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  • UM10503LPC43xx ARM Cortex-M4/M0 dual-core microcontroller Rev. 1.4 3 September 2012 User manual

    Document informationInfo ContentKeywords LPC43xx, LPC4350, LPC4330, LPC4320, LPC4310, LPC4357, LPC4353,

    LPC4337, LPC4333, LPC43Sxx, ARM Cortex-M4, ARM Cortex-M0, SPIFI, SCT, USB, Ethernet

    Abstract LPC4300 user manual

  • NXP Semiconductors UM10503LPC43xx user manual

    Revision historyRev Date Description

    1.4 20120903 LPC43xx user manual.

    Modifications: SSP0 boot pin functions corrected in Table 18 and Table 19. Pin P3_3 = SSP0_SCK, pin P3_6 = SSP0_SSEL, pin P3_7 = SSP0_MISO, pin P3_8 = SSP0_MOSI.

    CLKMODE3 removed from the SCT. Bit value CLKMODE = 0x3 changed to reserved in Table 647 SCT configuration register (CONFIG - address 0x4000 0000) bit description.

    SWD mode removed for ARM Cortex-M0. Details for GIMA clock synchronization added in Section 16.3.2. RESET_EXT_STATUS0 register removed in Chapter 13. Reset value of BASE_SAFE_CLK register changed to R (read-only) in Table 84. Reset delay values corrected in Figure 31 RGU Reset structure. RGU reset values corrected in Table 113 Register overview: RGU (base address: 0x4005 3000). Editorial updates in Chapter 18 LPC43xx Serial GPIO (SGPIO). POR reset value of the event router STATUS register corrected in Table 31 and Table 37. USB boot mode updated: 12 MHz external crystal required. See Section 5.3.5.5. IAP invoke call entry pointer clarified in Section 46.8. EMC memory data and control lines clarified for the LQFP208 package in Table 349. Figure 11 updated to include boot process for AES capable parts. Editorial updates.

    1.3 20120706 LPC43xx user manual.

    Modifications: Description of USB CDC device class updated in Section 25.5.26 USBD_API_INIT_PARAM and Section 25.5.27 USBD_CDC_API.

    Section 24.7.1 Susp_CTRL module added for USB1. Section 23.11 USB power optimization updated. Table 20 Boot image header use added. AES only available for LPC43Sxx parts. Bank, Row, Column addressing for SDRAM devices added in Table 373. Parts LPC4337 and LPC4333 added.

    1.2 20120608 LPC43xx user manual.

    Modifications: Syncflash removed from Chapter 21. Parameter tb updated in Section 5.3.6. Parameters for ISP/IAP command Copy RAM to flash updated (Table 1031 and Table 1044). Part IDs updated in Table 1036; also see Errata note ES_LPC43X0_A. Description of CTRL_DISABLE register updated (see Table 230). Table 215 SGPIO multiplexer corrected. Flash accelerator register waitstate values added (see Table 46 and Table 47). Programming procedure for the SDRAM mode register added in Section 21.8.5. Clock ramp-up procedures for core clock added in Section 11.2.1. Description of the event router updated (see Section 8.3).

    UM10503 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

    User manual Rev. 1.4 3 September 2012 2 of 1270

  • NXP Semiconductors UM10503LPC43xx user manual

    1.1 20120510

    Modifications: Reset value of the ETB bit in the ETBCFG register changed to one (see Table 48). UART1 FIFOLVL register removed. Chapter 46 LPC43xx flash programming/ISP and IAP added. OTP memory bank 0 changed to reserved. Hardware IP checksum feature removed from ethernet block. USB frame length adjust register added (see Table 54 and Table 55; for parts with on-chip flash

    only). Flash accelerator control registers added (see Table 46 and Table 47; for parts with on-chip flash

    only). Support for SAMPLE pin added to the CREG0 register (Table 42). Chapter 47 LPC43xx EEPROM memory added (for parts with on-chip flash only). SDRAM low-power mode removed in Chapter 21. Motor control PWM hardware noise filtering removed. Description of the QEI register VEL corrected. Chapter 41 LPC43xx I2S interface updated. Remove condition RTC_ALARM = LOW on reset for entering debug mode. Ethernet chapter updated: PPS and auxiliary timestamp features removed. Chapter 36 LPC43xx Event monitor/recorder added (for parts with on-chip flash only). Connection of USB0_VBUS/USB1_VBUS signals added (Section 23.5.1). Description of ADC GDR register updated (Section 44.6.2). Pin reset states updated in Table 128 and Table 129. SCT register map updated in Table 645. Changed maximum clock frequency for SWD and ETB access to 120 MHz in Chapter 48. Reduced and normal power modes removed in Chapter 10. AES encryption option added in Table 22 (parts LPC43Sxx only). SGPIO register names and descriptions updated. Update description of bit 0 in the USBSTS_D and bit 5:0 in ENDPTCOMPLETE registers of USB0/1. Update procedure Section 23.10.8.1.2 Setup packet handling using the trip wire mechanism. Polarity of bit OUTSEL in the SCT EVCTRL register swapped (see Table 670). Bit 9 (JTAG enable for the M0 co-processor) added to the CREG5 register (Table 44). Description of CCU Auto mode updated (see Section 12.5.3). LQFP100 package removed. Maximum power consumption in the USB Suspended state corrected according to USB 2.0 ECN

    specification (see Section 23.11.2).

    1 20111212 Preliminary LPC43xx user manual.

    Revision history continuedRev Date Description

    UM10503 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

    User manual Rev. 1.4 3 September 2012 3 of 1270

    Contact informationFor more information, please visit: http://www.nxp.com

    For sales office addresses, please send an email to: salesaddresses@nxp.com

  • 1.1 Introduction

    The LPC43xx are ARM Cortex-M4 based microcontrollers for embedded applications which include an ARM Cortex-M0 coprocessor, up to 1 MB of flash, up to 264 kB of SRAM, advanced configurable peripherals such as the State Configurable Timer (SCT) and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals. The LPC43xx operate at CPU frequencies of up to 204 MHz.

    The ARM Cortex-M4 is a next generation 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated in the core.

    The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which is code- and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor, designed as a replacement for existing 8/16-bit microcontrollers, offers up to 204 MHz performance with a simple instruction set and reduced code size.

    1.2 Features

    Cortex-M4 Processor core ARM Cortex-M4 processor, running at frequencies of up to 204 MHz. ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions. ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC). Hardware floating-point unit. Non-maskable Interrupt (NMI) input. JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four

    watch points. Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support. System tick timer.

    Cortex-M0 Processor core ARM Cortex-M0 co-processor capable of off-loading the main ARM Cortex-M4

    application processor. Running at frequencies of up to 204 MHz. JTAG and built-in NVIC.

    On-chip memory (flashless parts) Up to 264 kB SRAM for code and data use.

    UM10503Chapter 1: Introductory informationRev. 1.4 3 September 2012 User manual

    UM10503 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

    User manual Rev. 1.4 3 September 2012 4 of 1270

  • NXP Semiconductors UM10503Chapter 1: Introductory information

    Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually.

    64 kB ROM containing boot code and on-chip software drivers. 32 bit general-purpose One-Time Programmable (OTP) memory.

    On-chip memory (parts with on-chip flash) Up to 1 MB on-chip dual bank flash memory with flash accelerator. 16 kB on-chip EEPROM data memory. 136 kB SRAM for code and data use. Multiple SRAM blocks with separate bus access. Two SRAM blocks can be

    powered down individually. 64 kB ROM containing boot code and on-chip software drivers. 128 bit general-purpose One-Time Programmable (OTP) memory.

    Configurable digital peripherals Serial GPIO (SGPIO) interface. State Configurable Timer (SCT) subsystem on AHB. Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and

    outputs to event driven peripherals like the timers, SCT, and ADC0/1.

    Serial interfaces Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 60 MB

    per second. 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high

    throughput at low CPU load. Support for IEEE 1588 time stamping and advanced time stamping (IEEE 1588-2008 v2).

    One High-speed USB 2.0 Host/Device/OTG interface with DMA support and on-chip high-speed PHY.

    One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to external high-speed PHY.

    USB interface electrical test software included in ROM USB stack. One 550 UART with DMA support and full modem interface. Three 550 USARTs with DMA and synchronous mode support and a smart card

    interface conforming to ISO7816 specification. One USART with IrDA interface. Two C_CAN 2.0B controllers with one channel each. Two SSP controllers with FIFO

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