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Laboratory

Welcome to ChipMOS Quality Laboratory

Laboratory instrument introduction-----1:30~2:00 SAT instrument operation ----------------2:00~3:00 COF defect sample inspection

(OM/Decapsulation/SEM) --------------- 3:00~3:30 COF electrical measurement ----------- 3:30~4:00 COF mechanical test (die strength) --- 4:00~4:30

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Laboratory

XRM Image SAT Picture

SEM Photo

Hot Spot(Defect)

LCM Photo

Failure Analysis Procedure

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Laboratory

12

Scanning Acoustic Tomograph Inspection

• Die Surface Delamination Mode• TSOPII 50L

• Die Crack Mode• mBGA 70B

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Laboratory

COF Defect Location and DecapsulationPeeling from tape• COF (48mm)

- Fuming Nitric Acid (100%)- Room temperature- 30mins

Rinse by acetone

after decapsulation

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Laboratory

Optical Microscope (OM) Inspection after Decapsulation

50X

200X 500X

Stereo OM

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Scanning Electron Microscope (SEM) Inspection and Energy Dispersive X-ray (EDX) Detection

SEM

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Electrical Measurement (COF/Chip)

Short Pass Open

V (v)

I (mA)

V (v)

I (mA)

V (v)

I (mA)

Curve tracer

Probe station

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Laboratory

Mechanical Test (Die Strength)