si pixel tracking detectors introduction sensor readout chip mechanical issues performance -diamond

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Si Pixel Tracking Detectors •Introduction •Sensor •Readout Chip •Mechanical Issues •Performance -Diamond

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Page 1: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Si Pixel Tracking Detectors

•Introduction•Sensor•Readout Chip•Mechanical Issues•Performance -Diamond

Page 2: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

36 MPix150x150mm 2

Page 3: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Vertex High Radiation Stand- resolution multi hardness alone

Tracking Trig80’s- CCD detectors- SLD X

Si - diode x x 90’s- Si - diode- Omega2/3,DELPHI X X x Si - diode- SSC/LHC X X X

Diamond x x x2000’s Si - diode/ LHC/BTEV X X X X

Diamond X X X X

HISTORICAL

Page 4: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Single Track

Track ClusterPixel Tracker• Pixel Size • Occupancy• Charge Sharing• S/N• ExB Drift• Radiation Damage LHC - 1014 /cm2/yr

Charge Sharing

Vertex Resolution(20-30)m IP

& Trigger

Page 5: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Radiation Damage Effects

•Increase in volume leakage current.•Build-up of effective p-doping (bulk inversion).•Charge trapping.•Reverse Annealing- inactive defects become active, increasing effective p-doping. (T-dependent)

Page 6: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Basic Diode Structure

•.

Page 7: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

BASIC PACKAGE•Sensor Bump Bonded to Readout Chip•In or Pb/Sn for Bumps•Wafer Thinning•Dicing•Yield

Page 8: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Sensors & Isolation

• Guard Ring Design p-stop, p-spray• Radiation Damage

-Bulk Damage-Depletion Voltage

• Type Inversion • Self Annealing/Thermal

• Diamond Detectors -Radiation Hard -Simple Architecture

n+ n- p+

Single Ring p-stop Design

ElectrodeDiamondElectrode

CVD DIAMOND

Page 9: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

READOUT CHIP (CMOS)

•Radiation Hard Architecture (SOI)•Military/ Space Science •Analoque/Digital•SEU, Latchup (10-6 -10-10)•DMILL .80m Bi-CMOS•IBM .25m <-----

PSI Readout Chip

Thin Si Layer

Oxide

Si Substrate

Page 10: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond
Page 11: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

BUMP and FLIP-CHIP Interconnect

•Choice of Indium or Solder (PbSn)•Indium -Evaporation, 2 bumps, Allignment -High Yield

•Electroplated Solder -Reflow techniques ~180oC. Flux, Self Alligning -Complex UBM (UnderBump Metalization)

-Excellent Electrical and Mechanical Contact

Readout Chip

Sensor

Reflow and Wick-over

Page 12: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

CONTROL and INTERFACE BLOCK

DOUBLE COLUMN PERIPHERY

TIME STAMP and READOUT BUS

I2C DACSReadout Amplifier

TransmissionLine DriversPower Supply / Clock Pads

10.5mm

52 x 53 array150 x 150m

400K transistors~30%yield

8.0mm

TTRIGGER BLK

FEC FED

TBM

Opticallinks

Detectors

Clk

Fast Trigger

DATAFAST TRIGGER OUT (L3)

SLOW CONTROLUPLOADS 40MHz I2C

Pseudo -TRIGGER PAD

Page 13: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

• Low Mass Support Structures

- Be , C-Fiber

• Wafer Thinning

-.25 m lithography on 8”800m

• Dicing Accuracy and Placement

• Radiation Hard Glues/Epoxies

• Cooling (KWs per Detector)

- (10-20) oC

– Flurocarbons (high mass)

– Evaporative Cooling(low mass)

• Thermal Expansion

COOLINGMECHANICAL

Page 14: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

Be Panel

HDI

High Density Interconnects

SensorVHDI

ROC

Silicon Plate

Bump Bonds

Wire Bonds

Page 15: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

PERFORMANCE (Si & Diamond in CERN Test Beam)

Z, B

X

Y

20o

Row

Beam

}

Double Column

Charge Sharing

Pixels150 x150 m2

D:\Transfer from Bob\Pictures\Test Beam Hardware\Geometry Pixels.ppt 8mm

ROC, PSI36:11 double columns x 30 rows

Vienna Repeater

Page 16: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

150 m

= 14 mover pixel

Pixels at 20o to beam

150 m / 12 = 43 m = 46 mover pixel

Charge sharing vs position

Charge sharing vs position

Pixels normal to beam

150 m

PERFORMANCE (cont)Si 25000e/mip 2000e noise 99% efficiencyDia 9000e/mip 2000e noise 95% efficiency

Page 17: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

CONCLUSIONS

• Si Pixel Detectors- a Great Challenge!

• Many Difficult Technologies to Master.

• Much Will be Solved in LHC/BTeV era.

• HEP Must Learn to Deal with High Development Costs.

• Trigger Possibilities Abundant.

• Diamond Detectors Feasible.

Page 18: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond
Page 19: Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond

X-Ray Crystalography