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Новый взгляд Новый взгляд на современные на современные системысистемыВладимир ОвчинниковСистемный инженерSun Microsystems
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CMT- CMT- серверысерверы
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1990 1995 2005 1980 1985 2000
Закон Мура: ЗакЗакон Мура: количество транзисторов на кристалле удваивается каждые два года
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Производительность памяти отстает от производительности процессоров
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1990 1995 2005 1980 1985 2000
2x EverySix Years
2x EveryTwo Years
Gap
CPU FrequencyDRAM Speeds
10000
1000
100
10
1
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Single Threaded Performance
Однопотоковые вычисления
Thread
Memory Latency ComputeT
ime
HURRYUP ANDWAIT!
C C C
Typical Processor Utilization:15–25%
M M M
Up to 85% Cycles Waiting for Memory
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Single Threaded Performance Chip Multi-threaded
(CMT) Performance
Многопотоковость или“Прохладные потоки” - CoolThreads
Processor Utilization: Up to 85%
C MC MC MThread 1
Memory Latency ComputeT
ime
C MC MC M
C MC MC MC MC MC M
Thread 2
Thread 3
Thread 4
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Chip Multi-Threading – много потоков на одном кристалле
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Core-1
Core-2
Core-3
Core-4
Core-5
Core-6
Core-7
Core-8 Time
4 потока х 8 ядер = UltraSPARC T1
Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1
MemoryLatencyCompute
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SPARC Enterprise T1000
Network Infrastructure Workhorse
Expansive web access tier:Web Server
Identity/Directory ServerPortal Server,
App Integration,Index, Search,
Edge / Network Node
• Extreme Rackmount Density> 1RU chassis, 19” depth> Up to 16 GB DDR2 memory
• UltraSPARC T1 processor> 6 or 8 cores @ 1 Ghz> 4 Gb Ethernet ports
• Simple, Reliable Design> 1 S-ATA 3.5” disk drive> 1 PCI-E expansion slot
• Low Cost/High Efficiency> Under 180 watts typical> Diskless configs available> Single power supply
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SPARC Enterprise T2000
The Application Engine
Java Application Servers, Enterprise Application Servers (ERP, CRM), Web
Tier Consolidation–
• UltraSPARC T1 @ 1.2 or 1.4 Ghz> 4, 6 or 8 core versions
• Rackmount Dense> 2RU chassis, 24.4” depth> Up to 64* GB DDR-2 Memory
• High Reliability> Hot Plug, Redundant Power
Supplies & Fans> RAID
• Expandable> 3 PCI-E, 1 or 2 PCI-X slots > 4x SAS/SATA 2.5” disk drives with
RAID 0,1> Optional DVD drive> 2 USB ports
• Low Power/ Low TCO> <325 watts power typical
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Rel
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ceНовый технологический процесс – еще больше много потоков на ядро
Full Cross Bar
C0 C1 C2 C3 C4 C5 C6 C7FPU FPU FPU FPU FPU FPU FPU FPU
L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$
FB DIMM FB DIMM FB DIMM FB DIMM
FB DIMM FB DIMM FB DIMM FB DIMM
PCI-ENIU(E-net+)
Sys I/FBuffer Switch Core
2x 10GE EthernetPower ~95W<1.5W/thread
MCU
MCU
MCU
MCU
MAU MAUMAUMAUMAUMAUMAUMAU
DMA Sub-System
• Up to 8 cores @1.2GHz or 1.4GHz• Up to 64 threads per CPU • Up to 16 FB-DIMMs, 4 memory
controllers> Up to 64GB memory (4GB DIMMs)> 2.5x memory BW of UltraSPARC T1
• 8 x fully pipelined Floating Point units / core, 1 per core
• Dual 10Gbit Ethernet and PCI-E integrated onto chip
• 4MB L2 (8 banks) 16 way associative• Enhanced MAU/Security co-processor
per core• Advanced Power saving features• 65nm process technology
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SPARC Enterprise T5120• 1 chassis, 26.5” depth• Up to 8 cores @1.4GHz
> Up to 64 threads • 16 FB-DIMM memory slots
> 128GB of memory, (8GB DIMMs)• 4 hot plug SATA/SAS 2.5” disk
drive (Raid 0,1)• Redundant, hot-swappable PSUs
and Fans• 3 PCI-E expansion slots
(2 x 10 GBE I/0 slots)• 4 x 1GbE Ethernet as standard• 4 USB ports
• Optimized for best price / performance & performance / watt
• Scale-Out of web & network infrastructure
• Direct replacement of T1000/T2000
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SPARC Enterprise T5220• 2 RU chassis, 26.5” depth• Up to 8 cores @1.4GHz
> Up to 64 threads • 16 FB-DIMM memory slots
> 128GB of memory, (8GB DIMMs)• 8 hot plug SATA/SAS 2.5” disk
drive (Raid 0,1)• Redundant, hot-swappable PSUs
and Fans• 6 PCI-E expansion slots
(2 x 10 GBE I/0 slots)• 4 x 1GbE Ethernet as standard• 4 USB ports
• Optimized for best price / performance & performance / watt
• Scale-Out of web & network infrastructure
• Direct replacement of T1000/T2000
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• Per Socket> Up to 8 cores @1.2GHz or
1.4GHz> Up to 64 Threads per socket> 4MB L2$ 8 banks x 16 Way SA> Up to 8 FPU's, 1 per core> Up to 8 Crypto cores, 1 per core> 2 memory Controllers, 16 DIMMS> 25Read+13WriteGB/s Memory BW> One x8 PCIe interface
• Per system> 2 sockets glue-less> 4 sockets using UST2 Plus XBR> 16 or 32 PCIe lanes on 2 or 4
Socket systems• 65nm process technology
x8 @2.5GHz4GBytes/s
bi-directional
Full Cross Bar
Power ~105W<1.5W/thread
CO
FPUMAU
C1
FPUMAU
C2
FPUMAU
C3
FPUMAU
C4
FPUMAU
C5
FPUMAU
C6
FPUMAU
C7
FPUMAU
L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$CU CU CU CU
MCU MCU
FB-DIMM
FB-DIMM
FB-DIMM
FB-DIMM
FB-DIMM
FB-DIMM
FB-DIMM
FB-DIMM
4 x Coherency
Links
System I/F PCI-Express
SSI Bus
Each Coherency Link 6.4GBytes/s per direction, 12.8GB/s total4 x Coherency links give Snoop bandwidth of 51.2GB/s
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Continues to offer N2/T5120/T5220 values:
• Security – embedded crypto• Networking – on-board 10GbE (not on-
chip)• Floating Point – FPU per core• High Reliability – hot-plug HDD,
redundant/hot-swap PSU and fans, low total part count
New features include:• More capacity:
> 2 VF processors per system> More PCI-E IO lanes (all slots x8)> 8-disk 1U and 16-disk 2U configs
available> Up to 32 DIMMs in the 2U
• Enhanced Virtualization: > 128 isolated OS instances utilizing
LDOMs
• Expanding the CMT line to include multi-processor systems
• First Victoria Falls based platform• 4/6/8 cores per CPU - Up to 128
threads• Twice the threads of T5120/T5220 in
the same footprint• Memory capacity at RR of up to 64GB
(1U) or 128GB (2U), FB-DIMM
Sun SPARC Enterprise T5140/T5240
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Sun SPARC EnterpriseT5440
New features include:• More capacity:
> 4 VF processors per system> 1.2 and 1.4 GHz offerings> 6 or 8 cores per CPU > 8 PCI-E slots (all slots x8)
> Two intended for graphics > Two shared with XAUI
> Up to 64 DIMMs slots> 256 GB with 4 GB DIMMs
• Enhanced Virtualization: > 128 isolated OS instances
utilizing LDOMs
> Scaling CMT to New Heights> 4 sockets / 256 threads> Up to 512GB Memory> Up to 28 x PCI-E slots (with 2 I/O
Boxes)> Extends T5120/T5220 and
T5140/T5240 proposals> Electronic Prognostics
> Monitors internal sensors to anticipate failures
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Sun и Intel – родственность технологий
• многоядерные процессоры• многопроцессорные системы• контроллер оперативной памяти на одном
кристалле с процессором• скоростная шина обмена данными • встроенная поддержка технологий
виртуализации
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Blade- Blade- серверысерверы
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Sun Blade 6000 • Chassis> 10 RU, 24” deep> 6000W (N+N grid redundant)> Service Processor/CMM> 2 PCI-E Express modules/blade> 2 NEMs
• Up to 10 Blades> AMD Opteron dual socket> Intel Xeon dual/quad socket> Niagara T2 single socket
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Passive MidplaneFront – Server Module
and Power Supply ConnectorsRear – NEM, EM and
Rear Fan Module Connectors
Serve
r Mod
ule po
wer c
onne
ctors
●Server Module I/O connectors●Network Express Modules
● Two PCI Express x8 interfaces or● Two XAUI interfaces (GbE, FC or IB)
● Serial Attached SCSI links (4 total)● Gigabit Ethernet links (2 total)
●PCI ExpressModules● Two PCI Express x8 interfaces
●Service Processor Ethernet link●I2C Network
PCI-E
Exp
ress
Modu
le Co
nnec
tors t
o Ser
ver
Modu
les
CMM
conn
ector
Fron
t Pan
el LE
D co
ntrol
boar
d
●Network Express Module connectors ●Each NEM provides:●To every Server Module
● PCI Express x8 interface or● XAUI interface (GbE, FC or IB)
● Serial Attached SCSI links (2 total)● Gigabit Ethernet link (1 total)
●CMM Ethernet link●I2C Network
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Passive Midplane Data Interfaces
SAS
PCI-E x8
PCI-E x8
Service Processor EthernetPCI-E x8 or XAUI
Gigabit EthernetSASPCI-E x8 or XAUI
Gigabit Ethernet
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CMT Blades
• Sun Blade T6320• 3x more I/O throughput
than IBM• 2x more memory than IBM • Sun Blade T6340• 5x more core density
than HP• 2x more memory than HP • Industry’s most flexible I/O• Pre-installed cost free
Solaris 10 and LDom
Free Virtualization andWire-Speed Encryption
Best for Business Infrastructure
Sockets 1 2
CPU
Memory Up to 128 GB Up to 256 GB
On-Chip 10 GbE Yes No
PCle I/O
8 CoreUltraSPARC T2
2X UltraSPARC T2+with 16 Core
2X PCIe 1.0 X8,2X Pcle X4
2X PCIe 1.0 X8,2X Pcle X4
T6320 T6340
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AMD Blades
• Sun Blade X6240• Ideal blade for core IT
infrastructure apps• 2.7x more I/O throughput
and 2x more memorythan HP
• Sun Blade X6440• Ideal blade for core business
applications requiringvirtualization
• Industry’s leading I/Othroughput and leadingmemory capacity
Best Business Virtualization Platform
Sockets 2 4
CPU
Memory Up to 128 GB Up to 256 GB
142 Gb/s 142 Gb/s
Six-Core or Quad-coreAMD Opterons
Six-Core or Quad-coreAMD Opterons
I/OThroughput
X6240 X6440
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Intel Blades
• Sun Blade X6270:● Best business blades, ideal
for single demanding or multiple virtualized business workloads
● Up to 2x more hot plug storage● Up to 4x the I/O throughput
(270Gb/s)• Sun Blade X6275:● On-board IB or standard Ethernet● Industry TOP HPC blade with
unmatched capabilities● Up to 9 TFLOPS peak performance● Leading density - 2x compute
nodes in a single blade● End-to-End Quad Data Rate IB
Best Scalability and Compute Density
Sockets 2 2 per node/4 total
CPU
Memory
Up to 270 Gb/s Up to 129 Gb/s per node
Four-Core Intel® Xeon®
Processor 5500 SeriesFour-Core Intel® Xeon®
Processor 5500 Series
Up to 144 GB(18 DDR3 DIMMs)
Up to 96 GB per node/192 GB total (24 DDR3 DIMMs)
I/OThroughput
X6270 X6275
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Gigabit Ethernet Pass-through NEM
Blad
e 0
Blad
e 1
Blad
e 2
Blad
e 3
Blad
e 4
Blad
e 5
Blad
e 6
Blad
e 7
Blad
e 8
Blad
e 9
Midplane connectors
The Gigabit Ethernet pass-through NEM provides connectivity to external network switches which allow Server Module communications to the outside
External Network Ports
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• EMs available from Sun:> Dual-port GbE EM> Dual-port 4Gbps
FiberChannel EM> Dual-port 4X InfiniBand EM
PCI Express ExpressModules
• Future EMs:> Quad-port Gb EM> 10GbE EM> Quad-port FC-AL
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Старый Старый новый способ новый способ хранения хранения данныхданных
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Почему приложения тормозят
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Современные жесткие диски
Enterprise HDD > 180 Write IOPS > 320 Read IOPS > 300 GB > ~18W
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Традиционное решение проблемы
Увеличение объема кеша
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Традиционное решение проблемы
- большое количество дисков- запись на внешние (более быстрые) дорожки
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Новые возможности хранения данных
• Enterprise SSD > 7,000 Write IOPS > 35,000 Read IOPS > 32GB > ~3W
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Что внутри Enterprise SSD
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Похожий на обычный диск ...
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... или на модуль оперативной памяти
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... или на RAID-контроллер
Internal SAS Connectors (SFF 8087)
Super Capacitor
Flash Modules
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Новые серверы с использованием
SSD
Compute● 2x Intel Xeon 5500-series● 18x DDR3-1333 RDIMMs● 144 GB Max (RR + 90 days)● 72 GB Max at RRI/O● 3/6x PCIe Gen 2 slots (1 x16, 2 x8)● 8/16 x SFF SAS & SATA drives
● 8/16 SAS/SATA HDDs/SSDs (w/ HBA)
● 6/12 SATA HDDs/SSDs (w/o HBA)● Internal CompactFlash and USB● 4x on-board Gigabit Ethernet portsAvailability● Hot-swap disks ● HW RAID 0,1,5,6,10,50,60 (w/ HBA)● Hot-swap redundant 750W PSUs● Hot-swap redundant fansManagement● Integrated LOM Service Processor
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Нам не Нам не нужны такие нужны такие мощные мощные серверы!серверы!
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Спасение – в Спасение – в виртуализациивиртуализации
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Industry Leading Server Virtualization
Dynamic SystemDomains Solaris Containers
(Zones + SRM) Solaris Trusted
Extensions Solaris Containers for
Linux Applications
Solaris ResourceManager
(SRM)
Sun xVM (LDoms and Xen)
VMwareMicrosoft
Virtual Server
Hard Partitions Virtual Machines OS Virtualization Resource Management
Server
OS
App
Multiple OSs Single OS
CalendarServer Database Web
ServerSunRayServer
AppServerDatabaseMail
ServerWeb
ServerFile
ServerIdentityServer
AppServer Database
Trend to flexibility Trend to isolationTrend to flexibility Trend to isolation
> Very High RAS> Very Scalable> Mature Technology> Ability to run different
OS versions
> Very scalable and low overhead> Single OS to manage> Fine grained resource
management
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PlatformHardware
LDom A
Logical Domains Technology• Virtualization and partitioning of machine resources
> Each domain is a full virtual machine, with a dynamically reconfigurable sub-set of machine resources, and its own independent OS
> Protection & isolation via SPARC hardware and hypervisor firmware
LDom B LDom C LDom D
I/O I/OMemory
CPUCPU CPU CPU CPU CPU CPU CPUMemory Memory Memory
Linux FreeBSD
Hypervisor
OS Environment
of choiceLDoms Manager
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Driving Innovation at Every Level: UltraSPARC® T2 Plus ProcessorThird-generation CMT Processors Pack 128 Systems into a single 4RU package
Sun started the multithreaded revolution in 2005, and is still the industry leader, with more threads per core than anyone else
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Новый взгляд Новый взгляд на современные на современные системысистемыВладимир ОвчинниковСистемный инженерSun Microsystems