thermal pad
DESCRIPTION
Thermal silicon pad,Thermal conductive double-sided adhesive,Thermal graphite sheet,Silicon insulation,Phase change material,Thermal grease,Silicon fever pad,Thermal conductiveTRANSCRIPT
Thermal silicon pad
Features & benefits:● High compressibility, soft and flexible, designed for low‐stress application environment● Good thermal conductivity● Electrical insulation● Meet with the environmental requirements of ROHS and UL● Natural stickiness
Typical applications: ● Laptop● Communication hardware equipment● High‐speed hard disk drive equipment● Automobile engine control mould● Micro processor, memory chip and graphics processor● Mobile equipment
Physical properties:
High‐performance thermal conductive pad
The LG series high performance, thermal conductive paddesigned with extremely high thermal conductivity andfitting performance, which is from the boron nitridepowder of the raw material compound, its thermalconductivity in the thermally conductive gap fillingmaterials is unparalleled.
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Thermal silicon pad
Features & benefits:●High reliability & High thermal conductivity●High compressibility, soft and flexible●Natural stickiness, no extra surface frontal adhesives● Meet with the environmental requirements of ROHS and UL Typical applications:●Communication equipment ●Mobile equipment●LED Light ●Video equipment●Switching power supply ●Networking equipment●Back light model ●Household appliances●Medical equipment ●PC server/workstations Application modes:●The filling between PCB and heat sink●The filling between IC and heat sink or product outer coving●The filling between IC and similar heatsink cooling materials
sink,to achieve fully conforming and obviously cooling effect. Compared to common thermalconductive & insulating materials, HC series has certain nature stickiness which bring greatconvenience in the product installation processing, not easy to fall off and easy to operate.
Thermal conductive silicon pad
LC series thermal conductive silicon pad is high‐performance, thermal conductive gap filling materials,mainly for the transmission interface between theelectronic equipment and heat sink or product outercoving. Nice stickiness,flexibility,good compressionperformance and excellent heat conductivity aredesigned for HC series, which make the products candischarge gas from the electronic original and heat
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Thermal silicon pad
Thermal silicon pad with 3M adhesive
Features & benefits:●Ultra‐stickiness●Without fastening devices●Electrically isolating● Meet with the environmental requirements of ROHS and UL Typical applications:●LED light●Power conversion equipment●Between the semiconductor or magnetic body and heat sink●HID ballast●Household appliances Physical properties:
The LCB series is adhesive thermal conductive siliconpad, mainly for the thermal conductivity between theheating device and the heat sink or the product outercovings without fastening devices.
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Thermal silicon pad
Features & benefits:●Low hardness with ultra‐conforming●Enhanced shear strength, piercing and tearing resistance●Electrically isolating● Meet with the environmental requirements of ROHS and UL
Typical applications:●Communications industry /AC/DC power●Power conversion equipment●The framework, chassis or other area need to transfer heat●HID ballast●Auto control unit (ECU)●Uninterruptible power supply (UPS) Physical properties:
Thermal silicon pad coated with fiberglass
The LCP series thermal conductive silicon pad coated with fiberglass is an anti‐piercing & anti‐tearingproduct with a high shear strength,which consisted by the low modulus polymer attached to theglass fiber substrate,so the product can be used as a filler between the machine's contact interface.
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Thermal silicon pad
Fiberglass reinforced thermal silicon pad
Features & benefits:●Low hardness with ultra‐conforming●Enhanced shear strength, piercing and tearing resistance●Electrically isolating● Meet with the environmental requirements of ROHS and UL
Typical applications:●Communications industry /AC/DC power●Power conversion equipment●The framework, chassis or other area need to transfer heat●HID ballast●Auto control unit (ECU)●Uninterruptible power supply (UPS)
Physical properties:
The LCG series fiberglass reinforced thermalsilicon pad is an anti‐piercing & anti‐tearingproduct with a high shear strength , whichconsisted by the low modulus polymerattached to the glass fiber substrate, so theproduct can be used as a filler between themachine's contact interface.
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Thermal acrylic tape
Fiberglass reinforced thermal acrylic adhesive
Features & benefits:●High acrylic adhesive tape for pressure sensitive of various surfaces●High‐performance, thermal conductive acrylic tape Typical applications:●Make the heat sink fixed to the encapsulated chip●Make the radiator fixed to the power supply circuit board or the vehicle control circuit board●Efficient thermal conductive acrylic adhesive tape●Replace the fixed mode of hot melt adhesive, screw and buckle Physical properties:
LCT series is a kind of thermal acrylic adhesive applied inthe bond between heat sink and other powerconsumption semiconductor, the adhesive is in thenature of strong bonding strength and low thermalresistance, which can replace thermal silicon grease andmechanical fixation effectively.
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Thermal graphite sheet
Thermal graphite sheet
Key property:●Ultra‐high thermal conductive performance / easy to operate●Low thermal resistance●Light weight Application:●IC ; CPU; MOS; LED; Heat sink; LCD‐TV; Laptop; Communication equipment;Wireless switch; DVD; Hand‐held device; Camera/digital camera; Mobile phone Physical properties:
The thermal graphite sheet is a kind of totally newthermal & radiating material,heat conductingevenly along vertical & horizontal direction, shielding with heat and component while improving theperformance of the consumer electronic products.
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Thermal graphite sheet
High‐performance thermal graphite film
Applications:Cellular phone, DVC,PC and peripherals, pickup ,Semiconductor manufacturing equipment, MID table PC, Game Console, Optical communications equipment Physical properties:
It is ideal for providing thermal management/heat‐sinking in limited spaces or to providesupplemental heat‐sinking in addition to conventional means. This material is flexible and can be cutinto customizable shapes.
LGS800 high‐performance thermal graphite film is athermal interface material which is very thin,synthetically made, and has high thermal conductivity,and is made from a higly oriented graphite polymerfilm.
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Silicon insulation
LV series thermal silicon pad
Key property:●Heat resistance, insulation, fire prevention, shock resistance . Typical application:●Heating power components, Automobile electronic heating module, Power module,Household appliances,Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate. Physical properties:
The LV series silicon pad is cloth production which made by special process with the base material‐‐silicon gel and fiberglass, because of its nice thermal conductivity,insulation and convenientassembly,it's widely used in electronic appliances industry. According to the size of the feverinterface and the height of the clearance select different thickness of the thermal conductive silicontape cut zhe pad into different sizes, and put the silicon tap in the gap between the fever interfaceand their components to play as an heat‐conducting medium.
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Silicon insulation
Thermal silicon cap set
silicon‐based thermally conductive cap set
Key property:●Heat resistance, insulation, fire prevention, environmental protection and compression resistance Typical application:
LU series silicon‐based thermally conductive cap set is cap shape product designed with fiberglass &silicon as basic material and made through special processing. Because of its excellent thermalconductivity, insulation, shock resistance and easy installation, the product is widely used in fevertransistor, diode and audion, made it can installed directly on the heating tube while Using theproduct. The SH series suggested to be used for low‐stress application environment.
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Silicon insulation
Thermal silicon tube
Typical application:●Home appliances, Machine (Heat resistance, insulation, fire prevention, etc.),Electronic Components Instructions: ●LS‐100A‐‐‐general silicon tube ●LS‐200A‐‐‐high tensionsilicon tube●LS‐300A‐‐‐FDA silicon tube ●LS‐400A‐‐‐silicon‐based,thermally conductive tubes●LS‐500A‐‐‐ fire prevention silicon tubeNotes: The most thin wall thickness is 0.5mm currently, Specific shape and color could be providedaccording to your requirements.
LS series silicon‐based, thermally conductive tube is tube shape product designed with fiberglass &silicon as basic material and made through special processing. Because of its excellent thermalconductivity, insulation, shock resistance and easy installation, the product is widely used in fevertransistor, diode and audion, made it can installed directly on theheating tube while Using theproduct.The LS series is suggested to used for low‐stress application environment.
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Silicon insulation
TO series thermal silicon pad
Key property:●Heat resistance, insulation, fire prevention, shock resistance . Typical application:●Heating power components, Automobile electronic heating module, Power module,Householdappliances,Computer and peripherals, the filling and any place need heat dissipation between theheating element and the bottom plate.
Physical properties:
The TO series silicon pad is cloth production which made by special process with the base material‐‐silicon gel and fiberglass,because of its nice thermal conductivity,insulation and convenientassembly,it's widely used in electronic appliances industry. According to the size of the feverinterface and the height of the clearance select different thickness of the thermal conductive silicontape cut the pad into different sizes, and put the silicon tap in the gap between the fever interfaceand their components to play as an heat‐conducting medium.
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Silicon insulation
K‐10 silicon pad
Key property:●Heat emission, insulation , fire prevention, shock resistance. Features & benefits:1 Thermal impedance: 0.41°C‐in2/w(50psi)2 Breakdown voltage can reach at 7000V3 Designed for the substitutes of theceramic insulators
Typical application:●Heating power components; Automobile electronic heating module; Power module;Household appliances; Motor control;Power semiconductors; Military project
Physical properties:
Sli‐Pad K10 silicon pad,which is high‐performance,elastomer insulating material made with thespecial mylar,because of its good thermal conductivity, insulation and convenient assembly,it'swidely used in electronic appliances industry.According to the size of the fever interface and theheight of the clearance select different thickness of the thermal conductive silicon tape cut zhe padinto different sizes, and put the silicon tap in the gap between the fever interface and theircomponents to play as an heat‐conducting medium.
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Silicon insulation
TO series Bushing Insulator
Physical properties:
Model number:
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Phase change material
BC phase change interface material
Features & benefits:●Low heat resistance und low stress ●Flowing but not silicone oil●Low volatility—less than 1% ●Self‐adhesive , easy to use●No radiator preheating
Typical applications:●High frequency microprocessors●Chipset●Graphics chips & Amplifiers chip●Cache memory chips●Bridge rectifiers
The material is heat reinforced polymer, designed to meet the thermal conductivity and reliabilitydemand for the thermal conductivity of high application terminal. In addition, the heat sink’sperformance benefits a lot from the low heat resistance. And improve the microprocessor, DC‐DCconverter of memory module and the reliability of power module.
The phase change characteristics:the material is solid in room temperature and the installation iscompletely convenient,used between heat sink and devices. The material can be softened andflowing when the products reach phase‐change temperature to fill the devices'tiny irregular contactsurface.Thus,the material has the ability to fill the gap between the devices and heat sinkcompletely,make the phase change better than non‐current elastomers or thermal graphite pad andget the performance of thermal conductive silicon grease.
The material is nonconductive,however,as the material has endured the phase change at hightemperature, may make the metal get to the metal, so the phase change interface material can notbe used as electrical insulating material.
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Thermal grease
Thermal conductive silicon adhesive
Features:1. fast curing 2. proper adhesion, to splice the heatsink and the component, and it is removable when it is in need of repair 3. Eco‐friendly and thermostableHow to use:The gel is a single component silicon sealant in a room temperature, insulate and non‐poisonous, solvent‐free, pollution‐free and of ageing resistance, the surface tack free time is 30minutes( in a 25 degree temperature, relative humidity ≥60% ), to spread the gel on the desired part of the componentdirectly.How to store:To place it at a dry place and protect it from sun in a 30 degree temperature for 9 months.
Packaging: 100ml/pcs, 100pcs/box
LD120 Physical properties (after curing):
LD120 has good electric insulativity,thermal resistance,dielectric properties,anti‐chemical corrosionetc.,it is widely used for the insulationarcing, moistureproofof heatsink, TV, FBT component andhousehold appliances.
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Thermal grease
How to use：
Typical applications: ● between Semiconductor and heatsink● between CPU and heatsink● between power resistor and base● thermoelectric cooler● the surface of temperature regulator and assembly● high‐power LED lighting Physical properties：
Thermal grease
LE series thermal grease has good thermal conductive performance and reliability, which is extremlysuitable for the heat transfer of the CPU, GPU and other heating power components.
As LE series has low adhesion, it can fully contact with the surface, which result in very low interfacethermal resistance and high thermal conductivity.Please apply the grease by the screen printing, the60‐80 Me SH nylon mesh and 70‐80 hardness rubber scraper are recommended, leave 45 degreesbetween the scraper and the apply surface. CH
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Silicon fever pad
Silicon fever pad
1. Power density is 1 to 5w/Cm'.The power density changes strikingly as the temperature control methods are different, please contact with us when you choose the products.2. Hang the electric heater on the 20Cm' still air of the surface temperature.3. As the using environment, material and shape of the heating objects are different, the electric heater will happened to change.
Use precautions:1.Because of no waterproof construction, please do not get wet.2. Please do not use the controller and the electric heater separately.3. Please do not use in the flammable gas, or applied in low flash point objects.
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Silicon fever pad
Oil Bucket Heater
Features:The senser is fixed on the surface of the heater, to control the temperature directly by the thermoregulation Specifications:
Size: 250×1740 Size: 200×860 Size: 125×1740
Volume: 200V 2000W Volume: 200V 800W Volume: 200V 1000W
Weight: 0.5kg Weight: 0.4kg Weight: 0.3kg
Oil bucket heater makes the liquid, concretion take out from the oil bucket easily bycheating, such asthe adhesion, oil, pitch, paint, paraffins and kinds of the resin, the viscosity falls equably during theheating to reduce the powe of the pump.
Thermoregulation: 30~150°C EGO
200L oil bucket heater 20L oil bucket heater 200L oil bucket heater
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Thermal conductive silicon encapsulant
LTD 315 silicon thermal potting glue
Features & benefits:●Nice thermal conductivity and flame retardancy●Strong adhesive force●Heat resistance, humidity resistance, cold resistance●Low viscosity and nice levelling property●Insulation, cold resistance, shock resistance, electric corona resistance,electric leakageresistance and the performance of chemical mediator resistance. Typical applications:● Deep potting of Power Supply Module, electronic components, especially for thepotting of HID power supply module.● The potting of LED outdoors display screen● TV,CRT power supply, Communication equipment and other electric components'mechanical sealing & adhesion or adhesive fixed.● Other products'(mental, plastics, glass, etc.) adhesion & sealing with flameretardant requirement.
Thermal conductive silicon encapsulant is silicon encapsulant designed with a low viscosity and flameretardancy through bi‐component and additional moulding processing,which can cure by roomtemperature or heating,the higher the temperature, the curing faster.The product don't produce anyby‐products in the curing reaction, and can be used in the PC (Poly‐carbonate),PP,ABS,PVC materialsand metal surfaces,it is suitable for thermal conductivity,insulation waterproof and flame retardanceof electronic accessories,the flame retardancy can reach UL94‐V0,and meet with european UnionROHS completely.
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Thermal conductive silicon encapsulantTechnical properties before & after curing:
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Thermal conductive silicon encapsulant
LTD 312 silicon thermal potting glue
Features & benefits:●Nice thermal conductivity and flame retardancy●Strong adhesive force●Heat resistance, humidity resistance, cold resistance●Low viscosity and nice levelling property●Insulation, cold resistance, shock resistance, electric corona resistance, electric leakageresistance and the performance of chemical mediator resistance Typical applications:● Deep potting of Power Supply Module, electronic components, especially for thepotting of HID power supply module.● The potting of LED outdoors display screen● TV,CRT power supply, Communication equipment and other electric components'mechanical sealing & adhesion or adhesive fixed.●Other products’ (mental, plastics, glass, etc.) adhesion & sealing with flameretardant requirement.
potting glue Thermal conductive silicon encapsulant is silicon encapsulant designed with a lowviscosity and flame retardancy through bi‐component and additional moulding processing, which cancure by room temperature or heating,the higher the temperature, the curing faster. The product don’t produce any by‐products in the curing reaction, and can be used in the PC (Poly‐carbonate),PP,ABS,PVC materials and metal surfaces,it is suitable for thermal conductivity, insulationwaterproof and flame retardance of electronic accessories,the flame retardancy can reach UL94‐V0,and meet with European Union ROHS completely.
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Thermal conductive silicon encapsulantTechnical properties before & after curing:
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