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Click to edit the title text format 1 Новый взгляд Новый взгляд на современные на современные системы системы Владимир Овчинников Системный инженер Sun Microsystems

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Page 1: Sun Microsystems

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Новый взгляд Новый взгляд на современные на современные системысистемыВладимир ОвчинниковСистемный инженерSun Microsystems

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CMT- CMT- серверысерверы

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Rel

ativ

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rfor

man

ce

1990 1995 2005 1980 1985 2000

Закон Мура: ЗакЗакон Мура: количество транзисторов на кристалле удваивается каждые два года

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Производительность памяти отстает от производительности процессоров

Rel

ativ

e Pe

rfor

man

ce

1990 1995 2005 1980 1985 2000

2x EverySix Years

2x EveryTwo Years

Gap

CPU FrequencyDRAM Speeds

10000

1000

100

10

1

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Single Threaded Performance

Однопотоковые вычисления

Thread

Memory Latency ComputeT

ime

HURRYUP ANDWAIT!

C C C

Typical Processor Utilization:15–25%

M M M

Up to 85% Cycles Waiting for Memory

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Single Threaded Performance Chip Multi-threaded

(CMT) Performance

Многопотоковость или“Прохладные потоки” - CoolThreads

Processor Utilization: Up to 85%

C MC MC MThread 1

Memory Latency ComputeT

ime

C MC MC M

C MC MC MC MC MC M

Thread 2

Thread 3

Thread 4

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Rel

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Chip Multi-Threading – много потоков на одном кристалле

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Core-1

Core-2

Core-3

Core-4

Core-5

Core-6

Core-7

Core-8 Time

4 потока х 8 ядер = UltraSPARC T1

Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1Thread 4Thread 3Thread 2Thread 1

MemoryLatencyCompute

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SPARC Enterprise T1000

Network Infrastructure Workhorse

Expansive web access tier:Web Server

Identity/Directory ServerPortal Server,

App Integration,Index, Search,

Edge / Network Node

• Extreme Rackmount Density> 1RU chassis, 19” depth> Up to 16 GB DDR2 memory

• UltraSPARC T1 processor> 6 or 8 cores @ 1 Ghz> 4 Gb Ethernet ports

• Simple, Reliable Design> 1 S-ATA 3.5” disk drive> 1 PCI-E expansion slot

• Low Cost/High Efficiency> Under 180 watts typical> Diskless configs available> Single power supply

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SPARC Enterprise T2000

The Application Engine

Java Application Servers, Enterprise Application Servers (ERP, CRM), Web

Tier Consolidation–

• UltraSPARC T1 @ 1.2 or 1.4 Ghz> 4, 6 or 8 core versions

• Rackmount Dense> 2RU chassis, 24.4” depth> Up to 64* GB DDR-2 Memory

• High Reliability> Hot Plug, Redundant Power

Supplies & Fans> RAID

• Expandable> 3 PCI-E, 1 or 2 PCI-X slots > 4x SAS/SATA 2.5” disk drives with

RAID 0,1> Optional DVD drive> 2 USB ports

• Low Power/ Low TCO> <325 watts power typical

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Rel

ativ

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ceНовый технологический процесс – еще больше много потоков на ядро

Full Cross Bar

C0 C1 C2 C3 C4 C5 C6 C7FPU FPU FPU FPU FPU FPU FPU FPU

L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$

FB DIMM FB DIMM FB DIMM FB DIMM

FB DIMM FB DIMM FB DIMM FB DIMM

PCI-ENIU(E-net+)

Sys I/FBuffer Switch Core

2x 10GE EthernetPower ~95W<1.5W/thread

MCU

MCU

MCU

MCU

MAU MAUMAUMAUMAUMAUMAUMAU

DMA Sub-System

• Up to 8 cores @1.2GHz or 1.4GHz• Up to 64 threads per CPU • Up to 16 FB-DIMMs, 4 memory

controllers> Up to 64GB memory (4GB DIMMs)> 2.5x memory BW of UltraSPARC T1

• 8 x fully pipelined Floating Point units / core, 1 per core

• Dual 10Gbit Ethernet and PCI-E integrated onto chip

• 4MB L2 (8 banks) 16 way associative• Enhanced MAU/Security co-processor

per core• Advanced Power saving features• 65nm process technology

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SPARC Enterprise T5120• 1 chassis, 26.5” depth• Up to 8 cores @1.4GHz

> Up to 64 threads • 16 FB-DIMM memory slots

> 128GB of memory, (8GB DIMMs)• 4 hot plug SATA/SAS 2.5” disk

drive (Raid 0,1)• Redundant, hot-swappable PSUs

and Fans• 3 PCI-E expansion slots

(2 x 10 GBE I/0 slots)• 4 x 1GbE Ethernet as standard• 4 USB ports

• Optimized for best price / performance & performance / watt

• Scale-Out of web & network infrastructure

• Direct replacement of T1000/T2000

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SPARC Enterprise T5220• 2 RU chassis, 26.5” depth• Up to 8 cores @1.4GHz

> Up to 64 threads • 16 FB-DIMM memory slots

> 128GB of memory, (8GB DIMMs)• 8 hot plug SATA/SAS 2.5” disk

drive (Raid 0,1)• Redundant, hot-swappable PSUs

and Fans• 6 PCI-E expansion slots

(2 x 10 GBE I/0 slots)• 4 x 1GbE Ethernet as standard• 4 USB ports

• Optimized for best price / performance & performance / watt

• Scale-Out of web & network infrastructure

• Direct replacement of T1000/T2000

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• Per Socket> Up to 8 cores @1.2GHz or

1.4GHz> Up to 64 Threads per socket> 4MB L2$ 8 banks x 16 Way SA> Up to 8 FPU's, 1 per core> Up to 8 Crypto cores, 1 per core> 2 memory Controllers, 16 DIMMS> 25Read+13WriteGB/s Memory BW> One x8 PCIe interface

• Per system> 2 sockets glue-less> 4 sockets using UST2 Plus XBR> 16 or 32 PCIe lanes on 2 or 4

Socket systems• 65nm process technology

x8 @2.5GHz4GBytes/s

bi-directional

Full Cross Bar

Power ~105W<1.5W/thread

CO

FPUMAU

C1

FPUMAU

C2

FPUMAU

C3

FPUMAU

C4

FPUMAU

C5

FPUMAU

C6

FPUMAU

C7

FPUMAU

L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$CU CU CU CU

MCU MCU

FB-DIMM

FB-DIMM

FB-DIMM

FB-DIMM

FB-DIMM

FB-DIMM

FB-DIMM

FB-DIMM

4 x Coherency

Links

System I/F PCI-Express

SSI Bus

Each Coherency Link 6.4GBytes/s per direction, 12.8GB/s total4 x Coherency links give Snoop bandwidth of 51.2GB/s

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Continues to offer N2/T5120/T5220 values:

• Security – embedded crypto• Networking – on-board 10GbE (not on-

chip)• Floating Point – FPU per core• High Reliability – hot-plug HDD,

redundant/hot-swap PSU and fans, low total part count

New features include:• More capacity:

> 2 VF processors per system> More PCI-E IO lanes (all slots x8)> 8-disk 1U and 16-disk 2U configs

available> Up to 32 DIMMs in the 2U

• Enhanced Virtualization: > 128 isolated OS instances utilizing

LDOMs

• Expanding the CMT line to include multi-processor systems

• First Victoria Falls based platform• 4/6/8 cores per CPU - Up to 128

threads• Twice the threads of T5120/T5220 in

the same footprint• Memory capacity at RR of up to 64GB

(1U) or 128GB (2U), FB-DIMM

Sun SPARC Enterprise T5140/T5240

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Sun SPARC EnterpriseT5440

New features include:• More capacity:

> 4 VF processors per system> 1.2 and 1.4 GHz offerings> 6 or 8 cores per CPU > 8 PCI-E slots (all slots x8)

> Two intended for graphics > Two shared with XAUI

> Up to 64 DIMMs slots> 256 GB with 4 GB DIMMs

• Enhanced Virtualization: > 128 isolated OS instances

utilizing LDOMs

> Scaling CMT to New Heights> 4 sockets / 256 threads> Up to 512GB Memory> Up to 28 x PCI-E slots (with 2 I/O

Boxes)> Extends T5120/T5220 and

T5140/T5240 proposals> Electronic Prognostics

> Monitors internal sensors to anticipate failures

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Sun и Intel – родственность технологий

• многоядерные процессоры• многопроцессорные системы• контроллер оперативной памяти на одном

кристалле с процессором• скоростная шина обмена данными • встроенная поддержка технологий

виртуализации

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Blade- Blade- серверысерверы

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Sun Blade 6000 • Chassis> 10 RU, 24” deep> 6000W (N+N grid redundant)> Service Processor/CMM> 2 PCI-E Express modules/blade> 2 NEMs

• Up to 10 Blades> AMD Opteron dual socket> Intel Xeon dual/quad socket> Niagara T2 single socket

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Passive MidplaneFront – Server Module

and Power Supply ConnectorsRear – NEM, EM and

Rear Fan Module Connectors

Serve

r Mod

ule po

wer c

onne

ctors

●Server Module I/O connectors●Network Express Modules

● Two PCI Express x8 interfaces or● Two XAUI interfaces (GbE, FC or IB)

● Serial Attached SCSI links (4 total)● Gigabit Ethernet links (2 total)

●PCI ExpressModules● Two PCI Express x8 interfaces

●Service Processor Ethernet link●I2C Network

PCI-E

Exp

ress

Modu

le Co

nnec

tors t

o Ser

ver

Modu

les

CMM

conn

ector

Fron

t Pan

el LE

D co

ntrol

boar

d

●Network Express Module connectors ●Each NEM provides:●To every Server Module

● PCI Express x8 interface or● XAUI interface (GbE, FC or IB)

● Serial Attached SCSI links (2 total)● Gigabit Ethernet link (1 total)

●CMM Ethernet link●I2C Network

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Passive Midplane Data Interfaces

SAS

PCI-E x8

PCI-E x8

Service Processor EthernetPCI-E x8 or XAUI

Gigabit EthernetSASPCI-E x8 or XAUI

Gigabit Ethernet

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CMT Blades

• Sun Blade T6320• 3x more I/O throughput

than IBM• 2x more memory than IBM • Sun Blade T6340• 5x more core density

than HP• 2x more memory than HP • Industry’s most flexible I/O• Pre-installed cost free

Solaris 10 and LDom

Free Virtualization andWire-Speed Encryption

Best for Business Infrastructure

Sockets 1 2

CPU

Memory Up to 128 GB Up to 256 GB

On-Chip 10 GbE Yes No

PCle I/O

8 CoreUltraSPARC T2

2X UltraSPARC T2+with 16 Core

2X PCIe 1.0 X8,2X Pcle X4

2X PCIe 1.0 X8,2X Pcle X4

T6320 T6340

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AMD Blades

• Sun Blade X6240• Ideal blade for core IT

infrastructure apps• 2.7x more I/O throughput

and 2x more memorythan HP

• Sun Blade X6440• Ideal blade for core business

applications requiringvirtualization

• Industry’s leading I/Othroughput and leadingmemory capacity

Best Business Virtualization Platform

Sockets 2 4

CPU

Memory Up to 128 GB Up to 256 GB

142 Gb/s 142 Gb/s

Six-Core or Quad-coreAMD Opterons

Six-Core or Quad-coreAMD Opterons

I/OThroughput

X6240 X6440

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Intel Blades

• Sun Blade X6270:● Best business blades, ideal

for single demanding or multiple virtualized business workloads

● Up to 2x more hot plug storage● Up to 4x the I/O throughput

(270Gb/s)• Sun Blade X6275:● On-board IB or standard Ethernet● Industry TOP HPC blade with

unmatched capabilities● Up to 9 TFLOPS peak performance● Leading density - 2x compute

nodes in a single blade● End-to-End Quad Data Rate IB

Best Scalability and Compute Density

Sockets 2 2 per node/4 total

CPU

Memory

Up to 270 Gb/s Up to 129 Gb/s per node

Four-Core Intel® Xeon®

Processor 5500 SeriesFour-Core Intel® Xeon®

Processor 5500 Series

Up to 144 GB(18 DDR3 DIMMs)

Up to 96 GB per node/192 GB total (24 DDR3 DIMMs)

I/OThroughput

X6270 X6275

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Gigabit Ethernet Pass-through NEM

Blad

e 0

Blad

e 1

Blad

e 2

Blad

e 3

Blad

e 4

Blad

e 5

Blad

e 6

Blad

e 7

Blad

e 8

Blad

e 9

Midplane connectors

The Gigabit Ethernet pass-through NEM provides connectivity to external network switches which allow Server Module communications to the outside

External Network Ports

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• EMs available from Sun:> Dual-port GbE EM> Dual-port 4Gbps

FiberChannel EM> Dual-port 4X InfiniBand EM

PCI Express ExpressModules

• Future EMs:> Quad-port Gb EM> 10GbE EM> Quad-port FC-AL

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Старый Старый новый способ новый способ хранения хранения данныхданных

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Почему приложения тормозят

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Современные жесткие диски

Enterprise HDD > 180 Write IOPS > 320 Read IOPS > 300 GB > ~18W

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Традиционное решение проблемы

Увеличение объема кеша

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Традиционное решение проблемы

- большое количество дисков- запись на внешние (более быстрые) дорожки

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Новые возможности хранения данных

• Enterprise SSD > 7,000 Write IOPS > 35,000 Read IOPS > 32GB > ~3W

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Что внутри Enterprise SSD

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Похожий на обычный диск ...

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... или на модуль оперативной памяти

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... или на RAID-контроллер

Internal SAS Connectors (SFF 8087)

Super Capacitor

Flash Modules

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Новые серверы с использованием

SSD

Compute● 2x Intel Xeon 5500-series● 18x DDR3-1333 RDIMMs● 144 GB Max (RR + 90 days)● 72 GB Max at RRI/O● 3/6x PCIe Gen 2 slots (1 x16, 2 x8)● 8/16 x SFF SAS & SATA drives

● 8/16 SAS/SATA HDDs/SSDs (w/ HBA)

● 6/12 SATA HDDs/SSDs (w/o HBA)● Internal CompactFlash and USB● 4x on-board Gigabit Ethernet portsAvailability● Hot-swap disks ● HW RAID 0,1,5,6,10,50,60 (w/ HBA)● Hot-swap redundant 750W PSUs● Hot-swap redundant fansManagement● Integrated LOM Service Processor

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Нам не Нам не нужны такие нужны такие мощные мощные серверы!серверы!

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Спасение – в Спасение – в виртуализациивиртуализации

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Industry Leading Server Virtualization

Dynamic SystemDomains Solaris Containers

(Zones + SRM) Solaris Trusted

Extensions Solaris Containers for

Linux Applications

Solaris ResourceManager

(SRM)

Sun xVM (LDoms and Xen)

VMwareMicrosoft

Virtual Server

Hard Partitions Virtual Machines OS Virtualization Resource Management

Server

OS

App

Multiple OSs Single OS

CalendarServer Database Web

ServerSunRayServer

AppServerDatabaseMail

ServerWeb

ServerFile

ServerIdentityServer

AppServer Database

Trend to flexibility Trend to isolationTrend to flexibility Trend to isolation

> Very High RAS> Very Scalable> Mature Technology> Ability to run different

OS versions

> Very scalable and low overhead> Single OS to manage> Fine grained resource

management

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PlatformHardware

LDom A

Logical Domains Technology• Virtualization and partitioning of machine resources

> Each domain is a full virtual machine, with a dynamically reconfigurable sub-set of machine resources, and its own independent OS

> Protection & isolation via SPARC hardware and hypervisor firmware

LDom B LDom C LDom D

I/O I/OMemory

CPUCPU CPU CPU CPU CPU CPU CPUMemory Memory Memory

Linux FreeBSD

Hypervisor

OS Environment

of choiceLDoms Manager

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Driving Innovation at Every Level: UltraSPARC® T2 Plus ProcessorThird-generation CMT Processors Pack 128 Systems into a single 4RU package

Sun started the multithreaded revolution in 2005, and is still the industry leader, with more threads per core than anyone else

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Новый взгляд Новый взгляд на современные на современные системысистемыВладимир ОвчинниковСистемный инженерSun Microsystems