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www.huawei.com [email protected] Серверы Huawei- производительность и надежность

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www.huawei.com

[email protected]

Серверы Huawei- производительность и надежность

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2Huawei Cloud Congress 2013

Содержание

11

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33

История развитияИстория развития

Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества

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3Huawei Cloud Congress 2013

2009 2008

2007

2002

2006

2005

2004

Начало разработки 1-го поколения блэйд серверов

Начало продаж блэйд серверов 1го поколения Т8000Платформа ATCA (telecom)1. Массовые

внедрения 1G T8000 2. Начало разработки 2G 8000

1. Запуск 2го поколения T8000 2. Начало разработки rack серверов.

1. Запуск серверов RH1280 and RH2280 2. Начало производства сервеных компонентов таких как сетевые карты, SSD и комплекты памяти

2.Массовые инсталляции 2G T8000 2 Запуск сервера RH1120 3 Начало разработки собственных серверных компонентов 1. Запуск E6000

RH1285/2285 2G 2. Новое поколение серверных компонентов и начало предоставления заказчикам высоко производительных датацентр решений

Постоянные инновации,предложение более конкурентоспособной продукции

2010

1. Запуск Х6000 серверного решения для облачных вычислений

2. Запуск X8000

Более 1000 сотрудников занимающаяся разработкой и производством серверовБолее 100 патентов и участие во многих организациях по стандартизацииБогатый исследовательский и технический опыт в телеком,датаком сфере .Широкое сотрудничество с производителями оборудования и ПО, такими как Intel, AMD, SUSE и Redhat в технических областях, в том числе проектирования систем,разработки чипов и дизайна операционной системы

11 лет назад...История развития серверного направления в компании Huawei

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4Huawei Cloud Congress 2013

Мир изменяют данные

40 Total amount of Data of 40ZB in 2020

65%X86 servers with virtualization supported

80%Increase of unstructured data

2%Total power consumption of data centers

The huge amount of data created is the largest challenge to data center

network, storage, and servers.

Data Generation Data Transfer Data Compute and Storage

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5Huawei Cloud Congress 2013

Проблемы серверного оборудованияLow Utilization

High Power Consumptio

n

Rapid Expansion

Low Reliability

Traditional Servers

( Source : Michael Bell,research vice president at

Stamford )

<30% Average Utilization

Rate

Source : The Green Grid

2.5 Data Center PUE

3KW Per Rack power is limited

50%OPEX as a percentage of total IT spending

40ZB2020 Global Data

50% Increase in Total Amount of DataRapid Expansion

Big Data Analytics

77.7%Internet users are worried about security issues

68%Enterprises will experience 6 cases of stolen dataSource : IDC

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6Huawei Cloud Congress 2013

Input OutputCPU

Memory

Hard Drive

Magnetic Tape

Compute Centric

• Depends on compute power• Data stored on memory hierarchy• Compute is far away from data, result

in long latency and small bandwidth

Just Enough ComputingJust enough Compute power for each application

CPU

Multiple Storage MediaTiered Storage

Converged Switching TechnologyLow Latency IO, supports virtualization acceleration

Data

• Distributed compute nodes for computation• Compute is closer to Data, which reduces latency• Compute capability depends on location of data,

types of data storage, and appliation

CPU

CPU

CPU

CPU

CPU

CPU

CPU

Lower TCOHigher Performance

Data Centric

От Compute Centric к Data Centric

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7Huawei Cloud Congress 2013

CPU

Super Computer CISC Mini Computer RISC

System z BS2000 Power7 SPARC T4/T5

X86 Servers

Intel Xeon AMD Opteron

Micro Servers

Intel Atom ARM CortexItanium

MemoryEthernet

PCIe Shared IO

QPI

FC

iSCSI, FCoE

Increase BWReduce Latency

Cluster Interconnect

Latency

BW1 Gbps 40Gbps 1 00Gbps 128Gbps

25ns

500ns

2us

20us

InfiniBand QDR/FDR/EDR

100GbE

IO Interconnect

Racetrack

MRAMPCM

RRAM

Storage

Процессор более не основной компонент

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8Huawei Cloud Congress 2013

Processors are moving toward specialization

Performance per Watt is becoming more important

Generic CPU + Application specific CPU =

Heterogeneous CPU

• Heterogeneous CPUs can be more flexible, higher cost performance, and high power performance

• First used by storage systems• Internet server begin small scale deployment from 2013 ~ 2014

• Enterprise server application still lag behind 3~5 years

Просто добавь вычислений

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9Huawei Cloud Congress 2013

Рост твердотельных накопителей Another level in the memory hierarchy

Hard Disk (Magnetic)

Solid-State Disk (PCIE)

Main Memory (Electrical)

Shared L3 Cache

L2 Cache

D&IBuffer

Solid-State Disk (PCIE)

Solid-State Disk (SATA)

Tape (Magnetic)

CD DVD Blu-ray ROM (Optical)

Tape (Magnetic)

Hard Disk (Magnetic)

CD DVD Blu-ray ROM (Optical)

100S

100mS

10mS

100uS

60

20

7

1

CPUClock

1.5T

20M

256K

64K

RandomAccessMemory

5T

125G

4T

2.5T

SerialAccessMemory

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10Huawei Cloud Congress 2013

Ethernet supports DCB Ethernet supports RDMA Convergence of FC and Ethernet to

FCoE

Converged Switching of Infiniband, Ethernet, and

FC: SwitchX Infiniband bandwidth still leads Ethernet, but the

amount of lead is reducing, while FC is lagging far

behind. Ethernet is absorbing many new features

from other IO technology, and a Ethernet based

converged network is forming.

Конвергенция –будущее сетей

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11Huawei Cloud Congress 2013

Немного о виртуализации 65% WW workloads Virtualized Tier 1 Apps being virtualized NFV being promoted by Telcos

More Memory per Server Higher Network BW per Server

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12Huawei Cloud Congress 2013

Автоматизация –путь к снижению TCO

VM Sprawling, IT Management 65+% of IT

Spending IT Automation critical to lower TCO Support for IT Automation:

Stateless Computing – Physical Server Agentless Server Status Monitoring Bare metal Server Deployment Automation

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13Huawei Cloud Congress 2013

История развитияИстория развития

Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества

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Content

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14Huawei Cloud Congress 2013

Стратегические направления Huawei Server

Application acceleration card

2S RH22XX4S RH5885

8S RH588516S ~ 64S RH8XXX

E9000

X6000

X8000HPC

Private cloudAppliance

Virtualization

Mission-critical enterprise applications, virtualization, and midrange computer migration

Massive data processingWeb 2.0 applicationPublic cloudSc

ale

up

Scale outConvergedCloud server

iNIC Data compression cardSSD card

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15Huawei Cloud Congress 2013

Полный набор технологий в одном вендоре

The only global server vendor who develops chips, boards, cards, and builds up servers by oneself

ASICs

I/O Accelerator

Architect

Inter-connect

Node Controller, BMC, etc.

High performance interconnect technology for server products

Huawei Server

I/O Acceleration cards, help improve full system performance

Ind

igen

ou

s

R&

D

System level architecture design to improve performance and reliability

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16Huawei Cloud Congress 2013

Сервера высокой плотности

2S FW nodeXH320 V22S HW node1S HW node

XH311 V2

800GB1.2TB2.4TB

PCIe SSD card

«Решения»Exchange ApplianceN2000 NAS

RH1288 V2

X6000

2U 4S

RH2488 V2RH2485 V2

4U 4S

RH5885 V2 (4S)

XH621 V2

RH5885 V2 (8S)

XH310 V2

RH2285 V2 RH2288 V2

Стоечные сервера

Блейд сервера

BH620 V2

2*CPU(E5-2400)12*DIMMs4*2.5’’HDDs

BH621 V2

2*CPU(E5-2400)12*DIMMs2*2.5’’HDDs1*PCIe x8

BH622 V2

2*CPU(E5-2600)24*DIMMs2*2.5’’HDDs

E6000

8U, 10 лезвий

E90002S HW blade 2S FW blade

CH121

12U, 8/16 лезвий

CH221CH220

2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs4*PCIe x8FHHL

CH222

2*CPU(E5-2600)24*DIMMs15*2.5” HDDs1*PCIe x8FHHL

NXseries

1GE, 10GE, FC

BH640 V2

4*CPU(E5-4600)24*DIMMs2*2.5’’HDDs

CH240

4*CPU(E5-4600)48*DIMMs8*2.5” HDDsor 4*2.5” HDDs +1*PCIe x16FH3/4L

4S FW blade

CX seres

GE, 10GE, FCoE, FC,Infiniband QDR/FDR

Switch module

2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs1*PCIe x8 FHHL

2*CPU(E5-2600)24*DIMMs2*2.5’’ HDDs2*PCIe x16FHFL

2S blade 4S blade Switch series

2U, 2/4 ноды 1*CPU(E3-1200 V2)4*DIMMs1*3.5’’HDD

1*CPU(E3-1200 V2)4*DIMMs4*2.5’’HDDs

2*CPU(E5-2400)12*DIMMs4*2.5’’HDDs

2*CPU(E5-2600)24*DIMMs8*2.5’’HDDs

1U 2S 2U 2S 8U 8S

2*CPU(E5-2600)24*DIMMs4*3.5’’HDDsor 8*2.5’’HDDs

2*CPU(E5-2400)12*DIMMs12*3.5’’+2*2.5’’HDDs or8*2.5’’ HDDs or26*2.5’’ HDDs

2*CPU(E5-2600)24*DIMMs12*3.5’’+2*2.5’’HDDs or8*2.5’’HDDs or26*2.5’’HDDs

4*CPU(E5-4600)48*DIMMs8*2.5’’HDDs

4*CPU(E7-4800)32*DIMMs6*3.5’’HDDs

4*CPU(E7-4800)64*DIMMs10*2.5’’HDDs

8*CPU(E7-8800)128*DIMMs16*2.5’’HDDs

12*3.5”+2*2.5”HDDsSupports CIFS, NFS, iSCSI, etc.Windows Storage Server 2012

600users(3GB/user)1200users(3GB/user)3000users(5GB/user)

Серверное портфолио

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17Huawei Cloud Congress 2013

1.2TB 2.4TB

Flash granule

Form factor

Bus interface

MLC

Full-height, half-length

PCIe 2.0 x8

MLC

Full-height, half-length

PCIe 2.0 x8

MLC

Full-height, half-length

PCIe 2.0 x8Maximum read bandwidth

Read IOPS (Stable value, 4 KB,100% random)

Read IOPS (Maximum value,4 KB, 100% random)

Read latency

Maximum write bandwidth

Write IOPS (Stable value, 4 KB,100% random)

Write IOPS (Maximum value,4 KB, 100% random)

Write latency

2.2 GB/s

570,000

600,000

49 µs

1.2 GB/s

120,000

330,000

8 µs

3.2 GB/s

760,000

770,000

49 µs

1.8 GB/s

180,000

480,000

8 µs

3.2 GB/s

760,000

770,000

49 µs

2.8 GB/s

240,000

630,000

8 µsMixed IOPS (4 KB, R/W: 7/3)

Power consumption

Weight

Power-down protection

Granules failure protection

Supported trim

260,000(R/W: 180,000/80,000)

20 W to 35 W

300g

Yes

Yes

Yes

400,000(R/W: 280,000/120,000)

25 W to 50 W

350g

Yes

Yes

Yes

430,000(R/W: 300,000/130,000)

25 W to 60 W

350g

Yes

Yes

Yes

HUAWEI Tecal ES3000Высокопроизводительная карта SSD PCIe

Карта SSD PCIe HUAWEI Tecal ES устраняет ограничения системы ввода/вывода и позволяет раскрыть потенциал любых серверов стандартной архитектуры. ES3000 поможет значительно сократить эксплуатационные затраты и TCO, вместе с тем ускорив работу ваших приложений.

Емкость 800 ГБ 1,2 ТБ 2,4 ТБ

Тип памяти MLC MLC MLC

Интерфейс шины PCIe 2.0 x8 PCIe 2.0x8 PCIe 2.0 x8

Максимальная проп. способность

при чтении

2,2 ГБ/с 3,2 ГБ/с 3,2 ГБ/с

IOPS при чтении (стабильное

значение, 4 КБ, 100% случайно)

570,000 760,000 760,000

IOPS при чтении (максимальное значение, 4 КБ, 100% случайно)

600,000 770,000 770,000

Задержки при чтении

49 us 49 us 49 us

IOPS при записи (стабильное

значение, 4 КБ, 100% случайно)

120,000 180,000 240,000

IOPS при записи (максимальное значение, 4 КБ, 100% случайно)

330,000 480,000 630,000

Задержки при записи

8 us 8 us 8 us

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18Huawei Cloud Congress 2013

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Обзор серверной линейкиОбзор серверной линейкиОсновные преимуществаОсновные преимущества

Content

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19Huawei Cloud Congress 2013

Полно управляемое решение

Device Management platform

ServerNetworkStorage

IT Infrastructure

eSight3rd party software

Centralized device management

Enterprise management platform

Hardware monitor

Asset inventory

Fault prediction

Performance monitor

Installation deployment

Fault alarm

Incident response

Firmware Upgrade

Fault response

Service

Life CycleOperation Management

Fault Management

Remote control

Provide 3rd party management software plug-in, to support a full management solution.

Server Device Manager

1 Server Performance Reporter

2 Server resource Management;

Remote maintenance, batch configuration deployment; Alarm system

Server performance monitor; Analyze performance bottleneck, system optimization

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20Huawei Cloud Congress 2013

Huawei Tecal V2 series servers ranked first in 31 Standard Performance Evaluation Corporation (SPEC)

test items. The RH2288 V2 rack server ranked first based on the E5-2620, E5-2630, E5-2630L, E5-2640,

and E5-2670 CPUs. The BH622 V2 server blade ranked first based on the E5-2665, E5-2660, and E5-

2680 CPUs. By now, Huawei servers have refreshed 55 world records in the SPEC test, proving

excellent performance of Huawei servers…

Vision:http://server.zol.com.cn/304/3044242.html

http://server.chinabyte.com/127/12369627.shtml

• High computing performance: 74 SPEC records in SPEC integer and floating-point computing performance • Power-efficient: 9 records in the SPECpower_sj2008 benchmark

Records increasing

Huawei servers have refreshed 83 world

records in the SPEC benchmark test by now.

Производительность –83 SPEC Benchmark Records

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21Huawei Cloud Congress 2013

Качество

Supplier certification, component selection, and quality controlEMC laboratory, vibration test laboratory, high temperature test laboratory, and safety regulation laboratory

Huawei's fault-tolerant architecture provides comparable reliability as RISC midrange computers.Huawei has the design capability for architecture with 99.999% reliability for high-end products.

Board design, server design, and the test process meet Integrated Product Development (IPD) standards.35 Reliability, Availability, and Serviceability (RAS) features are supported.150 patents on reliability designs are obtained.

200,000 carrier-class server blades have been delivered to telecom users.

300,000 rack servers, blade servers, and high-density servers have been delivered to enterprise users.

Precise design

Strict test

Precise design

Strict test

500,000 serversin large-scale

use

500,000 serversin large-scale

use

Laboratories with sufficient equipment

Outstanding reliability in both components and

systems

Laboratories with sufficient equipment

Outstanding reliability in both components and

systems

High reliability

Architecture design capability

High reliability

Architecture design capability

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22Huawei Cloud Congress 2013

Huawei servers utility strict telecommunication grade

component derating during design phase, to make sure

component will not fail under stress(electrical and thermal),

also to delay component wear out, and extend component

useful life.

Высококачесвенные компоненты

Component Type De-rating requirements

CapacitorOperating voltage derating<0.6; Case temperature derating<0.8; Maximum voltage derating <rated voltage(mainly for aluminum electrolytic capacitor);

Resistor Power derating<0.6; Voltage derating<0.75; Power derating for Precision wirewound resistors<0.5;

TransistorJunction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; yes to safe operating area derating;

Diode Junction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; Surge derating<0.6;

Integrated Circuit Junction temperature derating<0.85;

Crystal Oscillator Frequency precision derating<0.9; Power consumption derating<0.7; Ripple amplitude derating<0.5;

Magnetics Operating temperature increase<30°C or 40°C; Hot spot temperature<110°C; Operating current derating<0.8;

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23Huawei Cloud Congress 2013

Архитектура повышенной надежности

VSStandard server operating temperature:

10 ~35℃ ℃Huawei server operating temperature:

5 ~40 ℃ ℃ Huawei Server can operate

continuously at 5 ~40℃ ℃

Product design with consideration for high altitude, high temperature, high humidity,

dusty, corrosive environments, Huawei is designing high reliability servers.

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24Huawei Cloud Congress 2013

EnergyEfficiency

DEMT*High efficiency thermal design

High efficiency power supply design

Power capping technologyHibernation & wakeup

Note : DEMT ( Dynamic Energy Management Technology ) Huawei proprietary technology, reduce power consumption when system is under utilized

Энергоэффективный дизайн

OS energy management & performance optimization

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Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.

Thank youwww.huawei.com