xdm 300.pdf

Edition : 09.05.2007 09:26

Global Professional Services ECI Training ServicesECI Telecom Ltd.

Global Professional Services

ECI Training services

XDM 300

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What is the XDM-300?

A cost effective, high-capacity MADM-64 and MADM-16, Multiple Service Provisioning Platform (MSPP)

Provides TDM, Ethernet and MPLS services over SDH/SONET and CWDM/DWDM

For Metro Access/Core , Cellular and Utelco networks1. MADM = Multi Add and Drop Multiplexer

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STMSTM--1/41/4

AccessAccess

Access to Metro Core Product PortfolioAccess to Metro Core Product Portfolio

Metro Metro AccessAccess

STMSTM--4/164/16 STMSTM--16/6416/64

Metro Metro

BGBG--20E20ENonNon--RedundantRedundantMultiMulti--ADMADM--1/41/4

XDMXDM--5050RedundantRedundant

MultiMulti--ADMADM--1/41/4

XDMXDM--100100MultiMulti--ADMADM--4/164/16

XDMXDM--300300MultiMulti-- ADMADM--16/6416/64

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Carrier Class Transport Ethernet Aggregation Products Overview

End-to-End OAM Managementvia LightSoft®

CPE/CLE Access Metro CPE/CLE Access Metro CoreCore

BG-20 XDM-50

MADM-1/4ADM/TM-1/4

XDM-100 XDM-500 XDM-1000

MADM-4/16 MADM-16/64 MADM-16/64

Access Aggregation

Metro Aggregation

Metro Access Aggregation

Metro Core Aggregation

AccessDemarcation

MSPP

12.5 GBps8 service-slots

Interfaces:E1,E3/DS3,

FE/GE,STM1/4

Protocols:SDH,L1,L2

MSPP

30 GBps12 service-slots


FE/GE,STM1/4/16 CWDM

Protocols:SDH,L1,L2,MPLS

MSPP

30/60 GBps10 service-slots


FE/GE/10GE,STM1/4/16/64

DWDM


MSPP



FE/GE10GE,STM1/4/16/64

DWDM


µMSPP

2.5 GBps1 service-slots


FE/GE,STM1/4

Protocols:SDH,L1,L2

XDM-1000

MADM-16/64

Core Aggregation

MSPP



FE/GE/10GE,STM1/4/16/64

DWDM


XDM-300

MADM-16/64

Metro Aggregation

MSPP



FE/GE/10GE,STM1/4/16/64

C/DWDM


1. Commonly agreed, Data is the main driver for B/W growth. However, both Enterprise users and Mobile operators rely heavily on TDM trunks for carrying most of their traffic. Enterprises connect their Private Branch exchanges (PBXs) to the WAN, and Mobile Base T? Station (BTSs) and Base Station Controllers are connected via multiple E1s trunks. Furthermore, SDH/SONET and DWDM are widely accepted as the most suitable technologies for reliable, high-capacity transmission. Thus, transmission systems, which offer multiservice access, namely both TDM and Ethernet, provide an attractive solution to these customers’ needs.

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Cost effective PlatformHigh density – very low cost per portScalability and flexibility – low entry price (CAPEX)Same I/O cards as XDM100/50 (OPEX)

Optimized for Metro Layer (Metro Access/Core)Single metro platform for all service typesSingle metro platform for all application typesEnhanced Ethernet services (L1,L2 and MPLS)Provides more efficient scaling in the Metro AccessThe Smallest MADM64 – only 325mm (7U) high

Hybrid & High CapacityPowerful 60G central matrixNon-blocking HO/LOCWDM supportSeamless network migration from 2.5G to 10G (XDM100 -> XDM300)

XDM-300

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XDM-300 Applications

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Basic MADM-64 and MADM-16Basic ADM-64 Functionality Multi ADM-64 - Multi ring closure of up to 3 STM-64 ringsMulti ADM-16 - Multi ring closure of up to 12 STM-16 rings Combine MADM-64 and MADM-16, Multi STM-16 Ring closure and Gateway to the Metro Core STM-64 ring

DXC - 60G LO Cross-ConnectDrop shelf – E1/E3/DS3 and STM1 Expansion shelf Up to 24,192 Low order XC

Metro Ethernet servicesMetro Access and Metro Core Aggregation

Layer One (EPL) – E-LineLayer Two (EPLAN) – E-Line, E-LAN

Carrier Class Ethernet ServicesMPLS – E-Line, E-LAN and Triple Play

Cellular BackhaulTDM & MPLS - 2.5G & 3G

XDM-300 Applications

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Typical Metro Network Aggregation

1. Real networks are like onions. They are composed of layers.2. The CPE layer may be addressed with various platforms such as simple switch for

Ethernet services, Terminal MSPP for combination of Ethernet and traditional TDM and IP-DSLAM for residential customers and SOHO.

3. CPE are typically connected to the edge layer over dedicated fiber (or co-located platforms). The edge layer caries both traditional and Ethernet services to the core network which acts as the gateway to IP-VPN networks, Internet and legacy voice systems.

4. The data part of the Edge layer may be implemented in one of two ways:5. Mapping of Ethernet to dedicated SDH containers (VC-12/3/4) with L1 data cards and

grooming (statistically) just before accessing the core layer1. This type of solution is offered today with BG-40 and will be offered with XDM-50

and XDM-100 in next release of XDM (V6)6. Using switched Ethernet on the Edge Nes and benefiting from the advantages of

statistical multiplexing much closer to the customer location (at higher cost).1. This type of solution is offered today by XDM-50 and XDM-100 with EIS cards.

7. The core of the network interconnects edge networks with the gateways to the IP core, Internet and may at the same time provides SDH transmission for legacy TDM services.

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Cellular Network Architecture

3G (Rel 5) RAN (Radio Access Network) aggregation SolutionMPLS benefits for 3G (Rel 5) based Ethernet/IP Mobile services

MPLS converged mobile network to reduce CapEx/OpExMPLS Traffic Engineering assured service quality, such as:

VoIP, HSDPA (HSI), Voice/Video conferencing, MP3 streaming, etcPreserve current infrastructure and offer smooth migration to 3G, 4G

Smooth migration path for mobile aggregation using MSPP

2G 2.5G 3G(rel42G 2.5G 3G(rel4--ATM) 3G(rel5ATM) 3G(rel5--IP) 4GIP) 4G

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XDM-300 Features and Benefits

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XDM-300 Concept

Cost optimize MADM-16/64High capacity 60G HO/LO Ultra-dense I/O cards for higher fan-outShare the same I/O cards as XDM50/100 Inherent all XDM100 functionalities (TPU, EoS cards, C/DWDM, OCU etc)

7U(325mm)

430mm 300mm

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The XDM-300 Layout

ECUECUExternal Control UnitExternal Control Unit

FCU300FCU300Fan Control UnitFan Control Unit

SDH/SONET SDH/SONET Quad I/O Quad I/O

Modules (I17) Modules (I17) (SIM16_1, SIM16_4, (SIM16_1, SIM16_4,

SIM64_XFP)SIM64_XFP)

I/O Modules:(I1I/O Modules:(I1--I8)I8)PIM, SIM, DIOM, EISMB, PIM, SIM, DIOM, EISMB, MCSM,CCMBR,CTRPMCSM,CCMBR,CTRP

MXCMXC--300A300A60G Multiplexer 60G Multiplexer Cross Connect Cross Connect

andandControlControl

MXCMXC--300B300B60G Multiplexer 60G Multiplexer Cross Connect Cross Connect

andandControlControl

SDH/SONET SDH/SONET Quad I/OQuad I/O

Modules (I18) Modules (I18) (SIM16_1, SIM16_4, (SIM16_1, SIM16_4,

SIM64_XFP)SIM64_XFP)

I/O Modules (I9I/O Modules (I9--I16):I16):PIM, SIM, DIOM, EISMB, PIM, SIM, DIOM, EISMB, MCSM, CCMBR,CTRPMCSM, CCMBR,CTRP

1. 18x I/O modules2. MXC300 – Main X-connect Card

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XDM-300 Common Cards

XDM-300 Shelf Basic XDM-300 shelf 7U (subrack) Up to 18 I/O slots Ready for 3 X external TPU

1 X ECU300F/ECU300 - External Connection Unit Management interfacesExternal alarms and monitor points control

2 X MXC300 - Main ProcessorSupporting 60G capacity HO/LOOne INF for -48V DC

1 X FCU300 - Fan Control UnitPowerful 8 Fans

XDMXDM--300 300 ShelfShelf

ECU300ECU300External Control External Control

UnitUnit

FCU300FCU300Fan Control UnitFan Control Unit

MXC300AMXC300AMultiplexer Multiplexer

Cross Connect Cross Connect and Controland Control

MXC300BMXC300BMultiplexer Multiplexer

Cross Cross Connect Connect

and Controland Control

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XDM-300 I/O Cards

Two aggregation SIM options (Quad I/O I17-I18) :SIM64_XFPSIM16_4

New I/O cards :SIM1_8SIM16_1SIM4_4MCSM

All of XDM50/100 I/O cards:PIM2_21, PIM2_63, PIM345_3SIM1_4, SIM4_2DIOM,EISMB

ECU Display

FCU300

I17

MXC300 A-SIM64_1XFP

1x48Vin

IM1 IM2 IM3 IM4IM5 IM6 IM7 IM8 I/O Modules:I/O Modules:

PIM, SIM,DIOM,PIM, SIM,DIOM,EISMB,MCSMEISMB,MCSM

I18

MXC 300 B1x48Vin

IM9 IM10 IM11 IM12IM13 IM14 IMI5 IMI6 I/O Modules:I/O Modules:

PIM, SIM,DIOM,PIM, SIM,DIOM,EISMB,MCSMEISMB,MCSM

SIM16_4

SIM64_XFPSIM64_XFP

SIM16_4SIM16_4

SIM16_1SIM16_1SIM4_4SIM4_4SIM1_8SIM1_8

MCSM,DIO,EISMBMCSM,DIO,EISMB

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C/DWDM InterfacesColored SDH Transceivers

STM-16 C/DWDM colored SFPSTM-64 DWDM colored XFP

Optical Cards 2xGBE/FC/FICON CombinerCTRP25_2CRPT25_2

CWDM Components MUX/DEMUX OADM ModulesSplitter/Coupler Modules

XDM-300 Hybrid

TCFTCFTPMTPM TPMTPM TPMTPM TPMTPM

ECU Display

IM17

MXC300 A1x48Vin

IM18

MXC 300 B1x48Vin

FCU

300


TCFTCF

IM1 IM2 IM3 IM4

IM5 IM6 IM7 IM8

IM9 IM10 IM11 IM12

IM13 IM14 IMI5 IMI6

I/O Modules:I/O Modules:PIM, SIM,DIOM,PIM, SIM,DIOM,EISMB,MCSMEISMB,MCSM

I/O Modules:I/O Modules:PIM, SIM,DIOM,PIM, SIM,DIOM,EISMB,MCSMEISMB,MCSM

TPU/OCUTPU/OCU

TPU/OCUTPU/OCU

OCUOCU

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XDM-300 Port Density

3284Layer 2 Ethernet (100FX/GBE)

6448Layer 2 MPLS (10/100BT)

6448Layer 2 MPLS (100FX/GBE)

2416x1+4x21/4STM-16

64164STM-4

3284Layer 2 Ethernet (10/100BT)

64164Layer 1 Ethernet (100FX/GBE)

128168Layer 1 Ethernet (10/100 BT)

661STM-64

128168STM-1O/E (SFP)

64164STM-1/E (IOP support)

48163E3,DS3

504863E1

Max. Ports per Shelf

Max. Cards per Shelf

Ports per Module

Traffic Type

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XDM-300 Characteristics

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Equipment Protection, Redundancy1:1 1:2 and 1:3 I/O protection schemes for 2/34/45Mbps and STM-1 electrical I/O1+1 matrix protection Common control redundancyTiming unit redundancyPower supply redundancy

Traffic Protection Mechanisms1+1 Path ProtectionSNCPMSP 1+1MS-SPRing

XDM-300 as Carrier Class Platform

Tributaries Tributaries Protection Protection

Module (TPM)Module (TPM)E1E1

Tributaries Tributaries Protection Protection Unit (TPU)Unit (TPU)

E3,DS3,STM1E3,DS3,STM1

Tributaries Tributaries Protection Protection

Module (TPM)Module (TPM)E3,DS3,STM1E3,DS3,STM1

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Full nonblocking low order 60G cross connect2 Quad I/O slots with 10G16 I/O slots with 2.5G

XDM-300 Slot Capacity

ECU Display

IM17

MXC300 A1x48Vin

IM1 IM2 IM3 IM4

IM5 IM6 IM7 IM8

I/O Modules:I/O Modules:PIM, SIM, DIOM,PIM, SIM, DIOM,EISMB, MCSMEISMB, MCSM

IM18

MXC300 B1x48Vin

IM9 IM10 IM11 IM12

IM13 IM14 IMI5 IMI6


FCU

300

2.5G

2.5G 2.5G 2.5G 2.5G

2.5G 2.5G 2.5G

2.5G

2.5G

2.5G

2.5G

2.5G

2.5G

2.5G

2.5G

10G

10G

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XDM-300 Modularity – Expansion Options

The basic XDM-300 shelf is designed to accommodate:Up to 3 X TPU/OCU (Tributary Protection Unit)


ECU Display

IM17

MXC300 A1x48Vin

IM18

MXC300 B1x48Vin

FCU

300


TCFTCF

IM1 IM2 IM3 IM4

IM5 IM6 IM7 IM8

IM9 IM10 IM11 IM12

IM13 IM14 IMI5 IMI6



TPU/OCUTPU/OCU

TPU/OCUTPU/OCU

OCUOCU

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Regular -48 to -60 VDC +/- 20% variation [standard]Double power feed capability (one in each MXC300)Protection against:

Reverse polaritySudden power disconnection and reconnectionShort-circuit input unitsLighting strikesAbnormal power supply current

Maximum power consumption 1600W

The XDM-300 Power Feed

INF Power INF Power FeedingFeeding

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Global Professional Services

ECI Training services

XDM 300 Modules

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New I/O CARD – SIM64_XFP

Accommodate in Quad I/O slot (wide slots)1 x STM-64 interface per card XFP colored/non-colored transmitters Transmitter types I, S, L (10KM,40KM,80KM)Receiver types PIN & APDSupport OTN G.709 10.7 Gbps line transceiver with FEC

1x STM1x STM--6464XFPXFP

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New I/O CARD - SIM16_4

Accommodate in Quad I/O slot (wide slots)4 X STM-16 interfaces per cardBased on SFP moduleColored C/DWDM and non-colored transmitters Transmitter types I, S,V,X, BReceiver types PIN & APD

4 x STM4 x STM--1616SFPSFP

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1 X STM-16 interface per cardBased on SFP moduleColored C/DWDM and non-colored transmitters Transmitter types I, S,V, X, BReceiver types PIN & APD

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New I/O CARD – SIM4_4

4 X STM-4 Interfaces per CardBased on SFP ModuleTransmitter Types I, S,LReceiver Types PIN & APD

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8 X STM-1 Interfaces per CardElectrical and Optical SFP SupportTransmitter Types I, S,LReceiver Types PIN and APD

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2 x 10/100 Ethernet for Management and Local Craft Terminal (LCT)Serial Port for LCT (RS-232)2 x External Timing (T3/T4)External Alarms Port

XDM-300 Control Interfaces

2 X 10/100 2 X 10/100 EthernetEthernet

Serial portSerial portRSRS--232232

External AlarmsExternal Alarms2 X T3/T4 2 X T3/T4 External External

timing portstiming ports

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The XDM-300 has a fan control unit for convection purposesThe FCU300 includes 8 fan units with stand alone heat sensor controllerThe FCU300 is replaceable without interrupting traffic

The FCU300 (Fan Control Unit)

Controller per Controller per FAN unit FAN unit

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MXC300 – 60G fully LO

384xVC4 4c/4/3/1 XC fully LO non blocking

NVMNVM

48VDC 48VDC –– 60VDC60VDCPower FeedPower Feed

DebugDebugConnectorConnector

xdm 300.pdf

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