 ch add/drop OADM function may be obtained with the following scheme.

From West side

Mux

Demux

Ch x

Demux

Mux

Ch y

From East side

To East side

To West side

Figure 35 2 ch Add/drop function in unidirectional transmission

This scheme has been chosen to implement the extraction and the insertion of chX, Y from and into the WEST or EAST side of a CWDM protected network. In the figure only the OADM working on the WEST side is shown.

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Particular case: The 1 ch add/drop OADM function can also be used in bi-directional transmission to add & drop 1 ch signal.

Express

Express

From / To West

From / To East

East Ch x West Ch y

Figure 36 1 ch add/drop function in bi-directional transmission

c) 4 ch add/drop The OADM is used to Add/drop four CWDM signals to/from a multi-wavelength signal on a single fiber transmission.

CH4 filter

CH3 filter

CH2 filter

CH1 filter

IN CH4DROP

CH3DROP

CH2DROP

CH1DROP

CH1 filter

CH2 filter

CH3 filter

CH4 filter

OUTCH1ADD

CH2ADD

CH3ADD

CH4ADD

EXP out EXP in

4 ch Add/Drop Module

Figure 37 4 ch add/drop function

1.4.2.5 1310nm circulator The circulator is used to separate two reverse directional optical signals over 1310nm window. The circulator function is the follow figure:

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Port 1 Port 3

Port 2

Figure 38 1310nm circulator 1.4.2.6 1310nm broadband filter This filter is used to add or drop 1310nm signal to or from 1310nm/1550nm mixed signal in OADM/OMDX board of 1692MSE. The function is shown in the below figure:

Out

1550nm Input1310nm Input

Figure 39 1310nm broadband filter

1.4.2.7 Optical parameters measurement (DDM) The analogue parameters of SFP can be monitored through DDM function in SFP transceiver. It includes Input Power, Input Power Type, Output Power, Bias Current, Power Supply Voltage, Temperature and Calibration Mode. In 1692MSE R3.2A, only DDM with External Calibration is supported. 1.4.2.8 Optical Supervisory Channel (OSC) An optional channel named OSC is allocated to the transport of the supervision data.

OSC

MUX

DMUX

MUX

DMUX

OSC OSC

OADM

OADM

WDMterminal

WDMterminal

B-to-BOADM

Figure 40 Optical supervisory channel management in line terminal and OADM configuration

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The OSC allows the remote monitoring of the NE in a network. 1.4.2.9 Optical Multiplex Section Protection (OMSP) OMSP function performs optical multiplex section protection. On the transmitter side, with the optical splitter, the signal from MUX output is broadcasted on the working fiber and protection fiber. On the receiver side, the optical switch will select one of the optical signals coming from working fiber and protection fiber under the control of board logic and send it into DEMUX. If a failure occurs on the main path, the system switches on the signal of the spare path. The protection is non-revertive. In point to point application, the optical multiplex section protection scheme is divided into the following two sorts:

Mux

switch splitter

switchsplitter

Demux

Demux

Mux

Figure 41 OMSP application without OADM

Mux

switch splitter

switchsplitter

Demux

OADM

switch splitter

switchsplitter Demux

Mux

Figure 42 OMSP application with OADM

1.4.2.10 Sub-Network Connection Protection (with WLA) In a ring network, the Sub-Network Connection Protection (SNCP) at optical channel level can be provided either in “Back to Back” terminals or in OADM configuration. The transponder cards (WLA) are duplicated for each protected channel. At the transmitting side, the signal is broadcast on the two arms of the ring. At the receiving side one of the two available signals is selected. If a failure occurs on the main path, the system switches on the signal of the spare path. The

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protection is non-revertive.

OADM

B-TO-B

ClientAdd & drop

traffic

ClientAdd & drop

traffic

Client end traffic

Client Add & drop traffic

OADMOADM

Figure 43 SNCP in a ring network

The ”Split & Select” function is performed either E-SNCP or O-SNCP. In case of E-SNCP, a matrix inside the transponders board ensures the split and selects the

function.

user Rx

WDM Tx

WDM Tx

WDM Rx

WDM Rx

user TxWDM

optical electrical optical opticalelectrical

8x8matrix

8x8matrix

control

LOS

Figure 44 Electrical SNCP

In case of O-SNCP, two optical splitters ensure the function. The selection is done by switching-off

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the user Tx corresponding to the failing path and re-activating the protecting one, the protection is performed at transponder level.

user Rx WDM Tx

WDM Tx

WDM Rx

WDM Rx user Tx

WDM

optical electrical optical opticalelectrical

opticalcoupler

opticalsplitter

control

LOS

user Rx

user Tx

Figure 45 Optical SNCP

1.4.2.11 Broadcast Sub Network Connection Protection (with WLA3C) B-SNCP is used to protect broadcasted service. B-SNCP +EPS (equipment protection switch) are used together, which need two WLA3C boards. In each board three SFP modules are needed. Signal from the WDM is input in CWDM port 1 and broadcast to user port 1 and two WDM ports. The routing is done electrically in the 8x8 matrix. In one board, a SFP module is placed in CWDM port 1 as main, a B/W placed in CWDM port 2 as spare. These two transponders are said to be twins. The system implements protective actions according to the alarms and status information of both CWDM ports. If a failure occurs on the main path, the system switches on the signal of the spare path. The protection is non-revertive. Only the user port 1 is needed, it can be placed CWDM or B/W modules.

CWDM 1

User 1

CWDM 2CWDM 1CWDM 2

Mainboard

Spareboard

User 1

Figure 46 BSNCP+EPS using two WLA3C

1.4.2.12 Sub-Network Connection Protection (with C-4xANY) In release 3.2A, C-4xANY with O-SNCP and E-SNCP are supported. In O-SNCP, there are two types: Use a WLA with O-SNCP board and place a B/W SFP in C-4xANY board. Use OMSP and place a colored SFP in C-4xANY board.

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In E-SNCP, only a WLA board can be used. In the meantime, place a B/W SFP in C-4xANY board. See the following figures.

Motherboard

Drawer 1

Drawer 2

Drawer 3

Drawer 4

B\W SFP

C-4xANY

Userport 1

Userport 2

WDMport 1

WDMport 2

WLA-P

Figure 47 C-4xANY with O-SNCP (use WLA-P)

Motherboard

Drawer 1

Drawer 2

Drawer 3

Drawer 4

Color SFP

C-4xANY OMSP

Figure 48 C-4xANY with O-SNCP (use OMSP)

Motherboard

Drawer 1

Drawer 2

Drawer 3

Drawer 4

B\W SFP

C-4xANY

User port 1

WDMport 1

WDMport 2

WLA

Figure 49 C-4xANY with E-SNCP

1.4.2.13 16 channels upgrade In 1692MSE R3.2A, the OSC port can be used either to transmit 1310nm OSC signal, or to interface with another aggregated 8 channels CWDM signal. Then the transmission channels can reach up to 16 channels. This is achieved by introducing a new 1310nm broadband filter. All types of C-MDX2/C-OAD2/C-MDX-B/C-OAD-B boards have been upgraded with 1310nm filter in order to support 16 channels upgrade in future. Furthermore, the improvement applied on 1310nm

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filter is also for compliance with ITU Recommendation G.694.2 version 2.2 for crosswalk issue. The upgraded C-MDX2/C-OAD2/C-MDX-B/C-OAD-B is software independent.

Figure 50 16 channels upgradable

MUXOAD

1310nm filter

OSC TX: 1280~1335nm

1471nm

1611nm

DMXOAD

1310nm filter

OSC RX

1471nm

1611nm

MUX OAD

1310nm filter

Aggregated signal comprisingCWDM wavelengths in O&E band(1271~1451nm)

1471nm

1611nm

DMXOAD

1310nm filter

Aggregated signal

1471nm

1611nm

OSC transmission

16CWDM channels transmission

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1.5 Device description 1.5.1 Shelf list In 1692MSE Release 3.2A, up to four compact shelves or one CO shelf are supported in one NE.

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

813

PSC2

PSC2Slot 6

ESC-LC

FAN

20

25

24

23

22

21

26PSC2

PSC2

FAN

38

37

36

39PSC2

PSC2

FAN

46

51

50

49

48

4752

PSC2

PSC2

Slave I-LINK

Slave I-LINK

Slave I-LINK

Slot 14

Slot 15

Slot 19

Slot 18

Slot 17

Slot 16

Slot 27

Slot 28

Slot 32

Slot 31

Slot 30

Slot 29 35

34

33

Slot 40

Slot 41

Slot 45

Slot 44

Slot 43

Slot 42

446.2 mm

Figure 51 Four compact shelves used in a NE (front view)

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1 98763 4 52 10 11 1918171613 14 1512 20 24232221

25 373635343332313029282726 41403938 45444342 484746

49

533.4mm

443mm

Figure 52 One CO shelf used in a NE (front view)

1.5.2 Shelf and boards designation and reference

Table 11 Shelf and boards designation and reference Name Mnemonic ALCATEL Code

1692 Metrospan Edge Compact Shelf / 2 - 3AL 97679 AA** 1692 Metrospan Edge Compact Shelf / 3 - 3AL 97679 AB** 1692 Metrospan Edge CO shelf - 3AL 86607 AA** Optinex rack with TRU & Door - 3AL 37952 AA** Optinex rack with TRU - 3AN 44815 AA** Low Cost Equipment and Shelf Controller ESC-LC 3AL 97690 AA** Local Access Network card LAN-Q 3AL 86653 AA** Power Supply Card PSC 3AL 86652 AA** Power Supply Card2 PSC2 3AL 86888 AA** Power Supply Card3 PSC3 3AL 86652 AB** Power Management Unit PMU 3AL 86825 AA** Compact FAN / 2 FAN 3AL 97682 AA** CO FAN module FAN-CO 3AL 86625 AA**

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Housekeeping card HK 3AL 86668 AA** Rack Alarm Interface card RAI 3AL 87009 AA** Intershelf Link Slave I-LINK-S 3AL 86808 AA** Optical Multiplex Section Protection card OMSP 3AL 97541 AA** Optical Supervision card OSC 3AL 97540 AA** Wavelength Adaptor3 with PM WLA3C 3AL 97795 AA** Wavelength Adapter3 with PM and O-SNCP WLA3COP 3AL 97795 AB** OCC10-No Amplified Ch193.300 (1550) OCC10-NA-1550 (193.300) 3AL 95313 AA** OCC10-No Amplified Ch 193.000 (1550) OCC10-NA-1550 (193.000) 3AL 95313 AB** OCC10-No Amplified Ch193.100 (1550) OCC10-NA-1550 (193.100) 3AL 95313 AC** OCC10-No Amplified Ch193.200 (1550) OCC10-NA-1550 (193.200) 3AL 95313 AD** OCC10-No Amplified Ch195.900 (1530) OCC10-NA-1530 (195.900) 3AL 95314 AA** OCC10-Enhanced-CWDM (1530) OCC10-EC-1530 8DG 81002 AA** OCC10-Enhanced-CWDM (1550) OCC10-EC-1550 8DG 81002 AB** 2XGE - 3AL 97800 AA** 2XGE-FC - 3AL 97878 AA** SFP transceiver L1.1 (1310nm) B&W L1.1 1AB194670002 SFP transceiver 2M (1310nm) B&W 2M 1AB209860001 SFP transceiver S1.1 (1310nm) B&W S1.1 1AB194670001 SFP transceiver S1.1 (1310nm) B&W with DDM S1.1_DDM 1AB194670004 SFP transceiver L1.2 (1310nm) B&W with DDM L1.2_DDM 1AB194670006 SFP transceiver S16.1 (1310nm) B&W S16.1 1AB196370001 SFP transceiver S16.1 (1310nm) B&W with DDM S16.1_DDM 1AB196370006

SFP transceiver L16.1 (1310nm) B&W with DDM L16.1 1AB196370004

SFP transceiver L16.2 (1310nm) B&W with DDM L16.2 1AB196370003

SFP transceiver S4.1 (1310nm) B&W S4.1 1AB196360001 SFP transceiver S4.1 (1310nm) B&W with DDM S4.1_DDM 1AB196360004 SFP transceiver L4.2 (1310nm) B&W with DDM L4.2_DDM 1AB196360007 SFP transceiver I16 (1310nm) B&W I16 1AB196370002 SFP transceiver I16 (1310nm) B&W with DDM I16_DDM 1AB196370005 SFP transceiver 1000Base-SX (850nm) B&W GbE_SX 1AB187280002 SFP transceiver 1000Base-SX (850nm) B&W with DDM GbE_SX_DDM 1AB187280033

SFP transceiver 1000Base-LX (1310nm) B&W GbE_LX 1AB187280001 SFP transceiver 1000Base-LX (1310nm) B&W with DDM GbE_LX_DDM 1AB187280031

SFP transceiver 1000Base-ZX (1550 nm) B&W with DDM GbE_ZX_DDM t.b.d

SFP transceiver FC/2FC-SX (850nm) B&W with DDM 2FC SX_DDM 1AB187280037

SFP transceiver FC/2FC-LX (1310nm) B&W with DDM 2FC LX_DDM 1AB187280038

CWDM wavelength SFP transceiver with PIN receiver (1470nm) 1470_Bronze 1AB196340001

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CWDM wavelength SFP transceiver with APD receiver Standard (1470nm) 1470_Silver 1AB196350001








CWDM wavelength SFP transceiver with PIN receiver (1470nm) with DDM 1470_Bronze_DDM 1AB196340009








CWDM wavelength SFP transceiver with APD receiver Standard (1470nm) with DDM 1470_Silver_DDM 1AB196350026




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4xANY Host card C-4xANY 3AL 95063 AA** High speed 1310nm optical drawer HF_1310 Drawer 3AL 86672 AA** Low speed 1310nm optical drawer LF_1310 Drawer 3AL 86674 AA** High speed 850nm optical drawer HF_850 Drawer 3AL 86870 AA** Low speed 850nm optical drawer LF_850 Drawer 3AL 86869 AA** STM-1/4 optical drawer/2 SDH_1310 Drawer 3AL 95284 AA** Unidirectional MUX/DEMUX without OSC filter C-MDX-U 3AL 97538 AB** Unidirectional MUX/DEMUXE with OSC filter C-MDX-E-U-S 3AL 97769 AA** Bi-directional MUX/DEMUX without OSC filter C-MDX-B 3AL 97538 AC** Bi-directional MUX/DEMUX with OSC filter C-MDX-B-S 3AL 97538 AD** Unidirectional MUX/DEMUX2 without OSC filter C-MDX2-U 3AL 97654 AA** Unidirectional MUX/DEMUX2E with OSC filter C-MDX2-E-U-S 3AL 97772 AA** 1-channel unidirectional MUX/DEMUX2E with OSC filter C-MDX2-E-1-S 3AL 97772 BA**

C-MDX2-E-2-4749-S 3AL 97772 CA** C-MDX2-E-2-5153-S 3AL 97772 CB** C-MDX2-E-2-5557-S 3AL 97772 CC**

2-channel unidirectional MUX/DEMUX2E with OSC filter

C-MDX2-E-2-5961-S 3AL 97772 CD**

C-OAD-U-1-4747 3AL 97539 AB** C-OAD-U-1-4949 3AL 97539 AC** C-OAD-U-1-5151 3AL 97539 AD** C-OAD-U-1-5353 3AL 97539 AE** C-OAD-U-1-5555 3AL 97539 AF** C-OAD-U-1-5757 3AL 97539 AG** C-OAD-U-1-5959 3AL 97539 AH**

1-channel unidirectional OADM without OSC filter

C-OAD-U-1-6161 3AL 97539 AJ**

C-OAD-E-U-1-4747-S 3AL 97770 AA** C-OAD-E-U-1-4949-S 3AL 97770 AB** C-OAD-E-U-1-5151-S 3AL 97770 AC** C-OAD-E-U-1-5353-S 3AL 97770 AD** C-OAD-E-U-1-5555-S 3AL 97770 AE** C-OAD-E-U-1-5757-S 3AL 97770 AF** C-OAD-E-U-1-5959-S 3AL 97770 AG**

1-channel unidirectional OADME with OSC filter

C-OAD-E-U-1-6161-S 3AL 97770 AH**

C-OAD2-U-1-4747 3AL 97653 AA** C-OAD2-U-1-4949 3AL 97653 AB** C-OAD2-U-1-5151 3AL 97653 AC** C-OAD2-U-1-5353 3AL 97653 AD**

1-channel unidirectional OADM2 without OSC filter

C-OAD2-U-1-5555 3AL 97653 AE**

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C-OAD2-U-1-5757 3AL 97653 AF** C-OAD2-U-1-5959 3AL 97653 AG**

C-OAD2-U-1-6161 3AL 97653 AH**

C-OAD2-E-U-1-4747-S 3AL 97771 AA** C-OAD2-E-U-1-4949-S 3AL 97771 AB** C-OAD2-E-U-1-5151-S 3AL 97771 AC** C-OAD2-E-U-1-5353-S 3AL 97771 AD** C-OAD2-E-U-1-5555-S 3AL 97771 AE** C-OAD2-E-U-1-5757-S 3AL 97771 AF** C-OAD2-E-U-1-5959-S 3AL 97771 AG**

1-channel unidirectional OADM2E with OSC filter

C-OAD2-E-U-1-6161-S 3AL 97771 AH**

C-OAD-U-2-47474949 3AL 97539 PA** C-OAD-U-2-51515353 3AL 97539 QA** C-OAD-U-2-55555757 3AL 97539 RA**


C-OAD-U-2-59596161 3AL 97539 SA**

C-OAD-E-U-2-47474949-S 3AL 97770 BA** C-OAD-E-U-2-51515353-S 3AL 97770 BB** C-OAD-E-U-2-55555757-S 3AL 97770 BC**


C-OAD-E-U-2-59596161-S 3AL 97770 BD**

C-OAD2-U-2-47474949 3AL 97653 BE** C-OAD2-U-2-51515353 3AL 97653 BF** C-OAD2-U-2-55555757 3AL 97653 BG**


C-OAD2-U-2-59596161 3AL 97653 BH**

C-OAD2-E-U-2-47474949-S 3AL 97771 BA** C-OAD2-E-U-2-51515353-S 3AL 97771 BB** C-OAD2-E-U-2-55555757-S 3AL 97771 BC**


C-OAD2-E-U-2-59596161-S 3AL 97771 BD**

C-OAD2-U-4-47495153 3AL 97653 CA** 4-channel unidirectional OADM2 without OSC filter C-OAD2-U-4-55575961 3AL 97653 CC**

C-OAD2-E-U-4-47495153-S 3AL 97771 CA** 4-channel unidirectional OADM2E with OSC filter C-OAD2-E-U-4-55575961-S 3AL 97771 CB**

C-OAD-B-1-4755 3AL 97539 FA** C-OAD-B-1-4957 3AL 97539 GA** C-OAD-B-1-5159 3AL 97539 HA**

1-channel bi-directional OADM without OSC filter

C-OAD-B-1-5361 3AL 97539 JA**

C-OAD-B-1-4755-S 3AL 97539 BA** C-OAD-B-1-4957-S 3AL 97539 CA** C-OAD-B-1-5159-S 3AL 97539 DA**

1-channel bi-directional OADM with OSC filter

C-OAD-B-1-5361-S 3AL 97539 EA** N.B. 2XGE board and 2XGE-FC board have the same function. 2XGE with P/N 3AL97800AA** only support DC48V, while 2XGE-FC with P/N 3AL97878AA** can support DC48/60V. N.B. PSC3 board is only used on CO shelf.

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1.5.3 Slot allocations 1.5.3.1 Slot allocations for compact shelf The board composition and placement in a shelf has some constraints at the hardware, software and functional levels. In the 1692MSE release 3.2A, up to four compact shelves are supported in a NE. For Hardware and/or Software organization, some boards are located on dedicated slots. Mandatory boards are: ESC-LC, LAN-Q, PSC, PSC2 and FAN.

Table 12 Slot allocations for compact shelves in 1692MSE release 3.2A Allowed unit types in master shelf Units

1 2 3 4 5 6 7 8 9 10 11 12 13 ESC-LC x MDX x x x x x OAD* x x x x x C-OAD2-4 x WLA x x x x x OCC10 x x x x x 2XGE-FC x x x x x C-4xANY x x OMSP x x LAN-Q x PSC x x PSC2 x x OSC x x FAN x HK x RAI x x

Allowed unit types in slave shelves Units 1 2 3 4 5 6 7 8 9 10 11 12 13

MDX x x x x x OAD* x x x x x C-OAD2-4 x WLA x x x x x OCC10 x x x x x 2XGE-FC x x x x x C-4xANY x x I-LINK-S x OMSP X** x x PSC2 x x FAN x HK x * Except C-OAD2-U-4-XXXX and C-OAD2-E-U-4-XXXX-S. ** Due to the hardware limitation, the slot 9 in the third expansion shelf can’t be provisioned when

PSC is used in master shelf. If PSC2 is used, there is no such constraint. N.B. The WLA includes WLA3C and WLA3COP. The OCC10 includes OCC10-NA and OCC10-EC. N.B. The OAD includes C-OAD and C-OAD2. The MDX includes C-MDX and C-MDX2. The

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C-OAD, C-OAD2, C-MDX and C-MDX2 respectively include many kinds of board according to different wavelengths and other features. N.B. OSC cards can be placed in slots 9 or 11 of the master shelf. When the OSC board is plugged in slot 9, the MDX/OAD board must be placed in slot 2. If only one OSC is used, slot 11 is preferred. N.B. Only one HK board can be configured in a NE. 1.5.3.2 Slot allocations for CO shelf In the 1692MSE release 3.2A, only one CO shelf is supported in a NE. Mandatory boards are: ESC-LC, LAN-Q, PSC/PSC3 and FAN-CO.

Table 13 Slot allocations for CO shelf in 1692MSE release 3.2A Units 1 2 3 4 5 6 7 8 9 10 11 12 13

ESC-LC x MDX x x x x x x x x x x x x OAD* x x x x x x x x x x x x C-OAD2-4 x WLA x x x x x x x x OCC10 x x x x x x x x 2XGE-FC x x x x x x x x C-4xANY x x x x x x 14 15 16 17 18 19 20 21 22 23 24 MDX x x x x x x x x x x OAD* x x x x x x x x x x C-OAD2-4 x WLA x x x x x x x x OCC10 x x x x x x x x 2XGE-FC x x x x x x x x C-4xANY x x x x x 25 26 27 28 29 30 31 32 33 34 35 36 37 PSC/PSC3 x LAN-Q x OSC x OMSP x x x x x x x x HK x RAI x 38 39 40 41 42 43 44 45 46 47 48 49 PSC/PSC3 x OSC x OMSP x x x x x x x x FAN-CO x * Except C-OAD2-U-4-XXXX and C-OAD2-E-U-4-XXXX-S. N.B. The WLA includes WLA3C and WLA3COP. The OCC10 includes OCC10-NA and OCC10-EC. N.B. The OAD includes C-OAD and C-OAD2. The MDX includes C-MDX and C-MDX2. The C-OAD, C-OAD2, C-MDX and C-MDX2 respectively include many kinds of board according to different wavelengths and other features. N.B. The OSC must host in slots 35 and 43. If the OSC is put in slot 35, slot 10 must be plugged with MDX/OAD. If the OSC is put in slot 43, slot 18 must be plugged with MDX/OAD.

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1.6 System Configuration 1.6.1 Configuration criteria The basic configuration of the 1692 MSE relies on the following criteria: The network architecture and the position of the equipment in the network define the NE type (line

terminal, OADM, back to back terminal, regenerator or CPE). Optical power budget limitations Need for upgrading Further need for the Optical Supervision Channel The initial cost

Once the basic configuration is defined, secondary criteria will be determinant to define the optional features: TDM concentrator (C-4xANY)

Up to 4 client signals may be multiplexed on a single STM-16. The concentration of 4 client signals on a unique CWDM channel requires a C-4xANY board but saves up to 3 CWDM channels.

Optical Sub-Network Connection Protection (O-SNCP)

In ring networks, channels that carry important or priority traffic can be individually protected. The protection of a channel requires a WLA3COP board.

Supervision function

The supervision feature requires an OSC board. The feature also requires the OSC insertion MUX and the OSC extraction DMUX implemented in some OAD and MDX boards.

1.6.2 Terminal configuration 1.6.2.1 Unidirectional application For release 3.2A product, a NE is composed of up to four compact shelves or one CO shelf. The equipment can be configured as 3 typical terminals. 1.6.2.1.1 Only WLA For multi-compact shelves application, the WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The C-MDX cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The OSC board (if needed) should be placed in slot 9 or slot 11 of master shelf. The OMSP card is placed in slot 9 or 10 of master shelf or 9, 10 or 11 of slave shelves. Following configuration is just an example.

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FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

C-MDX-U/C-MDX-E-U-S

(OSC)

WLA3C

WLA3C

WLA3C

WLA3C (OMSP)

PSC2

(): Selectable Figure 53 An example for slot allocations in unidirectional application (only WLA)

1.6.2.1.2 Only C-4xANY a) Using compact shelves For release 3.2A products, when compact shelves are used, up to 8 C-4xANY boards can be supported in one NE. The C-4xANY cards are placed in slot [3,4] or [5,6] of master or slave shelf. The C-MDX cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The OSC board (if needed) should be placed in slot 9 or slot 11 of master shelf. The following configuration is just an example.

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FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

ESC-LC

Slot 6

(OSC)

PSC2

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6

PSC2

C-MDX-U/C-MDX-E-U-S

C-4xANY

C-4xANY

C-4xANY

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6

PSC2

C-4xANY

C-4xANY

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6

PSC2

C-4xANY

C-4xANY

LAN-Q

C-4xANY

(): Selectable

Figure 54 An example for slot allocations in unidirectional application (using compact shelves, only C-4xANY)

b) Using CO shelf For release 3.2A, when CO shelf is used, up to 8 C-4xANY can be supported in one NE. Following configuration is just an example.

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C-4xANYC-4xANYC-4xANYC-4xANY

C-MDX-E-U-S

11 C-4xANYC-4xANY13 C-4xANY12 C-4xANY 242322

PSC 3736OSC3433323130292827LANQ

41403938 45444342 PSC4746

FAN-CO

ESC-LC

Figure 55 An example for slot allocations in unidirectional application (using CO shelves, only

C-4xANY) 1.6.2.1.3 Mixing WLA and C-4xANY Either compact shelves or CO shelves can be used to provide 8 λ unidirectional terminals. An example with CO shelf is as follows:

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ESC-LC 2

C-MDX-E-U-S

11 C-4xANYC-4xANY13 C-4xANY12 C-4xANY 242322

PSC 3736OSC3433323130292827LANQ

41403938 45444342 PSC4746

FAN-CO

3 6 7 8 9WLA3C

WLA3C

Figure 56 An example for slot allocations in unidirectional application (using CO shelves, mixed

WLA and C-4xANY) 1.6.2.2 Bi-directional terminal configuration In this case, there are only 4 channels per direction available. When compact shelves are used: The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The C-MDX-B- (S) cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelves. The OSC board (if needed) should be placed in slot 9 or slot 11 of the master shelf. The OMSP cannot be used in the bi-directional configuration.

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FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

C-MDX-B-(S)

(OSC)

WLA3C

WLA3C

PSC2

Figure 57 Slot allocations in bi-directional application 1.6.3 OADM configuration When compact shelves are used: The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The C-OAD cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves. The OSC board (if needed) should be placed in slot 9 or slot 11 of master shelf. The OMSP card is placed in slot 9 or 10 of the master shelf or 9, 10 or 11 of slave shelves. N.B. C-OAD2-4 only can be placed [2,3] of the master or slave shelf. 1.6.3.1 1-channel OADM Any wavelength among the eight CWDM wavelengths can be added and dropped. So, there are 8 types of 1-channel OADM modules according to the different wavelengths.

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

C-OAD-E-U-1-XX-S/C-OAD-U-1-XX

(OSC)

WLA3C

PSC2

(): Selectable Figure 58 An example for slot allocations in unidirectional OADM application (1 channel

add/drop) 1.6.3.2 2-channel OADM In this case, only 2 channels per direction can be added and dropped. Depending on different wavelength combinations, there are four kinds of OADM boards.

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Table 14 Wavelength combination for unidirectional application Number 1 2 3 4

Channels (nm) 1470,1490 1510,1530 1550,1570 1590,1610

FAN

Slot 1

WLA3C

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

WLA3C (OSC)

C-OAD-E-U-2-XXXX-S/C-OAD-U-2-XXXX

PSC2

(): Selectable Figure 59 An example for slot allocations in unidirectional OADM application (2 channels

add/drop) 1.6.3.3 4-channel OADM In this case, only 4 channels per direction can be added and dropped. Depending on different wavelength combinations, there are two kinds of OADM boards.

Table 15 Wavelength combination for unidirectional application Number 1 2

Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2Slot 6

WLA3C (OSC)

PSC2

WLA3C

FAN

Slot 1

WLA3C

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6

WLA3C

PSC2

LAN-Q

C-OAD2-E-U-4-XXXXXXXX-S/C-OAD2-U-4-XXXXXXXX

ESC-LC

(): Selectable

Figure 60 An example for slot allocations in unidirectional OADM application (4 channels add/drop)

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1.6.3.4 Bi-directional transmission in one fiber In this case, only 1 channel per direction can be added and dropped. Depending on different wavelength combinations, there are four kinds of OADM boards.

Table 16 Wavelength combination for a bi-directional application Number 1 2 3 4

Channels (nm) 1470,1550 1490,1570 1510,1590 1530,1610

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

C-OAD-B-1-XX-S/C-OAD-B-1-XX

(OSC)

WLA3C

PSC2

(): Selectable Figure 61 An example for slot allocations in bi-directional OADM application

1.6.4 Regenerator configuration As mentioned before, up to 8 channels can be regenerated in per direction in one NE when MUX/DMUX is used; up to 4 channels can be regenerated in per direction in one NE when OADM is used. When compact shelves are used: The WLA/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelves. The C-4xANY cards are placed in slot [3,4] or [5,6] of the master or slave shelf. The C-MDX-U/ C-MDX-E-U-S cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelf. The C-OAD2-4 can be placed in slot [2,3] of the master or slave shelf. The OSC board (if needed) should be placed in slot 9 or slot 11 of the master shelf. 1.6.4.1 Regenerator configuration (using MUX/DMUX) In this configuration, three shelves are needed.

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FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

WLA3C

WLA3C

C-MDX-E-U-S

PSC2

OSCC-MDX-E-U-S

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6WLA3C

WLA3C

WLA3C

PSC2

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2Slot 6WLA3C

WLA3C

PSC2I-LINK-S

WLA3C

Figure 62 An example for slot allocations in regenerator applications (MUX/DMUX)

N.B. In above figure, set WLA3C remote loopback (loopback on line side). 1.6.4.2 Regenerator configuration (using OADM)

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FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

WLA3C

C-OAD2-E-U-4-XXXXXXXX-S

PSC2

OSCWLA3C

FAN

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

I-LINK-S

Slot 6WLA3C

PSC2

WLA3C

Figure 63 An example for slot allocations in regenerator application (OADM)

N.B. In above figure, set the WLA3C remote loopback (loopback on line side). 1.6.5 CPE configuration There are two types of CPE, one-channel CPE and two-channel CPE. In both types only a master shelf is needed. 1.6.5.1 One-channel CPE When compact shelves are used: The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf. The C-4xANY cards are placed in slot [3,4] or [5,6] of the master or slave shelf. The C-MDX2-E-1-S cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf. The OSC board should be placed in slot 9 or slot 11 of the master shelf.

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FAN

Slot 1

WLA3C

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

OSC

C-MDX2-E-1-S

PSC2

Figure 64 An example for slot allocations in one-channel CPE application 1.6.5.2 Two-channel CPE When compact shelves are used: The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf. The C-4xANY cards are placed in slot [3,4] or [5,6] of the master or slave shelf. The C-MDX2-E-2-XX-S cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf. The OSC board should be placed in slot 9 or slot 11 of the master shelf.

FAN

Slot 1

WLA3C

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

8

13

PSC2

LAN-Q

ESC-LC

Slot 6

OSC

C-MDX2-E-2-XX-S

PSC2

Figure 65 An example for slot allocations in two-channel CPE application

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1.7 Optical safety 1.7.1 General information 1.7.1.1 Hazard level HAZARD LEVEL 1M, according to IEC 60825-1 (1998), and IEC 60825-2 (2000) requirements, can be assigned to all ports of the system. 1.7.1.2 Location type The equipment shall be installed in “Restricted Location” (industrial and commercial premises) or controlled locations (optical cable ducts and switching centers). 1.7.1.3 Labeling The labels reported below are applied during factory settings. The labels are affixed on all front covers that protect optical connectors. They are on the front side plate of all the units involved in optical transmission: HAZARD symbol:

Example of EXPLANATORY label:

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1.8 1692MSE System characteristics

1.8.1 Power supply Two PSC or PSC2 cards are in charge of feeding the shelf. Input power stage The following figure shows the equipment input power stage housed on the two PSC/PSC2/PSC3. It provides adaptation to the customer central power bus by a main power block and supplies all the SPIDER FPGA by means of an on-board converter. Distributed power stage All the boards receive the +3.6 V and the 5.5 V voltages to power the SPIDER FPGA present on each card. Moreover, some boards receive the +BATT –BATT voltages generated by the input stage of the PSC/PSC2/PSC3. Normal service range The normal input voltage range of the power supply module is either: -36V～-72V

Figure 66 1692MSE input power stage (same as PSC2)

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Normal service range DC/DC Power supply units output voltages: + 3.6 V ± 3%

+ 5.5 V ± 3% PSC/PSC2/PSC3 is used in 1692MSE system, slot 7 and slot 12. Its main purpose is to: Supply and distribute -48/-60V filtered and protected voltage to all the boards in the shelf of the

1692MSE. Supply and distribute 3V service voltage dedicated to SPIDER circuitry in all the boards. Supply and distribute 5V auxiliary voltage. Make a termination of ISPB bus, ISSB bus (GTLP Levels) and SPI bus (TX side). Give alarms on fault battery and voltages loss.

The PSC/PSC2/PSC3 boards work in “1 + 1” protection. 1.8.2 Equipment and shelf control It is important to note that management is performed by SNMP protocol. The physical link is obtained by ESC-LC EC/ESC-LC SC dialog through the ISSB Bus.

WLA

ESC-LC

OSC

OAD

MDX

OMSP

PSC/PSC2

LANSNMP

SPI--A

SPI--B

PDU/TRU

Power supply

Power supply

SHELF

PSC/PSC2

HK

RAI

HK

PDU/TRU

EC

SC

Figure 67 Equipment and shelf control

1.8.3 Management and monitoring interfaces The 1692MSE also provides the management and monitoring functions: Interface SNMP with a personal computer (ECT or RECT function) and 1353SH Network

Management System (on terminal) Station alarms Alarm status of the equipment and monitoring (indicated by the front cover LEDs) Visual indications for the card failure.

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The 1692MSE supports the following interfaces: SNMP: For connection to Equipment Craft Terminal (ECT) or Remote Craft Terminal

(RECT) Ethernet: For connection to OS 1353SH and other ALCATEL Nes with ETHERNET Interface QECC: For connection to other WDM Nes Local/Remote: Craft Interface

RS232 9-pin D, PC compatible 38400 bit/s (Personal Computer) Protocol Stack/Information Model messages SNMP

Local and remote management interfaces functions Alarms status checks, equipment, connection & TMN configurations, and maintenance memory for all the equipment events. Equipment software download (local and remote) on non-volatile memories without traffic interruption. Unit and equipment acknowledgement Through Remote Inventory Company ID, Unit type. Unit part number, Software part number, Manufacturing Plant, Data Identifier, Date.

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1.9 Environmental characteristics The 1692MSE is designed to be compliant with both ETSI and ANSI standards. The technical data of this chapter refers to ITU-T Recommendations, ETSI Standards or Telcordia (former Bellcore) Standards. 1.9.1 ETSI compliancy The electromagnetic compatibility requirements for the system are specified in the pr ETS 300 386. The following features are applicable: Environmental class 1 Normal priority of service

Immunity The following table specifies the valid tests and their compliance criteria for immunity. All the items make reference to the chapters of the pr ETS 300 386.

Table 17 Valid tests and compliance criteria for immunity

Phenomenon Coupling (Port)

Test Method Test Level Compliance

Criterion Electrostatic Discharge - - 4 Kv (contact) / 4 Kv (air)

6 Kv (contact) / 8 Kv (air) NP LFS

DC power - 500V NP Electrical Fast Transients

Signal - 500V 1KV

NP LFS

Radiated Electromagnetic Field - - 3V/m

10 V/m NP LFS

DC power - 3V NP Continuous Conducted Signals Signal - 3V NP NP: Normal performance within specified limits LFS: Loss of function (self recovery)

No corruption of data management Temporary loss of function following application of test Self recovery to normal performance occurs at the cessation of the test

Emission The following table specifies the requirements for the RF emissions of the equipment. All the items make reference to the chapters of the pr ETS 300 386.

Table 18 Requirements for RF emission Phenomenon Coupling (Port) Test Method Maximum Level

DC power - - Conducted emissions Signal - Hazard level A

Radiated emissions - - Hazard level A The designation “Hazard Level A” is defined in the EN 55 022 document. The electromagnetic compatibility requirements for the system are specified in the GR-1089. The recommendation related to immunity and the radiated emissions are located on 3-1 & 3-2.

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1.9.1.1 ANSI compliancy The electromagnetic compatibility requirements for the system are specified in the GR – 1089 (see note). The recommendation related to immunity and the radiated emissions is located section 3-1 & 3-2. N.B. GR – 1089 – CORE

Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunication equipment issue 2, December 1997

1.9.2 Environmental constraints The technical data for this chapter js, where it is possible, refers to ITU-T Recommendations or ETSI Standards. The system is designed for indoor operation with controlled air temperature. The complete environmental conditions, including climatic, atmospheric and mechanical conditions, are specified in the ETS 300 019. The following environmental hazard levels of this standard apply. 1.9.2.1 Storage The equipment meets the following requirements involving Storage: ETS 300 019-1-2: 1992, hazard level 1.2 Hazard level 1.2: weatherproofed, not temperature controlled storage location. This hazard level applies to weatherproofed storage having neither temperature nor humidity control. The location may have openings directly to the open air, i.e., it may be only partly weatherproofed. This hazard level applies to storage locations: Where equipment may be exposed to solar radiation and temporarily to heat radiation: They

may also be exposed to movements of the surrounding air due to draughts, e.g. through doors, windows or other openings. They may be subjected to condensed water, dripping water and to icing. They may also be subjected to limited wind driven precipitation, including snow.

Where mould growth or attacks by animals, except termites, may occur. With normal levels of contaminants experienced in urban locations with industrial activities

scattered over the whole area, and/or with heavy traffic. In areas with sources of sand or dust, including urban areas With vibration of low significance and insignificant shock

The conditions of this hazard level may occur in: Unattended buildings Some entrances of buildings Some garages and shacks

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Table 19 Main climatic conditions

Main Climatic Conditions Unit Value

Low air temperature ℃ -25

High air temperature ℃ 55

Low relative humidity % 10

High relative humidity % 100

Low absolute humidity G/m3 0.5

High absolute humidity G/m3 29

Rain intensity mm/Min No

Rate of change of temperature ℃/Min 0.5

Low air pressure kPa 70

High air pressure kPa 106

Solar radiation W/m2 1120

Movement of the surrounding air m/s 30

Condition of condensation - Yes

Condition of precipitation - Yes, wind-driven precipitation

Condition of icing and frosting - Yes

Climatogram - 2 (ETS 300 019-1-1)

Figure 68 Climatogram for hazard level 1.2: no temperature controlled storage location

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1.9.2.2 Transportation The equipment meets the following requirements involving transportation: ETS 300 019-1-1: 1992, hazard level 2.2 (Careful transportation) This hazard level applies to transportation where special care has been taken e.g. with respect to low temperature and handling. Hazard level 2.2 covers the condition of hazard level 2.1. In addition hazard level 2.2 includes transportation in all types of trucks and trailers in areas with a well-developed road system. It also includes transportation by ship and by train specially designed with shock-reducing buffers. Manual loading and unloading of up to 20 Kg is included.

Table 20 Main climatic conditions Environmental Parameter Unit Value


High air temperature, air in unventilated enclosures ℃ 70

High air temperature, air in ventilated enclosures or outdoor air ℃ 40

Relative humidity % 95

Absolute humidity g/m3 60



Rain intensity mm/Min 6


Heat radiation W/m2 600

Condition of condensation - Yes 1.9.2.3 Climatic conditions for operating The Equipment meets the requirements of ETSI Stand. The functionality of the Equipment, in relation to Temperature, is in compliance with: ETS 300 019-1-3: 1992, hazard level 3.2 Hazard level 3.2: Partlial temperature-controlled locations. This hazard level applies to locations: Where installed equipment may be exposed to solar radiation and heat radiation. They may also be exposed to movements of the surrounding air due to draughts in buildings, e.g. through open windows. They may be subjected to condensed water and to water from sources other than rain and icing. They are not subjected to precipitation: Where mould growth or attacks by animals, except termites, may occur. With normal levels of contaminants experienced in urban locations with industrial activities

scattered over the whole area and/or with heavy traffic. In close proximity to sources of sand or dust.

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With vibration of low significance, e.g. for products fastened to light supporting structures subjected to negligible vibrations.

The conditions of this hazard level may be found in: Entrances and staircases of buildings Garages Cellars Certain workshops Buildings in factories and industrial process plants Unattended equipment stations Certain telecommunication buildings Ordinary storage rooms for frost resistant products and farm buildings…

Figure 69 Climatogram for hazard level 3.2: partly temperature controlled locations

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Table 21 Main climatic conditions Environmental Parameter Unit Value


High air temperature ℃ 45

Low relative humidity % 5

High relative humidity % 95

Low absolute humidity G/m3 1

High absolute humidity G/m3 29

Rate of change of temperature ℃/Min 0.5


High air pressure kPa 106


Heat radiation W/m2 600


Condition of condensation - Yes

Condition of wind-driven rain, snow - No

Condition of icing - Yes

Climatogram 2 (ETS 300 019-1-3) 1.9.2.4 Waste of Electrical and Electronic Equipment (WEEE)

The marking printed on the subrack denotes compliancy with the Directive 2002/96/EC on Waste of Electrical and Electronic Equipment. The general principle is the producer responsibility in the management of the products he puts on the market when discarded by the owner. The producer responsibility now covers the end of life of the products sold. The European directive is effective in a country once transposed. The starting date for the producer responsibility for the European text is 13th August 2005. All Alcatel products fall under in Category 3 of Annex 1A of the WEEE directive (Directive 2002/96/ EC). I.e. ”IT and Telecommunication equipment” under item ”Other products transmitting sound, images or other information by telecommunications”. Alcatel products fall under WEEE directive name: “Other product or equipment of transmitting sound, images or other information by telecommunications” in Annex 1B. This mark will not cause any responsibility as all responsibilities will be defined by contract. 1.9.2.5 Acoustical noise The acoustical noise level of the product complies with: ETS 300 753 Environmental Class 3.1 for attended telecommunication equipment rooms (maximum sound level 7.2 bels).

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2 MECHANICAL DESCRIPTION In 1692MSE release 3.2A, compact shelves or CO shelf can be used in a NE. A fully loaded 1692MSE system can be housed in a single standard ETSI or ANSI rack (compact shelf can also be placed on the desk). 2.1 Rack design The 1692MSE mechanical design allows to put up to four CO shelves or up to 12 compact shelves in a single rack. It is compatible with the following mechanical standards: A 2000 mm high ETSI rack A 2150 mm high ANSI rack A 1950 mm high NEBS 2000 rack

Figure 70 Rack description

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2.2 CO shelf Only one CO shelf can be managed in a 1692MSE NE. 2.2.1 Shelf organization The CO shelf is divided into 49 board or unit slots, grouped in three parts: The main part, which is the upper part and which comprises the slots from 1 to 24. The first extension part, which is the middle part and which comprises the slots from 25 to 48. The second extension part, which is the bottom part and which comprises the slot 49.

Figure 71 Shelf organization

Figure 72 Shelf front view with cover

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2.2.2 Shelf dimensions

Figure 73 Shelf dimensions

2.3 Compact shelf The 1692MSE shelf is “Compact WDM” architecture. The following is the mechanical photo for single shelf (main or slave).

Figure 74 1692MSE single shelf Main features provided by the 1692MSE shelf:

The operator must wear a wrist-strap bracelet connected to the mechanical ground (available onthe rear of the shelf) for each handling a board, optical connectors or a part of the shelf.

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It is very easy to use due its small size. Up to 12 shelves can be set in a 2000 mm high ETSI rack, or a 2150 mm high ANSI rack, or

1950 mm high NEBS 2000 rack. It can be placed on the outside of rack, such as on the desk.

N.B. For compact shelf, the front cover can not be installed when the slave shelves are used. 2.3.1 Shelf organization The 1692MSE single compact shelf is divided into 13 board or unit slots, grouped in three parts: The main part comprises the slots from 1 to 6 used for the main boards. The right side part comprises the slots from 7 to 12 used for the small boards. The left side part comprises the slot 13 available for the FAN board.

Main part (slot 1 to 6)

Second extension part (slot 13) First extension part (slot 7 to 12)

Figure 75 1692 MSE compact shelf mechanical structure

2.3.2 Shelf dimensions Shelf size: The size of the 1692 MSE shelf is 446.2 (width) x 274mm (depth with cover) x 132.4 mm (height). The depth is compliant with the 300 mm deep ETSI rack (no limitation in ANSI rack).

On the Release 3.2A, up to four compact shelves can be is managed in one NE. The dimension for the four shelves is the same. See the following figure.

Slot 1

Slot 5

Slot 4

Slot 3

Slot 2

7

12

11

10

9

813

Slot 6

ESC-LC PSC2

PSC2

LAN-Q

446.2mm

132.

4m

m

FAN

Figure 76 Shelf dimension and shelf partitioning

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2.4 Unit front view

Figure 77 ESC-LC front view

Figure 78 LAN-Q board front view

Figure 79 PSC2 board front view

Figure 80 FAN board front view

Figure 81 FAN-CO board example

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Figure 82 OSC board front view

Figure 83 OMSP board front view

Figure 84 WLA3C board front view

Figure 85 WLA3COP board front view

Figure 86 OCC10-NA board front view

Figure 87 2XGE-FC board front view

Figure 88 C-OAD-E-U-1-6161-S board front view

Figure 89 C-OAD2-E-U-4-55575961-S board front view

Figure 90 C-MDX-E-U-S board front view

Figure 91 C-4xANY board front view

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Figure 92 HK board front view

Figure 93 RAI board front view

Figure 94 I-LINK-S board front view

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2.5 Power consumption and weight 2.5.1 Maximum power consumption and weight of the boards and units

Table 22 Maximum power consumption of the units Unit Maximum Power Consumption (W) Weight Indication (kg)

ESC-LC 10 0.85 LAN-Q 2.4 0.13

PSC 0.4 + Psec (*) 0.28 PSC2 1.4 0.30 FAN 14 0.33

FAN-CO 20 2.1 (Fan module +filter) WLA3C/WLA3COP 19.7 0.73/0.74

OCC10-NA 22.65 0.97 OCC10-EC 20.9 (with XFP) 0.87 (without XFP) 2XGE-FC 21.5 0.91

OSC 4 0.2 OMSP 4 0.3

HK 2.5 0.13 RAI 2 0.12

OAD/MDX 3 1.2 I-LINK-S 2.8 0.6

C-4xANY without drawers C-4xANY with 4 drawers

Drawer

20 32

3(each)

1.25 1.65

0.1(each) (*) For each PSC board, Psec = 1/2_(Pshelf 5V + Pshelf 3.3V)_(1-0.85). Pshelf 5V is the power consumption of the 5V feed, Pshelf 3.3V is the power consumption of the 3.3V. 2.5.2 Maximum power consumption of the equipment The following table gives an estimation of maximum power consumption of the 1692MSE for different typical configuration (just for examples).

Table 23 Estimated maximum power consumption of the equipment Item Number of Units Power Dissipation Per Item (w)

Configuration 1: 8 lambda with WLA3C in one compact shelf ESC-LC 1 10 LAN-Q 1 2.4

FAN 1 14 PSC2 2 1.4

C-MDX2-E-U-S 1 3 WLA3C 4 19.7

OSC 1 4 OMSP 1 4

Total Power Consumption 119W Configuration 2: 8 lambda with mixed 4xANY cards with 4 cartridges and WLA3C in CO shelf

ESC-LC 1 10 LAN-Q 1 2.4

FAN-CO 1 20 PSC 2 0.4 + Psec

C-MDX2-E-U-S 1 3

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C-4xANY 2 32 WLA3C 3 19.7

OSC 1 4 OMSP 1 4

Total Power Consumption 171.5W 2.6 FIT of 1692 MSE The following table lists the FIT of some units used in 1692MSE.

Table 24 FIT of 1692 MSE Unit FIT Unit FIT Unit FIT L1.1 351 C-4xANY 5868 C-OAD2-E-U-1-XX-S 491

L1.2_DDM 356 HF_1310 1350 C-OAD-U-2-XXXX 307 L4.2_DDM 356 SDH_1310 1050 C-OAD-E-U-2-XXXX-S 387

2M 107 LF_1310 1070 C-OAD2-U-2-XXXX 456 S1.1* 232 HF_850 800 C-OAD2-E-U-2-XXXX-S 537 S16.1* 351 LF_850 528 C-OAD2-U-4-XXXX 547 L16.1 351 WLA3C 2291 C-OAD2-E-U-4-XXXX-S 627 L16.2 356 WLA3COP 2306 C-OAD-B-1-XX 257 S4.1* 232 OCC10-EC 2502 C-OAD-B-1-XX-S 350 I16* 107 2XGE-FC 2292 ESC-LC 3219

GbE_SX* 61 C-MDX-U 387 LAN-Q 1050 GbE_LX* 107 C-MDX-E-U-S 427 PSC 1300

GbE_ZX_DDM 356 C-MDX-B 299 PSC2 1320 2FC SX_DDM 75 C-MDX-B-S 343 HK 1500 2FC LX_DDM 75 C-MDX2-U 480 RAI 1100

PIN* 313 C-MDX2-E-U-S 510 I-LINK-S 1170 APD* 275 C-MDX2-E-1-S 325 OMSP 500 XFP 754 C-MDX2-E-2-XX-S 375 OSC 449 - - C-OAD-U-1-XX 262 FAN-CO 6504 - - C-OAD-E-U-1-XX-S 342 FAN 2166 - - C-OAD2-U-1-XX 406 - -

* It includes two types of SFPs: with or without DDM function. N.B. The FIT of WLA only includes one channel in the WLA board, but the one of WLA-P includes

both channels of the board. N.B. The above FIT values are deduced from the corresponding MTBF values. N.B. 4 main contribution are not taken into account in the FIT calculation: 1) Mechanical damage These failures could be caused for example by poor handling, wrong packaging or incorrect transportation. 2) Problems of diagnostic leading to NFF (No Failure Found) A certain number or units returned to Alcatel have been declared in failure after an error of diagnostic. These units are not in failure and are declared NFF after the reparation process. From our experience of major networks, this NFF rate is generally around 20% of returns. A higher NFF rate would mean that the diagnostic process has to be revised. 3) FIT values do not apply to Installation/Commissioning failures and to the first months of the network operation.During this period, failures (reported as “Early Life Failures” or “Infant Mortality”)

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happen at higher rates than calculated FITs, due either to incorrect installation or to the presence of weak components. It is reasonable to assume that during the first 6 months of operation, the observed failure rate can be up to twice the predicted value 4) FITs do not take into account punctual defects that cannot be predicted, like a wrong component lot/batch coming from our suppliers manufacturing process. 2.7 Equipment connections The external connections of the 1692MSE may be divided into the following categories: Optical Management Power supply

2.7.1 Optical connections In 1692MSE, two kinds of optical connectors are used: LC and MU.

Table 25 Optical connections in 1692MSE Unit LC MU Direction

WLA/2XGE-FC √ Inclined OSC √ Straight

MDX/OAD √ Inclined OMSP √ Straight

OCC10-NA √ Inclined OCC10-EC √ √ Inclined

a) WLA/2XGE-FC board

Figure 95 LC optical connectors

b) OSC board

Figure 96 LC optical connectors

c) OMSP board

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Figure 97 MU optical connectors

d) OAD and MDX board


e) OCC10-NA board


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2.7.2 Management connections 2.7.2.1 Housekeeping The housekeeping alarm signals are available on the front panel connector of the HK board. It is a 25 pin SUB-D Female connector.

Table 26 Connector access Number Name Description Connector

1 Common out Common Output

2 OUT1 Output

3 OUT2 Output

4 OUT3 Output

5 OUT4 Output

6 OUT9_1 Output

7 OUT9_2 Output

8 OUT9_3 Output

9 IN1 Input

10 IN2 Input

11 IN3 Input

12 IN4 Input

13 GNDP Input Signal Ground

14 Common out Common Output

15 OUT8 Output

16 OUT7 Output

17 OUT6 Output

18 OUT5 Output

19 IN9_1 Input

20 IN9_2 Input

21 IN8 Input

22 IN7 Input

23 IN6 Input

24 IN5 Input

25 GNDP Input Signal Ground

26 GNDM Mechanical Ground

27 GNDM Mechanical Ground

N.B. The 25 pin SUB-D connector is connected to GNDM through the 2 screw holes called pin 26

and pin 27.

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2.7.2.2 Rack Alarm Interfaces The rack alarm interface signals are available on the two front panel connectors of the RAI board. The two interfaces are: A 9 pins SUB-D female connector, which provides the interface between the master shelf and the

TRU (or PDU). A 6 pins connector, which provides the interface between two shelves.

Master shelf - TRU interface

Table 27 Pins SUB-D connect access Number Name Description Connector

1 CRI _AL_UP Critical (or Urgent) Alarm Output

2 GNDP Common Inputs

3 MAJ_AL_UP Major (or Non-Urgent) Alarm Output

4 RACK_AL_UP Rack (or Up) Alarm Output

5 MIN_AL_UP Minor (or Non-Urgent) Alarm Output

6 AL_IN_COM Common Outputs

7 PRM_AL_UP Primary Alarm Input

8 SEC_AL_UP Secondary Alarm Input

9 FAN-AL_UP Fan Alarm Input

Master shelf - shelf interface

Table 28 Pins RJ11 connector access Number Name Description Connector

1 CRI_AL_DOWN Critical (or Urgent) Alarm Input

2 MAJ_AL_DOWN Major (or Non-Urgent) Alarm Input

3 RACK_AL_DOWN Rack (or Up) Alarm Input

4 MIN_AL_DOWN Minor (or Non-Urgent) Alarm Input

5 AL_IN_COM Common Inputs

6 AL_IN_COM Common Inputs

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2.7.2.3 LAN accesses The LAN-Q board can be accessed by the RJ-45 connector on its front panel.

Table 29 RJ 45 connector access Number Name Description Connector

1 RX-P Reception-Positive

2 RX-N Reception-Negative

3 TX-P Transmission-Positive

4 Not Used -

5 Not Used -

6 TX-N Transmission-Negative

7 Not Used -

8 Not Used - 2.7.2.4 “F” interface At the ESC-LC front panel, a 9-pin SUB-D female connector provides an access to an ”F” interface. It allows connection to a Craft Terminal.


1 F_DCD F_DATA Carrier Detect

2 F_RXD F_Received Data

3 F_TXD F_Transmitted Data

4 F_DTR F_Data Terminal Ready

5 GND Signal Ground

6 F_DSR F_Data Set Ready

7 F_RTS F_Request To Send

8 F_CTS F_Clear To Send

9 Not Used -

2.7.2.5 “DBG” interface connector The 8-pin RJ45 connector on the front-panel of the ESC-LC board gives an access to the “DBG” interface.


1 Not Used -

2 Not Used -

3 D_TXD SC/EC DBG_Transmit Data

4 Not Used -

5 D_RXD SC/EC DBG_Receive Data

6 Not Used -

7 D_DTR SC/EC DBG_Data Terminal Ready

8 GND Ground

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2.7.2.6 RS485 connector There are three RS485 connectors (I-LINK interface) on the front panel of the ESC-LC board and one connector on the front panel of the I-LINK-S board.


1 SPI_MODE_SLAVE_DP SPI_MODE Positive 2 SPI_CLK_SLAVE_DP SPI_CLK Positive 3 SPI_TXD_SLAVE_DP SPI_TXD Positive 4 SPI_RXD_SLAVE_DP SPI_RXD Positive 5 CARD_PRES_SLAVE_DP CARD_PRES Positive 6 Not Used - 7 Not Used - 8 Not Used - 9 SPI_MODE_SLAVE_DN SPI_MODE Negative

10 SPI_CLK_SLAVE_DN SPI_CLK Negative 11 SPI_TXD_SLAVE_DN SPI_TXD Negative 12 SPI_RXD_SLAVE_DN SPI_RXD Negative 13 CARD_PRES_SLAVE_DN CARD_PRES Negative 14 ID4 Slot ID4 15 ID5 Slot ID5

2.7.3 Power supply connections The power supply voltage is distributed to the shelves on a 3 pin SUB-D connector, on the front panel of each PSC/PSC2/PSC3.

Table 33 Power supply 1 and 2: connector access Number Name Connector

1 (Male) + PVBATT

2 (Female) GND

3 (Male) - NVBATT

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3 UNITS DESCRIPTION This chapter describes the cards and units of the 1692MSE Release 3.2A. It provides for each card: Functional diagram and description Interface definitions Front panel description

3.1 Wavelength Adapter There are 2 kinds of wavelength adapters in this release: WLA3C: WLA3 without O-SNCP WLA3COP: WLA3 with O-SNCP

BW Rx

BW Tx

BW Rx

BW Tx

8X8MATRIX CWDM

Tx

CWDMRx

CWDMTx

CWDMRx

Alarm&ControlUnit

User Input

UserOutput

User Input

UserOutput

CWDMInput

CWDM Output

CWDMInput

CWDM Output

SDH and GbEperformance monitoring

Figure 100 Block diagram of WLA3C boards

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BW Rx

BW Tx

BW Rx

BW Tx

8X8MATRIX CWDM

Tx

CWDMRx

CWDMTx

CWDMRx

Alarm&ControlUnit

User Input

UserOutput

User Input

UserOutput

CWDMInput

CWDM Output

CWDMInput

CWDM Output

O-SNCPmodule

User Input

User Output

SDH and GbEperformance monitoring

Figure 101 Block diagram of WLA3COP boards

3.1.1 Description The WLA unit is a bidirectional multi-rate interface. The block-diagrams are shown on the above figures. The electrical matrix provides some flexibility and additives features: Add and Drop Client (local) loopback Line (remote) loopback Local-Remote loopback E-SNCP

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The alarm and control unit ensures the following functions: Matrix management interface Clock and Data Recovery (CDR) units management Alarms collection and interface to the craft terminal via the shelf controller Optical Channel protection control (configuration, switch decision unit) if an Optical-SNCP

(O-SNCP): user Tx ON/OFF control Optical module information collection Performance monitoring result collection

The SDH and GbE performance-monitoring units complete the following functions: SDH B1 performance monitoring SDH J0 performance monitoring Gigabit Ethernet performance monitoring

3.1.2 Optical interfaces 3.1.2.1 B&W module The optical performances for the SFP transceivers are as follows. In this release, these SFP transceivers can be used in the user side and line side of WLA board:

Table 34 Optical parameters for SFP transceivers used in the user side

Item Output (dBm,EOL)

Sensitivity (dBm,EOL)

Overload (dBm,EOL)

Fiber type

S1.1 -15~-8 -29 -8 9/125µm SMF

S4.1 -15~-8 -29 -8 9/125µm SMF

S16.1 -5~0 -19 0 9/125µm SMF

I16 -10~-3 -19 -3 9/125µm SMF

L16.1 -2~+2 -28 -8 9/125µm SMF

L16.2 -2~+2 -29 -8 9/125µm SMF

GbE_SX -9.5~-4 -18 0 50/62.5/125µm MMF

GbE_LX -11~-3 -20 -3 9/125µm SMF

S1.1_DDM -15~-8 -29 -8 9/125µm SMF

L1.2_DDM -5~0 -34 -10 9/125µm SMF

S4.1_DDM -15~-8 -29 -8 9/125µm SMF

L4.2_DDM -3~+2 -28 -8 9/125µm SMF

I16_DDM -10~-3 -19 -3 9/125µm SMF

S16.1_DDM -5~0 -19 0 9/125µm SMF

GbE_SX_DDM -9.5~-4 -18 0 50/62.5/125µm MMF

GbE_LX_DDM -11~-3 -20 -3 9/125µm SMF

GbE_ZX_DDM 0~+5 -24 0 9/125µm SMF

2FC_SX_DDM -10~-3 2FC: -16; FC: -18 0 50/62.5/125µm MMF

2FC_LX_DDM -9.5~-3 -21 -3 9/125µm SMF 3.1.2.2 Colored modules In this release, there are 2 kinds of colored SFP that can be selected to meet the requirement of each application. They are SILVER, BRONZE SFPs.

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The two modules are: SFP with PIN receiver, for distances up to 40 Km, an operating bitrate from 125Mbps to 2.7Gbps

(called hereafter the BRONZE version). “Standard” SFP with APD receiver, for distances up to 70 Km, an operating bitrate from 125Mbps

to 2.7Gbps (called hereafter the SILVER version).

Table 35 Optical parameters for SFP transceivers used in the line side Parameter Unit Symbol Bronze Silver Note

Min 0 0 - Type - - -

Output Optical Power (EOL) dBm POUT

Max +5 +5 - SMSR dB SMSR Min 30 30 -

TX Side

Extinction Ratio dB ER Min 8.2 8.2 - Average Rx

Sensitivity@OC-48 dBm RSENS Max -18 -28 1 RX Side

Maximum Input Power dBm PMAX Min -3 -9 -

N.B. For the BRONZE, SLIVER SFPs, the sensitivity is measured with a PRBS 223-1 test pattern, @2.5Gb/s, BER<10-12, EOL.

N.B. For the BRONZE, SILVER SFPs, all parameters at lower supported bitrates are better than those at STM-16.For all these SFPs, all parameters are guaranteed under all operating conditions, EOL.

The colored SFP also can be configured on the user side of WLA3C boards for broadcast application. The colored SFP modules with DDM function have the same optical characteristic as the colored SFP module without DDM function. 3.1.3 WLA configurations 3.1.3.1 Default configuration (add and drop configuration) This configuration applies when a WLA3C board is used as a stand alone Add and Drop unit. And this configuration is the default configuration of WLA3C. The traffic received from a CWDM receiver is dropped on the user network, i.e. sent to a B&W transmitter. Meanwhile the traffic received from the B&W receiver is added on to the CWDM line via the CWDM transmitter. The 8x8 matrix is configured as follows (example with channel 1):

Table 36 Alarms usage in add and drop configuration Alarms

WDM Rx1 User Tx1 User Rx 1 WDM Tx1 Consecutive Action

ILOS SD of the WDM Tx1 ILOS SD of the User Tx1

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BWRx1

8 8Matrix

CWDMoutput

BWTx1

userinput

BWRx2

BWTx2

CWDMTx1

CWDMRx1

CWDMTx2

CWDMRx2

userinput

useroutput

useroutput

CWDMinput

CWDMoutput

CWDMinput

X

Figure 102 Add and drop matrix configuration

3.1.3.2 Local loopback configuration This configuration is used for testing purposes on the user side. The B&W transponder on the WLA board is configured as a loopback. In this configuration, the 8x8 matrix configuration is shown in the next figure. Traffic received on a B&W receiver is sent to the corresponding B&W transmitter to be tested. In this way, users can receive traffic sent by themselves. The local loopback configuration is not allowed in the E-SNCP mode.

BWRx1

8 8Matrix

CWDMoutput

BWTx1

userinput

CWDMTx1

CWDMRx1

useroutput

CWDMinput

BWRx2

BWTx2

CWDMTx2

CWDMRx2

userinput

useroutput

CWDMoutput

CWDMinput

X

Figure 103 Local loopback matrix configuration

3.1.3.3 Remote loopback configuration This configuration is used for testing purposes on the CWDM Side and the regenerator application. In this configuration, the 8x8 matrix configuration is shown in the next figure (example with channel 1). Traffic received from the CWDM receiver is sent to the corresponding CWDM transmitter to be tested.

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BWRx1

8 8Matrix

CWDMoutput

BWTx1

userinput

CWDMTx1

CWDMRx1

useroutput

CWDMinput

BWRx2

BWTx2

CWDMTx2

CWDMRx2

userinput

useroutput

CWDMoutput

CWDMinput

X

Figure 104 Remote loopback matrix configuration

3.1.3.4 Local-remote loopback This configuration is used for testing purposes on the user and CWDM side simultaneously. In this configuration, the 8x8 matrix configuration is shown in the next figure (example with channel 1). Traffic received from the receiver is sent to the corresponding transmitter to be tested.

BWRx1

8 8Matrix

CWDMoutput

BWTx1

userinput

CWDMTx1

CWDMRx1

useroutput

CWDMinput

BWRx2

BWTx2

CWDMTx2

CWDMRx2

userinput

useroutput

CWDMoutput

CWDMinput

X

Figure 105 Local-remote loopback matrix configuration

3.1.3.5 E-SNCP The WLA3C boards perform the E-SNCP function. They accept two kinds of operation mode: force and auto. The E-SNCP protection is achieved through a technique called “Parallel Transmit And Best One Receive” strategy on an electrical level. At the transmit side, the signal is broadcast on the two arms of the ring and the available signal is selected at the receive side. The routing is done electrically in the 8x8 matrix, see next figure. In this kind of application, only one user channel, such as channel 1, is

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equipped.

Table 37 Alarms usage in the auto E-SNCP configuration Alarms

Direction Channel WDM Rx User Tx User Rx WDM Tx Consecutive Action

West to East 1 ILOS SD of WDM TX1 and WDM Tx2 1 ILOS 2

Switch WDM RX2 to User TX1

1 2 ILOS

Switch WDM RX1 to User TX1

1 ILOS

East to West

2 ILOS No action

BWRx1

8 8Matrix

CWDMoutput

BWTx1

user input

CWDMRx1

CWDMTx1

CWDMTx2

CWDMRx2

user output

CWDMinput

CWDMoutput

CWDMinput

X

Figure 106 Electrical SNCP matrix configuration

3.1.3.6 O-SNCP The WLA3COP boards achieve the O-SNCP function. They accept 2 kinds of operation mode: force and auto. The auto O-SNCP protection is achieved through a technique called “Parallel Transmit And Best One Receive” strategy on an optical level. At the transmit side, the signal is broadcast on the two arms of the ring and the available signal is selected at the receive side. The splitter and the coupler are used to route optical signals in this application, see next figure.

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Table 38 Alarms usage in the auto O-SNCP configuration Alarms

Direction Channel WDM Rx User Tx User Rx WDM Tx Consecutive Action

1 ILOS SD of WDM TX1 West to East 2 ILOS SD of WDM TX2 1 ILOS 2

SD of User TX1 and Enable User TX2

1 2 ILOS

SD of User TX2 and Enable User TX1

1 ILOS

East to West

2 ILOS No Action

BWRx1

8 8Matrix

CWDMoutput

BWTx1

userinput

BWRx2

BWTx2

CWDMTx1

CWDMRx1

CWDMTx2

CWDMRx2

useroutput

CWDMinput

CWDMoutput

CWDMinput

Splitter

Coupler

X

Figure 107 Optical SNCP matrix configuration

3.1.3.7 B-SNCP B-SNCP (Broadcast Sub-Network Connection Protection) is the protection for broadcast services, which is only supported by WLA3C. Signals from the WDM are input in CWDM port 1 and broadcast to user port 1 and two WDM ports. The routing is done electrically in the 8x8 matrix.

WLA3C accepts 2 kinds of operation mode: force and auto.

In force mode, the network management can command the Matrix to switch the CWDM RX1 or CWDM RX2 to connect user TX1 unconditionally. In auto mode, WLA3C can command the Matrix to switch the CWDM RX1 or CWDM RX2 to user TX1 and WDM TX1/TX2 (see table below for details).

Table 39 Alarms usage in the auto B-SNCP configuration CWDMRX1_LOS CWDMRX2_LOS Action

1 1 Shut down CWDM TX1 TX2 and user TX1

1 0 Switch CWDM RX2 to user TX1, and shut down CWDM TX1 TX2

0 1 Switch CWDM RX1 to user TX1

0 0 No Action

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SDHMONI 1

GEMONI 2

GEMONI 1

SDHMONI 2

CDR4

CWDMRX 2

CWDMTX 2

CDR1USER TX

1

USER RX1 CDR3

CWDMRX 1

CWDMTX 1

8X8 MATRIX

Out2

In 1

In 0

Out3

In 2

Out1

Out7 Out5 Out6 Out4

CDR2

In 4

Out 0

Main

Spare

Figure 108 B-SNCP matrix configuration in one WLA3C

3.1.4 Performance monitoring In WLA3C and WLA3COP boards, the following performances can be monitored: SDH signal

For the SDH signal, the following performances will be monitored: B1 errors monitoring J0 monitoring

Gigabit Ethernet signal

For the Gigabit Ethernet signal, the following performances will be monitored: TRCO (Total Received Correct Octets) TRCF (Total Received Correct Frames) TRCF_Unicast (Total Received Correct Frames Unicast) TRCF_Multicast (Total Received Correct Frames Multicast) TRCF_Broadcast (Total Received Correct Frames Broadcast) TRSEF (Total Received Service Error frames)

In R3.2A, performance monitoring of SDH and GbE signal can be set on the two channels of one board at the same time.

ED 01 RL

3AL 97869 AAAA 125/259

3.1.5 Front panel description

PWR

CH1

CH2

OOS

W1

W1

U1

U1

W2

W2

U2

U2

Out of Service LED

ExtractionHandle

ExtractionHandle

CWDM Tx2CWDM Rx2

CWDM Tx1CWDM Rx1

BW Tx2BW Rx2

BW Tx1BW Rx1

Optical Safety

Label

Electrostatic DischargeLabel

Power Failure LED

Channel1 Abnormal LEDChannel2 Abnormal LEDHardware Failure LED

Figure 109 Front panel of WLA3C board

ED 01 RL

3AL 97869 AAAA 126/259

PWR

CH1

CH2

OOS

W1

W1

U1

U1

W2

W2

U2

U2

Out of Service LED

ExtractionHandle

ExtractionHandle

S1

C1

S2

C2

CS

CWDM Tx1CWDM Rx1

BW Tx1BW Rx1

BW Tx2BW Rx2

CWDM Tx2CWDM Rx2

SPID O1COUP I1

SPID O2COUP I2

USER OUSER I

Optical Safety

Label


Power Failure LED

Channel1 Abnormal LEDChannel2 Abnormal LEDHardware Failure LED

Figure 110 Front panel of WLA3COP board

ED 01 RL

3AL 97869 AAAA 127/259

3.1.5.1 Front panel wiring

Table 40 Front panel wiring of WLA3C board Name Signal

B&W Rx1 User Reception: client input signal (channel 1, from client) B&W Tx1 User Transmission: client output signal (channel 1, to client) B&W Rx2 User Reception: client input signal (channel 2, from client) B&W Tx2 User Transmission: client output signal (channel 2, to client) WDM Rx1 WDM Reception: WDM input signal (channel 1, from C-MDX or C-OAD board) WDM Tx1 WDM Transmission: WDM output signal (channel 1, to C-MDX or C-OAD board) WDM Rx2 WDM Reception: WDM input signal (channel 2, from C-MDX or C-OAD board) WDM Tx2 WDM Transmission: WDM output signal (channel 2, to C-MDX or C-OAD board)

Table 41 Front panel wiring of WLA3COP board Name Signal

B&W Rx1 B&W signal Reception: (channel 1) B&W Tx1 B&W signal Transmission: (channel 1) B&W Rx2 B&W signal Reception: (channel 2) B&W Tx2 B&W signal Transmission: (channel 2) WDM Rx1 WDM Reception: WDM input signal (channel 1, from C-MDX or C-OAD board) WDM Tx1 WDM Transmission: WDM output signal (channel 1, to C-MDX or C-OAD board) WDM Rx2 WDM Reception: WDM input signal (channel 2, from C-MDX or C-OAD board) WDM Tx2 WDM Transmission: WDM output signal (channel 2, to C-MDX or C-OAD board) COUP I1 Couple Input: (channel 1, from B&W Tx1) SPID O1 Splitter Output: (channel1, to B&W Rx1) COUP I2 Couple Input: (channel 2, from B&W Tx2) SPID O2 Splitter Output: (channel2, to B&W Rx2) USER I User Reception: client input signal (from client to Splitter in board) USER O User Transmission: client output signal (from Couple in board to client) 3.1.5.2 LEDs meaning

Table 42 Meaning of WLA board front panel LEDs Name LED Color Meaning PWR Green ON when the power supply is in standard range. OOS Yellow LED is on when the board is un-configured or mismatching.

CH1 Yellow

Channel1 Abnormal: problem on the channel1. LED is on when: Rx alarm, Tx alarm or Bitrate_Threshold alarm Unit type mismatch Not configured in software

CH2 Yellow

Channel1 Abnormal: problem on the channel2. LED is on when: Rx alarm, Tx alarm or Bitrate_Threshold alarm Unit type mismatch Not configured in software

Red Green

Orange

LED is Red before software configuring is finished, and becomes Green when board is configured correctly. When the board is downloading FPGA or after pressing LAT button, LED will be Orange.

ED 01 RL

3AL 97869 AAAA 128/259

3.2 10 Gbps Optical Channel Card (OCC10) The following OCC10 boards are used in R3.2A release: OCC10-NA-1530 (195.900) OCC10-NA-1550 (193.000) OCC10-NA-1550 (193.100) OCC10-NA-1550 (193.200) OCC10-NA-1550 (193.300) OCC10-EC-1530 OCC10-EC-1550

3.2.1 Description The OCC10 unit transponder is a bidirectional multi–clock interface for 10 Gbps native signals. It is hardware compliant with ITU-T G.709 Rec. This transponder can be provisioned to accept any digital signal at the nominal bit rate of 9.953 Gbps (STM-64/OC-192/10 GBE WAN) 10.3125 (GBE LAN).

To/from future To/from

twin OCC10 To/from future

GREYHOND10G 8x8 MATRIX

USER RX CDR

8102CDR 8102

USER TX

FRAMER 8512

WDM RX

FRAMER 8512

WDM TX

ALARM & CONTROL

UNIT (FPGA ABBESSES)

SPIinterface

Remote inventory EEPROM

Additional information EEPROM

BATT A + Power

conversion block

BATT A - BATT B + BATT B -


+3.6 VS

JTAG

To/from future matrix copy 0 matrix copy 1


USER RX

CDR USER TX

FRAMER WDM RX

FRAMER WDM TX

ALARM & CONTROL

UNIT (FPGA) ABBESSES

SPI interface

Remote inventory EEPROM

Additional information EEPROM

BATT A

+ Power conversion

block

BATT A - BATT B

+ BATT B -

10G 8x8

MATRIX

+3.6 VS

JTAG

CDR

Figure 111 Block diagram of OCC10 board

ED 01 RL

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OCC10-NA board is used as CWDM 10G transponder. Only 2 CWDM channels are available: 1530nm and 1550 nm. For CWDM 1530nm channel, at DWDM channel 195.9THz is used for OCC10-NA. For CWDM 1550nm channel, any one of the 4 DWDM channels can be selected: 193.0THz, 193.1THz, 193.2THz and 193.3THz. And in 1692MSE R3.2A, OCC10-NA is configured with fixed B&W and colored module. The DDM and Optical Measurement function are supported on line side. For OCC10-EC board, there are also 2 channels for CWDM application: 1530nm and 1550nm, which are compliant with G.694.2. With respect to OCC10-NA, XFP at user side can be plugged on the front panel of OCC10-EC. And the VCC & XFP temperature measurements are not supported. 3.2.2 OCC10 configuration There are only 2 channels available at CWDM grids for OCC10-NA/EC: 1530nm and 1550nm. Due to the limitation of OADM wavelength plan, OCC10-NA/EC cannot support the following applications: Unidirectional 2ch 10G OADM Unidirectional 4ch 10G OADM Bidirectional 1ch 10G OADM 2ch 10G CPE

N.B. For unidirectional 2ch and 4ch OADM application, only one 10G service transmission can be supported by OCC10. The following matrix configurations are supported in 1692MSE R3.2A: Add/Drop, Client loopback, Line loopback. And Client loopback and Line loopback can’t be configured simultaneously.


USER RX

CDR USER

TX

FRAMER WDM RX

FRAMER WDM TX

ALARM & CONTROL UNIT

(FPGA ABBESSES)

8x8 MATRIX

JTAG

CDR

Figure 112 Add/Drop configuration of OCC10 board

ED 01 RL

3AL 97869 AAAA 130/259


USER RX

CDR USER

TX

FRAMER WDM RX

FRAMER WDM TX


(FPGA ABBESSES)

8x8 MATRIX

JTAG

CDR

Figure 113 Client loopback configuration of OCC10 board


USER RX

CDR USER

TX

FRAMER WDM RX

FRAMER WDM TX


(FPGA ABBESSES)

8x8 MATRIX

JTAG

CDR

Figure 114 Line loopback configuration of OCC10 board

ED 01 RL

3AL 97869 AAAA 131/259

3.2.3 Optical characteristics

Table 43 OCC10-NA optical characteristics User side

Item Value Unit User Tx output power -6~-1 dBm User Rx sensitivity including path penalty @1E-12 <-14 dBm User Rx overload at 1E-12 >-1 dBm Target Transmission Distance 20 km

WDM side Item Value Unit

Tx output power +1.5～+7 dBm Rx sensitivity including path penalty without Noise @1E-12, FEC <-23 dBm

Rx overload at 1E-12 >-9 dBm Dispersion Tolerance 0~1600 ps/nm

Table 44 OCC10-EC optical characteristics

User side Item Value Unit

User Tx output power -6~-1 dBm User Rx sensitivity including path penalty @1E-12 <-14 dBm User Rx overload at 1E-12 >-1 dBm Target Transmission Distance 20 km

WDM side Item Value Unit

Tx output power +3～+7 dBm Rx sensitivity including path penalty without Noise @1E-12, FEC <-23 dBm

Rx overload at 1E-12 >-9 dBm Dispersion Tolerance 0~1600 ps/nm

ED 01 RL

3AL 97869 AAAA 132/259


Hardware Failure LED

PWR

MF

RXA

TXA

OOS

Power Failure LEDOut of Service LEDAbnormal Rx LED

Abnormal Tx LED

APSD Restart button

U

W

User RxUser Tx

WDM RxWDM Tx

P

N

P

N

10Gbps Rx

10Gbps Tx

Optical Safety Label

Extraction Handle

Extraction Handle

Not used

Not used

OCC10-NA

Not used


PWR

MF

RXA

TXA

OOS

Power Failure LEDOut of Service LEDAbnormal Rx LED

Abnormal Tx LED

APSD Restart button

U

W

User TxUser Rx

WDM RxWDM Tx

P

N

P

N

10Gbps Rx

10Gbps Tx


Extraction Handle

Extraction Handle

Not used

Not used

OCC10-EC

Not used

Figure 115 Front panel of OCC10 board

ED 01 RL

3AL 97869 AAAA 133/259

Table 45 Front panel wiring of OCC10 board Name Optical Signal

User Rx User Reception: client input signal (from client) User Tx User Transmission: client output signal (to client) WDM Rx WDM Reception: WDM input signal from MDX/OAD WDM Tx WDM Transmission: WDM output signal to MDX/OAD LEDs signification

Table 46 Meaning of OCC10 board front panel LEDs Name LED Color Meaning POWER Green Managed by HW. ON when the board is plugged and no HWF OOS Yellow LED ON when the board plugged but not configured by the SW RXA Yellow RX Abnormal: problem on the Egress side. Managed by the SW. TXA Yellow TX abnormal: problem on the ingress side. Managed by the SW.

HWF Red

Green Orange

Hardware Failure. Managed by the SW. LED is Red before software configuring is finished and becomes Green when board is configured correctly. After pressing LAT button, it turns Orange.

ED 01 RL

3AL 97869 AAAA 134/259

3.3 2XGE-FC Unit 2XGE-FC board is one slot wide board implement GbE aggregation with standard GFP-T encapsulation. See the following.

Mapper+

Framer

1

2

2

1

Not used

Client Line

Figure 116 Block diagram of 2XGE-FC board

3.3.1 Description In R3.2A, it can support two clients aggregation/extraction into/from 1 STM-16/OC-48 Frame. At client side, there are four client interfaces. Only two of them are available in this release. GE can be supported in R3.2A. 3.3.2 Optical interfaces In this release, the following SFPs can be used in the subslots of 2XGE-FC board. For client side: GbE_SX, GbE_LX, GbE_SX_DDM, GbE_LX_DDM and GbE_ZX_DDM. For line side: I16, S16.1, L16.1, L16.2, I16_DDM, S16.1_DDM, PIN and APD (with or without DDM). Please refer to 3.1.2 for optical parameters of SFPs. 3.3.3 2XGE-FC configuration From client Rx to line Tx side, after O-E converting, the two serial signals are sent to the mapper. After internal processing in the mapper, the client service are encapsulated into GFP frame and framed into STM-16/OC-48 frame. The STM-16/OC-48 signal is sent to the two line side transceivers and muxed into serial signals. From line Rx to client Tx side, the signal flow is reverse and E-SNCP is configured to protect the line port. The SFPs plugged on CWDM1 and CWDM2 are set as main SFP and slave SFP respectively. As above said, the serial Tx data is transmitted to both CWDM sides via CDR. Received signal from two SFP line side can be selected automatically according to the received signals status. Rx_LOS or SFP missing is the switching criteria. The protection is non-revertive. If Rx_LOS or LOF occurs on the local client Rx, the opposite client Tx of 2XGE-FC will shut down automatically. See the following.

ED 01 RL

3AL 97869 AAAA 135/259

Mapper+

Framer

1

2

2

1

2

1Mapper

+Framer

1

2

Not used Not used

Client ClientLineLine

Local Remote

LOS/ LOFLaser shut

downRx

Tx Rx

Tx

Figure 117 Communication between two 2XGE-FC board (example)

Loopback configuration on client side and line side are supported on 2XGE-FC board. They can be set at the same time.

Client1

Client2

Not used

Line1

Line2

Mapper+Framer

Figure 118 Local loopback configuration of 2XGE-FC board

Client1

Client2

Not used

Line1

Line2

Mapper + Framer

Figure 119 Remote loopback configuration of 2XGE-FC board

The default laser state of SFP on line side is on. Please pay attention to that the laser status of user side should be set as forced on when local loopback configuration. It is suggested to perform remote loopback on one of the line sides because of the E-SNCP. In R3.2A, performance monitoring is not supported on 2XGE-FC.

ED 01 RL

3AL 97869 AAAA 136/259


U3

U1

U4

U2

ExtractionHandle

ExtractionHandle

WW

-P

CWDM Tx1CWDM Rx1

BW Tx1BW Rx1

BW Tx2BW Rx2

CWDM Tx2CWDM Rx2



DBG Interface RJ45Not Used

RST RESET Push ButtonNot Used

BW Tx3

BW Tx4BW Rx4

BW Rx3

Figure 120 Front panel of 2XGE-FC board

ED 01 RL

3AL 97869 AAAA 137/259

Table 47 Front panel wiring of 2XGE-FC board Name Optical Signal

B&W Rx1 B&W signal Reception: (channel 1) B&W Tx1 B&W signal Transmission: (channel 1) B&W Rx2 B&W signal Reception: (channel 2) B&W Tx2 B&W signal Transmission: (channel 2) B&W Rx3 Not used B&W Tx3 Not used B&W Rx4 Not used B&W Tx4 Not used WDM Rx1 WDM Reception: WDM input signal (channel 1, from C-MDX or C-OAD board) WDM Tx1 WDM Transmission: WDM output signal (channel 1, to C-MDX or C-OAD board) WDM Rx2 WDM Reception: WDM input signal (channel 2, from C-MDX or C-OAD board) WDM Tx2 WDM Transmission: WDM output signal (channel 2, to C-MDX or C-OAD board) LEDs signification

Table 48 Meaning of 2XGE-FC board front panel LEDs Name LED Color Meaning

Red Green

Orange

LED is Red before software configuring is finished, and becomes Green when board is configured correctly. When the board is downloading FPGA or after pressing LAT button, LED will be Orange.

ED 01 RL

3AL 97869 AAAA 138/259

3.4 MUX/DEMUX units (C-MDX) The following C-MDX boards are used: MUX/DMX with OSC for unidirectional system: C-MDX-E-U-S MUX/DMX without OSC for unidirectional system: C-MDX-U MUX/DMX with OSC for bi-directional system: C-MDX-B-S MUX/DMX without OSC for bi-directional system: C-MDX-B

3.4.1 C-MDX-E-U-S

Line Rxin

1310nmFilter

1310nmFilter

OSC Txin

OSC Rxout

Line Txout

1470

1490

1510

1530

1550

1570

1590

1610

1470

1490

1510

1530

1550

1570

1590

1610

MUX out

DEMUX in

MUX

DEMUX

Figure 121 C-MDX-E-U-S block diagram

ED 01 RL

3AL 97869 AAAA 139/259

3.4.1.1 Description a) MUX side The MUX component multiplexes 8 channels (CWDM grid) signals into an optical fiber. The 1310nm filter couples the MUX out signal and OSC signal into the line fiber. b) DEMUX side At the receive side, the 1310nm filter splits the line signal into two channel signals. One is sent to the OSC board, the other is demultiplexed into 8 channel signals by a DEMUX component. 3.4.1.2 Optical characteristics

Table 49 C-MDX-E-U-S optical characteristics MUX Side

Insertion Losses Value Unit OSC In (1310nm)->Line out (Max) 1 dB CH1 In ->LINE OUT (1470nm) (Max) 1.4 dB CH2 In ->LINE OUT (1490nm) (Max) 1.7 dB CH3 In ->LINE OUT (1510nm) (Max) 2.0 dB CH4 In ->LINE OUT (1530nm) (Max) 2.3 dB CH5 In ->LINE OUT (1550nm) (Max) 2.6 dB CH6 In ->LINE OUT (1570nm) (Max) 2.9 dB CH7 In ->LINE OUT (1590nm) (Max) 3.2 dB CH8 In ->LINE OUT (1610nm) (Max) 3.5 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

DEMUX Side Insertion Losses Value Unit

LINE IN->OSC Out (1310nm)(Max) 1 dB LINE IN->CH1 Out (1470nm) (Max) 1.4 dB LINE IN->CH2 Out (1490nm) (Max) 3.5 dB LINE IN->CH3 Out (1510nm) (Max) 3.2 dB LINE IN->CH4 Out (1530nm) (Max) 2.9 dB LINE IN->CH5 Out (1550nm) (Max) 2.6 dB LINE IN->CH6 Out (1570nm) (Max) 2.3 dB LINE IN->CH7 Out (1590nm) (Max) 2.0 dB LINE IN->CH8 Out (1610nm) (Max) 1.7 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

Fiber Specs Type

Fiber type 0.9/2mm SMF28 Connector type MU

Reflectance Value Unit All input ports (Max) -40 dB

ED 01 RL

3AL 97869 AAAA 140/259

3.4.1.3 Front panel description

ExtractionHandle

ExtractionHandle

s47

4951

535

557

5961

OSC Tx inOSC Rx out

Line Rx inLine Tx out

1470nm signal in1470nm signal out








Optical Safety

Label



Figure 122 Front panel of C-MDX-E-U-S board

ED 01 RL

3AL 97869 AAAA 141/259


Table 50 Front panel wiring of C-MDX-E-U-S board Name Signal

OSC Tx in Supervision transmission input signal (from OSC board) OSC Rx out Supervision reception output signal (to OSC board) Line Rx in Line Reception input signal (from line) Line Tx out Line Transmission output signal (to line) ## nm signal in WDM transmission input signal (from corresponding transponder) ## nm signal out WDM reception output signal (to corresponding transponder) N.B. ## means from 1470 to 1610. LEDs signification

Table 51 Meaning of C-MDX-E-U-S board front panel LEDs

Red Green

Orange

LED is Red before software configuring is finished and becomes Green when board is configured correctly. After pressing LAT button, it turns Orange.

ED 01 RL

3AL 97869 AAAA 142/259

3.4.2 C-MDX-U

Line Rxin

Line Txout

1470

1490

1510

1530

1550

1570

1590

1610

1470

1490

1510

1530

1550

1570

1590

1610

MUX

DEMUX

Figure 123 C-MDX-U block diagram

3.4.2.1 Description a) MUX side The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber. b) DEMUX side The DEMUX component demultiplexes the line signal into 8 channel signals.

ED 01 RL

3AL 97869 AAAA 143/259

3.4.2.2 Optical characteristics

Table 52 C-MDX-U optical characteristics MUX Side

Insertion Losses Value Unit CH1 In ->LINE OUT (1470nm) (Max) 0.9 dB CH2 In ->LINE OUT (1490nm) (Max) 1.2 dB CH3 In ->LINE OUT (1510nm) (Max) 1.5 dB CH4 In ->LINE OUT (1530nm) (Max) 1.8 dB CH5 In ->LINE OUT (1550nm) (Max) 2.1 dB CH6 In ->LINE OUT (1570nm) (Max) 2.4 dB CH7 In ->LINE OUT (1590nm) (Max) 2.7 dB CH8 In ->LINE OUT (1610nm) (Max) 3 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm


LINE IN->CH1 Out (1470nm) (Max) 0.9 dB LINE IN->CH2 Out (1490nm) (Max) 3 dB LINE IN->CH3 Out (1510nm) (Max) 2.7 dB LINE IN->CH4 Out (1530nm) (Max) 2.4 dB LINE IN->CH5 Out (1550nm) (Max) 2.1 dB LINE IN->CH6 Out (1570nm) (Max) 1.8 dB LINE IN->CH7 Out (1590nm) (Max) 1.5 dB LINE IN->CH8 Out (1610nm) (Max) 1.2 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

Fiber Specs Type



ED 01 RL

3AL 97869 AAAA 144/259


ExtractionHandle

ExtractionHandle

s47

4951

535

557

5961

Line Rx inLine Tx out









Optical SafetyLabel



Figure 124 Front panel of C-MDX-U board

ED 01 RL

3AL 97869 AAAA 145/259


Table 53 Front panel wiring of C-MDX-U board Name Signal

Line Rx in Line Reception input signal (from line) Line Tx out Line Transmission output signal (to line) ## nm signal in WDM transmission input signal (from corresponding transponder) ## nm signal out WDM reception output signal (to corresponding transponder) N.B. ## means from 1470 to 1610. LEDs signification

Table 54 Meaning of C-MDX-U board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 146/259

3.4.3 C-MDX-B-S

Line

MUX

1310nmFilter

1310nmCirculatorOSC Tx in

OSC Rx out

CH 1

CH 2

CH 3

CH 4

CH 5

CH 6

CH 7

CH 8

Figure 125 C-MDX-B-S block diagram

3.4.3.1 Description As mentioned before, the 8:1 multiplexer can also be used in bi-directional line terminal configuration to multiplex/demultiplex signals. In this application, 1310nm circulators are used to multiplex/demultiplex bi-directional 1310nm wavelengths of the OSC. An extra 1310±30nm filter is also used to avoid the 1310nm multiplexing affecting the 1550nm transmission. 3.4.3.2 Optical characteristics

Table 55 C-MDX-B-S optical characteristics Insertion Losses Value Unit

I/O <->OSC channel (1310nm)(Max) 2 dB I/O <->CH1 (1470nm) (Max) 1.4 dB I/O <->CH2 (1490nm) (Max) 1.7 dB I/O <->CH3 (1510nm) (Max) 2.0 dB I/O <->CH4 (1530nm) (Max) 2.3 dB I/O <->CH5 (1550nm) (Max) 2.6 dB I/O <->CH6 (1570nm) (Max) 2.9 dB I/O <->CH7 (1590nm) (Max) 3.2 dB I/O <->CH8 (1610nm) (Max) 3.5 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

Fiber Specs Type



ED 01 RL

3AL 97869 AAAA 147/259


ExtractionHandle

ExtractionHandle

s47

4951

53OSC Tx inOSC Rx out

LINENot used

1470 nm signal in or out1490 nm signal in or out




5557

5961

Optical Safety

Label



Figure 126 Front panel of C-MDX-B-S board

ED 01 RL

3AL 97869 AAAA 148/259


Table 56 Front panel wiring of C-MDX-B-S board Name Signal

OSC Tx in Supervision transmission input signal (from OSC board) OSC Rx out Supervision reception output signal (to OSC board) Line Line signal (from/to line) Not used - ## nm signal in or out WDM signal (from/to corresponding transponder) N.B. ## means from 1470 to 1610. LEDs signification

Table 57 Meaning of C-MDX-B-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 149/259

3.4.4 C-MDX-B

MUX Line

CH 1

CH 2

CH 3

CH 4

CH 5

CH 6

CH 7

CH 8

Figure 127 C-MDX-B block diagram


Table 58 C-MDX-B optical characteristics Insertion Losses Value Unit

I/O <->CH1 (1470nm) (Max) 0.9 dB I/O <->CH2 (1490nm) (Max) 1.2 dB I/O <->CH3 (1510nm) (Max) 1.5 dB I/O <->CH4 (1530nm) (Max) 1.8 dB I/O <->CH5 (1550nm) (Max) 2.1 dB I/O <->CH6 (1570nm) (Max) 2.4 dB I/O <->CH7 (1590nm) (Max) 2.7 dB I/O <->CH8 (1610nm) (Max) 3 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

Fiber Specs Type



ED 01 RL

3AL 97869 AAAA 150/259


ExtractionHandle

ExtractionHandle

s47

4951

53

LINENot used





5557

5961

Optical Safety

Label



Figure 128 Front panel of C-MDX-B board

ED 01 RL

3AL 97869 AAAA 151/259


Table 59 Front panel wiring of C-MDX-B board Name Signal

Line Line signal (from/to line) Not used - ## nm signal in or out WDM signal (from/to corresponding transponder) N.B. ## means from 1470 to 1610. LEDs signification

Table 60 Meaning of C-MDX-B board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 152/259

3.5 MUX/DEMUX units (C-MDX2) The following C-MDX2 boards are used: MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-U-S MUX/DMX2 without OSC for unidirectional system: C-MDX2-U 1-channel MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-1-S 2-channel MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-2-XX-S

3.5.1 C-MDX2-E-U-S

Line Rxin

1310nmFilter

1310nmFilter

OSC Txin

OSC Rxout

Line Txout

14701490

151015301550157015901610

14701490

151015301550157015901610

MUX out

DEMUX in

MUX

DEMUX5:95 TAP

PIN AMP

95%

5%

Figure 129 C-MDX2-E-U-S block diagram 3.5.1.1 Description a) MUX side The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber. The 1310nm filter couples the MUX out signal and OSC signal into the line fiber. b) DEMUX side At the receive side, the 5:95 TAP splits the line signal into two channels. One (95%) is sent to 1310nm filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The 1310nm filter splits the input signal into two channel signals. One is sent to OSC board, the other is demultiplexed into 8 channels signals by the DEMUX component. The front panel and front panel wiring are the same as the C-MDX-E-U-S unit.

ED 01 RL

3AL 97869 AAAA 153/259

3.5.2 C-MDX2-U

Line Rxin

Line Txout

1470

1490

1510

1530

1550

1570

1590

1610

1470

1490

1510

1530

1550

1570

1590

1610

MUX

DEMUX5:95 TAP

PIN AMP

95%

5%

Figure 130 C-MDX2-U block diagram

3.5.2.1 Description a) MUX side The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber. b) DEMUX side At the receive side, the 5:95 TAP splits the line signal into two channels. One (95%) is sent to the DEMUX component; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The DEMUX component demultiplexes the line signal into 8 channel signals. The front panel and front panel wiring are the same as the C-MDX-U unit.

ED 01 RL

3AL 97869 AAAA 154/259

3.5.3 C-MDX2-E-1-S

Muxoutput1310nm

1310nmoutput

Demuxinput

CH1

1310nmFilter

1310nmFilter5:95 TAP

PINAMP

CH1

1310nmFilter

5%

95%

input

input

output

Figure 131 C-MDX2-E-1-S block diagram

3.5.3.1 Description The C-MDX2-E-1-S boards are only for the CPE application. This board is designed to multiplex/demultiplex one channel wavelengths to/from a fiber. It provides insertion/extraction of the 1310nm OSC signal or the 1310nm SDH signal. Input optical signal LOS detection is integrated into the unit. 3.5.3.2 Optical characteristics

Table 61 C-MDX2-E-1-S optical characteristics MUX Side

Insertion Losses Value Unit OSC In->MUX (1310nm)(Max) 1 dB CH1 In->MUX (Max) 0.9 dB


DEMUX->OSC Out (1310nm)(Max) 1.5 dB DEMUX->CH1 Out (Max) 1.9 dB

Temperature Specs Value Unit

Operating temperature 0～70 ℃ Storage temperature -40～+85 ℃

Fiber Specs Type Fiber type 0.9/2mm SMF28 Connector type MU


ED 01 RL

3AL 97869 AAAA 155/259


ExtractionHandle

ExtractionHandle

s

Optical Safety

Label


CH

1310nm signal input

1310nm signal output

DMX signal input

MUX signal output

CH1 signal input

CH1 signal output


Figure 132 Front panel of C-MDX2-E-1-S board

ED 01 RL

3AL 97869 AAAA 156/259


Table 62 Front panel wiring of C-MDX2-E-1-S board Name Signal

1310nm signal input Supervision transmission input signal (from OSC board) or other1310nm input

1310nm signal output Supervision reception output signal (to OSC board) or other1310nm output

DMX signal input Line Reception input signal (from line)

MUX signal output Line Transmission output signal (to line)

CH1 signal input WDM transmission input signal (from corresponding transponder)

CH1 signal output WDM reception output signal (to corresponding transponder) LEDs signification

Table 63 Meaning of C-MDX2-E-1-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 157/259

3.5.4 C-MDX2-E-2-XX-S

OADM

1310nmFilter

5:95 TAP 1310nmFilter

OADM

CH1 input

CH2 input

PIN AMP

OSC input

MUX output

DEMUX input

CH1 output

CH2 output

OSC output

5%

95%

Figure 133 C-MDX2-E-2-XX-S block diagram

3.5.4.1 Description The C-MDX2-E-2-XX-S boards are only for the CPE application. This board is designed to multiplex/demultiplex two channels wavelengths to/from a fiber. It provides insertion/extraction of the 1310nm OSC signal or the 1310nm SDH signal. Input optical signal LOS detection is integrated into the unit.

ED 01 RL

3AL 97869 AAAA 158/259


Table 64 Optical parameter of C-MDX2-E-2-XX-S MUX Side

Insertion Losses Value Unit OSC In->MUX (1310nm)(Max) 1 dB CH1/2 In->MUX (Max) 1.8 dB Channel passband at -0.5dB(include channel center wavelength -6～+8 range) 14 nm


DEMUX->OSC Out (1310nm)(Max) 1.5 dB DEMUX->CH1/2 Out (Max) 2.3 dB Channel passband at -0.5dB (include channel center wavelength -6～+8 range) 14 nm

Temperature Specs Value Unit

Operating temperature 0～70 ℃ Storage temperature -40～+85 ℃



ED 01 RL

3AL 97869 AAAA 159/259


ExtractionHandle

ExtractionHandle

s

Optical Safety

Label


CH

1310nm signal input

1310nm signal output

DMX signal input

MUX signal output

CH1 signal inputCH1 signal output

CH CH2 signal input

CH2 signal output


Figure 134 Front panel of C-MDX2-E-2-XX-S board

ED 01 RL

3AL 97869 AAAA 160/259


Table 65 Front panel wiring of C-MDX2-E-2-XX-S board Name Signal

1310nm signal input Supervision transmission input signal (from OSC board) or other1310nm input 1310nm signal output Supervision reception output signal (to OSC board) or other1310nm output DMX signal input Line Reception input signal (from line) MUX signal output Line Transmission output signal (to line) CH1 signal input WDM transmission input signal (from corresponding transponder) CH1 signal output WDM reception output signal (to corresponding transponder) CH2 signal input WDM transmission input signal (from corresponding transponder) CH2 signal output WDM reception output signal (to corresponding transponder) N.B. CH1 can be 1470nm, 1510nm, 1550nm, or 1590nm.

CH2 can be 1490nm, 1530nm, 1570nm, or 1610nm. LEDs signification

Table 66 Meaning of C-MDX2-E-2-XX-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 161/259

3.6 OADM units (C-OAD) The following C-OAD boards are used: UNIDIRECTIONAL 1 Add & Drop C-OAD with OSC: C-OAD-E-U-1-XX-S UNIDIRECTIONAL 1 Add & Drop C-OAD without OSC: C-OAD-U-1-XX UNIDIRECTIONAL 2 Add & Drop C-OAD with OSC: C-OAD-E-U-2-XXXX-S UNIDIRECTIONAL 2 Add & Drop C-OAD without OSC: C-OAD-U-2-XXXX Bi-directional 1 Add/Drop C-OAD with OSC: C-OAD-B-1-XX-S Bi-directional 1 Add/Drop C-OAD without OSC: C-OAD-B-1-XX

3.6.1 C-OAD-E-U-1-XX-S

OADMX2

Drop OSC Add OSC

1310nm FilterO1

Drop OSCAdd OSC

1310nm FilterO2

DropChannel

Express ChOutput

AddChannel

Express ChInput

DropChannel

Express ChOutput

OADMX1

AddChannel

Express ChInput

1310nm FilterO4

1310nm FilterO3

West to Eastin

East to Westout

West to Eastout

East to Westin

Figure 135 C-OAD-E-U-1-XX-S block diagram

ED 01 RL

3AL 97869 AAAA 162/259

3.6.1.1 Description This board (C-OAD-E-U-1-XX-S) is used to add and drop ONE Channel per direction in the unidirectional CWDM system; the added/dropped channel is from/to the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board. The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the OSC board; the added OSC signal comes from the OSC board. All channels can be added and dropped. There are 8 different 1-channel C-OAD boards according to the different wavelengths; the wavelengths are defined as in the following table.

Table 67 1-channel C-OAD module for unidirectional application Number (XX) 4747 4949 5151 5353 5555 5757 5959 6161

Add/Drop Channels (nm) 1470 1490 1510 1530 1550 1570 1590 1610 There are two OADM modules (one OADM module for each direction) in the board. 3.6.1.2 Optical characteristics

Table 68 C-OAD-E-U-1-XX-S optical characteristics Insertion Losses Value Unit

IN->Exp Ch OUT (Max) 1.3 dB Exp Ch IN->OUT (Max) 1.3 dB IN->DROP (Max) 1.5 dB ADD->OUT (Max) 1.5 dB IN->OSC DROP (Max) 1 dB OSC ADD->OUT (Max) 1 dB



ED 01 RL

3AL 97869 AAAA 163/259


ExtractionHandle

ExtractionHandle

East OSC Tx inEast OSC Rx out

West OSC Tx inWest OSC Rx out

East line Rx inEast line Tx out

East YY nm signal addEast YY nm signal drop

East express signal addEast express signal drop

West line Rx inWest line Tx out

West YY nm signal addWest YY nm signal drop

West express signal addWest express signal drop

YY-E

YY-W

S-E

S-W

E

E

W

W

Optical Safety

Label



Figure 136 Front panel of C-OAD-E-U-1-XX-S board

ED 01 RL

3AL 97869 AAAA 164/259


Table 69 Front panel wiring of C-OAD-E-U-1-XX-S board Name Signal

East OSC Tx in East Supervision transmission input signal (from OSC board) East OSC Rx out East Supervision reception output signal (to OSC board) West OSC Tx in West Supervision transmission input signal (from OSC board) West OSC Rx out West Supervision reception output signal (to OSC board) East Line Rx in East Line Reception input signal (from line) East Line Tx out East Line Transmission output signal (to line) East YY nm signal add East YY nm signal add (from corresponding transponder) East YY nm signal drop East YY nm signal drop (to corresponding transponder) East express signal add East express signal add (from East express signal drop) East express signal drop East express signal drop West Line Rx in West Line Reception input signal (from line) West Line Tx out West Line Transmission output signal (to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) West express signal add West express signal add (from West express signal drop) West express signal drop West express signal drop N.B. YY is one of the CWDM wavelengths (1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610). N.B. “East” means from west to east, while “West” means from east to west. LEDs signification

Table 70 Meaning of C-OAD-E-U-1-XX-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 165/259

3.6.2 C-OAD-U-1-XX

DropChannel

Express ChOutput

OADMX1

AddChannel

Express ChInput

OADMX2

DropChannel

Express ChOutput

AddChannel

Express ChInput

West to Eastin

East to Westout

West to Eastout

East to Westin

Figure 137 C-OAD-U-1-XX block diagram

3.6.2.1 Description This board (C-OAD-U-1-XX) is used to add and drop ONE Channel per direction in the unidirectional CWDM system, and the added/dropped channel is from/to the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board. The OSC 1310nm signal is NOT added and dropped by this board.

All channels can be added and dropped. There are 8 different 1-channel C-OAD boards according to the different wavelengths; the wavelengths are defined the same as in table 60. There are two OADM modules (one OADM module for each direction) in the C-OAD board. 3.6.2.2 Optical characteristics

Table 71 C-OAD-U-1-XX optical characteristics Insertion Losses Value Unit

IN->Exp Ch OUT (Max) 0.8 dB Exp Ch IN->OUT (Max) 0.8 dB IN->DROP (Max) 1 dB ADD->OUT (Max) 1 dB



ED 01 RL

3AL 97869 AAAA 166/259


ExtractionHandle

ExtractionHandle







YY-E

YY-W

S-E

S-W

E

E

W

W

Optical SafetyLabel



Figure 138 Front panel of C-OAD-U-1-XX board

ED 01 RL

3AL 97869 AAAA 167/259


Table 72 Front panel wiring of C-OAD-U-1-XX board Name Signal

East Line Rx in East Line Reception input signal (from line) East Line Tx out East Line Transmission output signal (to line) East YY nm signal add East YY nm signal add (from corresponding transponder) East YY nm signal drop East YY nm signal drop (to corresponding transponder) East express signal add East express signal add (from East express signal drop) East express signal drop East express signal drop West Line Rx in West Line Reception input signal (from line) West Line Tx out West Line Transmission output signal (to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) West express signal add West express signal add (from West express signal drop) West express signal drop West express signal drop N.B. YY is one of the CWDM wavelengths (1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610). N.B. “East” means from west to east, while “West” means from east to west. LEDs signification

Table 73 Meaning of C-OAD-U-1-XX board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 168/259

3.6.3 C-OAD-E-U-2-XXXX-S

Drop OSC Add OSC

1310nm FilterO1

Drop OSCAdd OSC

DropCh1 Express Ch

Output

OADMX1

AddCh1Express Ch

Input

DropCh2

AddCh2

OADMX2

DropCh1

Express ChOutputAdd

Ch1

Express ChInput Drop

Ch2AddCh2

1310nm FilterO2

1310nm FilterO4

1310nm FilterO3

West to Eastin

East to Westout

West to Eastout

East to Westin

Figure 139 C-OAD-E-U-2-XXXX-S block diagram

3.6.3.1 Description This board (C-OAD-E-U-2-XXXX-S) is used to add and drop TWO Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board. The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the OSC board; the added OSC signal comes from the OSC board. There are 4 types of 2-channel C-OAD boards. The wavelengths are defined as in the following table. There are two OADM modules (one OADM modules for each direction) in the C-OAD board.

ED 01 RL

3AL 97869 AAAA 169/259

Table 74 2-channel C-OAD modules for unidirectional applications Number (XX) 47474949 51515353 55555757 59596161

Add/Drop Channels (nm) 1470,1490 1510,1530 1550,1570 1590,1610 3.6.3.2 Optical characteristics

Table 75 C-OAD-E-U-2-XXXX-S optical characteristics Insertion Losses Value Unit

IN->Exp Ch OUT (Max) 1.5 dB Exp Ch IN->OUT (Max) 1.5 dB IN->DROP (Max) 1.8 dB ADD->OUT (Max) 1.8 dB IN->OSC DROP (Max) 1 dB OSC ADD->OUT (Max) 1 dB



ED 01 RL

3AL 97869 AAAA 170/259


ExtractionHandle

ExtractionHandle









YY-E

YY-W

S-E

S-W

E

E

W

W

East ZZ nm signal addEast ZZ nm signal dropZZ-E

West ZZ nm signal addWest ZZ nm signal drop

ZZ-W

Optical Safety

Label



Figure 140 Front panel of C-OAD-E-U-2-XXXX-S board

ED 01 RL

3AL 97869 AAAA 171/259


Table 76 Front panel wiring of C-OAD-E-U-2-XXXX-S board Name Signal

East OSC Tx in East Supervision transmission input signal (from OSC board) East OSC Rx out East Supervision reception output signal (to OSC board) West OSC Tx in West Supervision transmission input signal (from OSC board) West OSC Rx out West Supervision reception output signal (to OSC board) East Line Rx in East Line Reception input signal (from line) East Line Tx out East Line Transmission output signal (to line) East YY nm signal add East YY nm signal add (from corresponding transponder) East YY nm signal drop East YY nm signal drop (to corresponding transponder) East ZZ nm signal add East ZZ nm signal add (from corresponding transponder) East ZZ nm signal drop East ZZ nm signal drop (to corresponding transponder) East express signal add East express signal add (from East express signal drop) East express signal drop East express signal drop West Line Rx in West Line Reception input signal (from line) West Line Tx out West Line Transmission output signal (to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) West ZZ nm signal add West ZZ nm signal add (from corresponding transponder) West ZZ nm signal drop West ZZ nm signal drop (to corresponding transponder) West express signal add West express signal add (from West express signal drop) West express signal drop West express signal drop N.B. (YY, ZZ) is one of the CWDM wavelengths combinations [(1470, 1490), (1510, 1530),

(1550, 1570), (1590, 1610)]. N.B. “East” means from west to east, while “West” means from east to west. LEDs signification

Table 77 Meaning of C-OAD-E-U-2-XXXX-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 172/259

3.6.4 C-OAD-U-2-XXXX

Express ChOutput

OADMX1

AddCh1

Express ChInput

DropCh2

AddCh2

OADMX2

DropCh1

Express ChOutput

AddCh1

Express ChInput

DropCh2

AddCh2

DropCh1

West to Eastin

East to Westout

West to Eastout

East to Westin

Figure 141 C-OAD-U-2-XXXX block diagram

3.6.4.1 Description This board (C-OAD-U-2-XX) is used to add and drop TWO Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board. The OSC 1310nm signal is NOT added/dropped by this board. There are 4 types of 2-channel C-OAD boards, the wavelengths are defined the same as in Table 74.There are two OADM modules (one OADM modules for each direction) in the C-OAD board. 3.6.4.2 Optical characteristics

Table 78 C-OAD-U-2-XXXX optical characteristics Insertion Losses Value Unit

IN↔Exp Ch OUT (Max) 1.0 dB Exp Ch IN↔ OUT (Max) 1.0 dB IN->DROP (Max) 1.3 dB ADD->OUT (Max) 1.3 dB



ED 01 RL

3AL 97869 AAAA 173/259


ExtractionHandle

ExtractionHandle







YY-E

YY-W

S-E

S-W

E

E

W

W

East ZZ nm signal addEast ZZ nm signal dropZZ-E

West ZZ nm signal addWest ZZ nm signal drop

ZZ-W

Optical SafetyLabel



Figure 142 Front panel of C-OAD-U-2-XXXX board

ED 01 RL

3AL 97869 AAAA 174/259


Table 79 Front panel wiring of C-OAD-U-2-XXXX board Name Signal

East Line Rx in East Line Reception input signal (from line) East Line Tx out East Line Transmission output signal (to line) East YY nm signal add East YY nm signal add (from corresponding transponder) East YY nm signal drop East YY nm signal drop (to corresponding transponder) East ZZ nm signal add East ZZ nm signal add (from corresponding transponder) East ZZ nm signal drop East ZZ nm signal drop (to corresponding transponder) East express signal add East express signal add (from East express signal drop) East express signal drop East express signal drop West Line Rx in West Line Reception input signal (from line) West Line Tx out West Line Transmission output signal (to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) West ZZ nm signal add West ZZ nm signal add (from corresponding transponder) West ZZ nm signal drop West ZZ nm signal drop (to corresponding transponder) West express signal add West express signal add (from West express signal drop) West express signal drop West express signal drop N.B. (YY, ZZ) is one of the CWDM wavelengths combinations [(1470, 1490), (1510, 1530),


Table 80 Meaning of C-OAD-U-2-XXXX board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 175/259

3.6.5 C-OAD-B-1-XX-S

1310nm CirculatorO3

Drop EastOSC

AddWest OSC

1310nm CirculatorO4

Drop WestOSC

AddEast OSC

Add/DropOSC

Add/DropOSC

1310nm FilterO1

OADM

DropEast Ch

Express ChI/O Add

East Ch

Express ChI/O Drop

West ChAdd

West Ch

1310nm FilterO2Line I/O 1 Line I/O 2

Figure 143 C-OAD-B-1-XX-S block diagram

3.6.5.1 Description This board (C-OAD-B-1-XX-S) is used to add and drop only ONE channel per direction in the Bi-directional CWDM system. A west added/dropped channel is to/from a WLA board and an east added/dropped channel is to/from a WLA board. The other channels are passed through the C-OAD board. The OSC 1310nm signals (including east and west directions) are also added and dropped by this board. The east/west added OSC signals come from the east/west OSC modules and the east/west dropped OSC signals are sent to the east/west OSC modules. There are 4 types of Bi-directional C-OAD boards. The wavelengths are defined as in the following table. There is only one 2-channel C-OAD module (one add & drop channel for each direction) in the board.

Table 81 C-OAD modules for bi-directional application Number (XX) 4755 4957 5159 5361

Add/Drop Channels (nm) 1470,1550 1490,1570 1510,1590 1530,1610

ED 01 RL

3AL 97869 AAAA 176/259


Table 82 C-OAD-B-1-XX-S optical characteristics Insertion Losses Value Unit

I/O<->Exp Ch I/O (Max) 1.5 dB I/O->DROP (Max) 1.8 dB ADD->I/O (Max) 1.8 dB Insertion loss (I/O->OSC Drop, OSC Add->I/O)(Max) 2 dB



ED 01 RL

3AL 97869 AAAA 177/259


ExtractionHandle

ExtractionHandle



Line I/O 2Line I/O 1


East ZZ signal addEast ZZ signal drop

Express signal I/O 2Express signal I/O 1

YY

S-E

S-W

ZZ

Optical SafetyLabel



Figure 144 Front panel of C-OAD-B-1-XX-S board

ED 01 RL

3AL 97869 AAAA 178/259


Table 83 Front panel wiring of C-OAD-B-1-XX-S board Name Signal

East OSC Tx in East Supervision transmission input signal (from OSC board) East OSC Rx out East Supervision reception output signal (to OSC board) West OSC Tx in West Supervision transmission input signal (from OSC board) West OSC Rx out West Supervision reception output signal (to OSC board) Line I/O 2 Line signal 2 (from/to line) Line I/O 1 Line signal 1 (from/to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) East ZZ nm signal add East ZZ nm signal add (from corresponding transponder) East ZZ nm signal drop East ZZ nm signal drop (to corresponding transponder) Express signal I/O 2 Express signal I/O 2 add/drop (connected with express signal I/O 1) Express signal I/O 1 Express signal I/O 1 add/drop N.B. (YY, ZZ) is one of the CWDM wavelengths combinations [(1470, 1550), (1490, 1570),


Table 84 Meaning of C-OAD-B-1-XX-S board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 179/259

3.6.6 C-OAD-B-1-XX

OADM

DropEast Ch

Express ChI/O

AddEast Ch

Express ChI/O

DropWest Ch

AddWest Ch

Line Line

Figure 145 C-OAD-B-1-XX block diagram

3.6.6.1 Description This board (C-OAD-B-1-XX) is used to add and drop only ONE channel per direction in the Bi-directional CWDM system. A west added/dropped channel is to/from a WLA board and an east added/dropped channel is to/from a WLA board. The other channels are passed through the C-OAD board. The OSC 1310nm signal is NOT added and dropped by this board. There are 4 types of Bi-directional C-OAD boards; the wavelengths are defined the same as in Table 81. There is only one 2-channel C-OAD module (one add & drop channel for each direction) in the board. 3.6.6.2 Optical characteristics

Table 85 C-OAD-B-1-XX optical characteristics Insertion Losses Value Unit

IN<->Exp Ch OUT (Max) 1 dB IN->DROP (Max) 1.3 dB ADD->OUT (Max) 1.3 dB



ED 01 RL

3AL 97869 AAAA 180/259


ExtractionHandle

ExtractionHandle

Line I/O 2Line I/O 1


East ZZ signal addEast ZZ signal drop

Express signal I/O 2 Express signal I/O 1

YY

S-E

S-W

ZZ

Optical SafetyLabel



Figure 146 Front panel of C-OAD-B-1-XX board

ED 01 RL

3AL 97869 AAAA 181/259


Table 86 Front panel wiring of C-OAD-B-1-XX board Name Signal

Line I/O 2 Line signal 2 (from/to line) Line I/O 1 Line signal 1 (from/to line) West YY nm signal add West YY nm signal add (from corresponding transponder) West YY nm signal drop West YY nm signal drop (to corresponding transponder) East ZZ nm signal add East ZZ nm signal add (from corresponding transponder) East ZZ nm signal drop East ZZ nm signal drop (to corresponding transponder) Express signal I/O 2 Express signal I/O 2 add/drop (connected with express signal I/O 1) Express signal I/O 1 Express signal I/O 1 add/drop N.B. (YY, ZZ) is one of the CWDM wavelengths combinations [(1470, 1550), (1490, 1570),


Table 87 Meaning of C-OAD-B-1-XX board front panel LEDs

Red Green

Orange


ED 01 RL

3AL 97869 AAAA 182/259

3.7 OADM2 units (C-OAD2) The following C-OAD2 boards are used: UNIDIRECTIONAL 1 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-1-XX-S UNIDIRECTIONAL 1 Add & Drop C-OAD2 without OSC: C-OAD2-U-1-XX UNIDIRECTIONAL 2 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-2-XXXX-S UNIDIRECTIONAL 2 Add & Drop C-OAD2 without OSC: C-OAD2-U-2-XXXX UNIDIRECTIONAL 4 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-4-XXXXXXXX-S UNIDIRECTIONAL 4 Add & Drop C-OAD2 without OSC: C-OAD2-U-4-XXXXXXXX

3.7.1 C-OAD2-E-U-1-XX-S

OADMX2

Drop OSC Add OSC

1310nm FilterO1

Drop OSCAdd OSC

1310nm FilterO2

DropChannel

Express ChOutput

AddChannel

Express ChInput

DropChannel

Express ChOutput

OADMX1

AddChannel

Express ChInput

1310nm FilterO4

1310nm FilterO3

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5:95 TAP95%

PIN AMP

5%

5%

Figure 147 C-OAD2-E-U-1-XX-S block diagram

ED 01 RL

3AL 97869 AAAA 183/259

3.7.1.1 Description This board (C-OAD2-E-U-1-XX-S) is used to add and drop ONE Channel per direction in the unidirectional CWDM system; the added/dropped channel is to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board. The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the OSC board; the added OSC signal comes from the OSC board. All channels can be added and dropped. There are 8 different 1-channel C-OAD2 boards according to the different wavelengths; the wavelengths are defined as in the following table.

Table 88 1-channel C-OAD2 module for unidirectional application Number (XX) 4747 4949 5151 5353 5555 5757 5959 6161

Add/Drop Channels (nm) 1470 1490 1510 1530 1550 1570 1590 1610 There are two OADM modules (one OADM module for each direction) in the board. At each receiving direction, a 5:95 TAP is used to split the line signal into two channels. One (95%) is sent to the 1310nm filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The front panel and front panel wiring are the same as C-OAD-E-U-1-XX-S unit.

ED 01 RL

3AL 97869 AAAA 184/259

3.7.2 C-OAD2-U-1-XX

DropChannel

Express ChOutput

OADMX1

AddChannel

Express ChInput

OADMX2

DropChannel

Express ChOutput

AddChannel

Express ChInput

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5%

5:95 TAP95%

PIN AMP

5%

Figure 148 C-OAD2-U-1-XX block diagram

3.7.2.1 Description This board (C-OAD2-U-1-XX) is used to add and drop ONE Channel per direction in the unidirectional CWDM system and the added/dropped channel is to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board. The OSC 1310nm signal is NOT added and dropped by this board.

All channels can be added and dropped. There are 8 different 1-channel C-OAD2 boards according to the different wavelengths; the wavelengths are defined the same as in Table 88. There are two OADM modules (one OADM module for each direction) in the C-OAD2 board. At each receiving direction, a 5:95 TAP is used to split the line signal into two channels. One (95%) is sent to the OADM module; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The front panel and front panel wiring are the same as C-OAD-U-1-XX unit.

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3.7.3 C-OAD2-E-U-2-XXXX-S

5:95 TAP95%

PIN AMP

5%

DropOSC

AddOSC

1310nm FilterO1

DropOSC

AddOSC

DropCh1 Express Ch

Output

OADMX1

AddCh1Express Ch

Input

DropCh2

AddCh2

OADMX2

DropCh1

Express ChOutputAdd

Ch1

Express ChInput Drop

Ch2AddCh2

1310nm FilterO2

1310nm FilterO4

1310nm FilterO3

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5%

Figure 149 C-OAD2-E-U-2-XXXX-S block diagram

3.7.3.1 Description This board (C-OAD2-E-U-2-XXXX-S) is used to add and drop TWO Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board. The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the OSC board; the added OSC signal comes from the OSC board. There are 4 types of 2-channel C-OAD2 boards; the wavelengths are defined as the following table. There are two OADM modules (one OADM modules for each direction) in the C-OAD2 board. At each receiving direction, a 5:95 TAP is used to split the line signal into two channels. One (95%) is sent to the 1310nm filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS detection.

Table 89 2-channel C-OAD2 module for unidirectional application Number (XX) 47474949 51515353 55555757 59596161

Add/Drop Channels (nm) 1470,1490 1510,1530 1550,1570 1590,1610 The front panel and front panel wiring are the same as in a C-OAD-E-U-2-XXXX-S unit.

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3.7.4 C-OAD2-U-2-XXXX

Express ChOutput

OADMX1

AddCh1

Express ChInput

DropCh2

AddCh2

OADMX2

DropCh1

Express ChOutput

AddCh1

Express ChInput

DropCh2

AddCh2

DropCh1

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5%

5:95 TAP95%

PIN AMP

5%

Figure 150 C-OAD2-U-2-XXXX block diagram

3.7.4.1 Description This board (C-OAD2-U-2-XXXX) is used to add and drop TWO Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board. The OSC 1310nm signal is NOT added/dropped by this board. There are 4 types of 2-channel C-OAD2 boards. The wavelengths are defined the same as in Table 89. There are two OADM modules (one OADM modules for each direction) in the C-OAD2 board. At each receiving direction, a 5:95 TAP is used to split the line signal into two channels. One (95%) is sent to the OADM module; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The front panel and front panel wiring are the same as in a C-OAD-U-2-XXXX unit.

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3.7.5 C-OAD2-E-U-4-XXXXXXXX-S

5:95 TAP95%

PIN AMP

5%

Drop OSC Add OSC

1310nm FilterO1

Drop OSCAdd OSC

DropCh1～4 Express Ch

Output

OADMX1

Express ChInput

AddCh1～4

OADMX2

Express ChOutput

Express ChInput

1310nm FilterO2

1310nm FilterO4

1310nm FilterO3

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5%

AddCh1～4

DropCh1～4

Figure 151 C-OAD2-E-U-4-XXXXXXXX-S block diagram

3.7.5.1 Description This board (C-OAD2-E-U-4-XXXXXXXX-S) is used to add and drop FOUR Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2-E-U-4-XXXXXXXX-S board. The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the OSC board; the added OSC signal comes from the OSC board. There are 2 types of 4-channel C-OAD2 boards; the wavelengths are defined in the following table. The “XXXXXXXX” can be the values listed in the following table.

Table 90 4-channel C-OAD2 module for unidirectional application Number (XXXXXXXX) 4747494951515353 5555575759596161

Add/Drop Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610 Thus there are two kinds of C-OAD2-E-U-4-XXXXXXXX-S board.

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3.7.5.2 Optical characteristics The C-OAD2-E-U-4-XXXXXXXX-S unit’s add & drop channels sequence is defined by the following table.

Table 91 Add & Drop Channels Sequence Add & Drop Wavelength (nm)

C-OAD2-E-U-4-4747494951515353-S C-OAD2-E-U-4-5555575759596161-S Channel Number

1470 1550 1 1490 1570 2 1510 1590 3 1530 1610 4

The optical characteristics of the board are as follows:

Table 92 C-OAD2-E-U-4-XXXXXXXX-S board optical characteristics Insertion Losses Value Unit

IN->Exp Ch OUT (Max) 2.7 dB Exp Ch IN->OUT (Max) 2.2 dB In->CH1 Drop (Max) 2.8 dB In->CH2 Drop (Max) 2.5 dB In->CH3 Drop (Max) 2.2 dB In->CH4 Drop (Max) 1.9 dB CH1 Add->Out (Max) 1.4 dB CH2 Add->Out (Max) 1.7 dB CH3 Add->Out (Max) 2.0 dB CH4 Add->Out (Max) 2.3 dB IN->OSC DROP (Max) 1.5 dB OSC ADD->OUT (Max) 1 dB

Temperature Specs Value Unit Operating temperature 0～70 ℃ Storage temperature -40～+85 ℃



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ExtractionHandle

ExtractionHandle

East OSC addEast OSC drop

West OSC addWest OSC drop

Line East inLine East out

East A nm signal addEast A nm signal drop

East express signal add

A-E

S-E

S-W

B-E

Optical SafetyLabel


C-E

D-E

E

A-W

B-W

C-W

D-W

W

E W

East B nm signal addEast B nm signal drop

East C nm signal addEast C nm signal drop

East D nm signal addEast D nm signal drop

East express signal drop

Line West inLine West out

West A nm signal addWest A nm signal drop

West express signal add

West B nm signal addWest B nm signal drop

West C nm signal addWest C nm signal drop

West D nm signal addWest D nm signal drop

West express signal drop

Hardware FailureLED

Figure 152 Front panel of C-OAD2-E-U-4-XXXXXXXX-S board

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Table 93 Front panel wiring of C-OAD2-E-U-4-XXXXXXXX-S board Name Signal

OSC Add (East) East OSC signal input (From OSC board) OSC Drop (East) East OSC signal output (to OSC board) OSC Add (West) West OSC signal input (From OSC board) OSC Drop (West) West OSC signal output (to OSC board) Input (East) East Line signal input (from line) Output (East) East Line signal output (to line) Add A (East) East A nm signal add (from corresponding transponder) Drop A (East) East A nm signal drop (to corresponding transponder) Add B (East) East B nm signal add (from corresponding transponder) Drop B (East) East B nm signal drop (to corresponding transponder) Add C (East) East C nm signal add (from corresponding transponder) Drop C (East) East C nm signal drop (to corresponding transponder) Add D (East) East D nm signal add (from corresponding transponder) Drop D (East) East D nm signal drop (to corresponding transponder) Express Ch In (East) East express signal input Express Ch Out (East) East express signal output Input (West) West Line signal input (from line) Output (West) West Line signal output (to line) Add A (West) West A nm signal add (from corresponding transponder) Drop A (West) West A nm signal drop (to corresponding transponder) Add B (West) West B nm signal add (from corresponding transponder) Drop B (West) West B nm signal drop (to corresponding transponder) Add C (West) West C nm signal add (from corresponding transponder) Drop C (West) West C nm signal drop (to corresponding transponder) Add D (West) West D nm signal add (from corresponding transponder) Drop D (West) West D nm signal drop (to corresponding transponder) Express Ch In (West) West express signal input Express Ch Out (West) West express signal output N.B. (A, B, C and D) can respectively be (1470, 1490, 1510 and 1530) or (1550, 1570, 1590

and 1610). N.B. “East” means from west to east, while “West” means from east to west. LEDs signification

Table 94 Meaning of C-OAD2-E-U-4-XXXXXXXX-S board front panel LEDs

Red Green

Orange


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3.7.6 C-OAD2-U-4-XXXXXXXX

5:95 TAP95%

PIN AMP

5%

DropCh1～4

Express ChOutput

OADMX1

Express ChInput

AddCh1～4

OADMX2

Express ChOutput

Express ChInput

West to Eastin

East to Westout

West to Eastout

East to Westin

5:95 TAP95%

PIN AMP

5%

AddCh1～4

DropCh1～4

Figure 153 C-OAD2-U-4-XXXXXXXX block diagram 3.7.6.1 Description This board (C-OAD2-U-4-XXXXXXXX) is used to add and drop FOUR Channels per direction in the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10, 2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board. There are 2 types of 4-channel C-OAD2 boards; the wavelengths are defined in the following table. There are two OADM modules (one OADM modules for each direction) in the C-OAD2 board. The “XXXXXXXX” can be the values listed in the following table.

Table 95 4-channel C-OAD2 modules for unidirectional application Number (XXXXXXXX) 4747494951515353 5555575759596161

Add/Drop Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610 Thus there are two kinds of C-OAD2-U-4-XXXXXXXX boards.

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3.7.6.2 Optical characteristics The C-OAD2-U-4-XXXXXXXX unit’s add & drop channels sequence is defined by the following table:

Table 96 Add & Drop channels Sequence Add & Drop Wavelength (nm)

C-OAD2-U-4-4747494951515353 C-OAD2-U-4-5555575759596161 Channel Number

1470 1550 1 1490 1570 2 1510 1590 3 1530 1610 4

The optical characteristics of the board are as follows:

Table 97 C-OAD2-U-4-XXXXXXXX board optical characteristics Insertion Losses Value Unit

IN->Exp Ch OUT (Max) 2.2 dB Exp Ch IN->OUT (Max) 1.7 dB In->CH1 Drop (Max) 2.3 dB In->CH2 Drop (Max) 2.0 dB In->CH3 Drop (Max) 1.7 dB In->CH4 Drop (Max) 1.4 dB CH1 Add->Out (Max) 0.9 dB CH2 Add->Out (Max) 1.2 dB CH3 Add->Out (Max) 1.5 dB CH4 Add->Out (Max) 1.8 dB

Temperature Specs Value Unit Operating temperature 0～70 ℃ Storage temperature -40～+85 ℃



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ExtractionHandle

ExtractionHandle

Line East inLine East out

East A nm signal addEast A nm signal drop

East express signal add

A-E

B-E

Optical SafetyLabel


C-E

D-E

E

A-W

B-W

C-W

D-W

W

E W

East B nm signal addEast B nm signal drop

East C nm signal addEast C nm signal drop

East D nm signal addEast D nm signal drop

East express signal drop

Line West inLine West out

West A nm signal addWest A nm signal drop

West express signal add

West B nm signal addWest B nm signal drop

West C nm signal addWest C nm signal drop

West D nm signal addWest D nm signal drop

West express signal drop


Figure 154 Front panel of C-OAD2-U-4-XXXXXXXX board

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Table 98 Front panel wiring of C-OAD2-U-4-XXXXXXXX board Name Signal

Input (East) East Line signal input (from line) Output (East) East Line signal output (to line) Add A (East) East A nm signal add (from corresponding transponder) Drop A (East) East A nm signal drop (to corresponding transponder) Add B (East) East B nm signal add (from corresponding transponder) Drop B (East) East B nm signal drop (to corresponding transponder) Add C (East) East C nm signal add (from corresponding transponder) Drop C (East) East C nm signal drop (to corresponding transponder) Add D (East) East D nm signal add (from corresponding transponder) Drop D (East) East D nm signal drop (to corresponding transponder) Express Ch In (East) East express signal input Express Ch Out (East) East express signal output Input (West) West Line signal input (from line) Output (West) West Line signal output (to line) Add A (West) West A nm signal add (from corresponding transponder) Drop A (West) West A nm signal drop (to corresponding transponder) Add B (West) West B nm signal add (from corresponding transponder) Drop B (West) West B nm signal drop (to corresponding transponder) Add C (West) West C nm signal add (from corresponding transponder) Drop C (West) West C nm signal drop (to corresponding transponder) Add D (West) West D nm signal add (from corresponding transponder) Drop D (West) West D nm signal drop (to corresponding transponder) Express Ch In (West) West express signal input Express Ch Out (West) West express signal output N.B. (A, B, C and D) can respectively be (1470, 1490, 1510 and 1530) or (1550, 1570, 1590

and 1610). N.B. “East” means from west to east, while “West” means from east to west. LEDs signification

Table 99 Meaning of C-OAD2-U-4-XXXXXXXX board front panel LEDs

Red Green

Orange


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3.8 ESC-LC board The ESC-LC is low cost ESC (Equipment and Shelf Controller) and integrated function of I-LINK-M. It is the hardware platform designed to support the Equipment Controller (EC) functions and the Shelf Controller (SC) functions. The EC functions are the processing activities concerning the ”Virtual Equipment Control Element” (VECE) function: Virtual Machine Management Function (VMMF) Message Communication Function (MCF)

The SC functions are the processing activities concerning the ”Physical Equipment Control Element” (PECE) function: Physical Machine Management Function (PMMF) Basic Process Control Function (BPCF)

It provides the resources to support the SW functions related to the physical machine control and management and configuration provisioning. The ESC-LC consists in a double processor board. It is mainly composed of: An ESC-LC mother board A daughter board achieving the EC function and SC function in two processors. A non-volatile mass storage device PCMCIA 2.1 compatible (compact flash card).

Both EC and SC functions are realized using a daughter card. They are plugged on the ESC-LC mother board. The daughter card is developed in order to provide a common HW (and SW) platform for different applications requiring a Shelf Controller (SC) function. The processors used are members of Motorola MPC860 family. Various kinds of serial communication channels and parallel I/O ports for alarm & status signals are provided by the ESC-LC card.

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ATD/S1

ABN/S2

IND/S3

URG/SC

NUR/EC

ACO

LAT

RST

CO

NN

S1 C

ON

N S2

CO

NN

S3C

RAFT

Slave 1(Yellow)Slave 2(Yellow)Slave 3(Yellow)

SC (Red/Green)EC (Red/Green)

ALARM Cut Off Push ButtonLamp Test Push ButtonRESET Push Button

I-LINK Slave1 connector

I-LINK Slave2 Connector

I-LINK Slave3 Connector

F Interface Connector

EC_DBG Interface RJ45

SC_DBG Interface RJ45

ATTD LED(Yellow)ABN LED(Yellow)IND LED(Yellow)

URG LED(Red)NURG LED(Red)

Figure 155 Front panel of ESC-LC board

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3.8.1.1 Front panel connectors

Table 100 Front panel connectors of the ESC board Name Type

I-LINK Slave 1 RS485 connector (I-LINK interface) (see section 2.7.2.6) I-LINK Slave 2 RS485 connector (I-LINK interface) (see section 2.7.2.6) I-LINK Slave 3 RS485 connector (I-LINK interface) (see section 2.7.2.6) F Interface SUB-D 9 pins connector (see section 2.7.2.4) DBG_SC RJ45 connector (see section2.7.2.5) DBG_EC RJ45 connector (see section2.7.2.5)

3.8.1.2 LEDs signification

Table 101 Meaning of ESC front panel LEDs signification Name LED Color Meaning URG Red Critical or major alarm appears. NURG Red Major alarm appears. ATTD Yellow After pressing ACO or LAT button.

ABN Yellow Abnormal condition appears or after pressing LAT button.

IND Yellow Non-alarmed event is declared.

SC

EC Green, Red, Yellow

Green: SC/EC is in normal operation. Red: hardware failure on SC/EC. Yellow: SC/EC is booting or restarting, or after pressing the LAT button.

S1 S2 S3

Yellow The slave shelf is powered on and the I-LINK connection is correct.

N.B. Before the communication between EC and SC is established: When the RST push button is pressed, EC & SC LED’s status doesn’t change. When the SC is restarted and the communication between EC and SC is not established, the EC LED is red and the SC LED is green. N.B. When the communication between EC & SC is re-established, both EC & SC LEDs are green. N.B. On the Craft Terminal (C.T.) and on the Operation System (O.S), the application of the

URGENT (URG), NOT URGENT (NURG) and INDICATIVE alarm are named in a different way; the relation between this two terminology is explained in the following table.

Table 102 Relation between alarm severity terminology displayed on C.T./O.S. and alarm severity

terminology used for the ESC-LC LEDs and ETSI market rack (TRU) Alarm severity terminology on C.T. and

O.S. Alarm severity terminology used for ESC

LEDs and for TRU in the rack

CRITICAL or MAJOR URG, T*URG, T*RURG MINOR T*NURG, T*RNURG

WARNING INDICATIVE INDETERMINATE (not used) -

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3.9 C-4xANY card

2.5GSignal

Figure 156 C-4xANY block diagram 3.9.1 Description The 4xANY unit is a TDM concentrator that enables to the multiplexing in the time domain of up to 4 ”Low Bit-rate” signals into one at 2.5 Gbit/s: 4 x Fast Ethernet 4 x FDDI 4 x ESCON 4 x Digital Video 4 x STM-1 3 x STM-4 2 x Gigabit Ethernet 2 x Fiber Channel or FICON Some mixes are also possible:

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3 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 2 x (FDDI or FE or DV or ESCON or STM-1) + 2 x STM-4 2 x (FDDI or FE or DV or ESCON or STM-1) + 1 x (FC or GbE or FICON) 1 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 +1 x (FC or GbE or FICON) 2 x (FC or GbE or FICON)

The architecture of the TDM concentrator board is based on the concept of virtual concatenation, and on the mapping of SDH on OTN: The data traffic is packed into VC-4 structures (virtually concatenated). The VC-4s are groomed into a STM-16 structure.

The next figure explains the allocation of the VC-4.

Figure 157 VC-4 allocation

The board is divided into: One mother board One daughter board 1 to 4 drawers plugged into the mother or daughter board (2 on each one).

The board consists essentially of: Slots for bi-directional client optical interfaces One 2.5 Gbit/s transceiver FPGAs for the mapping function:

Two dedicated to the concatenation into virtual VC-4 structures (2xANY) One dedicated to the STM-16 frame termination (Pontaccio) One STM-6 regenerator section termination (Passtru) One alarm and control unit (Mascon)

Receivers and transmitters can be locked to either the received clock or the local clock: Default configuration: Tx locked to the local clock and Rx locked to the received clock. Loopback configuration. Loopback and Continue managed.

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Three different kinds of drawers are provided: High frequency 1310nm optical interface drawers (Gigabit Ethernet, Fiber Channel), which can

be plugged only into the ports #3 & #4 (HF_1310_DRAWER).

STM-1/4 drawers, which can be plugged into any slots. But, the STM-4 Bit rate can only be set for ports #3 and #4 (SDH-SONET_1310_DRAWER). Particular Case: For the 3 STM-4 configuration, slot #1 is exceptionally occupied by a STM-4 bit rate.

Low frequency drawers (Fast Ethernet, FDDI, ESCON, Digital Video) with 1310nm optical interfaces, which can be plugged in any slots (LF_1310_DRAWER).

High frequency drawers are equipped with 850nm detectors and lasers. The following rules for

the position of these drawers are only imposed due to the high frequency nature of the drawer (HF_850_DRAWER).

Low frequency drawers are equipped with 850nm detectors and lasers. The rules followed for the

position of these drawers are only imposed due to the low frequency nature of the drawer (LF_850_DRAWER).

Furthermore, a limited number of configurations of drawers can be provided. Rules must be followed: If High Frequency drawer is plugged into ports #3, port #1 must be non-provisioned. If High Frequency drawer is plugged into ports #4, port #2 must be non-provisioned.

For each 2xANY, the following table lists the allowed configurations. Configurations for the two 2xANY are independent.

Table 103 Allowed drawers association in each 2xANY 2xANY #1 2xANY #2

Drawer #1 Drawer #3 Drawer #2 Drawer #4 Not Provisioned High Frequency Not Provisioned High Frequency

Low Frequency / STM-1 Low Frequency / STM-1 / STM-4 Low Frequency / STM-1 Low Frequency / STM-1

/ STM-4

Not Provisioned High Frequency / Low Frequency / STM-1 /

STM-4 Low Frequency / STM-1 Low Frequency / STM-1

/ STM-4

Low Frequency / STM-1 Low Frequency / STM-1 / STM-4 Not Provisioned

High Frequency / Low Frequency / STM-1 /

STM-4 STM-4 STM-4 Not Provisioned STM-4

Any couple (DRW#1; DRW#3) can be associated to any couple (DRW#2; DRW#4) except for the last Line (3 x STM-4 configuration is fixed for the 4 drawers).

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The following table shows the allowed data type for each kind of drawer:

Table 104 Client Data Type configuration for drawer

LF_1310_ Drawer

LF_850_ Drawer

HF_1310_ Drawer

HF_850_ Drawer

STM-1/4_ Drawer

Other Y Y Y Y Y FastEthernet100 Y Y N N N

ESCON Y Y N N N DigitalVideo Y Y N N N FiberChannel N N Y Y N

GigabitEthernet N N Y Y N FICON N N Y Y N FDDI Y Y N N N

STM-1 N N N N Y STM-4 N N N N Y*

3.9.2 C-4xANY optical characteristics User Rx (1 to 4 on the board)

Table 105 User Rx specification 1310nm

Fiber type Multi-mode 62.5 / 125 µm

High Frequency

Sensitivity @ BER = 10-10 -20 dBm

Overload @ BER = 10-10 -3 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance 12 dB

STM-1, STM-4




Maximum receiver reflectance - dB

Low Frequency




Maximum receiver reflectance 12.5 dB User Tx (1 to 4 on the board)

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Table 106 User Rx specification 1310nm

Fiber type Single-mode

High Frequency

Maximum RMS width 4 nm

Minimum side mode suppression ratio NA dB

Optical output power Min: -12; Max:-3 dBm

Minimum extinction ratio 9 dB

Shutdown time <5 ms

Re-activation time <30 ms

STM-1, STM-4

Maximum RMS width 2.5 nm


Optical output power Min: -15; Max: -8 dBm

Minimum extinction ratio 8.2 dB

Shutdown time <5 ms


Low Frequency

Maximum RMS width 2.5 nm


Optical output power Min: -15; Max: -8 dBm

Minimum extinction ratio 8.2 dB

Shutdown time <5 ms

Re-activation time <30 ms In the following table, the specifications of optical ports used in 850nm drawers are displayed. User Rx (1 to 4 on the board)

Table 107 User Rx specification (850nm) Fiber type Multi-mode, 62.5 / 125 µm

High Frequency


Overload @ BER = 10-10 0 dBm


Maximum receiver reflectance -12 dB

Low Frequency


Overload @ BER = 10-10 0 dBm


Maximum receiver reflectance 12 dB

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User Tx (1 to 4 on the board)

Table 108 User Tx specification (850nm) Fiber type Multi-mode, 62.5 / 125 µm

High Frequency



Optical output power Min: -9.5; Max: -1.5 dBm


Shutdown time <0.5 ms


Low Frequency



Optical output power Min: -9.5; Max: -1.5 dBm


Shutdown time <0.5 ms

Re-activation time <300 ms The laser state of drawer should be set forced on when setting local loopback. On the CWDM side of the C-4xANY board, I16, S16.1, L16.1, L16.2, I16_DDM, S16.1_DDM, PIN and APD can be set. Please refer to chapter 3.1.2 for the optical parameters. In R3.2A, B1 monitoring can be performed on the line side of C-4xANY board. But the J0 processing is not supported.

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CWDM signal

Figure 158 Front panel of C-4xANY board

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Table 109 Meaning of C-4xANY card front panel LEDs Name LED Color Meaning PWR Green This LED is ON when the power supply is in range of standard. OOS Yellow LED is on when the board is un-configured or mismatching.

RXA Yellow

Rx Abnormal: problem on the receive side. Board is un-configured or mismatching. ILOS on STM-16 side ILOS on drawers

Managed by the SW.

TXA Yellow

Tx Abnormal: problem on the transmit side. Managed by the SW. LED is on when: Drawer of Line SFP module laser is forced off. Tx Fault alarm is present.

Green Orange

Red

Hardware Failure: Green when the board is plugged, configured and without failure. Orange when the board is in downloading state or after pressing LAT button. Red when the On Board Power Supply (OBPS) is in failure (or on the power supply alarms).

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3.10 OSC unit The OSC board receives data from the ESC-LC board, and transmits it to the optical fiber line; On the other hand, OSC board receives data from the optical fiber line and transmits it to the ESC-LC board. The supervision unit is composed of two optical transceivers (OSC channel receiver and transmitter) and a FPGA dedicated to the supervision frames management and OSC alarms and status collection. Thus the OSC board can deal with two data communication channels (DCC1 and DCC2), one for each direction. 3.10.1 Description For this release, the functionalities supported by the OSC board are the following: Management of one or two bidirectional supervision streams at 2048 Kbit/s. For Line terminal

applications. There is one supervision stream. For back to back or OADM applications, there are two.

Management of Data Communication Channels DCC1 and DCC2. The configurations of Line Terminal or back to back terminals and OADM are done by software. 3.10.2 Functional description of the configurations As described in the two following figures, the data of OSC channel at 1310nm are sent to the matrix in a 2 Mbit/s signal to the supervision frame management functional block. This block generates one/or two TDM signals according to the NE configuration.

Matrix

Supervision framemanagement

Tx 1optical

transmitter

Rx 1opticalreceiver

SFPmodule

TDM1

ESC-LCboard

C-MDXor C-OAD

board

Figure 159 OSC board in Line Terminal configuration

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Matrix

Supervision framemanagement

TDM1

Tx 1optical

transmitter

Rx 1opticalreceiver

SFPmodule

C-MDXor C-OAD

board

Tx 2optical

transmitter

Rx 2opticalreceiver

SFP module

C-MDXor C-OAD

board

OSC11310nm

OSC21310nm

West East

TDM2

ESC-LC board

Figure 160 OSC board in OADM or back to back configuration 3.10.3 Optical characteristics Receiver:

Table 110 Rx specification Fiber type 9/125 Single-mode Sensitivity @ BER=10-10 -35 dBm Overload @ BER=10-10 -10 dBm Maximum receiver reflectance -14 dB

Transmitter:

Table 111 Tx specification Fiber type 9/125 Single-mode Maximum -20 dB width 1nm Minimum side mode suppression ratio 30 dB

Optical Output power Min: -5 dBm Max: 0 dBm

Minimum Extinction Ratio 10 dB N.B. The optical characteristics of these WDM interfaces correspond to the ones of the L-1.1

interfaces. N.B. All the figures are EOL.

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2 1

OSC2Tx

OSC2Rx

OSC1Tx

OSC1Rx

Hardware failure LED

Optical Safety

Label

Extraction hole


Figure 161 Front panel of OSC board LEDs signification

Table 112 Meaning of OSC board front panel LEDs

Red Green

Orange

LED is Red before software configuring is finished and becomes Green when board is configured correctly. It turns Orange when in downloading state or after pressing LAT button.

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3.11 OMSP unit OMSP performs optical multiplex section protection.

50/50 Splitter

OpticalSwitch

Tx out line 1

Tx out line 2

Rx in line 1

Rx in line 2

Rx in

Tx out F2

F3

F1

F4

N.B. The F4 port of optical switch is not used.

Figure 162 OMSP block diagram 3.11.1 Description An optical signal is received on Rx link coming from the C-MDX/C-OAD board and is split into two channels (channel 1 and 2) to send towards the CWDM line in the board by a 3dB splitter. The two optical signals received on CWDM line Rx link are sent to an optical switch. Under the control of board logic, the optical switch will select one channel optical signal to send towards the C-MDX/C-OAD board. The LOS detection is made on each of the two CWDM line RX input channels. Both splitter and optical switch are double-windows (1270～1350nm, 1460～1620nm) optical components. 3.11.2 Optical characteristics

Table 113 Absolute maximum ratings Symbol Parameter Value Unit

Insertion Loss IL (Min) dB West to east IL IL (Max) 4.0* dB IL (Min) dB

IL (Max) @ 1270 to 1350nm 1.9* dB East to west IL

IL (Max) @ 1460 to 1620nm 2.3* dB

* Including connectors and splices

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Rx inTx outTx outline 1

Tx outline 2

Rx inline 1

Rx inline 2 Extraction hole

Optical SafetyLabel

Hardware failure LED


Figure 163 Front panel of OMSP board

3.11.4 Front panel wiring

Table 114 Front panel wiring of OMSP board Name Signal

Rx in line 1 CWDM line input signal 1 (from line) Rx in line 2 CWDM line input signal 2 (from line) Tx out line 1 CWDM line output signal 1 (to line) Tx out line 2 CWDM line output signal 2 (to line) Tx out Selected optical signal output (to C-MDX or C-MDX) Rx in Protected optical signal input (from C-MDX or C-MDX)

LEDs signification

Table 115 Meaning of OMSP board front panel LEDs

Red Green

Orange


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3.12 I-LINK-S unit The I-LINK Slave is designated to connect the SPI bus from the Slave shelves only to the ESC-LC unit only provided in the Master shelf.

RS485Connector

RS485 transcievers

SPI BUS

RS485 transcieversand Card Presence

Identification

Alarm & Control

BAC

K PAN

EL

CardPresence bus

Figure 164 I-LINK-S block diagram

3.12.1 Description The I-LINK Slave is designated to be plugged into slot 1 of the slave shelf. The link to the SPI bus is made via an interface RS485. The I-LINK Slave unit can be inserted into a shelf (hot insertion) without causing any damage to itself or to any other unit.

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SP Always off

Power supply alarm LEDHardware failure LED

ExtractionHandle

ExtractionHandle

Always offAlways off

Connector for master shelf

PWR

Figure 165 Front panel of I-LINK-S board

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3.12.2.1 Front panel connectors

Table 116 Front panel connectors of the I-LINK-S board Name Type

- RS485 connector (see section 2.7.2.6) 3.12.2.2 LEDs signification

Table 117 Meaning of I-LINK-S front panel LEDs signification Name Meaning

PWR LED orange ON if there is an alarm on power supply on board. Otherwise LED orange off.

HWF Used by SPIDER: The Red LED is turned on (pin set low) by software during software reset. The Green LED is turned on (pin set low) by software when card configuring is finished. After pressing LAT button, it turns Orange.

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3.13 General user interfaces Two main functions are supported by vary small units: Provide the power supply to the other units Provide the electrical interface to operators

3.13.1 Power Supply Card Two power supply units are used: a) working and b) protecting. They are located in the slots 7 and 12 of the compact shelf or slot 25 and 48 of the CO shelf. These boards provide some +3.6 V and +5.5 V for service use to all units and a -48/-60 V power supply when needed. The input voltage range of the Power Supply Cards is -36 / -72 V. Front panel Connector: Sub-D 3 poles LEDs signification

Table 118 Meaning of Power Supply Card LEDs signification

Hardware Failure: GREEN when the board is plugged, configured and without failure RED when one of the On Board Power Supply (OBPS) is in failure (or on the power supply alarms). ORANGE after pressing LAT button.

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3.13.2 Power Management Unit (PMU) The PMU is strictly dedicated to the 1692MSE compact shelf. It is an external shelf able to feed the compact shelf providing the -48/-60Vdc to the power supply cards. Hence the 1692MSE compact shelf can be fed By the classical -48/-60Vdc provided by the telecom rack, By the -48V/-60Vdc provided by the PMU, able to deliver this powering from any alternative

voltage source. The PMU is an external shelf of the same size that the 1692MSE compact shelf, which can be installed in 19“ and 21“racks. This additional shelf is 1U high (1U = 44.45mm). The PMU works in a worldwide environment, which applies to the following requirements: US requirements: NEBS compliant (115V/ 60Hz), Europe requirements (230V/ 50Hz).

PSC boards are connected to the rectifiers of the PMU which provide the power.

Figure 166 PMU cabling scheme

3.13.2.1 Description The PMU architecture is made up of: 2 VAC inputs 2 VDC outputs without fuses 1 battery connection One control unit 2 rectifiers modules

On DC voltage outputs, no fuses are required because the 1692MSE compact shelf has on his PSC unit fuses on inputs. The outputs are connected together, so they can protect the DC outputs. Two rectifiers modules are present in one PMU. Each module is able to supply with power up to 4 stacked 1692MSE compact shelf. One module enables to supply the 4 stacked shelves. If one module fails, the other one can still supply the 4 shelves. The Control Unit must be able to provide the following functions: Deliver 2 outputs -48/-60Vdc

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Manage the battery Manage Status LEDs.

Figure 167 PMU block diagram

3.13.2.2 Batteries for PMU Batteries are optional units used with the PMU in order to supply the -48/-60V to the 1692MSE compact shelf in case of power outage of the alternative power source (100V/115V/220V supply). Battery units are linked to the Control unit of the PMU by cascading the units. The first battery gives a temperature measurement of the unit to the PMU so as to generate an alarm when out of the range. It is possible to add up to three optional batteries. This depends of the current consumption of the shelves (150W per battery). Performance. The battery must be charged in a maximum of 15 hours with 1 PMU and 1 shelf. The battery must be charged in a maximum of 60 hours with 1 PMU and 4 shelves. The battery duration for 150W must be of 3 hours. Mechanical dimension of each battery: W = 446.02 mm; L = 284 mm; H = 133.35 mm. Batteries can be inserted in a 19“ and 21“ (ETSI) rack or put on table. In Rack Version, the batteries are located below the PMU.

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Figure 168 Minimum configuration of the batteries in 1692MSE R3.0, rack version

In table version, batteries are located and stacked besides the PMU and 1692MSE compact shelves; only this configuration is supported since a battery is not likely to hold the full stack of batteries, PMU and shelves.

Figure 169 Maximum configuration of the batteries in 1692MSE R3.0, table version

The following figure is the front panel of PMU.

Figure 170 PMU front panel

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Connectors: 5) Battery connector. It has to be connected to the (optional) back-up battery. 6) Output power connector. Sub-D 3p to be connected to the two PSC(2) cards. 7) Not used in this release. 8) AC input power connector. To be connected to the primary AC power supply (100V/50–60Hz, 115V/60Hz, 230V/50Hz) LEDs signification

Table 119 Meaning of PMU LEDs signification Name Meaning

1) Green/Red

MAJOR alarm. The LED is – GREEN when the board is plugged and without failure – RED when the alarm is present (raised only if PMU_Presence). It is the OR of

• Both rectifiers are missing or both rectifiers input voltage < 85V rms • Both rectifiers output voltage <38V or >60V • Both rectifiers temperature >55 C or output current < 12A

2) Green/Red

MINOR alarm. The LED is – GREEN when the board is plugged and without failure – RED when the alarm is present (raised only if PMU_Presence). It is the OR of

• One rectifier is missing or one rectifier input voltage < 85V rms • One rectifier output voltage <38V or >60V • Battery present but battery breaker open

3) Green/Red

BATTERY CONNECTED. The LED is RED if battery connection is failed. The LED is GREEN if battery is connected.

4) Green/Red

TEST BATTERY. The LED is RED if test battery is failed. The LED is GREEN if test battery is OK. The LED is LIT OFF if no battery connected

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3.13.3 Housekeeping board (HK) 1692MSE may interface itself with the user's environment and/or another WDM system to build up operations maintenance. To allow these exchanges of information, HK (Housekeeping) unit may be mounted in slot 11 of the compact shelf or slot 36 of the CO shelf. Its main purpose is to: Send and receive data, to/from master cards via the SPI bus and to/from the user or another

WDM system throughout the protected I/O interface. Alarms are provided on failed battery and voltages losses.

Figure 171 Block diagram of control HK board

8 housekeeping accesses are provided in both directions (8 inputs and 8 outputs). Connector: Sub-D 25 pins LEDs signification

Table 120 Meaning of HK board LEDs signification

Hardware Failure: GREEN when the board is plugged, configured and without failure RED when one of the On Board Power Supply (OBPS) is in failure (or on the power supply alarms).

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3.13.4 Rack Alarm Interface board (RAI) The Remote Alarm Inventory Card receives signals from the ESC-LC and signals from the Bus Alarm (FAN-CO alarms and PSC/PSC2/PSC3 alarms). This information is sent to the PDU or the TRU card, and receives alarm signals from the PDU or TRU card to alert the ESC-LC.

Figure 172 Block diagram of RAI unit

The RAI board can be plugged in the slot 9/10 of the compact shelf or slot 37 of the CO shelf. 2 ways of working are available: For Interfacing with the PDU

The RAI cards in the same rack are linked to each other. And the RAI card in the master shelf is linked

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with the PDU. For Interfacing with the TRU

The same methods can be utilized but, in addition, a direct link between each shelf and the TRU can be used. The RAI card inputs are alarms coming from the FAN-CO card, from the PSC and from the Equipment Controller. Taking the various inputs into account the rack lamps are light on or off. Electrical characteristics: OPEN: Vmax=72 Volts CLOSE: Imax=100mA

Voltage difference between Common out and OUT*< 2.5 Volts Resistance of the closed relay= 300 M.(Max)

Connectors: SUB-D 9 pins female RJ11 6pins female

Table 121 Meaning of RAI board LEDs signification


Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface with both standards. The available alarms are the following. PDU Front Panel LED Markings (ANSI): CRI: Critical alarm from one of the shelves in the rack MAJ: Major alarm from one of the shelves in the rack MIN: Minor alarm from one of the shelves in the rack RACK: Alarm storing from one of the shelves in the rack

TRU Front Panel LED Markings (ETSI): URG: Urgent: major alarm input from one of the shelves in the rack NURG: Non urgent: minor alarm input from one of the shelves in the rack ATTD: Attended: acknowledged URG or NURG alarm SIG PRES: Signal presence (power on)

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3.13.5 LAN-Q board

Ethernetinterfaceadapter

TP-RJ45

COAXTRANSC

EQTYPE

SHELF-ID

IE-LAN OUT

IE-LAN INPUT

Hex rotary switches

N.B. If a wire is plugged on RJ45, BNC isunavailable.

Figure 173 Block diagram of control LAN-Q board 3.13.5.1 Purposes The purposes of the LAN-Q board are the following: To provide the physical layer for the QB interface between the Equipment shelf (ESC-LC board)

and an external supervisor (e.g. 1353SH). To provide the 4 bits Equipment type Codification, necessary for the application stored in the

Equipment Controller. To provide the 8 bits Shelf Identification number (i.e.: MAC address necessary to build up the IP

address of the shelf where the LAN-Q board is installed. 3.13.5.2 Description The LAN-Q board has to be plugged in slot #8 of the 1692MSE compact shelf or slot #26 of the CO shelf. It is linked to the ESC-LC board by a backpanel link. The link to external supervision equipment is ensured by 2 BNC connectors or by one RJ 45 connector. The Equipment Type Codification is ensured by the hexadecimal rotary switch CW3. The Shelf Identification is ensured by the two hexadecimal rotary switches CW1 and CW2. For a 1692MSE NE, the switches setting values are mandatory (B, F, 5). Jumper configuration For operation with the ESC-LC, only the following jumper settings are permitted: No jumper Jumper between pins A-D

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Front panel

Rotary wheels6 pins host for jumper

Back panel

Figure 174 LAN-Q board settings

3.13.5.3 LEDs signification

Table 122 Meaning of LAN-Q board LEDs signification


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3.14 FANS unit If the power consumption of the WLA is high enough, fans are necessary to dissipate the heat. 3.14.1 FAN-CO unit The fan is located at the bottom of the shelf. The use of fans requires an air filter be placed just below. This is shown in the following figure.

ESC

-LC

PSC

LAN

FAN-CO

PSC

Air filter Figure 175 Fan shelf description and rack partitioning

One FAN-CO module is placed at the bottom of the shelf, in the slot 49. The FANS are monitored via SPI bus and some direct wires are sent to the Housekeeping/Remote Alarms module to monitor a possible failure of the cooling system. Max Power dissipation per shelf: 400 W. 3.14.2 FAN unit On the 1692MSE shelf, FAN unit is located on the left side of the compact shelf. The use of fans requires putting an air filter just aside.

Slot 1

Slot 5Slot 4Slot 3Slot 2

7

12111098

13 PSC2

PSC2

LAN-QESC-LC

Slot 6

C-MDX-U/C-MDX-E-U-S

OSC

WLA-P/WLA

WLA-P/WLAWLA-P/WLAWLA-P/WLA OMSP

FAN

Airfilter

Figure 176 FAN description and Shelf partitioning

The FAN unit is placed in the left slot of the 1692MSE shelf and is equipped with two fans with

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speedometer sensors to essentially dissipate the heat coming from WLA and C-4xANY boards essentially. The FAN board is mandatorily provided. 3.14.3 LEDs signification One bi-color LED on the front-panel of the FAN/FAN-CO card is available.

Table 123 Meaning of FAN/FAN-CO board LEDs signification

Hardware Failure: GREEN when Power is on. RED when Hardware failure (HWF). ORANGE after pressing LAT button.

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MAINTENANCE

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4 MAINTENANCE WHEN CARRYING OUT THE GIVEN OPERATIONS OBWERVE THE NORMS STATED IN PARA.

4.1.2.IN HANDBOOK GUIDE 4.1 Maintenance introduction 4.1.1 General safety rules

SAFETY RULES Carefully observe the front panel warning labels prior to working on optical connections while the equipment is in–service. Should it be necessary to cut off power during the maintenance phase, proceed to switch off the power supply units as well as cut off power station upstream (rack or station distribution frame)

SAFETY RULES DANGER: Possibility of personal injury. Personal injury can be caused by -48 V dc. DANGER: Possibility of personal injury. Short circuiting, low-voltage, low-impedance, dc circuits can cause severe arcing that can result in burns and/or eye damage. Remove rings, watches, and other metal jewelry before working with primary circuits. Exercise caution to avoid shorting power input terminals.

SAFETY RULES DANGER: Possibility of eyes damage: read carefully and strictly observe the rules pointed out in para.3.2.4.2 in Handbook guide.

4.1.2 General rules Check that the equipment is operating with all the shields properly positioned (dummy covers, ESD connector protections, etc). In order to reduce the risk of damage the electrostatic sensitive devices, is mandatory to use the elasticized band (around the wrist) and the coiled cord joined connect with the ground rack during the touching of the equipment. 4.1.3 Maintenance - definitions Maintenance consists of a set of operation which maintain or bring back the assembly to optimum operating conditions in a very short time, with the aim of obtaining maximum operational availability. Maintenance is classified as: ROUTINE (PREVENTIVE)

Routine (preventive) maintenance consists in carrying out a number of periodic operations to minimize the risk of a failure on a link. These operations can be scheduled or initiated by the equipment supervision system.

ATTENTION EMC NORMS

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CORRECTIVE Corrective maintenance consists in carrying out a minimum number of operations to repair a fault as rapidly as possible. These operations are initiated by the equipment supervision system and limited to replacement of boards. Definition of the technical level of the maintenance agent: It is mandatory for the technicians in charge of the equipment maintenance to be familiar with the measurement techniques used on equipment fitted with optical connectors. 4.1.4 Instruments And Accessories There is a local terminal (PC) which permits to display all the alarms and manages the Equipment. The relative processing is described in the operator’s handbook. Where TMN is implemented, an Operation System displays alarms and manages all the connected Equipments of the network. Refer to the relevant handbooks. The need of special tools and accessories to perform possible routine and corrective maintenance procedures is described inside the procedures themselves. 4.2 Preventive maintenance The ALCATEL1692MSE equipment requires no systematic preventive maintenance. 4.2.1 Routine maintenance every year It is suggested to carry out the following operations yearly: Check that the power cable is perfectly safety grounded. Make sure that the shelf has been tightly fastened to the rack with screws to guarantee grounding

(the rack is connected to the station ground). 4.2.2 Routine maintenance of fan filter According to the filter type, it is suggested to carry out the following operations: Fan filter cleaning (3AL_86633_AA**) for 1692 CO shelf; Fan filter cleaning (3AN_51151_AA**) for 1692 compact shelf

The fan filter is the practice adopted for equipment installed in locations where the environmental conditions are compliant to EN 300 019-1-3 edition: 2004, class 3.1 and 3.2.

SAFETY RULES DANGER: Possibility of personal injury. Personal injury can becaused by –48 V dc. DANGER: Possibility of personal injury. Short circuiting, low-voltage,low-impedance, dc circuits can cause severe arcing that can result inburns and/or eye damage. Remove rings, watches, and other metaljewelry before working with primary circuits. Exercise caution to avoidshorting power input terminals.

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(Caution to avoid equipment damage)

Replace the “Fan filter” from the FAN Shelf as follows: Unscrew the screws that ensure the fan filter to the fans shelf Extract the fan filter Clean the fan filter removing the dust using a brush. It's not recommend to use water (to avoid

rusting the metal parts). Insert and ensure the “Fan filter” to the “FAN shelf“ using the relevant screw.

N.B. It is required to clean the fan filter every 3 to 6 months. And the fan filter should be replaced at least once a year. The period can be shorter depending on the location environmental conditions. 4.3 Corrective maintenance (troubleshooting) Since the troubleshooting procedure is carried out with the use of the Craft Terminal, for details, please refer to the Maintenance section of 1692MSE R3.2A Operator’s Handbook (3AL_97869_ADAA) or Troubleshooting Handbook. 4.4 Set of spare parts 4.4.1 Suggested Spare Parts The overall number of spares depends on Customer requirements, and should be based on the average amount of transmission circuits available to be accounted for not only during MTBF but also during MTTR; the latter depending on the amount of spare parts available. 4.4.2 General rules on spare parts management Before storing the spare units make sure that they are working by inserting them in an operating equipment It is suggested to periodically check those spare units have not been utilized for over a year. If the spare parts and the equipment are stored in the same environment, make sure that the spare parts are placed in cabinets to safeguard them from dust and damp. Moreover, they should also be well grounded to avoid electrostatic discharges.

SAFETY RULES DANGER: Possibility of personal injury. Personal injury can be causedby the rotating fans.

ATTACHING THE UNITS (AND MODULES) INTO THE SUBRACK (Caution to avoid equipment damage) The screw tightening torque for attaching the units (and modules, if any and if fixed byscrews) into the shelf must be:

2.8 kg x cm (0.28 Newton x m)± 10 % Exceeding this value may result in the screw breaking.

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If the spare parts are stored in another room, or have to be moved from another place, building or site, make sure that the following is observed: The spare parts must be wrapped in anti–static and padded envelopes; The spare parts must not touch wet surfaces or chemical agents that might damage them (e.g.,

gas); If during transport the temperature is lower than that of the room where they had been kept,

make sure that before using them they pass a certain period in a climatic chamber to prevent thermal shocks and/or the possibility of steaming up.

When replacing a unit/sub–unit, make sure that the spare unit/sub–unit is set exactly as the replaced one.

4.4.3 Particular rules on spare parts management Whenever some units with flash-memories are common to different kinds of equipment or to different versions of the same type of equipment, it is possible to maintain one spare part only: this allows spare part stock saving, even though software downloading will be necessary when the software loaded into the unit (program part or data part) is different from that necessary in the equipment where the spare unit must be used. At the end of the commissioning phase or after an equipment data change, it is suggested to save the equipment data, e.g. on floppy disk, and store this floppy disk in the spare part stock pointing out the equipment it refers to. 4.5 Operating advices

For this release 3.2A the user should take into account the following advice about the Equipment. Software management At the occurrence of one of the following things, select the CT Environment→Process control from the main menu to first close the EML-USM process and then restart the NE. Having changed the IP address if the corresponding IP access mode has been used to manage

the NE. The EML-USM doesn’t work anymore.

The WLA will not lock frequency when the signal frequency changes from higher to lower, if the higher frequency is times of lower one, e.g. change from STM-4 to STM-1, the bit rate read for FPGA is till STM-4 because of the chip's feature. This rule applies on SDH, GE and Fiber channel. The 3 STM-4 drawer configurations are the only configuration, which support a STM-4 rate in the first drawer position. Consequently, there is a STM-4 configurations order to respect to avoid having only one STM-4 drawer left in position 1. This should be followed by a STM-4 drawer de-configuration order for the same reasons, which is not the case. Others The time zone on PC should be set as "(GMT) Casablanca, Monrovia.” This time zone needn't be changed for daylight savings time. The button label's language on info-box is the same as the OS default language.

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4.6 Repair Form

To facilitate repair operation, data on the faulty unit must be reported on the form shown in the following figure. The repair form must be filled-in with as much data as possible and returned to Alcatel together with the faulty unit.

Figure 177 Repair form

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DISMANTLING & RECYLING

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5 DISMANTLING & RECYCLING 5.1 WEEE general information A new European directive was published on the 13th of February 2003 on wastes of electrical and electronic equipment (Directive 2002/96/EC). The general principle promoted by this directive is the producer responsibility in the management of the wastes coming from the products he puts on the market. The producer responsibility now covers the end of life of the products sold. This new split of responsibility will have impacts on Alcatel practices both as a producer of EEE equipment but also as an owner of EEE equipment. From August 13th 2005, Waste electrical and Electronic equipment (e-Waste) directive sets rules in terms of operational and financial responsibility for the collection and treatment of electrical and electronic equipment in Europe. Two responsibility regimes have been defined: Waste of household equipment. Alcatel only household implication is through its Joint

Venture with TCL on mobile phone ”TAMP”. Alcatel will check the appropriate consideration of the WEEE directive in the Joint Venture which covers the subject by itself independently from the Alcatel e-waste implementation project.

Waste of professional equipment. Alcatel owns and produces professional equipment; As a consequence this Chapter 12 of this handbook focuses on professional equipment responsibility regime.

There are two e-waste streams to be considered: Historical e-waste or waste of equipment put on the market before August 13th 2005 Two

possible regimes left open to implementation in each member state: either the owner of the equipment is responsible or

the producer of a new equipment which is purchased to replace an old equipment

Future waste or waste of equipment put on the market after August 13th 2005.The producer

of the equipment being sold is responsible unless otherwise specified in contract with Customer. In order to know when a unit or subrack has been put on the market it is necessary to read the date present on the Label affixed on the product (refer to para. 4.4 for Label position and type). In the following figure an example is given:

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Example:

FA Alcatel Italy – Città Ducale

01 Last two digits of production year; in the example is 2001

19 Week 19 in year 2001

63580 Product progressive number

F A 0 1 1 9 6 3 5 8 0

Year Week Alcatel

Location Company Date of production Progressive Number

Figure 178 Put on the market date

In next paragraphs is given a description example of how to disassemble an equipment; the same principle can be applied to all the subracks and units composing the equipment. The unit chosen for disassembly is one of the most complex. Para. 5.2 describes the equipment disassembly; in detail:

Para. 5.2.1 lists all the units composing the equipment with the relevant Waste code. Waste code permits to know the weight of the Subrack or Unit and the percentage of material composing the single item.

Para. 5.2.2 lists the tools necessary for disassembly

Para. 5.2.3 describes the subrack disassembly

Para. 5.2.4 describes the unit disassembly

Para. 5.2.5 describes the procedure to apply in order to manage Hazardous materials and components (example battery)

Para. 5.3 reports the ECO declaration information.

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5.2 How to disassembly equipment This equipment is designed for easy disassembly, by using screws and rivets for mechanical assembly of subracks and modules. The variety of screw types is minimized. Tools necessary for subrack and units disassembly are reported in para. 5.2.2. The disassembly process depends on the respective recycling methods and can be derived from the delivered assembly instructions of the product. Table 124 and Table 125 list all the units composing the equipment with the relevant Waste code. Waste code allows to know the weight of the Subrack or Unit and the percentage of material utilized for the single item. 5.2.1 Waste codes detailed information In Table 124 and Table 125 are listed all the items composing this equipment. In the column “Waste Code” it is possible to find the weight and the materials composing each “Part Number” according to the following rule:

Material Types: A Alluminium B Stainless Steel C Steel E Cables F Motors G Plastic H Back Panel J Generic PCB K PCB with electronic Capacitors L LCD display ( major than 100 cm2) M Cathode Ray Tube (Lead, Mercury, Phosfhors) N Battery (Lithium, Cadmium, Mercury) X Others Example: W1000J60A20X20 Means: W1000=Overall Weight of the item in grams J60= 60% Generic PCB = 600 grams A20= 20% Alluminium = 200 grams X20= 20% Other materials =200 grams

Figure 179 Waste code interpretation

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Table 124 Items waste codes list

Name Mnemonic ALCATEL Code Waste Code 1692 Metrospan Edge Compact Shelf / 2 - 3AL 97679 AA** t.b.d 1692 Metrospan Edge Compact Shelf / 3 - 3AL 97679 AB** t.b.d 1692 Metrospan Edge CO shelf - 3AL 86607 AA** t.b.d Optinex rack with TRU & Door - 3AL 37952 AA** t.b.d Optinex rack with TRU - 3AN 44815 AA** t.b.d Low Cost Equipment and Shelf Controller ESC-LC 3AL 97690 AA** t.b.d Local Access Network card LAN-Q 3AL 86653 AA** t.b.d Power Supply Card PSC 3AL 86652 AA** t.b.d Power Supply Card2 PSC2 3AL 86888 AA** t.b.d Power Supply Card3 PSC3 3AL 86652 AB** t.b.d Compact FAN / 2 FAN 3AL 97682 AA** t.b.d CO FAN module FAN-CO 3AL 86625 AA** t.b.d Housekeeping card HK 3AL 86668 AA** t.b.d Rack Alarm Interface board RAI 3AL 87009 AA** t.b.d Intershelf Link Slave I-LINK-S 3AL 86808 AA** t.b.d Optical Multiplex Section Protection card OMSP 3AL 97541 AA** t.b.d Supervision Management card OSC 3AL 97540 AA** t.b.d Wavelength Adaptor3 Without O-SNCP WLA3C 3AL 97795 AA** t.b.d Wavelength Adapte3 With O-SNCP WLA3COP 3AL 97795 AB** t.b.d OCC10-No Amplified Ch193.300 (1550) OCC10-NA-1550 (193.300) 3AL 95313 AA** t.b.d OCC10-No Amplified Ch193.000 (1550) OCC10-NA-1550 (193.000) 3AL 95313 AB** t.b.d OCC10-No Amplified Ch193.100 (1550) OCC10-NA-1550 (193.100) 3AL 95313 AC** t.b.d OCC10-No Amplified Ch193.200 (1550) OCC10-NA-1550 (193.200) 3AL 95313 AD** t.b.d OCC10-No Amplified Ch195.900 (1530) OCC10-NA-1530 (195.900) 3AL 95314 AA** t.b.d OCC10-Enhanced-CWDM (1530) OCC10-EC-1530 8DG81002AA** t.b.d OCC10-Enhanced-CWDM (1550) OCC10-EC-1550 8DG81002AB** t.b.d 2XGE - 3AL 97800 AA** t.b.d 2XGE-FC - 3AL 97878 AA** t.b.d SFP transceiver L1.1 RT (1310nm) L1.1 1AB194670002 t.b.d SFP transceiver 2M (1310nm) 2M 1AB209860001 t.b.d SFP transceiver S1.1 (1310nm) B&W S1.1 1AB194670001 t.b.d SFP transceiver S1.1 (1310nm) B&W with DDM

S1.1_DDM 1AB194670004 t.b.d

SFP transceiver L1.2 (1310nm) B&W with DDM

L1.2_DDM 1AB194670006 t.b.d

SFP transceiver S16.1 (1310nm) B&W S16.1 1AB196370001 t.b.d SFP transceiver S16.1 (1310nm) B&W with DDM

S16.1_DDM 1AB196370006 t.b.d


L16.1 1AB196370004 t.b.d


L16.2 1AB196370003 t.b.d

SFP transceiver S4.1 (1310nm) B&W S4.1 1AB196360001 t.b.d SFP transceiver S4.1 (1310nm) B&W with DDM

S4.1_DDM 1AB196360004 t.b.d


L4.2_DDM 1AB196360007 t.b.d

SFP transceiver I16 (1310nm) B&W I16 1AB196370002 t.b.d SFP transceiver I16 (1310nm) B&W with DDM I16_DDM 1AB196370005 t.b.d SFP transceiver 1000Base-SX (850nm) B&W GbE_SX 1AB187280002 t.b.d SFP transceiver 1000Base-SX (850nm) B&W with DDM

GbE_SX_DDM 1AB187280033 t.b.d

SFP transceiver 1000Base-LX (1310nm) B&W GbE_LX 1AB187280001 t.b.d SFP transceiver 1000Base-LX (1310nm) B&W with DDM

GbE_LX_DDM 1AB187280031 t.b.d

SFP transceiver 1000Base-ZX (1550nm) B&W with DDM

GbE_ZX_DDM 1AB187280042 t.b.d

SFP transceiver FC/2FC-SX (850nm) B&W with DDM

2FC SX_DDM 1AB187280037 t.b.d

SFP transceiver FC/2FC-LX (1310nm) B&W with DDM

2FC LX_DDM 1AB187280038 t.b.d

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CWDM wavelength SFP transceiver with PIN receiver (1470nm)

1470_Bronze 1AB196340001 t.b.d


1490_Bronze 1AB196340002 t.b.d


1510_Bronze 1AB196340003 t.b.d


1530_Bronze 1AB196340004 t.b.d


1550_Bronze 1AB196340005 t.b.d


1570_Bronze 1AB196340006 t.b.d


1590_Bronze 1AB196340007 t.b.d


1610_Bronze 1AB196340008 t.b.d

CWDM wavelength SFP transceiver with APD receiver Standard (1470nm)

1470_Silver 1AB196350001 t.b.d


1490_Silver 1AB196350002 t.b.d


1510_Silver 1AB196350003 t.b.d


1530_Silver 1AB196350004 t.b.d


1550_Silver 1AB196350005 t.b.d


1570_Silver 1AB196350006 t.b.d


1590_Silver 1AB196350007 t.b.d


1610_Silver 1AB196350008 t.b.d

CWDM wavelength SFP transceiver with PIN receiver (1470nm) with DDM

1470_Bronze_DDM 1AB196340009 t.b.d















CWDM wavelength SFP transceiver with APD receiver (1470nm) with DDM

1470_Silver_DDM 1AB196350026 t.b.d















4xANY Host card C-4xANY 3AL 95063 AA** t.b.d High speed 1310nm optical drawer HF_1310 Drawer 3AL 86672 AA** t.b.d Low speed 1310nm optical drawer LF_1310 Drawer 3AL 86674 AA** t.b.d High speed 850nm optical drawer HF_850 Drawer 3AL 86870 AA** t.b.d Low speed 850nm optical drawer LF_850 Drawer 3AL 86869 AA** t.b.d STM-1/4 optical drawer/2 SDH_1310 Drawer 3AL 95284 AA** t.b.d

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Unidirectional MUX/DEMUX without OSC filter

C-MDX-U 3AL 97538 AB** t.b.d

Unidirectional MUX/DEMUXE with OSC filter C-MDX-E-U-S 3AL 97769 AA** t.b.d Bi-directional MUX/DEMUX without OSC filter C-MDX-B 3AL 97538 AC** t.b.d Bi-directional MUX/DEMUX with OSC filter C-MDX-B-S 3AL 97538 AD** t.b.d Unidirectional MUX/DEMUX2 without OSC filter C-MDX2-U 3AL 97654 AA** W885A5B36E7G5J47 Unidirectional MUX/DEMUX2E with OSC filter

C-MDX2-E-U-S 3AL 97772 AA** W880A5B36E7G5J47


C-MDX2-E-1-S 3AL 97772 BA** W700A7B45E2G4J42

C-MDX2-E-2-4749-S 3AL 97772 CA** W775A6B41E4G3J46 C-MDX2-E-2-5153-S 3AL 97772 CB** W775A6B41E4G3J46 C-MDX2-E-2-5557-S 3AL 97772 CC** W775A6B41E4G3J46


C-MDX2-E-2-5961-S 3AL 97772 CD** W775A6B41E4G3J46

C-OAD-U-1-4747 3AL 97539 AB** t.b.d C-OAD-U-1-4949 3AL 97539 AC** t.b.d C-OAD-U-1-5151 3AL 97539 AD** t.b.d C-OAD-U-1-5353 3AL 97539 AE** t.b.d C-OAD-U-1-5555 3AL 97539 AF** t.b.d C-OAD-U-1-5757 3AL 97539 AG** t.b.d C-OAD-U-1-5959 3AL 97539 AH** t.b.d


C-OAD-U-1-6161 3AL 97539 AJ** t.b.d

C-OAD-E-U-1-4747-S 3AL 97770 AA** t.b.d C-OAD-E-U-1-4949-S 3AL 97770 AB** t.b.d C-OAD-E-U-1-5151-S 3AL 97770 AC** t.b.d C-OAD-E-U-1-5353-S 3AL 97770 AD** t.b.d C-OAD-E-U-1-5555-S 3AL 97770 AE** t.b.d C-OAD-E-U-1-5757-S 3AL 97770 AF** t.b.d C-OAD-E-U-1-5959-S 3AL 97770 AG** t.b.d


C-OAD-E-U-1-6161-S 3AL 97770 AH** t.b.d

C-OAD2-U-1-4747 3AL 97653 AA** W867A5B37E6G5J47 C-OAD2-U-1-4949 3AL 97653 AB** W867A5B37E6G5J47 C-OAD2-U-1-5151 3AL 97653 AC** W867A5B37E6G5J47 C-OAD2-U-1-5353 3AL 97653 AD** W867A5B37E6G5J47 C-OAD2-U-1-5555 3AL 97653 AE** W867A5B37E6G5J47 C-OAD2-U-1-5757 3AL 97653 AF** W867A5B37E6G5J47 C-OAD2-U-1-5959 3AL 97653 AG** W867A5B37E6G5J47


C-OAD2-U-1-6161 3AL 97653 AH** W867A5B37E6G5J47

C-OAD2-E-U-1-4747-S 3AL 97771 AA** W880A5B36E7G5J47 C-OAD2-E-U-1-4949-S 3AL 97771 AB** W880A5B36E7G5J47 C-OAD2-E-U-1-5151-S 3AL 97771 AC** W880A5B36E7G5J47 C-OAD2-E-U-1-5353-S 3AL 97771 AD** W880A5B36E7G5J47 C-OAD2-E-U-1-5555-S 3AL 97771 AE** W880A5B36E7G5J47 C-OAD2-E-U-1-5757-S 3AL 97771 AF** W880A5B36E7G5J47 C-OAD2-E-U-1-5959-S 3AL 97771 AG** W880A5B36E7G5J47


C-OAD2-E-U-1-6161-S 3AL 97771 AH** W880A5B36E7G5J47

C-OAD-U-2-47474949 3AL 97539 PA** W885A5B36E7G5J47 C-OAD-U-2-51515353 3AL 97539 QA** W885A5B36E7G5J47 C-OAD-U-2-55555757 3AL 97539 RA** W885A5B36E7G5J47


C-OAD-U-2-59596161 3AL 97539 SA** W885A5B36E7G5J47

C-OAD-E-U-2-47474949-S 3AL 97770 BA** W905A5B35E9G5J46 C-OAD-E-U-2-51515353-S 3AL 97770 BB** W905A5B35E9G5J46 C-OAD-E-U-2-55555757-S 3AL 97770 BC** W905A5B35E9G5J46


C-OAD-E-U-2-59596161-S 3AL 97770 BD** W905A5B35E9G5J46

C-OAD2-U-2-47474949 3AL 97653 BE** W885A5B36E7G5J47 C-OAD2-U-2-51515353 3AL 97653 BF** W885A5B36E7G5J47 C-OAD2-U-2-55555757 3AL 97653 BG** W885A5B36E7G5J47


C-OAD2-U-2-59596161 3AL 97653 BH** W885A5B36E7G5J47

C-OAD2-E-U-2-47474949-S 3AL 97771 BA** W900A5B35E8G5J47 2-channel unidirectional OADM2E with OSC filter C-OAD2-E-U-2-51515353-S 3AL 97771 BB** W900A5B35E8G5J47

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C-OAD2-E-U-2-55555757-S 3AL 97771 BC** W900A5B35E8G5J47 C-OAD2-E-U-2-59596161-S 3AL 97771 BD** W900A5B35E8G5J47

C-OAD2-U-4-47495153 3AL 97653 CA** t.b.d 4-channel unidirectional OADM2 without

OSC filter C-OAD2-U-4-55575961 3AL 97653 CC** t.b.d

C-OAD2-E-U-4-47495153-S 3AL 97771 CA** t.b.d 4-channel unidirectional OADM2E with OSC filter C-OAD2-E-U-4-55575961-S 3AL 97771 CB** t.b.d

C-OAD-B-1-4755 3AL 97539 FA** W933A5B34E9G4J48 C-OAD-B-1-4957 3AL 97539 GA** W933A5B34E9G4J48 C-OAD-B-1-5159 3AL 97539 HA** W933A5B34E9G4J48

1-channel bi-directional OADM without OSC filter

C-OAD-B-1-5361 3AL 97539 JA** W933A5B34E9G4J48

C-OAD-B-1-4755-S 3AL 97539 BA** W948A5B33E8G5J49 C-OAD-B-1-4957-S 3AL 97539 CA** W948A5B33E8G5J49 C-OAD-B-1-5159-S 3AL 97539 DA** W948A5B33E8G5J49

1-channel bi-directional OADM with OSC filter

C-OAD-B-1-5361-S 3AL 97539 EA** W948A5B33E8G5J49

N.B. 2XGE board and 2XGE-FC board have the same function. 2XGE with P/N 3AL97800AA** only support DC48V, while 2XGE-FC with P/N 3AL97878AA** can support DC48/60V. N.B. PSC3 board is only used on CO shelf.

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5.2.2 Tools necessary for disassembly The following tools are necessary for unit disassembly: # T9 TORX screw driver # T20 TORX screw driver Crosshead screwdriver Wrench # Scissors Protection gloves

5.2.3 Subrack disassembly Figure 180 and Figure 181 is shown an example of subrack. The same rules can be applied to the specific equipment to be dismantled. The front panel of the subrack can be removed by loosing the two handles.

Figure 180 Subrack front view

Figure 181 Subrack rear view

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Procedure: Remove the screws in order to disassemble the top cover as reported in the following figure.

Figure 182 Top cover removing

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Unscrew all the screws present on back cover as reported in the following figure. Remove the rear cover in order to access the subrack Back Panel.

Figure 183 Back cover removing

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Unscrew all the screws fastening the back board to the mechanical structure of the subrack as indicated in the following figure.

Remove the back board from the subrack mechanical structure.

Figure 184 Back board removing

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Remove the guides from the subrack as indicated in the following figure.

Figure 185 Guides removing

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Unscrew the screws fastening the dummy front panel to the mechanical structure of the subrack. And pick out the fixing bars as indicated in the following figure.

Figure 186 Dummy front panels and fixing bars removing

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Remove the side wall by unscrewing all the relevant screws as indicated in the following figure.

Figure 187 Side wall removing

1 2

5

43

Fixing bars

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5.2.4 Unit disassembly

Figure 188 Unit view

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Procedure: Remove the two screws from the bottom cover as indicated in the following figure.

Figure 189 Bottom cover removing

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Remove the screws that fix the two levers and subsequently pull out them from the front plate as indicated in the following figure.

Figure 190 Levers removal

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Extract the front panel from board as indicated in the following figure. Extract the fibers from the adapters as indicated in the following figure. Extract the fibers from the fiber supports as indicated in the following figure. Extract the gasket from the front panel as indicated in the following figure.

Figure 191 Front panel, fibers and gasket removing

Extract

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Remove the screws from PCB as indicated in the following figure. Remove the heat sink from the PCB board as indicated in the following figure.

Figure 192 Heat sink removing

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Remove the screws that fix the barket to board and pull it out from the board (refer to Figure 193).

Figure 193 Barket removing

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5.2.5 Hazardous materials and components Table 125 lists the presence (or not) of hazardous substance/components. N.B. The system cabling is designed for reduced halogen content. All the traffic cabling is fully

PVC free.

Table 125 List of hazardous materials and components present in the equipment

Materials/Substances Presence

In The Equipment

Where

Batteries External (Mercury/NiCad/Lithium/Other) NO

Batteries Internal (Mercury/NiCad/Lithium/Other) NO

Mercury NO Cadmium NO Capacitors with PCB’s Capacitors with substances of concern + height > 25 mm, diameter > 25 mm or proportionately similar volume

NO

Gas discharge lamps NO Mercury containing Backlighting lamps NO Plastic containing brominated flame retardants other than in Printed Circuit Assemblies.

NO

Liquid Crystal Displays with a surface greater than 100 cm2 NO

Asbestos NO Refractory ceramic fibers NO

Thermal conductive paste YES

Protective plastic gloves must be used in order to avoid contact between hands and thermal conductive paste. Pay attention to avoid contact of thermal conductive paste with eyes.

Radio-active substances NO Beryllium Oxide NO

Other forms of Beryllium YES

Refer to Figure 191. N.B.: Copper-beryllium contact spring must be separated from other material and must be fused in a specific regulated environment.

Pressure volume NO Liquids Volume NO Gasses Volume NO ”Hidden” mechanical springs or other equivalent parts. NO

Ozone depleting substances, according to those categories that are already banned in the Montreal protocol.

NO

Chloroparaffins with chain length 10-13 C atoms, chlorination greater than 50% contained in mechanical plastic parts heavier than 25g.

NO

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Lead contained in mechanical parts heavier than 25g. NO

Polychlorinated biphenyls (PCB) or polychlorinated terphenyls (PCT) NO

Polybrominated biphenyl’s and their others (CAS no. 32534-81-9, CAS no. 32536-52-0, CAS no 1163-19-5, CAS no. 13654-09-6) contained in mechanical parts heavier than 25g, in concentrations exceeding the natural background levels.

NO

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5.3 Eco declaration The 1692MSE product release 3.2A is CWDM equipment intended for the METRO ACCESS, enterprise and METRO CORE in the small cities. It is compliant with both ETSI and NEBS (level3) standards. It is designed for a small number of channels (8 in this version) and for very low cost application, without amplifiers. Key features Refer to para. 1.4 for details. Dimensional and Weight Characteristics Refer to para. 2.2, 2.3 and 2.5.1 for details. EXTENSION OF SYSTEM LIFETIME The product is designed to ensure an outstanding quality of services through very high traffic transmission, connection and protection performances and minimum service interruption. The life utility is at least 5 years. This means that maintenance will be assured for at least 5 years. The system architecture facilitates future extensibility and upgradability: On-site configuration changes as for example the extension of the node traffic capacity without re-cabling of interconnections. Implementation of new features and functionalities by remote Software download. The terms and conditions of warranty, service availability and spare parts availability are individually agreed between Alcatel and the Customer and are part of the relevant contractual commitments. POWER CONSUMPTION Refer to para. 2.5 for details. RADIO FREQUENCY EMISSION Regarding compliance with radio frequency emission requirements refer to para. 1.9. ACOUSTICAL NOISE Refer to para. 1.9.2.5 for details. MATERIALS Refer to paragraph 5.2.5 for details. DISASSEMBLY Refer to paragraph 5.2 for details. BATTERIES The product requires no backup batteries. PACKAGING The packaging of this Alcatel equipment complies with the directive 94/62/EEC concerning packaging and packaging waste. Depending on the means of transportation, the racks are packed in a cardboard or wooden box, which can easily be recycled after use. Environmentally harmful materials are not used for packaging. The packaging materials are marked according to ISO 11 469. If required by the Customer and agreed by both parties, Alcatel can take care of the proper disposal of all packaging materials.

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For details refer to” Installation Handbook”. TAKE BACK INFORMATION On request of customers, Alcatel can take care of the take back of depreciated equipment and of the ecological safe and appropriate disposal under conditions to be agreed. For that purpose Alcatel co-operates with qualified companies. DOCUMENTATION In order to reduce paper consumption for Customer Documentation, Alcatel delivers the Generic Customer Documentation on a CD-ROM. The CD-ROM contains interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance Manuals and User Guides. This allows the operator to put the documentation on a server accessible by all relevant people in the organization without any additional paper copies.

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END OF DOCUMENT

1692mse r3[1].2a technical handbook

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