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TRANSCRIPT
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2Huawei Cloud Congress 2013
Содержание
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История развитияИстория развития
Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества
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3Huawei Cloud Congress 2013
2009 2008
2007
2002
2006
2005
2004
Начало разработки 1-го поколения блэйд серверов
Начало продаж блэйд серверов 1го поколения Т8000Платформа ATCA (telecom)1. Массовые
внедрения 1G T8000 2. Начало разработки 2G 8000
1. Запуск 2го поколения T8000 2. Начало разработки rack серверов.
1. Запуск серверов RH1280 and RH2280 2. Начало производства сервеных компонентов таких как сетевые карты, SSD и комплекты памяти
2.Массовые инсталляции 2G T8000 2 Запуск сервера RH1120 3 Начало разработки собственных серверных компонентов 1. Запуск E6000
RH1285/2285 2G 2. Новое поколение серверных компонентов и начало предоставления заказчикам высоко производительных датацентр решений
Постоянные инновации,предложение более конкурентоспособной продукции
2010
1. Запуск Х6000 серверного решения для облачных вычислений
2. Запуск X8000
Более 1000 сотрудников занимающаяся разработкой и производством серверовБолее 100 патентов и участие во многих организациях по стандартизацииБогатый исследовательский и технический опыт в телеком,датаком сфере .Широкое сотрудничество с производителями оборудования и ПО, такими как Intel, AMD, SUSE и Redhat в технических областях, в том числе проектирования систем,разработки чипов и дизайна операционной системы
11 лет назад...История развития серверного направления в компании Huawei
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4Huawei Cloud Congress 2013
Мир изменяют данные
40 Total amount of Data of 40ZB in 2020
65%X86 servers with virtualization supported
80%Increase of unstructured data
2%Total power consumption of data centers
The huge amount of data created is the largest challenge to data center
network, storage, and servers.
Data Generation Data Transfer Data Compute and Storage
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5Huawei Cloud Congress 2013
Проблемы серверного оборудованияLow Utilization
High Power Consumptio
n
Rapid Expansion
Low Reliability
Traditional Servers
( Source : Michael Bell,research vice president at
Stamford )
<30% Average Utilization
Rate
Source : The Green Grid
2.5 Data Center PUE
3KW Per Rack power is limited
50%OPEX as a percentage of total IT spending
40ZB2020 Global Data
50% Increase in Total Amount of DataRapid Expansion
Big Data Analytics
77.7%Internet users are worried about security issues
68%Enterprises will experience 6 cases of stolen dataSource : IDC
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6Huawei Cloud Congress 2013
Input OutputCPU
Memory
Hard Drive
Magnetic Tape
Compute Centric
• Depends on compute power• Data stored on memory hierarchy• Compute is far away from data, result
in long latency and small bandwidth
Just Enough ComputingJust enough Compute power for each application
CPU
Multiple Storage MediaTiered Storage
Converged Switching TechnologyLow Latency IO, supports virtualization acceleration
Data
• Distributed compute nodes for computation• Compute is closer to Data, which reduces latency• Compute capability depends on location of data,
types of data storage, and appliation
CPU
CPU
CPU
CPU
CPU
CPU
CPU
Lower TCOHigher Performance
Data Centric
От Compute Centric к Data Centric
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7Huawei Cloud Congress 2013
CPU
Super Computer CISC Mini Computer RISC
System z BS2000 Power7 SPARC T4/T5
X86 Servers
Intel Xeon AMD Opteron
Micro Servers
Intel Atom ARM CortexItanium
MemoryEthernet
PCIe Shared IO
QPI
FC
iSCSI, FCoE
Increase BWReduce Latency
Cluster Interconnect
Latency
BW1 Gbps 40Gbps 1 00Gbps 128Gbps
25ns
500ns
2us
20us
InfiniBand QDR/FDR/EDR
100GbE
IO Interconnect
Racetrack
MRAMPCM
RRAM
Storage
Процессор более не основной компонент
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8Huawei Cloud Congress 2013
Processors are moving toward specialization
Performance per Watt is becoming more important
Generic CPU + Application specific CPU =
Heterogeneous CPU
• Heterogeneous CPUs can be more flexible, higher cost performance, and high power performance
• First used by storage systems• Internet server begin small scale deployment from 2013 ~ 2014
• Enterprise server application still lag behind 3~5 years
Просто добавь вычислений
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9Huawei Cloud Congress 2013
Рост твердотельных накопителей Another level in the memory hierarchy
Hard Disk (Magnetic)
Solid-State Disk (PCIE)
Main Memory (Electrical)
Shared L3 Cache
L2 Cache
D&IBuffer
Solid-State Disk (PCIE)
Solid-State Disk (SATA)
Tape (Magnetic)
CD DVD Blu-ray ROM (Optical)
Tape (Magnetic)
Hard Disk (Magnetic)
CD DVD Blu-ray ROM (Optical)
100S
100mS
10mS
100uS
60
20
7
1
CPUClock
1.5T
20M
256K
64K
RandomAccessMemory
5T
125G
4T
2.5T
SerialAccessMemory
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10Huawei Cloud Congress 2013
Ethernet supports DCB Ethernet supports RDMA Convergence of FC and Ethernet to
FCoE
Converged Switching of Infiniband, Ethernet, and
FC: SwitchX Infiniband bandwidth still leads Ethernet, but the
amount of lead is reducing, while FC is lagging far
behind. Ethernet is absorbing many new features
from other IO technology, and a Ethernet based
converged network is forming.
Конвергенция –будущее сетей
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11Huawei Cloud Congress 2013
Немного о виртуализации 65% WW workloads Virtualized Tier 1 Apps being virtualized NFV being promoted by Telcos
More Memory per Server Higher Network BW per Server
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12Huawei Cloud Congress 2013
Автоматизация –путь к снижению TCO
VM Sprawling, IT Management 65+% of IT
Spending IT Automation critical to lower TCO Support for IT Automation:
Stateless Computing – Physical Server Agentless Server Status Monitoring Bare metal Server Deployment Automation
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История развитияИстория развития
Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества
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Content
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14Huawei Cloud Congress 2013
Стратегические направления Huawei Server
Application acceleration card
2S RH22XX4S RH5885
8S RH588516S ~ 64S RH8XXX
E9000
X6000
X8000HPC
Private cloudAppliance
Virtualization
Mission-critical enterprise applications, virtualization, and midrange computer migration
Massive data processingWeb 2.0 applicationPublic cloudSc
ale
up
Scale outConvergedCloud server
iNIC Data compression cardSSD card
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15Huawei Cloud Congress 2013
Полный набор технологий в одном вендоре
The only global server vendor who develops chips, boards, cards, and builds up servers by oneself
ASICs
I/O Accelerator
Architect
Inter-connect
Node Controller, BMC, etc.
High performance interconnect technology for server products
Huawei Server
I/O Acceleration cards, help improve full system performance
Ind
igen
ou
s
R&
D
System level architecture design to improve performance and reliability
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16Huawei Cloud Congress 2013
Сервера высокой плотности
2S FW nodeXH320 V22S HW node1S HW node
XH311 V2
800GB1.2TB2.4TB
PCIe SSD card
«Решения»Exchange ApplianceN2000 NAS
RH1288 V2
X6000
2U 4S
RH2488 V2RH2485 V2
4U 4S
RH5885 V2 (4S)
XH621 V2
RH5885 V2 (8S)
XH310 V2
RH2285 V2 RH2288 V2
Стоечные сервера
Блейд сервера
BH620 V2
2*CPU(E5-2400)12*DIMMs4*2.5’’HDDs
BH621 V2
2*CPU(E5-2400)12*DIMMs2*2.5’’HDDs1*PCIe x8
BH622 V2
2*CPU(E5-2600)24*DIMMs2*2.5’’HDDs
E6000
8U, 10 лезвий
E90002S HW blade 2S FW blade
CH121
12U, 8/16 лезвий
CH221CH220
2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs4*PCIe x8FHHL
CH222
2*CPU(E5-2600)24*DIMMs15*2.5” HDDs1*PCIe x8FHHL
NXseries
1GE, 10GE, FC
BH640 V2
4*CPU(E5-4600)24*DIMMs2*2.5’’HDDs
CH240
4*CPU(E5-4600)48*DIMMs8*2.5” HDDsor 4*2.5” HDDs +1*PCIe x16FH3/4L
4S FW blade
CX seres
GE, 10GE, FCoE, FC,Infiniband QDR/FDR
Switch module
2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs1*PCIe x8 FHHL
2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs2*PCIe x16FHFL
2S blade 4S blade Switch series
2U, 2/4 ноды 1*CPU(E3-1200 V2)4*DIMMs1*3.5’’HDD
1*CPU(E3-1200 V2)4*DIMMs4*2.5’’HDDs
2*CPU(E5-2400)12*DIMMs4*2.5’’HDDs
2*CPU(E5-2600)24*DIMMs8*2.5’’HDDs
1U 2S 2U 2S 8U 8S
2*CPU(E5-2600)24*DIMMs4*3.5’’HDDsor 8*2.5’’HDDs
2*CPU(E5-2400)12*DIMMs12*3.5’’+2*2.5’’HDDs or8*2.5’’ HDDs or26*2.5’’ HDDs
2*CPU(E5-2600)24*DIMMs12*3.5’’+2*2.5’’HDDs or8*2.5’’HDDs or26*2.5’’HDDs
4*CPU(E5-4600)48*DIMMs8*2.5’’HDDs
4*CPU(E7-4800)32*DIMMs6*3.5’’HDDs
4*CPU(E7-4800)64*DIMMs10*2.5’’HDDs
8*CPU(E7-8800)128*DIMMs16*2.5’’HDDs
12*3.5”+2*2.5”HDDsSupports CIFS, NFS, iSCSI, etc.Windows Storage Server 2012
600users(3GB/user)1200users(3GB/user)3000users(5GB/user)
Серверное портфолио
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17Huawei Cloud Congress 2013
1.2TB 2.4TB
Flash granule
Form factor
Bus interface
MLC
Full-height, half-length
PCIe 2.0 x8
MLC
Full-height, half-length
PCIe 2.0 x8
MLC
Full-height, half-length
PCIe 2.0 x8Maximum read bandwidth
Read IOPS (Stable value, 4 KB,100% random)
Read IOPS (Maximum value,4 KB, 100% random)
Read latency
Maximum write bandwidth
Write IOPS (Stable value, 4 KB,100% random)
Write IOPS (Maximum value,4 KB, 100% random)
Write latency
2.2 GB/s
570,000
600,000
49 µs
1.2 GB/s
120,000
330,000
8 µs
3.2 GB/s
760,000
770,000
49 µs
1.8 GB/s
180,000
480,000
8 µs
3.2 GB/s
760,000
770,000
49 µs
2.8 GB/s
240,000
630,000
8 µsMixed IOPS (4 KB, R/W: 7/3)
Power consumption
Weight
Power-down protection
Granules failure protection
Supported trim
260,000(R/W: 180,000/80,000)
20 W to 35 W
300g
Yes
Yes
Yes
400,000(R/W: 280,000/120,000)
25 W to 50 W
350g
Yes
Yes
Yes
430,000(R/W: 300,000/130,000)
25 W to 60 W
350g
Yes
Yes
Yes
HUAWEI Tecal ES3000Высокопроизводительная карта SSD PCIe
Карта SSD PCIe HUAWEI Tecal ES устраняет ограничения системы ввода/вывода и позволяет раскрыть потенциал любых серверов стандартной архитектуры. ES3000 поможет значительно сократить эксплуатационные затраты и TCO, вместе с тем ускорив работу ваших приложений.
Емкость 800 ГБ 1,2 ТБ 2,4 ТБ
Тип памяти MLC MLC MLC
Интерфейс шины PCIe 2.0 x8 PCIe 2.0x8 PCIe 2.0 x8
Максимальная проп. способность
при чтении
2,2 ГБ/с 3,2 ГБ/с 3,2 ГБ/с
IOPS при чтении (стабильное
значение, 4 КБ, 100% случайно)
570,000 760,000 760,000
IOPS при чтении (максимальное значение, 4 КБ, 100% случайно)
600,000 770,000 770,000
Задержки при чтении
49 us 49 us 49 us
IOPS при записи (стабильное
значение, 4 КБ, 100% случайно)
120,000 180,000 240,000
IOPS при записи (максимальное значение, 4 КБ, 100% случайно)
330,000 480,000 630,000
Задержки при записи
8 us 8 us 8 us
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История развитияИстория развития
Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества
Content
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19Huawei Cloud Congress 2013
Полно управляемое решение
Device Management platform
ServerNetworkStorage
IT Infrastructure
eSight3rd party software
Centralized device management
Enterprise management platform
Hardware monitor
Asset inventory
Fault prediction
Performance monitor
Installation deployment
Fault alarm
Incident response
Firmware Upgrade
Fault response
Service
Life CycleOperation Management
Fault Management
Remote control
Provide 3rd party management software plug-in, to support a full management solution.
Server Device Manager
1 Server Performance Reporter
2 Server resource Management;
Remote maintenance, batch configuration deployment; Alarm system
Server performance monitor; Analyze performance bottleneck, system optimization
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20Huawei Cloud Congress 2013
Huawei Tecal V2 series servers ranked first in 31 Standard Performance Evaluation Corporation (SPEC)
test items. The RH2288 V2 rack server ranked first based on the E5-2620, E5-2630, E5-2630L, E5-2640,
and E5-2670 CPUs. The BH622 V2 server blade ranked first based on the E5-2665, E5-2660, and E5-
2680 CPUs. By now, Huawei servers have refreshed 55 world records in the SPEC test, proving
excellent performance of Huawei servers…
Vision:http://server.zol.com.cn/304/3044242.html
http://server.chinabyte.com/127/12369627.shtml
• High computing performance: 74 SPEC records in SPEC integer and floating-point computing performance • Power-efficient: 9 records in the SPECpower_sj2008 benchmark
Records increasing
Huawei servers have refreshed 83 world
records in the SPEC benchmark test by now.
Производительность –83 SPEC Benchmark Records
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21Huawei Cloud Congress 2013
Качество
Supplier certification, component selection, and quality controlEMC laboratory, vibration test laboratory, high temperature test laboratory, and safety regulation laboratory
Huawei's fault-tolerant architecture provides comparable reliability as RISC midrange computers.Huawei has the design capability for architecture with 99.999% reliability for high-end products.
Board design, server design, and the test process meet Integrated Product Development (IPD) standards.35 Reliability, Availability, and Serviceability (RAS) features are supported.150 patents on reliability designs are obtained.
200,000 carrier-class server blades have been delivered to telecom users.
300,000 rack servers, blade servers, and high-density servers have been delivered to enterprise users.
Precise design
Strict test
Precise design
Strict test
500,000 serversin large-scale
use
500,000 serversin large-scale
use
Laboratories with sufficient equipment
Outstanding reliability in both components and
systems
Laboratories with sufficient equipment
Outstanding reliability in both components and
systems
High reliability
Architecture design capability
High reliability
Architecture design capability
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22Huawei Cloud Congress 2013
Huawei servers utility strict telecommunication grade
component derating during design phase, to make sure
component will not fail under stress(electrical and thermal),
also to delay component wear out, and extend component
useful life.
Высококачесвенные компоненты
Component Type De-rating requirements
CapacitorOperating voltage derating<0.6; Case temperature derating<0.8; Maximum voltage derating <rated voltage(mainly for aluminum electrolytic capacitor);
Resistor Power derating<0.6; Voltage derating<0.75; Power derating for Precision wirewound resistors<0.5;
TransistorJunction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; yes to safe operating area derating;
Diode Junction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; Surge derating<0.6;
Integrated Circuit Junction temperature derating<0.85;
Crystal Oscillator Frequency precision derating<0.9; Power consumption derating<0.7; Ripple amplitude derating<0.5;
Magnetics Operating temperature increase<30°C or 40°C; Hot spot temperature<110°C; Operating current derating<0.8;
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23Huawei Cloud Congress 2013
Архитектура повышенной надежности
VSStandard server operating temperature:
10 ~35℃ ℃Huawei server operating temperature:
5 ~40 ℃ ℃ Huawei Server can operate
continuously at 5 ~40℃ ℃
Product design with consideration for high altitude, high temperature, high humidity,
dusty, corrosive environments, Huawei is designing high reliability servers.
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24Huawei Cloud Congress 2013
EnergyEfficiency
DEMT*High efficiency thermal design
High efficiency power supply design
Power capping technologyHibernation & wakeup
Note : DEMT ( Dynamic Energy Management Technology ) Huawei proprietary technology, reduce power consumption when system is under utilized
Энергоэффективный дизайн
OS energy management & performance optimization
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Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.
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