二零一四年台灣平坦化論壇2014 CMP Forum Taiwan

0830~1200 AM, September 5, 2014台北市南港區經貿二路 1 號世貿南港展覽館 402C 會議室Taipei World Trade Center Nangang Exhibition Hall Rm 402C

平坦化現在以及超越摩爾定律後的角色

THE ROLE OF CMP NOW AND BEYOND

MOORE’S LAW

平坦化如何勝任在 1X 技術節點訴求？製程材料與周邊支援技術都須到位，把握機會，聆聽專家對以上議題解決方案的重點，必有收益。

主辦單位Organized by

協辦單位Co-Organized by

執行單位Executed by

收費 Price By 8/21 8/22~9/1 9/5 walk-in

CMPUGTW board members Free Free TWD 200

CMPUGTW members TWD 600 TWD 900 TWD 1000

Non-member TWD 900USD 30

TWD 1000USD 35

TWD 1200USD 40

08:30–08:50 Registration, sign up

08:50-09:00Opening Remarks: Professor Arthur Chen, National Taiwan University of Science and Technology; Chairman of Board Directors of CMPUGTW.

09:00-10:00 Session 1. Moderator: Dr. Willie Pai/Vice Chairman, KINIK Company

09:00-09:30Challenges in 1x Design Node Semiconductor Device Cleaning

Professor Jingoo ParkHanyang University

09:30-10:00CMP Applications from Nanometer Scale Features to Microscopic Levels

Dr. Yuchun Wang, Vice President of R&DAnji Microelectronics (Shanghai) Co., Ltd.

10:00-10:20 Break

10:20-12:00 Session 2 Moderator. Professor PL Tso, Tsing Hua University

10:20-10:50The Next Generation Filtration of CMP Slurry with Nanofiber Technology

HJ Yang, Director of Application DevelopmentEntegris

10:50-11:20CMP Solutions for 1X Technology Nodes

Dr. Marty DeGroot, Asia Technology DirectorDow Electronic Materials

11:20-11:50Novel Colloidal Slurry for Low Defect Dielectrics CMP.

Dr. KC Wu, Global Strategic Marketing DirectorCabot Microelectronics

11:50-12:00 Open discussion

12:00 VIP lunch (invited only)

Programs are subject to change without prior notice