1322x network node · in different applications and actual performance may vary over time. all...

Document Number: 1322xNNRMRev. 1.511/2010

1322x Network NodeReference Manual

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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.

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© Freescale Semiconductor, Inc. 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.

1322x Network Node Reference Manual, Rev. 1.5

Freescale Semiconductor i

ContentsAbout This Book

Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiOrganization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Chapter 1 Safety Information

1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2 FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2.1 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2.2 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.2.3 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.3 Regulatory Approval For Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Chapter 2 1322x Network Node Module Overview and Description

2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12.2 Available Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.4 Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32.5 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

Chapter 3 System Overview and Functional Block Descriptions

3.1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23.3 Power Management and Measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33.4 Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.5 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.6 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.7 128x64 Pixel Monochrome Graphic LCD Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.8 Debug/Development Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.9 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.10 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.11 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6

Chapter 4 Interface Locations and Pinouts

4.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2


ii Freescale Semiconductor

4.2.1 Supply Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.2.2 On/Off Switch and Power On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.3 RF Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.4 USB Connector (“B” Receptacle). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.5 LEDs, Switch, Buttons and Joystick. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.6 LCD Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.7 Debug/Development Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.7.1 ARM JTAG Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.7.2 Nexus Mictor Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-64.8 Audio Subsystem Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-74.9 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-74.10 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-84.11 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-94.12 Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10

Chapter 5 Schematic, Board Layout, and Bill of Material

Chapter 6 PCB Manufacturing Specifications

6.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4

MC1322x Network Node Reference Manual, Rev. 1.5

Freescale Semiconductor iii

About This BookThis manual describes Freescale’s 1322x Network Node evaluation board. The 1322x Network Node contains a Freescale third-generation, low power, 2.4 GHz radio frequency transceiver, with 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE Standard 802.15.4 MAC and AES security, and a full set of MCU peripherals into an 99-pin LGA Platform-in-Package (PiP).

AudienceThis manual is intended for system designers.

OrganizationThis document is organized into six chapters.Chapter 1 Safety Information — Highlights some of the FCC requirements.Chapter 2 1322x Network Node Module Overview and Description — This chapter

introduces 1322x Network Node (NN) which is an IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1322x device.

Chapter 3 System Overview and Functional Block Descriptions — This section provides an overview of the Network Node and block diagrams.

Chapter 4 Interface Locations and Pinouts — This chapter provides a description of the interface locations and pinout of the 1322x Network Node circuit board.

Chapter 5 Schematic and Bill of Materials — This chapter provides the schematic, board layout, and Bill of Materials (BOM).

Chapter 6 PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the 1322x Network Node printed circuit board (PCB).

Revision HistoryThe following table summarizes revisions to this document since the previous release (Rev 1.4).

Revision History

Location Revision

Chapter 2Chapter 4

Added dimensions to photos.

MC1322x Network Node Reference Manual, Rev. 1.5

iv Freescale Semiconductor

Definitions, Acronyms, and AbbreviationsThe following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital ConverterAES Advanced Encryption StandardARM Advanced RISC MachineCOG Chip on GlassCTS Clear to SendDAC Digital to Analog ConverterDMA Direct Memory AccessI2C Inter-Integrated Circuit is a multi-master serial computer busISM Industrial Scientific Medical 2.4 GHz radio frequency bandJTAG Joint Test Action GroupLCD Liquid Crystal DisplayLGA Land Grid ArrayMAC Media Access ControllerMCU Microcontroller UnitNEXUS An embedded processor development tool interface that helps design engineers

identify software and hardware-level issues. NN Network NodePCB Printed circuit boardPiP Platform in PackagePWM Pulse-width modulation RTS Request to SendSMA Connector Sub Miniature version “A” connector SPI Serial Peripheral InterfaceSSI Synchronous Serial InterfaceTACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.TELCO Telephone CompanyUSB Universal Serial BusVCP Virtual Com Port


Freescale Semiconductor 1-1

Chapter 1 Safety Information

1.1 FCC GuidelinesThis equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful.

1.2 FCC LabelingFCC labels are physically located on the back of the board.

1.2.1 47 C.F.R. Sec. 15.21This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.• Consult the dealer or an experienced radio/TV technician for help.

Safety Information


1-2 Freescale Semiconductor

1.2.2 47 C.F.R. Sec.15.105(b)This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions:

1. This device may not cause harmful interference.2. This device must accept any interference received, including interference that may cause undesired

operation.3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon.

1.2.3 47 C.F.R. Sec.15.203An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded.

1.3 Regulatory Approval For CanadaThis Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7.

Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.

1.4 Disposal InstructionsThis product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal.

http://www.freescale.com/productdisposal



Chapter 2 1322x Network Node Module Overview and Description

2.1 IntroductionThe 1322x Network Node (NN) is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322x device. The heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.

The 1322x Network Node provides a platform to evaluate the MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The Network Node surrounds the core device with capabilities that provide a complete 802.15.4 radio, user interface, debugging capabilities, connection to personal computers (PCs) and other devices, and portability.

Figure 2-1. 1322x Network Node

(40 mm)

(100 mm)

5.31 inches (135 mm)

3.93 inches

1.57 inches

1322x Network Node Module Overview and Description



2.2 Available DevicesThe MC1322x family is available as two part numbers. These device types differ only in their ROM contents, all other device hardware, performance, and specifications are identical:

• MC13224V - this is the original version and is the generic part type. It is intended for most IEEE 802.15.4 applications including MAC-based, ZigBee-2007 Profile 1, and ZigBee RF4CE targets.

• MC13226V - this is a more recent version and is intended specifically for ZigBee-2007 Profile 2 (Pro) applications. Only the onboard ROM image has been changed to optimize ROM usage for the ZigBee Pro profile and maximize the amount of available RAM for application use - — The IEEE MAC/PHY functionality has been streamlined to include only that functionality

required by the ZigBee specification. Similar to the MC13224V, the MC13226V does not support the Beaconing or GTS MAC/PHY features. The MAC functionality is 802.15.4 compatible.

— Certain drivers present in the MC13224 ROM were removed. These were the ADC, LCD_font, and SSI drivers. These drivers are still available as library functions, but now compile into the RAM space.

— The Low Level Component (LLC) functionality has also been streamlined for the ZigBee specification

NOTEThe MC1322x Network Node is available with either the MC13224 or the MC13226. The MC13226 version is identified by exception from the MC13224 version. For the MC13226, the node PCB has a special “13226-NCB” label located between the lower part of the LCD and the push button switch array.

2.3 FeaturesThe 1322x Network Node provides the following features:

• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack

• Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP)

• MC1322x provides a highly integrated, low cost RF node— On-board balun and antenna switch in package— Typical -95 dBm sensitivity— Typical 0 dBm output power, with max approximately +2 dBm— SMA connector with external antenna

• USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications• 128x64 pixel chip-on-glass monochrome, graphic LCD with LED backlight




• Audio subsystem— 2.5mm audio jack for microphone and mono earpiece— Input amplifier and anti-aliasing filter for an electret microphone— Output path to second order analog filter from either 10-bit serial DAC or PWM as output

signal sources— I2C controlled 32-position linear nonvolatile volume control for audio circuit— Audio output amplifier for both earpiece or on-board dynamic speaker (switched by headset

jack)• Two debug / development interfaces

— 20-pin connector for standard JTAG debug interface— 38-pin MICTOR connector for extended NEXUS real-time debug interface

• Power management circuit with on-board regulation for multiple power sources— Can be powered from USB interface, DC power jack or two AA batteries— On/Off power switch— Power-on green LED

• User interface switches and LEDs— 4-directional TACT switch with center push for application purposes— 4 pushbuttons for application purposes— 4 processor controlled red LEDs for application purposes— Reset switch

• 26-pin user header for selected General Purpose Input Output signals and data interfaces• System clock options

— Default 24 MHz crystal reference oscillator (13 to 26 MHz crystal optional)— Reference oscillator can be driven from an external source— Optional 32.768 kHz crystal oscillator for accurate real-time delays

2.4 Driver ConsiderationsWhen users first plug a 1322x Network Node into the system, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory:C:\Program Files\Freescale\Drivers

If installing the BeeKit software package to another drive or directory, indicate the Drivers directory created by the installer in the custom location where BeeKit was installed.

Follow the instructions as they appear on the screen to complete driver installation.

If BeeKit is not installed, be aware of the following:• The 1322x Network Node uses the FTDI serial to USB converter, Virtual COM Port (VCP) driver

for Windows, available at www.ftdichip.com/ftdrivers.htm.. (Direct (D2XX) drivers are also available.)

http://www.ftdichip.com

http://www.ftdichip.com




• The FTDI web site offers drivers for other platforms including Windows® (98 through Vista x64 and CE), MAC OS (8 through X) and Linux.

• Download the appropriate driver and follow the instructions to complete driver installation.

2.5 Board Level SpecificationsTable 2-1. 1322x Network Node Specifications

Parameter Units Notes/Conditions

MIN TYP MAX

General

Size (Enclosure: X, Y, Z) 135x100x40 mm

Size (PCB: X, Y) 125 x 854.92 x 3.35

mminches

Layer build (PCB) 0.80.032

mminches

4-Layer

Dielectric material (PCB) FR4

Power

Voltage supply (DC) 4.4 5 12 V

Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification

Voltage supply (Batteries) 3 3.2 V

Current consumption 100 mA

Temperature

Operating temperature (see note) -20 +25 +70 °C The operating temperature is limited to +70°C due to the switches and the monochrome-graphic LCD module. Basic circuit is good for a maximum temperature of +85 °C

Storage temperature -30 +25 +70 °C

USB interface USB 2.0 and 1.1 full-speed compatible

Audio

Audio (Input) -40 dB Accepts electret microphone element

Audio (Output)

Attenuation

RF

802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band

Range (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board)

RF Transmitter




802.15.4 Output power -30 0 +2 dBm Over range of Pout from IC control in 2 dB steps.Note: On channel 26, output power should

not exceed -5 dBm (power setting 0x0E) to meet FCC Part 15 requirements.

Harmonics2nd harmonics3rd harmonics

-30-30

dBmdBm

Harmonics are compliant to ETSI and FCC regulatory approval standards

RF Receiver

802.15.4 sensitivity -92 -95 dBm <1% PER for 20-byte packets

Regulatory Approval

FCC Product is approved accordingly to the FCC part 15 standard

CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard

CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards

Safety

UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards

Environment

RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003

WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003

Table 2-1. 1322x Network Node Specifications

Parameter Units Notes/Conditions



Chapter 3 System Overview and Functional Block DescriptionsThis section provides an overview of the Network Node and block diagrams.

3.1 System Block DiagramThe following is the 1322x Network Node system level block diagram.

Figure 3-1. 1322x Network Node Block Diagram

24 MHz 32.768KHz

AudioOutputDAC

DAC101S101

Earphone

PowerManage-

ment

DC Adaptor

2xAA Battery

USB Bus Power

VCC

MC13224V/226VAdvanced ZigBee™- Compliant PiP

ExtClock

Source13-26MHz Clk Clk

DebugInterface38-Pin

MICTORConn

NEXUSNEXUS

DebugInterface20-PinJTAGConn

JTAGJTAG

PowerMeasure-

ments

128x64MonochromeGraphic LCD

Optrex(OPTREX#F-51553)

LCD

Step-UpDC-DC

Converter

SMA Connector

AudioMic Input w/

Amp / LP Filter

ADC Mic

SSI

TMR3 - PWMAudioOutput

Amp / LPFilter

AudioVolumeControl

MAX5434

AudioAmp

NCP4896 Speaker

GPIO26-PinHeader

GPIO User Apps

USBInterfaceFT232RQ

UART USBConn

GPIO 4 Push Buttons, Joystick,

Reset Switch,On/Off Switch

GPIO 4 Red LEDs,1 Green LED

System Overview and Functional Block Descriptions



3.2 System OverviewThe heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.

The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4 applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core.

Figure 3-2. MC1322x Block Diagram

On-board peripherals include• Two dedicated UART modules capable of 2Mbps with CTS/RTS support• SPI port with programmable master and slave operation• Keyboard interface capability.• Two 12-bit analog-to-digital converters (ADCs) with 8 input channels• Four independent 16-bit timers with PWM capability.• Inter-integrated circuit (I2C) interface• Synchronous Serial Interface (SSI) with I2S and SPI capability and FIFO data buffering

TIMERMODULE

(TMR)(4 Tmr B locks)

UARTMODULE(UART0)

UARTMODULE(UART1)

SYNC SERIALINTERFACE

(SSI/i2S)

KEYBOARDINTERFACE

(KBI)

INTER-IC BUSMODULE

(I2C)

SERIALPERIPHERALINTERFACE

(SPI)

DUAL12-BITADC

MODULE

GPIO and IOCONTROL

UP

TO

64

IO P

INSARM7

TDMI-S32-BITCPU

BUSINTERFACE& MEMORY

ARBITRATOR

ARMINTERRUPT

CONTROLLER(AITC)

JTAG/Nexus

DEBUG

ADVANCEDSECURITYMODULE

(ASM)

CLOCK &RESET

MODULE(CRM)

RADIOINTERFACE

MODULE(RIF)

96KBYTESRAM

(24K WORDS x32 BITS)

80KBYTEROM

(20KWORDS x32 BITS)

RFOSCILLATOR

&CLOCK GENERATION

SPIFLASH

MODULE(SPIF)

802.15.4MAC

ACCELERATOR(MACA)

DIGITALMODEM

TXMODEM

RXMODEM

128KBYTENON-VOLATILE

MEMORY(SERIALFLASH)

ANALOGTRANSMITTER

ANALOGRECEIVER

RFTX/RX

SW ITCH

IEEE 802.15.4 TRANSCEIVER

BALUN

ANALOGPOW ER

MANAGEMENT&

VOLTAGEREGULATION

MC1322xPlatform-in-Package (PiP)IEEE 802.15.4/ZIGBEE SOLUTION

BuckRegulator

24 MHz (typ) 32.768 KHz (optional)

BATTERYDETECT




The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +2 dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna.

Figure 3-3. MC1322x RF Interface

Augmenting the core device on the Network Node are:• Low-cost 2.4 GHz ISM Band radio• 2.0 USB connection• User interface with pushbuttons, LEDs and 128x64 pixel graphic LCD• Versatile power sources and management• Debug / development ports• Audio subsystem• GPIO connector for system expansion

Users are encouraged to reference the board schematic for the following sections.

3.3 Power Management and MeasurementTo allow maximum versatility, the Network Node can be powered via a DC source (typically an AC-DC converter; nominally 5 Vdc), the USB node, or an onboard battery pack with 2 AA alkaline batteries.

• The DC source or USB will automatically shutdown the battery supply.• The DC source and the USB power are regulated to 3.3 V, however, the raw battery pack voltage

directly supplies the circuitry• All sources are isolated via diodes.• An on/off switch and a power-on LED are provided (see Section 4.2.2, “On/Off Switch and Power

On Indicator”).• Zero-ohm resistors are provided to allow isolation and measurement of various system components

(see Section 4.2.3, “Power Measurement”)

ANALOGTRANSMITTER

ANALOGRECEIVER

RFTX/RX

SWITCHBALUN

LNA

PA




3.4 Low-cost 2.4 GHz ISM Band radioThe MC1322x provides an onboard balun, antenna switch, and LNA. The only external component required for the radio is an antenna. The Network Node provides a PCB-mounted SMA that connects to an external antenna for a complete solution. Figure 3-4 shows the RF network external to the MC1322x.

• Typical output power is 0 dBm, with +2 dBm max• Typical sensitivity is -95 dBm.• Frequency range is 2405 to 2480 MHz• Typical range (outdoors, line of sight) is 300 meters

Figure 3-4. Network Node RF Network

The onboard SMA connector is used to mount the provided antenna (see Section 4.3, “RF Circuitry”). The provided antenna must be used to comply with FCC certification.

3.5 USB InterfaceFor many applications or demonstrations it is desirable to connect the Network Node to a PC or other device. A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232R USB UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the module.

The USB interface is configured as a "Bus Powered" device and will therefore draw all required power from the USB interface. The device is USB 2.0 full speed compatible.

3.6 User InterfaceThe Network Node provides multiple means for user interface for both debug and demonstration.

• Four individual pushbuttons can be used as input, and a 4-direction tactile joystick switch with center push is wired in parallel with the individual pushbuttons. These pushbuttons have interrupt generation capability, while the joystick center push does not.

• Four individual LEDs can be used as indicators for debug or status.

J7SMA

L13.9nHNot Mounted

C31pFNot Mounted

RF_RX_TX

RFC54

10pF

RF_GND




3.7 128x64 Pixel Monochrome Graphic LCD DisplayThe Network Node supports a 128x64 pixel chip-on-glass (COG) STN transmissive monochrome graphic LCD that provides for alpha-numeric or graphic readout. The LCD module is mounted on top of the main circuit board and connects via a flat flex cable (FFC).

• The display is an OPTREX #F-51553GNBJ-LW-AB• Viewing area is 66.8 (W) × 35.5 (H) mm• The LCD operates from 5 Vdc generated from the main operating voltage - The LCD module

requires a highly regulated 5 V so that the high voltages generated onboard the display are consistent.

• The LCD has white LED backlighting with a typical current of 40 mA when full on. The backlighting is switched by a FET and can be modulated to save current and vary the intensity.

• LCD interface to the MCU is via an 4-bit parallel, nibble mode interface• The onboard controller is a member of the Epson S1D15605 Series family with an integrated

display data RAM

3.8 Debug/Development InterfacesThere are two separate debug ports (for pinouts see Section 4.7, “Debug/Development Connectors”). A 20-pin connector is provided for a standard JTAG debug interface. This a lower cost option that only requires a simple interface cable to connect to the PC and uses standard ARM software development tools.

A separate 38-pin Mictor connector is uniquely provided on this module to support the extended capability Nexus real-time debug interface for the ARM processor.

3.9 Audio SubsystemThe audio subsystem provides means for simple output sounds/tones or for TELCO voice quality audio.

• A 2.5mm stereo jack is provided to interface to a typical telephone-type headset with an electret microphone and a single earphone.

• Audio input - The audio input is taken from the headset electret microphone (mic).— An onboard 10 k-ohm resistor circuit biases the mic for an ~1 Vdc operating voltage.— The mic AC signal is filtered and amplified through a active low-pass filter with a voltage gain

of about 30 (~30 dB). The filter topology is a multiple feedback (MFB) 3-pole, linear phase design. The target cutoff frequency is 3.6 kHz. The filter is intended as an anti-aliasing filter for sampled data.

— The input amplifier output is sampled via the onboard MC1322x ADC. The sampling frequency is programmable.

• Audio output source - The audio output can be sourced from both a serial 10-bit DAC and a PWM timer output.— The 10-bit serial DAC uses the SSI port to send provide the digital sample data.— The PWM timer output is typically modulated to create a Class-D amplifier. Secondarily, a

simple 50% duty cycle signal can provide simple tones.




— The audio output source is jumper selectable via J10• Audio output processing - The DAC or PWM out signal is filtered through an active 2-pole LPF.

From the filter the signal passes through a passive attenuator, and then is amplified and driven to either an on-board speaker or the headset earphone.— The attenuator provides a volume control that is controlled via a software programmable, linear

32-tap non-volatile digital potentiometer. The interface to the potentiometer is the I2C port.— The onboard speaker is automatically disconnected if a headset is plugged-in.

3.10 GPIO ConnectorThe GPIO connector (J2) provides a number of data interfaces and GPIO for external system expansion, Section 4.9, “GPIO Connector” gives details.

• A number of the GPIO are shared with the LCD interface. User should take care to avoid conflict and may have to disable the LCD to use some GPIO or ports.

• Power supply voltage is provided— Current draw should be limited to 50 mA.— A separate regulated voltage can be enabled.

• Provision is made to supply an external reference clock if desired.

3.11 ClocksThe 1322x Network Mode provides for two system clock sources.

• MC1322x Reference Oscillator - The default frequency for the reference oscillator is 24 MHz and the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two additional options for the module— X1 can be replaced by 13-26 MHz crystal (it must meet MC1322x specifications), however,

the onboard PLL must be used in this case. The PCB provides for PLL filter components, but these are not populated. See the MC1322x Reference Manual for more information on using a non-default reference frequency.

— An external clock source can be supplied as the reference source (typically 24 MHz). The frequency must accurate to +/-40ppm. The external clock source is supplied through GPIO Connector J2, and crystal X1 must be removed and capacitor C58 mounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1).

• 32.768 kHz Crystal Oscillator - Provision is also made for an optional secondary 32.768 kHz crystal X2. This oscillator can be used for a low power accurate timebase. The module comes without this crystal and its load capacitors C7 and C12 unmounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1).



Chapter 4 Interface Locations and PinoutsThis chapter provides a description of the interface location and pinout of the 1322x Network Node PCB.

4.1 OverviewThis chapter provides the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and connectors on the 1322x Network Node PCB. Users should reference the figures in the subsequent sections while moving through this chapter and reference the circuit board schematic in Chapter 5, “Schematic, Board Layout, and Bill of Material”, for additional information.

NOTEThe MC13226 version board has a “13226-NCB” label located between the LCD and pushbutton switch array.

Figure 4-1. Network Node PCB Top View

F

Tact SwitchesOn-Off Switch

JTAG ConnectorGPIO Connector

USB

DCSupply

Joystick

RF Connector

LCD Display

Audio Connector

Buzzer

Mictor Connector

4.92 inches (125 mm)

3.35

inch

es (8

5 m

m)

Interface Locations and Pinouts



4.2 Power ManagementThe module can be powered from the DC power jack, the USB port, or the battery pack.

4.2.1 Supply SourcesTable 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100 mA.

Table 4-1. Power Supply Sources

4.2.2 On/Off Switch and Power On IndicatorThe following are used with the power management:

• Switch SW7 - 4-pole slide switch disconnects all sources• Green LED D5 - indicates power from any source

4.2.3 Power MeasurementIt is possible to isolate various circuit blocks to measure current draw via 0-ohm resistors. The resistors are all mounted as default.

Below is a list of the supplies.• R68 -> VCC (Output from on-board regulator)• R65 -> VBATT (Supply for 1322x)• R80 -> V_DIS (Supply for display circuit)• R43 -> V_AUD (Supply for audio circuit)• R64 -> 3V (Output from on-board regulator for GPIO customer access), or alternately, R66 (not

mounted) can enable separate regulator U12.

Source Connector Min(Volts)

Typical(Volts)

Max(Volts) Notes

DC Source J5 4.4 5 12 Use DC only source. The connector is a 2 mm DC power jack; positive center conductor.

USB J6 4.4 5 5.25 Series “B” receptacle connector

AA Battery Pack

BC1 ~2.0 3 3.2 Two AA cells. Battery pack is automatically disabled by either DC source or USB. Accessible through the door on the bottom of the plastic enclosure.




4.3 RF CircuitryThe external antenna is connected via the provided SMA connector (J7).

NOTEOnly the provided Antenova® antenna (model Titanus) should be used with this module. This RF design has been certified with this antenna.

Figure 4-2. Antenova® Titanus Model Antenna

4.4 USB Connector (“B” Receptacle)The USB connector is designated as J6. Figure 4-3 shows the connector pinout.

Figure 4-3. USB Connector Pinout




4.5 LEDs, Switch, Buttons and JoystickThe Network Node contains a total four red LEDs and one green LED

• The four red LEDs are driven by the MCU and controlled by the software application.• As previously stated, the green LED is directly connected to the on-board regulator and acts as a

"Power On" indication.

As also previously stated, SW7 is an on/off slide switch that connects the power supplies.

There are five pushbuttons total.• One pushbutton (SW5) is separate and provides a master hardware Reset.• Four additional pushbuttons are connected to the MCU GPIO for software application. These

buttons all have interrupt generation capability

A joystick (SW6) is also provided.• The joystick is a 4-direction TACT Switch with Center Push.• The 4-directional TACT switches are connected in parallel with the four user pushbuttons.• The center push switch is separate and does not have interrupt generation capability

Table 4-2. Switch and LED Summary

Item GPIO Connection Feature

PWR (green) VCC ‘Power On’ indication

LED1 (red) KBI_1 Application specific



LED4 (red) TX_ON Application specific

SW1 (pushbutton) KBI_4 Interrupt functionality. In parallel with SW6 (right).

SW2 (pushbutton) KBI_5 Interrupt functionality. In parallel with SW6 (down).

SW3 (pushbutton) KBI_6 Interrupt functionality. In parallel with SW6 (left).

SW4 (pushbutton) KBI_7 Interrupt functionality. In parallel with SW6 (up).

SW5 (RST) RESETB HW reset

SW6 (right) KBI_4 Interrupt functionality. In parallel with SW1.

SW6 (down) KBI_5 Interrupt functionality. In parallel with SW2.

SW6 (left) KBI_6 Interrupt functionality. In parallel with SW3.

SW6 (up) KBI_7 Interrupt functionality. In parallel with SW4.

SW6 (center) KBI_0_HST_WK Host wake up output functionality. No interrupt functionality




4.6 LCD ConnectorThe LCD module is connected to the main circuit board via a 30-conductor flat flex cable (FFC) with 0.5 mm spacing. The main board connector is an FFC, Right Angle Dip, zero insertion force (ZIF), 30 pin connector (J13).

NOTEThe LCD connector is a ZIF unit. Be sure to release the connector before trying to connect or disconnect the LCD FFC to the PCB.

4.7 Debug/Development Connectors

4.7.1 ARM JTAG Interface ConnectorThe MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly separated from the GPIO pin header (J2) and located at the rear side of the module. The 20-pin connector has Pin 1 marking for correct plug-in of the development cable.

Table 4-3 shows the device pins that are connected to the associated JTAG header pinouts if the JTAG connector is used.

Table 4-3. ARM JTAG 20-Pin Connector Assignments (J1)

Name1

1 NC means No Connect.

Pin # Pin # Name

VCC 1 2 VCC

NC2

2 MC1322x does not support separate JATG reset TRST.

3 4 GND

TDI 5 6 GND

TMS 7 8 GND

TCK 9 10 GND

RTCK 11 12 GND

TDO 13 14 GND

RESET3

3 VCC through a 100k-ohm pullup.

15 16 GND

NC 17 18 GND

NC 19 20 GND




4.7.2 Nexus Mictor Interface ConnectorThe MC1322x also supports connection to a subset of the defined Nexus Mictor connector. The hardware interface is a 38-pin Mictor 0.64mm/0.025inch spacing target connector (J11). Table 4-4 shows the device pins that are connected to the associated Mictor pinouts. The 38-pin MICTOR connector has a “plug security” to prevent reverse plug-in. J11 is located on the component side of the main board near the GPIO connector. The plastic box cover must be removed to use the Nexus Mictor connection.

Table 4-4. Nexus 38-Pin Mictor Connector Assignments (J11)

Name1

1 NC means No Connect.

Pin # Pin # Name

NC 1 2 NC

NC 3 4 NC

NC 5 6 RTCK

NC 7 8 NC

VCC (pullup)2


9 10 EVTI_B

TDO 11 12 VCC3

3 VCC isolated by a 1k-ohm resistor.

NC 13 14 RDY_B

TCK 15 16 MDO07

TMS 17 18 MDO06

TDI 19 20 MDO05

RESET4


21 22 MDO04

NC 23 24 MDO03

NC 25 26 MDO02

NC 27 28 MDO01

NC 29 30 MDO00

NC 31 32 EVTO_B

NC 33 34 MCKO

NC 35 36 MSEO1_B

NC 37 38 MSEO0_B




4.8 Audio Subsystem ConnectionsThe audio subsystem uses the following connections:

• 2.5mm stereo jack J12 - for headset mic and earphone• Jumper J10 - selects audio output source. See Figure 4-4 for connections.

Figure 4-4. J10 Audio Output Source Jumper

4.9 GPIO ConnectorThe GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header. The connector provides access to MCU GPIO, an external clock source connection, a timer output, ADC inputs, the SSI port, a UART port, the SPI port, the I2C port, and the serial DAC output. Power is also provided on the connector.

• VCC is the main supply voltage. Current draw should be limited to 50 mA.• CLKIN can be used to supply an external reference clock (nominally 24 MHz). The onboard

crystal must be removed and an ac-coupling capacitor added.• A number of the GPIO are shared with the LCD interface. Best practice is to disable the LCD data

interface to used these signals (see Table 4-5 below).• The serial DAC output is available at the connector. The DAC output should not be selected as the

output audio source (J10) when used offboard.Table 4-5. GPIO Connector J2 Pinouts

Pin Name Function Notes

1 TMR1 Timer I/O or GPIO Hardwired to LCD control output.

2 CLKIN Source for external clock to reference oscillator

• 13-26 MHz reference clock with <40 ppm accuracy • Onboard crystal must be removed • Enable signal to MC1322x by adding C58, 10pF; see

schematic

3 VCC Voltage supply from module 3V output from on-board regulation

4 GND System ground

5 ADC1 ADC Analog Input Channel or GPIO

6 ADC2 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.



11

2 2

33

J10

TSM-103-01-L-SV

1-2 DAC3-2 PWM

Audio Select

SERIAL DAC

PWM

AUD FILTER INPUT




4.10 FLASH Memory Recovery Jumpers and EraseThe MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of doing so:

• JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can be changed.

• Load new FLASH image via UART1 port -

NOTEThe 1322x Network Node provides access for UART1 through the USB connection. If users need to use UART1 with Test Tool running on a PC, they must access the UART through the USB port as a virtual COM port.

— The Freescale BeeKit IDE download provides a software tool called “Test Tool”. This application runs on a PC and can be used with a client running on the MC1322x to test the platform.

— Test Tool also has the capability to load a new image into the FLASH.


10 DAC_OUT Serial DAC Output Jumper J10 selects DAC output as audio output source

11 SSI_TX SSI Port or GPIO Hardwired to serial DAC

12 SSI_RX SSI Port or GPIO

13 SSI_FSYN SSI Port or GPIO Hardwired to serial DAC

14 SSI_BITCLK SSI Port or GPIO Hardwired to serial DAC

15 KBI_0_HST_WK Hardwired to “center” on joystick

16 KBI_4 Hardwired to “right” on joystick and SW1

17 UART2_TX UART2 or GPIO

18 UART2_RX UART2 or GPIO

19 UART2_RTS UART2 or GPIO Hardwired to LCD control output.

20 UART2_CTS UART2 or GPIO Hardwired to LCD control output.

21 I2C_SCL I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50

22 I2C_SDA I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50

23 SPI_SCK SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.

24 SPI_SS SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.

25 SPI_MOSI SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.

26 SPI_MISO SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.

Table 4-5. GPIO Connector J2 Pinouts (continued)




NOTEThe FLASH must first be cleared before loading a new image to FLASH.

The 1322x Network Node has two jumper sites (J19 and J20, Figure 4-5) that must be used to erase the FLASH:

1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar. 2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar.3. Turn on power, push the reset button, and wait a few seconds.4. Turn off power.5. Remove the jumper shorting bars.6. The board is now ready for boot operation.

After the FLASH is erased, the module can be loaded with a new image through the USB port using Test Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit Wireless Connectivity Toolkit download.

Figure 4-5. FLASH Erase Headers

4.11 ADC Voltage ReferencesTwo ADC reference voltages are provided:

• The reference voltage for ADC2_VREFH is tied to VCC which is regulated when the board is supplied from the DC source or the USB port. However, this voltage moves with VCC when power is supplied via the battery source.

• A fixed voltage reference for ADC1_VREFH is provided (see Figure 4-6).— The fixed voltage is 1.5 Vdc.— The LM285M (U17) is programmed via R120 and R121 to provide a constant reference— The reference can be enabled via Jumper J18.— This reference is useful for battery operation where a known, fixed high reference voltage for

the ADC is required.

ADC2_VREFH -> "0"ADC2_VREFL -> "1"

Recovery Mode

12

J19

HDR_2X1 12

J20

HDR_2X1

R10310K

TP103

C2100nF TP3

R10410K

VCC

ADC2_VREFH

VCC

ADC2_VREFL




Figure 4-6. ADC Voltage 1.5 Vdc Voltage Reference

4.12 Jumper SelectionTable 4-6 lists all the possible jumper selections for the Network Node. The jumpers available on the board are as follows:

• J10 - used to select audio output source• J14 - used to disable LCD data buffer if GPIO are used with connector J2 (GPIO Interface)• J18 - Sets fixed ADC reference voltage• J19, J20 - used to clear MC1322x onboard FLASH. See Table 4-6.

Table 4-6. Network Node Jumper Selection

Pin Header

Pin NumberConnection Description Default

Setting

J10 1-2

2-3

Connect to enable audio path from DAC

Connect to enable audio path from PWM

Not mounted

Mounted

J14 1-2 Connect to disable the LCD data bus buffer Not mounted

J18 1-2 Connect to enable ADC 1.5V reference Not mounted

J19, J20 1-2, 1-2 Connect both to recover/clear FLASH. See Section 4.10, “FLASH Memory Recovery Jumpers and Erase”

Not mounted

1.5V

R110K

11

22

33

44 5 5667 788

U17

LM285M

R12124.9K1%

R120120K1%

12

J18

HDR_2X1

Not Mounted

VCC

ADC1_VREFH

Schematic, Board Layout, and Bill of Material



Cha

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5

Sche

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Bill

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4 4

3 3

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H1

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H5

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1_C

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1_R

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1_R

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1_C

TS

UA

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1_R

X

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TS

RE

SE

T

RE

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T

RT

CK

RT

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SW

ITC

H1

SW

ITC

H2

SW

ITC

H3

SW

ITC

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SW

ITC

H5

UA

RT

2_T

X

UA

RT

2_R

TS

UA

RT

2_R

X

UA

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2_C

TS

SP

I_S

CK

SP

I_S

CK

SP

I_M

OS

I

SP

I_S

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SP

I_M

ISO

I2C

_S

CL

AD

C1

AD

C2

AD

C3

AD

C4

AD

C5

AD

C2

AD

C3

AD

C4

AD

C5

UA

RT

2_T

X

UA

RT

2_R

X

UA

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2_C

TS

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I2C

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I2C

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CL

I2C

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SP

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TM

R1

TM

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SS

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N

SS

I_R

X

SS

I_T

X

SS

I_B

ITC

KS

SI_

FS

YN

SS

I_R

X

SW

ITC

H1

SW

ITC

H5

DA

C_O

UT

DA

C_O

UT

TD

O

TD

I

TC

K

TM

S

TD

I

TD

O

TC

K

TM

S

RE

SE

T

TD

O

TC

K

TM

S

TD

I

RT

CK

MD

O0

MD

O1

MD

O2

MD

O3

MD

O4

MD

O5

MD

O6

MD

O7

MD

O0

MD

O1

MD

O2

MD

O3

MD

O4

MD

O5

MD

O6

MD

O7

MC

KO

RD

Y_B

MS

EO

1_B

MS

EO

0_B

EV

TI_

B

EV

TO

_B

EV

TI_

B

RD

Y_B

EV

TO

_B

MC

KO

MS

EO

1_B

MS

EO

0_B

VT

RE

F

CLK

IN

CLK

IN

UA

RT

2_C

TS

UA

RT

2_R

TS

TM

R1

TM

R0

SP

I_S

S

SP

I_M

ISO

SP

I_M

OS

I

SP

I_S

CK

AD

C2

AD

C3

AD

C4

AD

C5

TM

R2

TM

R2

TM

R0

RE

SE

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36

_X

_--

---

-

C8

100pF

C8

100pF

R14

1K

R14

1K

X2

32.7

68kH

z

Not M

ounte

d

X2

32.7

68kH

z

Not M

ounte

d

R83

10K

Not M

ounte

d

R83

10K

Not M

ounte

d

TP

103

TP

103

R11

220R

R11

220R

R1

10K

R1

10K

J1

90122-2

0

J1

90122-2

0

11

33

55

77

99

11

11

13

13

15

15

17

17

19

19

22

44

66

88

10

10

12

12

14

14

16

16

18

18

20

20

SW

5

DT

SM

63N

RESE

T

SW

5

DT

SM

63N

RESE

T3

12

4

TP

10

TP

10

Dis

pla

y

Dis

pla

y

TM

R1

TM

R0

SP

I_S

S

SP

I_M

ISO

SP

I_M

OS

I

AD

C2

AD

C3

AD

C4

AD

C5

TM

R2

SP

I_S

CK

V_D

IS

UA

RT

2_R

TS

UA

RT

2_C

TS

R13

1K

R13

1K

ZZ

4

M3x8.0

mm

ZZ

4

M3x8.0

mm

D3

LH

R974

LED3

D3

LH

R974

LED3

R6

390R

R6

390R

TP

83

TP

83

RE

F3

Ref

RE

F3

Ref

11

US

B/P

ow

er

Supply

US

B/P

ow

er

Supply

UA

RT

1_C

TS

UA

RT

1_T

X

UA

RT

1_R

TS

UA

RT

1_R

X

V_A

UD

V_D

IS

TP

78

TP

78

R104

10K

R104

10K

C11

1nF

C11

1nF

TP

76

TP

76

R70

0R

Not M

ounte

d

R70

0R

Not M

ounte

d

MH

2M

H2

1

R64

0R

R64

0R

R5

240R

Not M

ounte

d

R5

240R

Not M

ounte

d

TP

70

TP

70

ZZ

3

M3x8.0

mm

ZZ

3

M3x8.0

mm

TP

6T

P6

TP

71

TP

71

R122

1K

R122

1K

C4

27nF

Not M

ounte

d

C4

27nF

Not M

ounte

d

TP

45

TP

45

C49

1uF

C49

1uF

C48

4.7

uF

C48

4.7

uF

R3

0R

R3

0R

R102

10K

R102

10K

SW

2

DT

SM

63N

SWIT

CH2

SW

2

DT

SM

63N

SWIT

CH2

3

12

4

TP

8T

P8

TP

72

TP

72

C55

10pF

Not M

ounte

d

C55

10pF

Not M

ounte

d

X1

24.0

0M

Hz

X1

24.0

0M

Hz

C3

1pF

Not M

ounte

d

C3

1pF

Not M

ounte

d

TP

80

TP

80

MH

3M

H3

1

TP

73

TP

73

ZZ

1

Label 1322X

-NC

B

ZZ

1

Label 1322X

-NC

B

R69

0R

R69

0R

D12

MB

R0520LT

1

D12

MB

R0520LT

1

L1

3.9

nH

Not M

ounte

d

L1

3.9

nH

Not M

ounte

d

TP

1T

P1

R9

390R

R9

390R

C58

10pF

Not M

ounte

d

C58

10pF

Not M

ounte

d

R81

1K

Not M

ounte

d

R81

1K

Not M

ounte

d

R105

0R

R105

0R

R123

1K

R123

1K

C12

22pF

Not M

ounte

d

C12

22pF

Not M

ounte

d

TP

74

TP

74

R4

0R

Not M

ounte

d

R4

0R

Not M

ounte

d

RE

F2

Ref

RE

F2

Ref

11

ZZ

5

M3x8.0

mm

ZZ

5

M3x8.0

mm

U1

MC

13224V

U1

MC

13224V

UA

RT

2_R

TS

13

EV

TI_

B132

MC

KO

/IO

50

131

MS

EO

0_B

114

EV

TO

_B

123

RD

Y_B

122

MS

EO

1_B

113

VB

AT

T45

LR

EG

_B

K_F

B44

CO

IL_B

K43

AD

C2_V

RE

FL

61

AD

C1_V

RE

FL

62

AD

C1_V

RE

FH

63

AD

C2_V

RE

FH

64

AD

C0

1

AD

C1

2

AD

C2

3

AD

C3

4

AD

C4

5

AD

C5

6

AD

C6

7

AD

C7_R

TC

K8

MD

O00

103

MD

O01

102

MD

O02

112

MD

O03

111

MD

O04

121

MD

O05

120

MD

O06

130

MD

O07

129

TD

I10

RF

_G

ND

58

TD

O9

UA

RT

2_C

TS

14

UA

RT

2_R

X15

TC

K11

TM

S12

RE

SE

TB

51

VR

EG

_A

NA

55

XT

AL_24_O

UT

49

RF

_P

LL_F

LT

46

XT

AL_24_IN

50

KB

I_0_H

ST

_W

K42

XT

AL_32_IN

47

AN

T_1

56

XT

AL_32_O

UT

48

RF

_R

X_T

X60

AN

T_2

57

UA

RT

2_T

X16

RX

_O

N59

PA

_P

OS

54

PA

_N

EG

53

TX

_O

N52

UA

RT

1_R

TS

17

UA

RT

1_C

TS

18

UA

RT

1_R

X19

UA

RT

1_T

X20

I2C

_S

DA

21

I2C

_S

CL

22

TM

R3

23

TM

R2

24

TM

R1

25

TM

R0

26

SP

I_S

CK

27

SP

I_M

OS

I28

SP

I_M

ISO

29

SP

I_S

S30

SS

I_B

ITC

K31

SS

I_F

SY

N32

SS

I_R

X33

SS

I_T

X34

KB

I_1

41

KB

I_2

40

KB

I_3

39

KB

I_4

38

KB

I_5

37

KB

I_6

36

KB

I_7

35

GN

D_F

LA

G_1

75

DIG

_R

EG

124

NV

M_R

EG

133

GN

D_F

LA

G_2

76

GN

D_F

LA

G_3

77

GN

D_F

LA

G_4

78

GN

D_F

LA

G_5

79

GN

D_F

LA

G_6

84

GN

D_F

LA

G_7

85

GN

D_F

LA

G_8

86

GN

D_F

LA

G_9

87

GN

D_F

LA

G_10

88

GN

D_F

LA

G_11

93

GN

D_F

LA

G_12

94

GN

D_F

LA

G_13

95

GN

D_F

LA

G_14

96

GN

D_F

LA

G_15

97

GN

D_F

LA

G_16

104

GN

D_F

LA

G_17

105

GN

D_F

LA

G_18

106

GN

D_F

LA

G_19

115

NC

165

NC

266

NC

367

NC

468

NC

569

NC

670

NC

771

NC

872

NC

973

NC

10

74

NC

11

80

NC

12

81

NC

13

82

NC

14

83

NC

15

89

NC

16

90

NC

17

91

NC

18

92

NC

19

98

NC

20

99

NC

21

100

NC

22

101

NC

23

107

NC

24

108

NC

25

109

NC

26

110

NC

27

116

NC

28

117

NC

29

118

NC

30

119

NC

31

125

NC

32

126

NC

33

127

NC

34

128

NC

35

134

NC

36

135

NC

37

136

NC

38

137

NC

39

138

NC

40

139

NC

41

140

NC

42

141

NC

43

142

NC

44

143

NC

45

144

NC

46

145

TP

46

TP

46

R103

10K

R103

10K

Audio

Audio

SC

LK

AU

DIO

_P

WM

Din

AU

DIO

_M

IC

SY

NC

DA

C_O

UT

V_A

UD

VO

L_S

CL

VO

L_S

DA

SW

6

SK

RH

A

SW

6

SK

RH

A

C3

A1

Ce

2

D4

Co

5B

6

NC

17

NC

28

J19

TS

M-1

02-0

1-L

-SV

J19

TS

M-1

02-0

1-L

-SV

11

22

PC

B1

JD

P7050_3

PC

B1

JD

P7050_3

TP

82

TP

82

TP

9T

P9

TP

75

TP

75

J20 T

SM

-102-0

1-L

-SV

J20 T

SM

-102-0

1-L

-SV

11

22

AN

T1

F_A

nte

nna

AN

T1

F_A

nte

nna

R12

100K

R12

100K

D4

LH

R974

LED4

D4

LH

R974

LED4

SW

4

DT

SM

63N

SWIT

CH4

SW

4

DT

SM

63N

SWIT

CH4

3

12

4

ZZ

2

M3x8.0

mm

ZZ

2

M3x8.0

mm

J2

90122-2

6

J2

90122-2

6

11

33

55

77

99

11

11

13

13

15

15

17

17

19

19

21

21

23

23

25

25

22

44

66

88

10

10

12

12

14

14

16

16

18

18

20

20

22

22

24

24

26

26

TP

5T

P5

R66

0R

Not M

ounte

d

R66

0R

Not M

ounte

d

R8

390R

R8

390R

C1

10pF

Not M

ounte

d

C1

10pF

Not M

ounte

d

C6

100nF

C6

100nF

D2

LH

R974

LED2

D2

LH

R974

LED2

J11

767054-1

J11

767054-1

11

33

55

77

99

11

11

13

13

15

15

17

17

19

19

21

21

23

23

25

25

27

27

29

29

31

31

33

33

35

35

37

37

22

44

66

88

10

10

12

12

14

14

16

16

18

18

20

20

22

22

24

24

26

26

28

28

30

30

32

32

34

34

36

36

38

38

GND139

GND240

GND341

GND442

GND543

R124

1K

R124

1K

C9

10nF

Not M

ounte

d

C9

10nF

Not M

ounte

d

C5

180nF

Not M

ounte

d

C5

180nF

Not M

ounte

d

R65

0R

R65

0R

D5

LG

R971

POW

ER

D5

LG

R971

POW

ER

C10

1uF

Not M

ounte

d

C10

1uF

Not M

ounte

d

R121

24.9

K

1%

R121

24.9

K

1%

C50

100nF

C50

100nF

TP

79

TP

79

TP

4T

P4

SW

1

DT

SM

63N

SWIT

CH1

SW

1

DT

SM

63N

SWIT

CH1

3

12

4

R120

120K

1%

R120

120K

1%

C2

100nF

C2

100nF

J7

SM

A

J7

SM

A

C7

22pF

Not M

ounte

d

C7

22pF

Not M

ounte

d

SW

3

DT

SM

63N

SWIT

CH3

SW

3

DT

SM

63N

SWIT

CH3

3

12

4

RE

F1

Ref

RE

F1

Ref

11

R125

1K

R125

1K

TP

7T

P7

U17

LM

285M

U17

LM

285M

11

22

33

44

55

66

77

88

J18

TS

M-1

02-0

1-L

-SV

J18

TS

M-1

02-0

1-L

-SV

11

22

MH

4M

H4

1

TP

44

TP

44

R82

1K

Not M

ounte

d

R82

1K

Not M

ounte

d

MH

1M

H1

1

R7

390R

R7

390R

D1

LH

R974

LED1

D1

LH

R974

LED1

TP

11

TP

11

C54

10pF

C54

10pF

TP

77

TP

77

TP

3T

P3

TP

81

TP

81

U12

LT

1129C

ST

-3.3

U12

LT

1129C

ST

-3.3

Vin

1V

out

3

GN

D1

2

GN

D2

4




Figu

re5-

2. S

chem

atic

(2 o

f 4)

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Audi

o Am

plifi

er

Audi

o DA

C

Aud

io A

mp

Enab

le

Aud

io A

mp

Dis

able

Aud

io S

elec

t1-

2 D

AC

3-2

PWM

Audi

o Fi

lter

Mic

. Am

plifi

er/A

nti-a

lias

Filte

r

Mic

. Bia

sing

AU

DIO

_M

IC

Din

SC

LK

AU

DIO

_P

WM

SY

NC

DA

C_O

UT

V_A

UD

VO

L_S

DA

VO

L_S

CL

V_A

UD

V_A

UD

V_A

UD

V_A

UD

V_A

UD

V_A

UD

VC

CV

CC

V_A

UD

V_A

UD

V_A

UD

V_A

UD

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

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of

Page T

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:

ICA

P C

lassific

ation:

FC

P:

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O:

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BI:

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: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

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C

Tuesday, M

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h 2

3, 2010

Audi

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atic

46

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:

Siz

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ocum

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Rev

Date

:S

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of

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:

ICA

P C

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ation:

FC

P:

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O:

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BI:

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: S

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-23452 P

DF

: S

PF

-23452

D1

1322

X-N

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C

Tuesday, M

arc

h 2

3, 2010

Audi

o Sc

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atic

46

_X

_--

---

-

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

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:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

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BI:

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: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

Audi

o Sc

hem

atic

46

_X

_--

---

-

R26

100K

R26

100K

R15

10K

R15

10K

J10

TS

M-1

03-0

1-L

-SV

J10

TS

M-1

03-0

1-L

-SV

11

22

33

BU

Z1

ND

T-0

3C

BU

Z1

ND

T-0

3C

+1

-2

NC

13

NC

24

R87

10K

R87

10K

R24

100K

R24

100K

C46

270pF

C46

270pF

C22

100nF

C22

100nF

C20

47pF

C20

47pF

+ -

U2B

MC

33204D

TB

G

+ -

U2B

MC

33204D

TB

G

5 6

7

R84

0R

R84

0R

C16

100pF

C16

100pF

R109

0R

R109

0R

TP

25

TP

25

R29

47K

R29

47K

R86

1.8

K

R86

1.8

K

+ -

U2D

MC

33204D

TB

G

+ -

U2D

MC

33204D

TB

G

12

13

14

U4

DA

C101S

101

U4

DA

C101S

101

SC

LK

5V

DD

3

GN

D2

SY

NC

6

Din

4

Vo

ut

1

C15

10U

F

C15

10U

F

C25

1uF

C25

1uF

R67

27K

R67

27K

TP

18

TP

18

R25

1K

R25

1K

R34

0R

Not M

ounte

d

R34

0R

Not M

ounte

d

C30

22nF

C30

22nF

TP

24

TP

24

R20

200K

R20

200K

R33

0R

R33

0R

C44

1uF

C44

1uF

R23

100K

R23

100K

R85

11K

R85

11K

R106

4.7

K

R106

4.7

K

R30

220R

R30

220R

R56

4.7

K

R56

4.7

K

TP

49

TP

49

R32

0R

Not M

ounte

d

R32

0R

Not M

ounte

d

C29

4.7

nF

C29

4.7

nF

TP

48

TP

48

TP

23

TP

23

C45

220nF

C45

220nF

C19

22uF

C19

22uF

C47

3.3

nF

C47

3.3

nF

TP

51

TP

51

C24

1uF

C24

1uF

C28

47nF

C28

47nF

U6

NC

P4896

U6

NC

P4896

INM

C1

SE

/BT

LA

1

VP

1B

1

GN

DB

3O

UT

BA

3

NC

B2

OU

TA

C3

BY

PA

2

SD

C2

U13

MA

X5434

U13

MA

X5434

VC

C1

GN

D2

SD

A4

SC

L3

L6

W5

TP

20

TP

20

+ -

U2A

MC

33204D

TB

G

+ -

U2A

MC

33204D

TB

G

3 2

1

4 11

R57

4.7

K

R57

4.7

K

TP

16

TP

16

R110

0R

R110

0R

R88

51K

R88

51K

C21

100nF

C21

100nF

C13

100nF

C13

100nF

R60

8.2

K

R60

8.2

K

J12

ST

X-2

550-5

NT

R

J12

ST

X-2

550-5

NT

R13 5 42

+-

U2C

MC

33204D

TB

G

+-

U2C

MC

33204D

TB

G

10

8

9

TP

15

TP

15

C14

10U

F

C14

10U

F

TP

19

TP

19

R58

27K

R58

27K

TP

50

TP

50

R61

13K

R61

13K

R107

4.7

K

R107

4.7

K

R111

0R

R111

0R

TP

22

TP

22

TP

17

TP

17

R59

27K

R59

27K

C27

100nF

C27

100nF




Figu

re5-

3. L

CD

Sch

emat

ic (3

of 4

)

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

P/S

IRS

LE

D_P

WM

RE

SN

VD

D

D4

D3

D2

D1

D0

V2

V3

V4

VO

UT

CA

P3-

CA

P2+

CA

P2-

CA

P1-

CA

P1+

V1

D5

D6

D7

GN

D

RD

N

CS

N

A0

WR

N

V5

AD

C4

AD

C3

SP

I_M

OS

I

SP

I_M

ISO

SP

I_S

S

V_D

IS

UA

RT

2_C

TS

TM

R1

TM

R0

UA

RT

2_R

TS

AD

C5

TM

R2

AD

C2

SP

I_S

CK

5V

_LC

D

5V

_LC

D

5V

_LC

D

V_D

IS

5V

_LC

D

V_D

IS

5V

_LC

D

V_D

IS

V_D

IS

V_D

IS

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

Disp

lay

Sche

mat

ic

56

_X

_--

---

-

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

Disp

lay

Sche

mat

ic

56

_X

_--

---

-

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

Disp

lay

Sche

mat

ic

56

_X

_--

---

-

U14B

74H

CT

04A

U14B

74H

CT

04A

34

L3

22uH

L3

22uH

R101

100K

R101

100K

C75

4.7

UF

US

E M

UR

AT

A P

AR

T

C75

4.7

UF

US

E M

UR

AT

A P

AR

T

U14C

74H

CT

04A

U14C

74H

CT

04A

56

+

C60

47uF

+

C60

47uF

R96

200R

R96

200R

TP

96

TP

96

C74

10nF

C74

10nF

TP

91

TP

91

TP

101

TP

101

TP

102

TP

102

+

C70

1uF

+

C70

1uF

R100

100K

R100

100K

J13

6210_30_sm

d

LC

D C

ON

NE

CT

OR

J13

6210_30_sm

d

LC

D C

ON

NE

CT

OR

11

22

33

44

55

66

77

88

99

10

10

11

11

12

12

13

13

14

14

15

15

16

16

17

17

18

18

19

19

20

20

21

21

22

22

23

23

24

24

25

25

26

26

27

27

28

28

29

29

30

30

31

31

32

32

TP

88

TP

88

TP

94

TP

94

TP

89

TP

89

U14D

74H

CT

04A

U14D

74H

CT

04A

13

12

TP

99

TP

99

R98

100K

R98

100K

TP

90

TP

90

C72

100nF

C72

100nF

C62

10nF

C62

10nF

U14A

74H

CT

04A

U14A

74H

CT

04A

12

714

+

C67

1uF

+

C67

1uF

R99

100K

R99

100K

TP

97

TP

97

U15

MA

X1676E

UB

+

U15

MA

X1676E

UB

+

GN

D

8

LX

9

SH

DN

6F

B1

BA

TT

7

LB

O3

RE

F5

OU

T1

0

CLS

EL

4L

BI

2

G

D S

Q2

ZV

N3320F

G

D S

Q2

ZV

N3320F

+

C63

4.7

uF

+

C63

4.7

uF

R90

47 O

HM

US

E V

ISH

AY

PA

RT

R90

47 O

HM

US

E V

ISH

AY

PA

RT

U14E

74H

CT

04A

U14E

74H

CT

04A

11

10

+

C66

1uF

+

C66

1uF

128x64

Monochrome-Graphic

Liquid Crystal Display

D11

F-5

1553G

NB

J-L

W-A

B

128x64

Monochrome-Graphic

Liquid Crystal Display

D11

F-5

1553G

NB

J-L

W-A

B

01

30

24

03

50

46

+ A

no

de

1

- C

ath

od

e2

C59

100nF

C59

100nF

TP

95

TP

95

+C

68

1uF

+C

68

1uF

R44

7.1

5 O

HM

R44

7.1

5 O

HM

TP

100

TP

100

U14F

74H

CT

04A

U14F

74H

CT

04A

98

C61

100nF

C61

100nF

R91

0R

Not M

ounte

d

R91

0R

Not M

ounte

d

TP

93

TP

93

U16

MC

74LV

XC

3245D

T

U16

MC

74LV

XC

3245D

T

A1

4

A2

5

A3

6

A4

7

A5

8

A6

9

A7

10

A0

3

OE

22

T/R

2

B1

20

B2

19

B3

18

B4

17

B5

16

B6

15

B7

14

B0

21

VC

CB

24

GN

D1

3G

ND

11

GN

D1

2

VC

CA

1

NC

23

R89

470K

R89

470K

+

C73

47uF

+

C73

47uF

+C64

4.7

uF

+C64

4.7

uF

TP

98

TP

98

R97

100K

R97

100K

C71

100nF

C71

100nF

+

C65

4.7

uF

+

C65

4.7

uF

TP

92

TP

92

+

C69

1uF

+

C69

1uF

J14

TS

M-1

02-0

1-L

-SV

J14

TS

M-1

02-0

1-L

-SV

11

22




Figu

re5-

4. S

chem

atic

(4 o

f 4)

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

USB

Inte

rface

Pow

er M

anag

emen

tPo

wer

Mea

sure

men

t

2xAA

Cel

ls

UA

RT

1_T

X

UA

RT

1_C

TS

UA

RT

1_R

X

UA

RT

1_R

TS

V_A

UD

V_D

IS

V_U

SB

V_U

SB

V_A

UD

VC

C

V_M

AIN

V_D

IS

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

USB/

Pow

er S

uppl

y Sc

hem

atic 6

6

_X

_--

---

-

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

USB/

Pow

er S

uppl

y Sc

hem

atic 6

6

_X

_--

---

-

Dra

win

g T

itle

:

Siz

eD

ocum

ent N

um

ber

Rev

Date

:S

heet

of

Page T

itle

:

ICA

P C

lassific

ation:

FC

P:

FIU

O:

PU

BI:

SO

UR

CE

: S

CH

-23452 P

DF

: S

PF

-23452

D1

1322

X-N

CB

C

Tuesday, M

arc

h 2

3, 2010

USB/

Pow

er S

uppl

y Sc

hem

atic 6

6

_X

_--

---

-

R68

0R

R68

0R

U10

FT

232R

U10

FT

232R

TxD

30

RxD

2

RT

S3

2

CT

S8

DT

R3

1

DS

R6

DC

D7

RI

3

AG

ND

24

GN

D1

4

GN

D2

17

VC

C1

9V

CC

IO1

3V

3O

UT

16

US

BD

M1

5

US

BD

P1

4

RE

SE

T1

8

OS

CI

27

OS

CO

28

EP

33

CB

US

49

CB

US

31

1

CB

US

21

0

CB

US

12

1

CB

US

02

2

NC

15

NC

21

2

NC

31

3

GN

D3

20

NC

42

3

NC

52

5

NC

62

9T

ES

T2

6

RT

1

500m

A

RT

1

500m

A

R51

0R

R51

0R

TP

41

TP

41

C43

15pF

C43

15pF

D8

MB

R0520LT

1

D8

MB

R0520LT

1

TP

38

TP

38

TP

32

TP

32

C35

100nF

C35

100nF

SW

7-1

MM

S42R

SW

7-1

MM

S42R

1

2

3

D6

MB

R0520LT

1

D6

MB

R0520LT

1

R80

0R

R80

0R

TP

40

TP

40

J5

DJ-0

05

J5

DJ-0

05

1 3 2

J6

US

B-B

J6

US

B-BV

US

B1

Da

ta-

2

Da

ta+

3

GN

D4

SH

IEL

D1

5

SH

IEL

D2

6

D7

MB

R0520LT

1

D7

MB

R0520LT

1

R42

10K

R42

10K

C42

15pF

C42

15pF

C41

100nF

C41

100nF

C40

100nF

C40

100nF

TP

28

TP

28

R43

0R

R43

0R

RT

2

500m

A

RT

2

500m

A

TP

29

TP

29

SW

7-3

MM

S42R

SW

7-3

MM

S42R

7

8

9

C38

100nF

C38

100nF

TP

60

TP

60

L2

60O

HM

L2

60O

HM

12

D10

MB

R0520LT

1

D10

MB

R0520LT

1

TP

26

TP

26

TP

33

TP

33

Q1

ZX

M61P

02F

Q1

ZX

M61P

02F

R50

0R

R50

0R

D9

MB

R0520LT

1

D9

MB

R0520LT

1

BC

1

2462

BC

1

2462

+1

-2

U9

LT

1129C

ST

-3.3

U9

LT

1129C

ST

-3.3

Vin

1V

ou

t3

GN

D1

2

GN

D2

4

TP

43

TP

43

TP

39

TP

39

C56

10nF

C56

10nF

C36

4.7

uF

C36

4.7

uF

TP

47

TP

47

SW

7-4

MM

S42R

SW

7-4

MM

S42R

10

11

12

C37

4.7

uF

C37

4.7

uF

R40

10K

R40

10K

TP

42

TP

42

SW

7-2

MM

S42R

SW

7-2

MM

S42R

4

5

6

C34

1uF

C34

1uF

C57

4.7

uF

C57

4.7

uF




Figure 5-5. Network Node PCB Component Location (Top View)

Figure 5-6. Network Node PCB Test Points (Bottom View)




Figure 5-7. Network Node PCB Layout (Top View)

Figure 5-8. Network Node PCB Layout (Bottom View)




Table 5-1. Bill of Materials

Qty Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number

1 ANT1 F_Antenna PCB F ANTENNA

NOT A PART NOT A PART

1 BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C

1 C54 Ceramic Capacitor C0G

10pF 50V 5% Murata GRM1555C1H100JZ01

0 C1,C55,C58 Ceramic Capacitor C0G

10pFNot Mounted

50V 5% Murata GRM1555C1H100JZ01

3 C24,C25,C44 Ceramic Capacitor X5R

1uF 6.3V 10% Murata GRM155R60J105KE19B

0 C10 Ceramic Capacitor X5R

1uFNot Mounted

6.3V 10% Murata GRM155R60J105KE19B


1nF 50V 10% Murata GRM155R71H102KA01D

2 C14,C15 CAP CER 10UF 6.3V 20% X5R 0603

10uF 6.3V 20% PANASONIC ECJ1VB0J106M

1 C19 Ceramic Capacitor for smoothing X5R

10uF 10V 10% Murata GRM21BR61J106KE19L

15 C2,C6,C13,C21,C22,C27,C35,C38,C40,C41,C50,C59,C61,C71,C72

Ceramic Capacitor X5R

100nF 10V 10% Murata GRM155R61A104KA01D


47pF 50V 5% KEMET C0402C470J5GAC


47nF 10V 10% PANASONIC-ECG

ECJ-0EB1A473K


4.7nF 25V 10% MURATA GRM155R71E472KA01


22nF 25V 10% MURATA GRM155R71E223KA61D


1pFNot Mounted

50V 0.25pF Murata GRM1555C1H1R0CZ01D

2 C34,C49 Ceramic Multilayer Capacitor X7R NoPb

1uF 16V 15% Murata GRM21BR71C105

3 C36,C37,C48 Ceramic Multilayer Capacitor X5R

4.7uF 16V 15% Phycomp 2222 781 13672

0 C4 Ceramic Multilayer Capacitor X7R

27nFNot Mounted

10V 5% Vishay VJ0402Y273JXQCW1BC

2 C42,C43 Ceramic Capacitor C0G

15pF 50V 5% Murata GRM1555C1H150JZ01J





220nF 10V 10% Murata GRM188R71A224KA01


270pF 50V 5% Murata GRM1555C1H271JA01


3.3nF 50V 15% Murata GRM155R71H332KA01


180nFNot Mounted

16V 5% Vishay VJ0603Y184JXJCW1BC


4.7uF 10V 10% Murata GRM219R61A475KE34D

2 C60,C73 Low ESR Tantal Capacitor

47uF 16V +/-10% AVX TPSD476K016R150

3 C63,C64,C65 Aluminum Electrolytic Capacitor low ESR CV-GX

4.7uF 35V 20% Sanyo 35CV4.7GX

5 C66,C67,C68,C69,C70

Aluminum Electrolytic Capacitor

1uF 50V 20% Nic Components

NACE 1R0 M 50V 4x5,5 TR13

0 C7,C12 Ceramic Capacitor C0G

22pFNot Mounted

50V 5% Murata GRM1555C1H220JZ01J

1 C75 CAP CER 4.7UF 6.3V 10% X5R 0603

4.7uF 6.3V 10% VENKEL COMPANY

C0603X5R6R3-475KNE

2 C8,16 Ceramic Capacitor C0G

100pF 50V 5% Murata GRM1555C1H101JZ01

3 C56,C62,C74 Ceramic Capacitor X7R

10nF 25V 10% Murata GRM155R71E103KA01D


10nFNot Mounted

25V 10% Murata GRM155R71E103KA01D

4 D1,D2,D3,D4 SMD Red topled LHR974 OSRAM Q62702P5182

1 D5 SMD Green topled LGR971 OSRAM Q65110P5179

6 D6,D7,D8,D9,D10,D12

SMD Power Schottky Rectifier

MBR0520LT1 20V On Semiconductor

MBR0520LT1G

1 J10 Single Row Straight Pin Header SMD

TSM-103-01-L-SV

Samtec TSM-103-01-L-SV

1 J11 Mictor, Centerline Matched Impedance Connector

767054-1 AMP 767054-1

1 J12 2.5mm Audio stereo jack with switch

STX-2550-5NTR

Kycon STX-2550-5NTR

1 J13 FFC Right Angle Dip Zif 30 pin Connector

6210_30_smd

AVX 08 6210 030 340 800

4 J14, J18,J19,J20 Single Row Straight Pin Header SMD

TSM-102-01-L-SV

Samtec TSM-102-01-L-SV





0 J18,J19,J20 HDR 1X2 SMT 78.7MIL SP 235H AU

HDR_1X2 SAMTEC TMM-102-01-S-S-SM

0 L1 HF Chip coil 3.9nHNot Mounted

5% Murata LQG15HS3N9S02D

1 L2 Chip Ferrite Bead 500mA Murata BLM11P600Sxx

1 L3 SMD power inductor 22uH 20% Coilcraft DO1608C-223LC

1 Q1 P-channel MOSFET ZXM61P02F 20V Zetex ZXM61P02F

1 Q2 N-Chanel Enhancement MOSFET

ZVN3320F 200V Zetex ZVN3320FTA

15 R3,R33,R43,R50,R51,R64,R65,R68,R69,R80,R84,R105,R109,R110,R111

Fixed resistor RC31 0R 50V 0.063W 2%

Philips 2322 705 91002

0 R4,R32,R34,R66,R70,R91

Fixed resistor RC31 0RNot Mounted

50V 0.063W2%

Philips 2322 705 91002

2 R11,R30 Fixed resistor RC31 220R 50V 0.063W2%

Philips 2322 705 50221

9 R12,R23,R24,R26,R97,R98,R99,R100,R101

Fixed resistor RC31 100K 50V 0.063W2%

Philips 2322 705 50104

3 R13,R14,R25 Fixed resistor RC31 1K 50V 0.063W2%

Philips 2322 705 50102

0 R81,R82 Fixed resistor RC31 1KNot Mounted

50V 0.063W2%

Philips 2322 705 50102

4 R56,R57,R106,R107

Fixed resistor RC31 4.7K 50V 0.063W2%

Philips 2322 705 50472

9 R1,R15,R40,R42,R44,R87,R102,R103,R104

Fixed resistor RC31 10K 50V 0.063W2%

Philips 2322 705 50103

1 R44 Fixed resistor RC31 7R15 0.063W1%

KOA SPEER RK73H1ETTP7R15F

0 R83 Fixed resistor RC31 10KNot Mounted

50V 0.063W2%

Philips 2322 705 50103

1 R20 Fixed resistor RC31 200K 50V 0,063W2%

YAGEO AMERICA

RC0402JR-07200KL

1 R29 Fixed resistor RC31 47K 50V 0.063W2%

Philips 2322 705 50473

0 R5 Fixed resistor RC31 240RNot Mounted

50V 0.063W2%

Philips 2322 705 50241





3 R58,R59,R67 Fixed resistor RC31 27K 50V 0.063W2%

Philips 2322 705 50273

4 R6,R7,R8,R9 Fixed resistor RC31 390R 50V 0.063W2%

Philips 2322 705 50391

1 R60 Fixed resistor RC31 8.2K 50V 0.063W2%

Philips 2322 705 50822

1 R61 Fixed resistor RC31 13K 50V 0.063W2%

Philips 2322 705 50133

1 R85 Fixed resistor RC32 11K 50V 0.063W KOA SPEER RK73H1ETTP1102F

1 R86 Fixed resistor RC33 1.8K 50V 0.063W KOA SPEER RK73H1ETTP1801F

1 R88 Fixed resistor RC34 51K 200V 0.063W KOA SPEER RK73H1ETTP5102F

1 R89 RESISTOR RC31 470K 100V 1/16W5%

YAGEO AMERICA

RC0402JR-07470KL

1 R96 RESISTOR 200 OHM 0.063W VISHAY/DALE CRCW0402200RJNED

1 R90 RES MF 47 OHM 1/4W 5% 1206

47 OHM 1/4W5%

BOURNS CR1206-JW-470ELF

1 R120 RES MF 120K 1/16W 1% 0402

120K 1/16W1%

KOA SPEER RK73H1ETTP1203F

1 R121 RES MF 24.9K 1/16W 1% 0402

24.9K 1/16W1%

KOA SPEER RK73H1ETTP2492F

4 R122,R123,R124,R125

RES MF 1.0K 1/16W 5% 0402

1K 1/16W5%

VISHAY INTERTECH-NOLOGY

CRCW04021K00JNED

2 RT1,RT2 Polyswitch Overcurrent Protection Device

500mA 13.2V Tyco Electronics

microSMD050F

5 SW1,SW2,SW3,SW4,SW5

SMD Tact Switch 2.6N (7.0mm)

DTSM63N Diptronic DTSM-63N-V-B

1 SW6 4-directional TACT switch with center push SMD

SKRHA ALPS SKRHAAE010

1 SW7 Miniature Slide Switch 4 pole

MMS42R APEM MMS42R

1 U1 ZigBee Wireless Transceiver and ARM7 processor

MC13224V orMC13226V

Freescale MC13224VorMC13226V

1 U10 USB UART, PB-free FT232R FTDI FT232RQ





1 U13 Digitally Controled Potentiometer, 50Kohm

MAX5434 Maxim MAX5434LEZT+T

1 U14 Hex inverter 74HCT04A On Semiconductor

MC74HCT04ADTR2G

1 U15 Low supply current Step-up DC-DC Converter with shutdown

MAX1676 Maxim MAX1676EUB+-ND

1 U16 Low Voltage CMOS Octal Bidirectional Transceiver

74LCX245 On Semiconductor

MC74LVXC3245DTG

1 U2 Dual Low voltage Op-Amp

MC33202 On Semiconductor

MC33204DTBG

1 U4 10-bit Low Power DAC with rail to rail output

DAC101S101 National Semiconductors

DAC101S101CIMK-NoPB

1 U6 Audio class AB amplifier, 1,0W

NCP4896 On Semiconductor

NCP4896FCT1G

2 U9,U12 LDO voltage regulator 3V3

LT1129CST-3.3

Linear Technology

LT1129CST-3.3

1 U17 IC VREG ADJ 1.24-5.3V 20MA SOIC8

LM285M NATIONAL SEMICONDUCTOR

LM285M/NOPB

1 X1 Crystal SMD 24.00MHz +-10ppm NDK EXS00A-CS02020 (24MHz NX3225SA) (for OA/AV and Bluetooth)

0 X2 Crystal SMD 32.768kHzNot Mounted

+-20ppm Abracon ABS25-32.768-12.5-2-T

1 D11 128x64 pixel monochrome display w. LED backlight

F-51553GNBJ-LW-AB

Optrex F-51553GNBJ-LW-AEN

1 BC1 PCB Battery Holder 2xAA

2462 Keystone 2462

1 J1 Dual Row Right Angle pin header 0.38um gold

90122-20 Molex 90122-0770

1 J2 Dual Row Right Angle pin header 0.38um gold

90122-26 Molex 90122-0773

1 J5 DC Power Jack PCB, 2mm

DJ-005 Taitek 2DC-0005-D100





1 J6 USB-series "B" receptacle

USB-B AMP 292304-1

1 J7 Straight SMA Receptacle for PCB edge mounting (0.79mm PCB)

SMA Johnson Components

142-0701-881




Chapter 6 PCB Manufacturing SpecificationsThis chapter provides the specifications used to manufacture the 1322x Network Node printed circuit board (PCB).

The 1322x Network Node PCB must comply with the following:• The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)• The PCB manufacturer’s logo is required• The PCB production week and year code is required

— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask

— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc.

• The required Underwriter’s Laboratory (UL) Flammability Rating— The level is 94V-0 (http://www.ul.com/plastics/flame.html)— The UL information must be stamped on the back of the PCB solder mask

NOTE• A complete set of design files is available the 1322x Network Node at

the Freescale web site (http:www.freescale.com/802154) under reference designs. It is recommended that this design or one of a number of other reference designs be used as a starting point for a custom application.

• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, Document Number: ZHDCRM is also available at the same web site to provide additional design guidance.

6.1 Single PCB ConstructionThis section describes individual PCB construction details.

• The PCB is a four-layer, multi-layer design• The PCB contains no blind, buried, or micro vias• PCB data:

— Size: Approximately 125 x 85 mm (4.92 x 3.35 inches)— Final thickness (Cu/Cu): 0.864 mm (0.032 inches) +/- 10% (excluding solder mask)

http://www.perfag.dk/Uk/ukindex.htm

http://www.ul.com/plastics/flame.html

PCB Manufacturing Specifications



• The following table defines each layer of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms.

NOTEThe 1322x Network Node contains high frequency 2.4 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup (see Figure 6-1) information as provided with the reference design.

Figure 6-1. PCB Stackup Cross-Section

• Solder mask is required• Silk screen is required

6.2 PanelizationThe panel size can be negotiated depending on production volume.

Table 6-1. Layer by Layer Overview

Layer Artwork Identification File Name

1 Solder Resist MASK1.art

2 Copper Top Layer ASSY1.art

3 Copper Layer 2 ASSY2.art

4 Copper Layer 3 ASSY3.art

5 Copper bottom Layer ASSY4.art

6 Solder Resist MASK4.art

Dielectric

Dielectric

Dielectric

Metal 1

Metal 2

Metal 3

Metal 4




6.3 MaterialsThe PCB composite materials must meet the following requirements:

• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance.

• Copper Foil - — Top and Bottom copper layers must be 1 oz. copper— Interior layers must be 1/2 oz. copper

• Plating - All pad plating must be Hot Air Levelling (HAL)

6.4 Solder MaskThe solder mask must meet the following requirements:

• Solder mask type: Liquid Film Electra EMP110 or equivalent• Solder mask thickness: 10 – 30 µm

6.5 Silk ScreenThe silk screen must meet the following requirements:

• Silkscreen color: White• Silkscreen must be applied after application of solder mask if solder mask is required• The silkscreen ink must not extend into any plated-thru-holes• The silk screen must be clipped back to the line of resistance

6.6 Electrical PCB Testing• All PCBs must be 100 percent tested for opens and shorts• Impedance Measurement - An impedance measurement report is not mandatory

6.7 Packaging Packaging for the PCBs must be the following requirements:

• Finished PCBs must remain in panel• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.

These materials can degrade solderability.




6.8 Hole Specification/Tool TableSee the ncdrill-1-4.tap file included with the Gerber files and the FAB-23452.pdf file.

6.9 File DescriptionFiles included with the download include Design, Gerber and PDF files.

Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing.

PDF files included are assembly drawings (ASSYx), board fabrication drawing (FAB-23452), the two metal layers (LAYx), solder mask (MASKx), solder paste (PASTE1) and silk screen (SILKx). The schematic is SPF-23452_REV_x.

Design files are in Allegro format with OrCAD schematic capture.

1322x network node · in different applications and actual performance may vary over time. all...

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