surface mounting technology ppt
TRANSCRIPT
INDUSTRIAL TRANING 13 JULY TO 31 AUGUST
UNIVERSITY INSTITUTE OF ENGINEERING AND TECHNOLOGY KURUKSHETRA
UNIVERSITY KURUKSHERTA
SUBMITTED BY:-
ROLL NO.ANIL KUMAR 2509154
04/11/23
Topics Covered
Surface Mounting Assembly Programming Through Fuji Flexa Software
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SURFACE MOUNTING ASSEMBLY
• Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs).
• Electronic devices so made are called surface-mount devices or SMDs
• Smaller components. Smallest is currently 0.5 x 0.25 mm. • Much higher number of components and many more connections
per component• Fewer holes need to be drilled through abrasive boards. • Simpler automated assembly.
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SURFACE MOUNTING ASSEMBLY contd..
Small errors in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads).
Components can be placed on both sides of the circuit board. Lower resistance and inductance at the connection (leading to better
performance for high frequency parts). Better mechanical performance under shake and vibration
conditions. SMT parts generally cost less than through-hole parts. Fewer unwanted RF signal effects in SMT parts when compared to
leaded parts, yielding better predictability of component
characteristics.
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SURFACE MOUNTING ASSEMBLY contd..
• Faster assembly. Some placement machines are capable of placing more than 50,000 components per hour.
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Surface Mounting Assembly
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Programming
• X-Y coordinates of each component are inserted in Software (Fuji Flexa) for :-
• Glue Dispenser• Chip shooter CP-6• Fine Pitch Placer IP-3
• Temperature Setting for Different Products for:-
• Reflow Oven
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INTRODUCTION TO FUJI FLEXA
(PROGRAMMING SOFTWARE)
• This is the software used for programming and sending the data to
» GLUE DISPENSER» CP-6 CHIP SHOOTER» FIP-3 FINE CHIP IC PLACER
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MAKING A NEW PROJECT/JOB IN FUJI
FLEXA SOFTWARE
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* NAMING THE PROJECT04/11/23
SETTING X-Y CORDINATES FOR BOARD
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SETTING X-Y CORDINATE VALUES AND ROTATION FOR THE
PLACEMENT OF THE SMD COMPONETNS
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VALUES TO BE PUT HERE
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FINAL VIEW OF THE OUTPUT OF FUJI FLEXA AFTER PROGRAMMING
SETTING FIDUCIAL POINT (IT IS THE REFRENCE POINT FOR THE PCB BEFORE STARING THE MOUNTING OF COMPONENTS,THE LENSE OF THE THREE MACHINES READS THIS FIRST.IF THE REFRENCE POINT IS EXACTLY THE SAME AS GIVEN BY THE FUJI FLEXA THEN THE MOUNTING OR GLUE IS APPLLIED,OTHERWISE THE PCB IS REJECTED AND RED BUTTON STARTS GLOWING AND A SOUND IS GIVEN BY MACHINE SO AS IT SHOULD BE CORRECTED.
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SETTING THE FIDUCIAL POINT
SOLDER PASTE PRINTING STENSILS ARE MADE FOR PCB WHERE SOLDER HAS TO PASTED.
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GLUE DISPENSOR
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GLUE ON PCB
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CP-6 CHIP SHOOTER
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CP-6 CHIP SHOOTER
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CP-6 CHIP SHOOTER BACK SIDE
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FIP-III FINE PITCH PLACER
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FIP-III FINE PITCH PLACER
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FIP-III FINE PITCH PLACER BACK SIDE..
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REFLOW OVEN
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REFLOW OVEN
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