I oduc[.

Self-adhesive chemical warning labels have space for emergency messages

Fig. 3 Write-on chemical warning labels in continuous self-adhesive tape form from Limpet Tapes

An innovation from printed self- adhesive tape manufacturers, Limpet Tapes Limited, UK, is a chemical warning label that conforms to the Classification, Packaging and Labelling of Dan, gerous Substances Regulations 1984 which has the benefit of a write-on surface as shown in Fig. 3. This enables last-minute information such as emergency telephone numbers to be added.

Printed on self-adhesive vinyl

tape in 33 m rolls in the appropriate widths for the label sizes required, they are overlaminated with a special "write-on" material and perforated between texts to form individual labels on a roll. The labels are weather- and chemical-resistant and are, it is claimed, a breakthrough for the industry.

Limpet Tapes Limited, Bond House, 9A George Street, Hunting- don, Cambs, PE18 6BD, UtC

Versatile pressure-sensitive foam tape available for 'invisible" bonding

To achieve a level of performance not previously attainable with conventional pressure-sensitive tapes, 3M UK is introducting a range of VHB acrylic foam tapes. The first of this family of products, Scotch 4945 VHB, is already being marketed.

The closed-cell structure of the foam ensures a good seal, helps to supress vibration and protects against moisture ingress, thus making the tape suitable for outdoor applications such as attaching signs to notice boards or securing glass within a frame. The viscoelastic nature of the foam allows materials with different coefficients of expansion to be securely bonded. Dissimilar metals may also be joined together with Scotch VHB tape without the risk of galvanic corrosion, it is claimed.

The technology behind the development of the acrylic foam tapes was provided by 3M research both in the laboratory and in the field. A technical service which will provide performance data to support customers' own product and prototype testing is also available from 3M laboratories in Gorseinon, South Wales, UK, and the 3M European Tape Centre in Neuss, FRG. These services complement the world-wide service based in the USA.

Industrial Tape Specialities/3M, 3M United Kingdom p/c, 3M House, PO Box 1, Bracknell, Berks, RGI2 IJU, UK.

Preview

The Golden Gate Materials Technology Conference is planned to take place at The Sheraton Palace Hotel, San Francisco, USA, on 3-5 February 1987. Among the 24 sessions which make up this conference will be one devoted to Adhesive Bonding.

Further details may be obtained from: The Vice-Chairman, David Himmelblau, Lockhead Missiles & Space Company Incorporated, Department 81-32, Building B / 157, PO Box 3504, Sunnyvale, CA 94088, USA.

An international symposium entitled Adhesives, Sealants, and Coatings for Space and Harsh Environments is to take place in Denver, CO, USA on 8-10 April 1987. The programme for this symposium, which has been organized by the Division of Polymeric Materials Science and Engineering of the American Chemical Society, is available. It indicates that papers covering a wide spectrum of subjects will be given under the Section headings: environmental exposure; stress and interface; adhesives for harsh environments; sealants for harsh environments; coatings for corrosive environments; and coatings for electronic and optical environments.

Further technical information may be obtained from: Dr L.H. Lee, Symposium Chairman, M/S 0114- 22D, Webster Research Center, Xerox Corporation, Webster, New York, NY 14580, USA.

It is noted in the programme that a concurrent symposium on High Performance Polymers for Harsh Environments will be taking place at the same location on 7-9 April 1987.

Further information regarding both the above symposia may be obtained from: Meeting and Exposition, American Chemical Society, 1155 Sixteenth Street, NW, Washington, DC 20036, USA.

The TAPPI Hot Melt Symposium is to be held at the Doubletree Hotel, Monterey, CA, USA, on 7-10 June 1987. Covering the latest advances in hot-melt technology, the symposium is expected to be of interest not only to those working directly with hot-melt adhesives and sealants but also to resin suppliers, adhesive compounders, machinery manufacturers and end-use converters.

There is a call for papers, and prospective speakers are requested to submit titles and abstracts of proposed papers before 1 January 1987 to the Symposium Chairman: Kenneth E. Johnsen, Adhesive and Sealant Laboratory, Dow Chemical USA, 1603 Building, Midland, M/ 48674, USA.

Further details of the symposium may be obtained from TAPPI (Technical Association of the Pulp and Paper Industry) Headquarters: The Meetings Department, TAPPI, Technology Park/Atlanta, PO Box 105113, Atlanta, GA 30348-5113, US,~

6 INT.J.ADHESION AND ADHESIVES JANUARY 1987