1 introduction 2 basic ic fabrication processes 3...
TRANSCRIPT
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Outline
1 Introduction
2 Basic IC fabrication processes
3 Fabrication techniques for MEMS
4 Applications
5 Mechanics issues on MEMS
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3. Fabrication Techniques for MEMS
3.2 Surface micromachining
3.3 LIGA process
3.1 Bulk micromachining
3.4 Hybrid micromachining
3.5 Thick micromachined structures
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3.4 Hybrid micromachining
• Hybrid micromachining – the fabrication processes containing both surface and bulk micromachining technique
• Presently, more and more MEMS devices are fabricated through hybrid micromachining technique
Q. Zou, Z. Li, and L. Liu, J. of MEMS, 1996
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C.-J. Kim, A.P. Pisano, and R.S. Muller, J. of MEMS, 1992
Micro Gripper
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+ Fabrication processes
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Resonant pressure transducer
surface micromachinedresonator
Surface micromachinedresonator
Bulk silicon etching
C.J. Welham, J.W. Gardner, and J. Greenwood, Transducer '95, 1995.
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Capacitive type pressure transducer
J.T. Kung and H.-S. Lee, J. of MEMS, 1992.
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Microphone
Q. Zou, Z. Li, and L. Liu, J. of MEMS, 1996
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DRIE trench
define wet anisotropic etch mask
define sacrificial layer
define structure layer
Wet anisotropic under etching
Electorstatic lever actuator
H.-Y. Lin and W. Fang, ASME IMECE 2000.
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Torque generatorFolded frame
define the structure layer
Remove the sacrificial layer
Wet anisotropic under etching
RIE trench
define wet under etching mask
define the sacrificial layer
Micro scanner
H.-Y. Lin and W. Fang, Transducer01, 2001
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Surface device Bulk device
Micro scanner
Surface+ Bulk device
J. Hsieh and W. Fang, Transducer99, 1999
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Define cavity and lower electrode
Pattern sacrificial layer
Pattern structural layer
Releasing structure and etching Si
Pattern top electrode (option)and then remove sacrificial layer
extending cavity
Deposit protection/isolation layer
+ Fabrication processes
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DRIE (~10 μm)
DRIE trimming SixNy passivation
Bulk etching (~100 μm)
MUMPsprocess (~1 μm)
MOSBE Fabrication Platform
M. Wu, C. Lai, and W. Fang, IEEE MEMS’04, the Netherlands, 2004M. Wu, C. Lai, and W. Fang, JMM, 2005
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• Increasing the stiffness of the thin poly-Si structures w/o changing the film thickness
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A B
A
B
AB
y (d
efle
ctio
n)
x (beam length)
y (d
efle
ctio
n)
Def
lect
ion
(μm
)
A
B
Position along the beam length (μm)0 140
0
0
9
9
U-shape cantilever
Conventional cantilever
Passive component - Stiff beam
H.-Y. Lin and W. Fang, JMM., 2000
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H.-Y. Lin and W. Fang, the ASME IMECE, Orlando, FL, 2000
Reinforced folded frame
Passive component - Flat mirror
H.-Y. Lin and W. Fang, Sensors and Actuators A, 2004
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ρ : 93mm ρ : 41mm ρ : 153mm ρ : 179mm
X axis-Profile435μm
Y axis-Profile435μm
X axis-Profile435μm
Y axis-Profile435μm
MOSBE mirrorConventional mirror
H.-Y. Lin and W. Fang, the ASME IMECE, Orlando, FL, 2000
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• Narrow trench-refilled poly-Si (depth ~ 20 μm)+ Double-ring reinforced rib on its boundary + Grid reinforced rib on its domain
M. Wu, C. Lai, and W. Fang, IEEE MEMS’04, the Netherlands, 2004
Passive component – Flat mirror
M. Wu, and W. Fang, JMM, 2005
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• Four different type mirror
Rib-reinforced structure
+ Thin film mirror (ROC: 19 mm) + Single ring mirror (ROC: 64 mm)
+ Double ring mirror (ROC: 92 mm) + Double ring with grid (ROC: 150 mm)
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Active component - Electrostatic actuator I
J. Hsieh and W. Fang, Transducers’99, Sendai Japan, 1999J. Hsieh and W. Fang, Sensors and Actuators A, 2000
Plate Torsional springDriving electrode
• META Engine : ((MMicroicro EElectrostatic lectrostatic TTorsionalorsional AActuator )ctuator )
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• EDLA Engine : ((EElectrostaticallylectrostatically--DDrivenriven--LLeverage everage AActuator )ctuator )
Outputdisplacement
Electrode
Pivot
Lever
Max disp. > 15μm Driving voltage < 25 volt
H.-Y. Lin, H. Hu, and W. Fang, Transducers’01, Munich Germany, 2001
Active component - Electrostatic actuator II
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• Vertical comb electrodes+ Comb thickness ~20um + Travel stoke ~20um
20um
Active component - Vertical comb actuator
M. Wu, and W. Fang, JMM, 2005
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Active component - electrothermal actuator
W.-C. Chen, J. Hsieh, and W. Fang, IEEE MEMS’02, Las Vegas, NV, 2002W.-C. Chen, J. Hsieh, and W. Fang, Sensors and Actuators A, 2003
Move upward
Move downward
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1000 10000 100000
-40
-35
-30
-25
-20
-15
-10
-5
Res
pons
e (d
B)
Frequency (Hz)
1.8 kHz 33 kHz
105 106 107 108 10930
31
32
33
34
35
reso
nant
freq
uenc
y (k
Hz)
number of cyclesNumber of cycles (million cycles)
0.1 1.0 10 100 1000
Frequency (kHz)
1.0 10 100R
eson
ant f
requ
ency
Res
pons
e (d
b)
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Vertical comb actuatorRib-reinforced mirror and frame
Torsionalspring
Applications – 1 axis optical scanner
M. Wu, and W. Fang, IEEE MEMS, Masstricht, the Netherlands, 2004M. Wu, and W. Fang, JMM, 2005
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Scanning test
M. Wu, and W. Fang, IEEE MEMS, Masstricht, the Netherlands, 2004
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00.20.40.60.81
0 1 2 3 4 5 6
Frequency(kHz)
Am
plitu
de
Resonant frequency ~1.8 kHz
Dynamic measurement
• Dynamic test driven by AC
0
1
2
3
0 10 20 30 40 50
Voltage (V)A
ngle
(deg
ree)
• Static load-deflection test + out-of plane displacement
~12.03μm at 50V+ scanning angle ~ 2.8 degree
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M. Wu, C. Lai, and W. Fang, IEEE MEMS’04, the Netherlands, 2004
Mirror (passive)
Driving electrodes (active)
Springs (passive)
Supporting frame (passive)
Applications - 2D Gimbal mirror
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Scanning test
Outer axis: 7.1kHz
Inner axis: 4.1kHz
• Scanning images
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• Scanning images
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Dynamic measurement
• Dynamic test driven by AC • Static load-deflection test
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H.-Y. Lin and W. Fang, IEEE Optical MEMS, Kauai, Hawaii, 2000H.-Y. Lin and W. Fang, the ASME IMECE, Orlando, FL, 2000
1 cm
Applications: optical scanner
EDLA engine
Mirror
Torsional spring
H.-Y. Lin and W. Fang, Sensors and Actuators A, 2004
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Excitation frequency (kHz)
Op
tica
l sc
an
nin
g a
ng
le(d
eg
)
0
1
23
4
5
6
7
8
9
10
0 2 4 6 8 10 12 14 16 18 20 22 24 26
Sine wave, ±18.5 VDC bias, 18.5 V1st torsional mode
4.2 kHz, 9.2 deg
2nd torsional mode17.7 kHz, 1.53 deg
• Measured frequency response