steady state
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CHAPTER 3
STEADY-STATE ONE-DIMENSIONAL CONDUCTION
The term one-dimensional refers to the fact that only one coordinate is needed to describe the spatial variation of the dependent variables.
In one dimensional system, temperature gradients exists along only a single coordinate direction.
In this chapter we will
- Learn how to obtain temperature profiles for common geometries with and without heat generation.
- Introduce the concept of thermal resistance and
thermal circuits
Steady-State, One-Dimensional Conduction
The Plane Wall
Consider a simple case of one-dimensional conduction in a plane
wall, separating two fluids of different temperature, without energy
generation
Temperature is a function of x
Heat is transferred in the x-direction
Must consider
Convection from hot fluid to wall
Conduction through wall
Convection from wall to cold fluid
qx
1,T
1,sT
2,sT
2,T
x
x=0 x=L
11, ,hT
22, ,hT
Hot fluid
Cold fluid
Temperature Distribution Heat diffusion equation in the x-direction for steady-state
conditions, with no energy generation:
Integrate twice to obtain the general solution:
T(x) = C1x + C2
To obtain C1 and C2, boundary conditions must be introduced
at x=0, T(0) = Ts,1
at x=L, T(L) = Ts,2
Apply the condition at x=0 to the general solution
Ts,1 = C2
Apply the condition at x=L to the general solution
Ts,2 = C1L + C2 = C1L + Ts,1
C1 = Ts,2 Ts,1
L
0
dx
dTk
dx
d qx is constant
Temperature Distribution
Apply to the general solution, the temperature profile, assuming
constant k:
From Fouriers Law, we can determine the conduction heat transfer rate:
qx = -kAdT = kA (Ts,1 Ts,2)
dx L
And heat flux:
qx = qx = k (Ts,1 Ts,2)
A L
1,1,2, )()( sss TL
xTTxT
Problem 3.1
Consider the plane wall, separating hot and cold fluids at temp. T,1 and T,2 respectively. Using surface energy balances as boundary conditions at x=0 and x=L, obtain the temp. distribution within the wall and the heat flux in terms of T,1 , T,2 , h1 , h2 , k and L.
Thermal Resistance
Based on the previous solution, the conduction hear transfer rate can be calculated:
Similarly for heat convection, Newtons law of cooling applies:
And for radiation heat transfer:
Recall electric circuit theory - Ohms law for electrical resistance:
kAL
TTTT
L
kA
dx
dTkAq
ssssx
/
2,1,2,1,
hA
TTTThAq SSx
/1
)()(
Ah
TTTTAhq
r
surssursrrad
/1
)()(
Resistance
Difference Potential=currentElectric
Thermal Resistance
We can use this electrical analogy to represent heat transfer problems using the concept of a thermal circuit (equivalent to an electrical circuit).
The temperature difference is the potential or driving force for the heat flow
The combinations of thermal conductivity, convection coefficient, thickness and area of material act as a resistance
R
Tq overall
Resistance
Force DrivingOverall
AhR
hAR
kA
LR
rradtconvtcondt
1,
1, ,,,
CONDUCTION CONVECTION RADIATION
Thermal Resistance for Plane Wall
In terms of overall temperature difference:
qx
1,T
1,sT
2,sT
2,T
x x=0
x=L
11, ,hT
22, ,hT
Hot fluid
Cold fluid
AhkA
L
AhR
R
TTq
tot
totx
21
2,1,
11
Ah
TT
kAL
TT
Ah
TTq
ssssx
2
2,2,2,1,
1
1,1,
/1//1
Thermal Resistance for Composite Walls
Thermal Resistance for Composite Walls
Heat transfer rate for composite wall:
qx = T,1 - T ,4
Rt
= T,1 - T ,4
[(1/h1A) + (LA/kAA) + (LB/kBA) + (LC/kCA) + (1/h4A)]
-Alternatively:
qx= T,1 Ts,1 = Ts,1 T2 = T2 T3 = U = overall heat transfer coefficient
(1/h1A) (LA/kAA) (LB/kBA) T = temperature difference (overall)
)]/1()/()/()/()/1[(
11
41 hkLkLkLhARU
CCBBAAtot
UAq
TRR
TUAq
ttot
x
1
Composite Walls
For resistances in series: Rtot=R1+R2++Rn
For resistances in parallel:
1/Rtot=1/R1+1/R2++1/Rn
Contact Resistance
In composite systems, the temperature drop across the interface between materials may be appreciable, due to surface roughness effects.
This temperature change is attribute to thermal contact resistance:
"
",
x
BAct
q
TTR
See tables 3.1, 3.2 for typical values of Rt,c
Problem 3.4 In a manufacturing process, a transparent film is being bonded to a
substrate. To cure the bond at a temperature To, a radiant source is used to provide a heat flux qo (W/m
2), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T and a convection heat transfer coefficient, h.
a) Show a thermal circuit representing the steady
state heat transfer situation.
b) Assume the following conditions:
T = 20C, h = 50 W/m2K, T1 = 30C
Calculate the heat flux qo that is required to
maintain the bonded surface at To = 60C
Problem 3.15
Consider a composite wall that includes an 8-mm thick hardwood siding (A), 40-mm by 130-mm hardwood studs (B) on 0.65-m centers with glass fiber insulation (D) (paper faced, 28 kg/m3) and a 12-mm layer of gypsum (vermiculite) wall board (C).
What is the thermal resistance associated with a wall that is 2.5 m high by 6.5 m wide (having 10 studs, each 2.5 m high?)
(Note: Consider the direction of heat transfer to be downwards, along the x-direction)
Given: PROPERTIES from Table A-3 (T 300K): Hardwood siding, kA = 0.094 W/mK Hardwood, kB = 0.16 W/mK Gypsum, kC = 0.17 W/mK Insulation (glass fiber paper faced, 28 kg/m3), kD = 0.038W/mK.
Problem 3.20
A composite wall separates combustion gases at 2600C
from a liq coolant at 100C with gas and liq side convection
coefficients of 50 and 1000 W/m2K. The wall is composed of
a 10mm thick layer of beryllium oxide on the gas side. The
contact resistance between the oxide and the steel is 0.05
m2K/W.
a) What is the heat loss per unit surface area of the composite?
b) Sketch the temp. distribution from the gas to the liquid.
Assume temperature of beryllium oxide at 1500 K
and stainless steel at 1000 K.
Problem 3.22
Consider a plane composite wall that is composed of two
materials of thermal conductivities kA = 0.1 w/m.k and kB =
0.04 w/m.k and thicknesses LA = 10mm and LB = 20mm.
The contact resistance at the interface between the two
mterials is known to be 0.30 m2k/w. Material A adjoins a
fluid at 200c for which h = 10w/m2k and material B
adjoins a fluid at 40c for which h = 20w/m2k
a) What is the rate of heat transfer through a wall that is 2m high by 2.5m wide
b) Sketch the temp. distribution
Radial Systems-Cylindrical Coordinates
Consider a hollow cylinder, whose inner and outer surfaces are exposed to fluids at different temperatures
dr
dT)rL2(k=
dr
dTkA=qr - -
Radial Systems-Cylindrical Coordinates
Heat diffusion equation in the r-direction for steady-state conditions, with no energy generation (for cylinder):
Integrate twice to obtain general soution
T(r) = C1 ln r + C2
To obtain C1 and C2 , boundary conditions:
T(r1) = Ts,1 and T(r2) = Ts,2
Apply to the general solution:
Ts,1 = C1 ln r + C2
Ts,2 = C1 ln r + C2
01
dr
dTkr
dr
d
r
Solve C1 and C2 and substitute into general solution: The conduction heat transfer rate can be calculated: - Fouriers Law : In terms of equivalent thermal circuit:
2,221
2,1,ln
)/ln(
)()( s
ssT
r
r
rr
TTrT
condt
ssssssr
R
TT
Lkrr
TT
rr
TTLkq
,
2,1,
12
2,1,
12
2,1,
)2/()/ln()/ln(
2
)2(
1
2
)/ln(
)2(
1
22
12
11
2,1,
LrhkL
rr
LrhR
R
TTq
tot
totr
constdr
dTrLk
dr
dTkAqr )2(
Composite Walls
The heat transfer rate may be expressed as
qr = T,1 - T ,4
1 + ln (r2/r1) + ln (r3/r2) + ln (r4/r3) + 1
2r1Lh1 2kAL 2kBL 2kcL 2r4Lh4
The heat transfer rate may also be expressed in terms of an overall heat
transfer coefficient:
qr = T,1 - T ,4 = UA(T,1 - T ,4)
Rtot where U is the overall heat transfer coefficient. If A = A1 = 2r1L
44
1
3
41
2
31
1
2