versatile cost effective green pwm controller ap3103 …archive.espec.ws/files/ap3103.pdf ·...

VERSATILE COST EFFECTIVE GREEN PWM CONTROLLER AP3103

Preliminary Datasheet

1

Feb. 2010 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

General Description

The AP3103 is a low startup current, current modePWM controller with green-mode power-saving opera-tion. The PWM switching frequency at normal opera-tion is externally programmable and is trimmed to atigh range. The dithering of frequency will improveEMI feature. When the load decreases, the frequencywill reduce and when at a very low load, the IC willenter the ‘skip mode’ to minimize switching loss.About 20kHZ frequency switching is aviode the audi-ble noise as well as reduding the standby loss.

The AP3103 features a lot of functions such as theLeading-Edge Blanking (LEB) of the current sensing,internal slope compensation and several protectionfunctions including cycle-by-cycle current limit(OCP), VCC Over Voltage Protection (VOVP), OTP,OLP protection.

This IC is available in SOT-23-6 and DIP-8 packages.

Features

· Bi-CMOS Process with Excellent Performance· Very Low Start-up Current:(< 15µA) · Current Mode Control· Non-audible-noise Green-mode Control· LEB (Leading-edge Blanking) on CS Pin· Internal Slope Compensation · Frequency Fold Back for High Average Effi-

ciency· Soft Switching for Reducing EMI· Useful Pin Fault Protection:

CS Pin FloatingRI Pin Short to GroundRI Pin FloatingFB/Opt-coupler Open/short

· Comprehensive System Protection Feature:VCC Over Voltage Protection (VOVP) Over Temperature Protection (OTP) Over Load Protection (OLP)

· Mini Size with Packages

Applications

· Switching AC-DC Adapter/Charger· ATX/BTX Auxiliary Power· Set-top Box(STB) Power Supply· Open Frame Switching Power Supply

Figure 1. Package Types of AP3103

SOT-23-6 DIP-8



2


Pin Configuration

Pin NumberPin Name Function

SOT-23-6 DIP-8

1 8 GND Signal ground. Current return for driver and control circuits

2 7 FB (COMP) Feedback. Directly connected to the opto-coupler

3 5 RI Set the bias current to determine the normal switching frequency

4 4 SENSE Current Sense

5 2 VCC Supply voltage of driver and control circuits

6 1 GATE Gate driver output

3, 6 NC No connection. These pins are not internally connected

Pin Description

(SOT-23-6)

GATEGND

K Package

Figure 2. Pin Configuration of AP3103 (Top View)

(DIP-8)P Package

1

2

3

4

8

7

6

5

GATE

FB

GND

RI

NC

VCC

NC

SENSE

1

2

3 4

5

Pin 1 Dot by Marking

6

FB

RI

VCC

SENSE

3




Functional Block Diagram

Figure 3. Functional Block Diagram of AP3103

GND

GATE

SENSE

Driver17.5V

OSC

FB

OCP

0.85 V

2

41

PWM

OLP1.1V

6

VCC5

28VOVP

RI3O/S Protection

UVLO15V

Internal Bias &VREF

0.6V

250nsLEB

OLPOTPOVP

FOCP

Line Compensation

QBD

CLKRBDFF

OTP140

VCC

Soft Start

VDD

35.5V

8.8V



4


Ordering Information

Circuit Type

PackageK: SOT-23-6

G1: Green

AP3103 -

TR: Tape and ReelBlank: Tube

P: DIP-8

Package Temperature Range Part Number Marking ID Packing Type

SOT-23-6 -40 to 85oC AP3103KTR-G1 GHL Tape & Real

DIP-8 -40 to 85oC AP3103P-G1 AP3103P-G1 Tube

BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green.

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Parameter Symbol Value Unit

Power Supply Voltage VCC 30 V

Gate Output Current IO 300 mA

Input Voltage to FB, SENSE pin VFB, VSENSE -0.3 to 7 V

Thermal Resistance Junction to Ambient θJASOT-23-6 250

oC/WDIP-8 100

Power Dissipation and Thermal Charac-teristic, SENSE at TA<25oC

PDSOT-23-6 500

mWDIP-8 1250

Operating Junction Temperature TJ -40 to150 oC

Storage Temperature Range TSTG 150 oC

ESD (Human Body Model) 3000 V

ESD (Machine Model) 300 V

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage tothe device. These are stress ratings only, and functional operation of the device at these or any other conditionsbeyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max-imum Ratings" for extended periods may affect device reliability.

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Supply Voltage VCC 10 25 V

Ambient Operating Temperature Range TA -40 85 oC

Absolute Maximum Ratings (Note 1)



6


Parameter Symbol Conditions Min Typ Max Unit

Supply Voltage (VCC Pin)Start-up Current ISTART-UP VCC=14.8V 5 15 µA

Operating Supply Current ICCVFB=0V, CL=1nF, RRI=100kΩ 1 2 3 mAVFB=3V, CL=1nF, RRI=100kΩ 0.65 1.65 2.65

UVLO (on) 14 15 16 V

UVLO (off) 7.8 8.8 9.8 VVCC OVP 27 28 29 V

VCC Clamp ICC=5mA 34 35.5 37 V

PWM Section/Oscillator SectionMaximum Duty Cycle 70 75 80 %Minimum Duty Cycle 0Oscillation Frequency RRI=100kΩ 60 65 70 kHz

Green Mode Frequency RRI=100kΩ 22 kHz

Frequency Temperature Stability -40oC to 85oC 5 %

Frequency Voltage Stability VCC=12 to 30V 3 %

Frequency Dithering ±6 %

Current Sense Section (SENSE Pin)

Maximum SENSE Voltage VCS VFB=3.3V, RRI=100kΩ 0.800 0.850 0.900 V

LEB Time of SENSE 150 250 350 nsDelay to Output 50 150 250 ns

Soft-start Time 0.5 msFeedback Input Section (FB Pin)

The Ratio of Input Voltage to Current Sense Voltage 2.5 3 3.5 V/V

Input Impedance 3 4.5 6 kΩ

Source Current VFB=0V -0.5 -1 -1.5 mAInput Voltage for Zero Duty 1.5 V

Output Section (GATE Pin)Output Low Level IO=20mA, VCC=12V 1 V

Output High Level IO=20mA, VCC=12V 8 VOutput Clamping 16 17.5 19 V

Rising Time CL=1nF, VCC=13V 120 220 320 nsFalling Time CL=1nF, VCC=13V 30 50 90 ns

Electrical CharacteristicsVCC=16V, TA=25oC, unless otherwise specified.

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Electrical CharacteristicsVCC=16V, TA=25oC, unless otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Over Temperature Protection SectionShutdown Temperature 140 oCTemperature Hysteresis 20 oCDelay Time SectionDelay 1 of Protection OLP 35 ms

Delay 2 of Protection VCC OVP 25 µs



8


Typical Performance Characteristics

Figure 4. Start-up Voltage vs. Ambient Temperature

Figure 5. Shutdown Voltage vs. Ambient Temperature

Figure 6. Start-up Current vs. Ambient Temperature Figure 7. Operation Current vs. Ambient Temperature

-40 -20 0 20 40 60 80 100 1202.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

Sta

rt-up

Cur

rent

(µA)

Ambient Temperature (oC)

-40 -20 0 20 40 60 80 100 120 140

13.6

13.8

14.0

14.2

14.4

14.6

14.8

15.0

15.2

15.4

Sta

rt-up

Vol

tage

(V)

Ambient Temperature (oC)-60 -40 -20 0 20 40 60 80 100 120 140 160

7.8

8.0

8.2

8.4

8.6

8.8

9.0

9.2

9.4

9.6

9.8

Shu

tdow

n V

olta

ge (V

)


-40 -20 0 20 40 60 80 100 120 1400.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

Ope

ratio

n C

urre

nt (m

A)


9




Typical Performance Characteristics (Continued)

Figure 8. VCC OVP vs. Ambient Temperature Figure 9. fOSC vs. Ambient Temperature

-40 -20 0 20 40 60 80 100 120 14027.4

27.6

27.8

28.0

28.2

28.4

VC

C O

VP

(V)


-40 -20 0 20 40 60 80 100 120 14055.0

57.5

60.0

62.5

65.0

67.5

70.0

72.5

75.0

f OS

C (k

Hz)




10


Operation Description The AP3103 is specifically designed for off-line AC-DC power supply used in LCD monitor, notebookadapter and battery charger applications. It offers a costeffective solution with a versatile protection function.

Start-up Current and UVLOThe start-up current of AP3103 is optimized to realizeultra low current (5µA typical) so that VCC capacitorcan be charged more quickly. The direct benefit of lowstart-up current is the availability of using large start-up resistor, which minimizes the resistor power loss forhigh voltage AC input.

An UVLO comparator is included in AP3103 to detectthe voltage on the VCC pin. It ensures that AP3103 candraw adequate energy from hold-up capacitor duringpower on. The turn-on threshold is 15V and the turn-off threshold is 8.8V.

OscillatorThe oscillation frequency is programmed by the valueof resistor R1, connected from pin RI to ground. Theresistor will make a constant current source todetermine the oscillation frequency by charging anddischarging an internal capacitor. Normally, RI pinshould not be placed where exists too much noise, asthe disturbance may make the IC work abnormally. The oscillation frequency can be expressed as:

The recommended oscillation frequency is 50 to 100kHz from the EMI consideration.

Current Sense Comparator and PWMLatchThe AP3103 operates as a current mode controller; theoutput switch conduction is initiated by everyoscillator cycle and is terminated when the peakinductor current reaches the threshold level establishedby the FB pin. The inductor current signal is convertedto a voltage signal by inserting a reference senseresistor RS. The inductor current under normaloperating conditions is controlled by the voltage at FB

pin, the relation between peak inductor current (IPK)and VFB is:

Leading-edge BlankingA narrow spike on the leading edge of the currentwaveform can usually be observed when the powerMOSFET is turned on. A 250ns leading-edge blank isbuilt-in to prevent the false-triggering caused by theturn-on spike. During this period, the current limitcomparator is disabled and the gate driver can not beswitched off.

FB Pin and Short Circuit ProtectionThis pin is normally connected to the opt-coupler anda lways pa ra l l e l ed wi th a capac i to r fo r loopcompensation. When the voltage at this pin is greatthan 4.2V (such as output short to ground or the opt-coupler is broken) and lasts for about 25ms, the IC willenter the protection mode. For AP3103, the system willenter hiccup mode to wait the VCC decreasing to lowUVLO level, then the IC will try to restart until thefailure removed. And when this voltage is less than1.5V, the IC will stop the drive pulse immediately.Therefore, this feature can be used for short circuitprotection, which makes the systemimmune fromcatastrophic failure. Normally, output short makes theVFB value to the maximum because the opt-coupler iscut off.

System Protection and Pin FaultProtectionThe AP3103 provides versatile system and pin faultprotections. The OCP comparator realizes the cycle-by-cycle current limiting (OCP).In universal input linevoltage, the IC realizes the constant over loadprotection (OLP). VCC over voltage protection can beapplied as the primary OVP or opt-coupler brokenprotection. The AP3103 also has pin fault connectionprotection including floating and short connection. Thefloating pin protection include the RI, SENSE, FB, etc;The short pin protection includes the RI pin shortprotection. When these pins are floated or RI pin isshorted to ground, PWM switching will be disabled,thus protecting the power system.

)()(1

6500kHz

kRf

Ω≈

SFBPK RVI 3/)8.0( −=

11




Figure 10. Typical Application of AP3103

Typical Application

~ ~

+

-

VCC

GND

OUT

FB

CSRI

~

AZ431AP3103

L2T1

R13C7

C6

C8

R14

R15

R16R17

R18

C9

U2

C10

R12R11

R10R9

R8

C5R6

R19

C4

R5

R4C2

C1

VR1

U1

NTC

R2 R3

F1

R7

C3

C11



12


Mechanical Dimensions

SOT-23-6 Unit: mm(inch)

2.820(0.111)3.020(0.119)

2.65

0(0.

104)

2.95

0(0.

116)

1.50

0(0.

059)

1.70

0(0.

067)

0.950(0.037)TYP

1.800(0.071)2.000(0.079)

0.300(0.012)0.400(0.016)

0.700(0.028)REF

0.100(0.004)0.200(0.008)

0°8°

0.200(0.008)

0.300(0.012)0.600(0.024)

0.000(0.000)0.100(0.004)

0.900(0.035)1.300(0.051)

1.450(0.057)MAX

1 2 3

456

Pin 1 Dot by Marking

13




Mechanical Dimensions (Continued)

DIP-8 Unit: mm(inch)

4°

6°

R0.750(0.030)

0.254(0.010)TYP

0.130(0.005)MIN

8.200(0.323)9.400(0.370)

0.204(0.008)0.360(0.014)

7.620(0.300)TYP

4°

6°5°

0.700(0.028)

9.000(0.354)9.400(0.370)

3.710(0.146)4.310(0.170)

3.000(0.118)3.600(0.142)

0.360(0.014)0.560(0.022)

2.540(0.100) TYP

6.200(0.244)6.600(0.260)

3.200(0.126)3.600(0.142)

0.510(0.020)MIN

Φ3.000(0.118)Depth

0.100(0.004)0.200(0.008)

1.524(0.060) TYP

Mechanical Dimensions (Continued)

Note: Eject hole, oriented hole and mold mark is optional.

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or useof any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights orother rights nor the rights of others.

- Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Limited800, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008

BCD Semiconductor Manufacturing LimitedMAIN SITE

REGIONAL SALES OFFICEShenzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen OfficeAdvanced Analog Circuits (Shanghai) Corporation Shenzhen OfficeRoom E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951Fax: +86-755-8826 7865

Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, TaiwanTel: +886-2-2656 2808Fax: +886-2-2656 2806

USA OfficeBCD Semiconductor Corporation30920 Huntwood Ave. Hayward,CA 94544, U.S.ATel : +1-510-324-2988Fax: +1-510-324-2788

- IC Design GroupAdvanced Analog Circuits (Shanghai) Corporation8F, Zone B, 900, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6495 9539, Fax: +86-21-6485 9673

BCD Semiconductor Manufacturing Limited

http://www.bcdsemi.com

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or useof any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights orother rights nor the rights of others.

- Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.800 Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008

MAIN SITE

REGIONAL SALES OFFICEShenzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen OfficeUnit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,China Tel: +86-755-8826 7951Fax: +86-755-8826 7865

Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, TaiwanTel: +886-2-2656 2808Fax: +886-2-2656 2806

USA OfficeBCD Semiconductor Corp.30920 Huntwood Ave. Hayward,CA 94544, USATel : +1-510-324-2988Fax: +1-510-324-2788

- HeadquartersBCD Semiconductor Manufacturing LimitedNo. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, ChinaTel: +86-21-24162266, Fax: +86-21-24162277

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