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1 Copyright 2011 FUJITSUOEM Industrial-XLC-Roadmap Q4/2011_V2

OEM Mainboard Roadmap- Update -

eXtended LifeCycle MainboardsIndustrial Mainboards

OEM Sales – Q4 / 2011_V2


Newsn Updates vs. 2011_Q4-V1

n ECN schedule (GS1 à GS2) for D3071-S / D3076-S delayedn Urgent ECN for D2778-D added (becoming effective immediately)

==========================================================

n Updates vs. 2011_Q3-V1

n Mini-ITX Mainboard D3003-S3 released for mass production

n Industrial Mainboard D3076-S (ATX, iQ67) released for mass production

n Launch Schedule for Mainboard D3128-B (“Romley”) updated

n ECN preview for mainboards D307x-S and D306x-B updated

n EoL/XLT schedule for mainboard D2778-D updated

n EoL schedule for “S1” processors (D2703-S) added


Important Links

n Basic OEM FTP linkftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/

n Industrial & eXtended Lifecycle Mainboardsftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Products/Mainboards/Industrial&ExtendedLifetime/(Datasheets, manuals, drivers, BIOS, approvals, 3D-files, ECN details etc.)

n Mainboard qualification software & specific toolsftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Services/Software&Tools/

n General Mainboard informationftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Information/

n Processor / Mainboard compatibility overviewftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Services/Compatibility_CPU_x_Board/

ftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/

ftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM

ftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Services/Software&Tools/

ftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Information/

ftp://ftp.ts.fujitsu.com/pub/Mainboard-OEM-Sales/Services/Compatibility_CPU_x_Board/


ECN – Engineering Change Notification

Mainboard Chipset Changes Successor Expected Successor Shipment

(1) D3003-S11/S21 GS1 AMD eOntario.

Corrective wire on PCB replaced.

D3003-S11/S21 GS2 already shipping

(2) D3003-S11/S21 GS2 AMD eOntario

.

New stepping of onboard processor (change from B0 to C0). Update mandatory due to AMD request.

(see page 23 for details).

D3003-S12/S22 GS1 10/2011

D3071-S11 GS1 iQ67 Core Voltage Regulator – Updated stepping D3071-S11 GS2 10/2011 12/2011

D3076-S11 GS1 iQ67 Core Voltage Regulator – Updated stepping D3076-S11 GS2 10/2011 12/2011

D3062-B13 GS1 iQ67 Core Voltage Regulator – Updated stepping D3062 -B13 GS2 10/2011

D3061-B13 GS1 iQ65 Core Voltage Regulator – Updated stepping D3061-B13 GS2 10/2011

D2778-D14 GS1 X58 Update of MOSFET driver chip for improved MOSFET reliability D2778-D14 GS2 10-11/2011

Update

New

Update


LAO / EOL / XLCLast Assured Order / End Of Life / eXtended LifeCycle

Mainboard LAO 1) EOL 2) XLC 3) XLC-LAO 4)

D3076-S ATX, Intel Q67, Industrial Q2/2014 Q2/2014 Q3/2014 - Q2/2016 ~ 04/2016D3071-S µATX, Intel Q67, Industrial Q2/2014 Q2/2014 Q3/2014 - Q2/2016 ~ 04/2016D3003-S Mini-ITX, AMD, Industrial Q2/2014 Q2/2014 Q3/2014 - Q2/2016 ~ 04/2016D3062-B µATX, Intel Q67 Q1/2013 Q1/2013 Q2/2013 - Q1/2014 ~01/2014D3061-B µATX, Intel Q65 Q1/2013 Q1/2013 Q2/2013 - Q1/2014 ~01/2014D2963-S Mini-ITX, AMD, Industrial 12/2012 01/2013 Q1/2013 - Q1/2015 ~ 01/2015D2778-D ATX, Intel X58 03/2012 04/2012 05/2012 - 01/2013 12/2012D2703-S Mini-ITX, AMD, Industrial 12/2011 01/2012 Q1/2012 – Q1/2013 ~ 01/2013D283x-S (µ)ATX, iQ45, Industrial 12/2011 01/2012 Q1/2012 – Q1/2014 ~ 01/2014

1) After LAO date, orders can only be accepted while stocks last. Orders placed on LAO date are binding.Delivery is possible up to 8 weeks after LAO has been placed/confirmed.

2) In EOL month, orders can only be accepted while stocks last.

3) Mainboard still available upon demand via eXtended LifeCycle (XLC) process. Minimum order quantity required!

4) Last assured order date during XLC


Roadmap Overview


eXtended Lifecycle Series

SA Samples are available about 4 weeks ahead of launch date LAO After Last Assured Order date, orders can only be accepted based upon availability PL? Product Launch: Date is not yet confirmed Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAOPL Product Launch: Date is confirmed EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability

ECN Engineering Change Notification XLC eXtended LifeCycle: Product is still available after regular EOL (min. order quantity required)Mainboard/Component in production EOXLC End of eXtended LifeCycle

XLC: 12-24 months extended availability after EOL

Intel Processors 2011 2012 2013 2014 2015

Size Name Chipset Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

µATX D3161-B Q75 SA PL 1) EOL? XLC? EOXLC?

µATX D3162-B Q77 SA PL 1) EOL? XLC? EOXLC?

ATX D3128-B „Romley“ SA PL? 2) EOL? XLC? EOXLC

?

ATX D2778-D iX58 EOLXLC EOXLC EOL: 04/2012 XLC: 05/2012 – 01/2013

µATX D3061-B Q65 SA PL EOL XLC EOXLC

µATX D3062-B Q67 SA PL EOL XLC EOXLC

1) Depends on Intel Launch Schedule (03-04/2012 expected).

2) Depends on Intel Launch Schedule (03/2012 expected).


Industrial Series (µATX/ATX)


Intel Processors 2011 2012 2013 2014 2015

Size Name Chipset Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

ATX D3076-S iQ67vPro SA PL1) ECN 3) EOL XLC

µATX D3071-S iQ67vPro SA PL2) ECN 3) EOL XLC

ATX D2836-S iQ45 EOL XLC EOXLC

µATX D2831-S iQ45 EOL XLC EOXLC



1) Launch in 09/20112) Launch in 07/20113) Change from GS1 to GS2 expected from 12/2011

.


Industrial Series (Mini-ITX)

1) Processor AMD embedded G-Series Single-Core 1,2 GHz / 9W (T44R)2) Processor AMD embedded G-Series Dual-Core 1,6 GHz / 18W (T56N) [Note: 1.65GHz with C0 stepping]

3) Launch (limited release) in 05/2011; shipment from mid of June/20114) Launch D3003-S3 in 10/20115) Unlimited release, includes new processor stepping (Update from B0 to C0 mandatory due to AMD request!) from 10/2011

à see page 23 for details! .

6) Processor AMD Mobile Sempron™ 200U (1GHz/8W) soldered onboard (BGA/ASB1)7) Processor AMD Mobile Athlon™ Neo X2 L325 (1.5GHz/18W) soldered onboard (BGA/ASB1)

AMD Processors 2011 2012 2013 2014 2015

Name Chipset Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

D3003-S3 2)

DVI + LVDSAMD

embeddedG-Series

SA) PL 4) EOL XLC

D3003-S11)

DVI + LVDSAMD

embeddedG-Series

SA/PL 3) ECN 5) EOL XLC

D3003-S2 2)

DVI + DPAMD

embeddedG-Series

SA/PL3) ECN 5) EOL XLC

D2963-S16) AMD M690E EOL XLC EOXLC

D2963-S2 7) AMD M690E EOL XLC EOXLC

D2703-S AMD M690E ECN EOL XLC EOXLC





Industrial Series - Processors for D2703-S

For detailed ordering information, please refer to applicable ACN/EOL notification distributed by AMD Business Operations.

2007 2008 2009 20112010 2012 2013

AMD Turion™ 64 Mobile Processors

Mobile AMD Sempron™ Processors

“Tylor” – 1.6GHz 31W Socket S1 Dual-Core Processor TL-52

“Keene” – 1.8GHz 25W Socket S1 Single-Core Processor

Last Orders through Last Time Ship

Two year contractual extension possibleACN to announce EOL

Production

“Sherman” - 1.0GHz 8W Lidless Socket S1 Single-Core Processor

“Sherman” – 2.0GHz 25W Socket S1 Single-Core Processor 3500+

2100+

3700+

AMD Sempron™ Processors “Keene” - 9W 1.0GHz Lidless Socket S12100+

“Tyler” – 1.8GHz 31W Socket S1 Dual-Core Processor TL-56“Tyler” – 2.1GHz 35W Socket S1 Dual-Core Processor TL-62

Note: Please consider EoL / Last Time Ship for AMD „S1“-processors


Mainboard details


n ATX supporting Intel® “Romley” (Patsburg-A chipset)

n TPM V1.2

n LGA2011

n Intel® “Sandy Bridge” and XEON processor series

n Compatible with Intel® processors LGA2011(max. 150W TDP, High Efficiency CoreVoltage Regulator)

n Quad Channel DDR3-1333 SDRAM,ECC support (eight sockets), max. 256GB

n 2 x PCI Express x16 (16 lanes, Gen 3),1 x PCI Express x16 (4 lanes, Gen 3)1 x PCI Express x16 (4 lanes, Gen 2) 1 x PCI Express x8 (4 lanes, Gen 3)2 x PCI

n Intel Gbit LAN supporting iAMT 7.1 / vPro, Intel® High Definition Audio

n 12 x USB 2.0, internal socket for USB stick, 2 x USB 3.0

n 6 x SATA 600 RAID (4 x SATA can be configured as SAS Gen2)

n 1 x COM (internal connector), Boot Watchdog

D3128-B based on Intel® „Patsburg“ (Romley)


D3128-B detailed overview

Date Event Version BIOS Comment

Q1/2012 Launch D3128-Bxx GS1 ≥ R1.00 First Release


D3076-S based on Intel® Q67n ATX (designed for industrial applications)

n LGA1155

n Intel® 2nd Generation Core™ i7 / i5 / i3 Processors

n max. 95W TDP, High Efficiency Core Voltage Regulator

n Dual Channel DDR3 1333 SDRAM (four sockets ), max. 32GB

n Intel® HD Graphics (DX10.1, integrated in processor)

n DVI-I and DisplayPort V1.1

n 1 PCI Express x16 (Gen.2), 1 PCI Express x16 (4 lanes), 1 PCI Express x8 (1 lane), 4 PCI

n Dual Intel Gbit LAN supporting iAMT 7.0 and DASH 1.1

n LAN Teaming Support

n Intel® High Definition 5.1 Audio, Infineon TPM V1.2

n Optional Parallel Port (Pin Header onboard)

n 14 USB 2.0, 4 SATA 3Gb/s, 2 SATA 6Gb/s; RAID 0/1/5/10

n Second COM (internal), 8 Bit GPIO port onboard

n Boot Watchdog

n Operating temperature range from 0°C to 60°C


D3076-S detailed overview


Q3/2011 Launch(sample shipments only) D3076-S11 GS1 ≥ R1.3.0 First Release

10/2011 12/2011Stuffing change

(First mass productionshipments)

D3076-S11 GS2 ≥ R1.4.0 Core Voltage Regulator (Updated version)

Update


D3071-S based on Intel® Q67n µATX (designed for industrial applications)

n LGA1155


n max. 95W TDP, High Efficiency Core Voltage Regulator




n 1 PCI Express x16 (Gen.2), 1 PCI Express x16 (4 lanes), 2 PCI

n Dual Intel Gbit LAN supporting iAMT 7.0 and DASH 1.1

n LAN Teaming Support




n Second COM (internal), 8 Bit GPIO port onboard

n Boot Watchdog





Q3/2011 Launch D3071-S11 GS1 ≥ R1.3.0 First Release

10/2011 12/2011 Stuffing change D3071-S11 GS2 ≥ R1.4.0 Core Voltage Regulator (Updated version)

Update


D3062-B based on Intel® Q67

n µATX

n Supporting Intel iAMT 7.0 (vPro ready)

n LGA1155


n max. 95W TDP, High Efficiency Core Voltage Regulator)




n 1 PCI Express x16 (Gen.2), 1 PCI Express x16 (4 lanes),1 PCI Express x1, 1 PCI

n Intel Gbit LAN supporting iAMT 7.0 and DASH 1.1

n Intel® High Definition 5.1 Audio, Atmel TPM V1.2






Q2/2011 Launch D3062-B13 GS1 ≥ R1.00 First Release

10/2011 Stuffing change D3062-B13 GS2 n.r. Core Voltage Regulator (Updated version)


D3061-B based on Intel® Q65

n µATX

n Supporting Intel iAMT (Standard Manageability)

n LGA1155


n max. 95W TDP, High Efficiency Core Voltage Regulator)




n 1 PCI Express x16 (Gen.2), 1 PCI Express x16 (4 lanes),1 PCI Express x1, 1 PCI

n Intel Gbit LAN supporting iAMT and DASH 1.1

n Intel® High Definition 5.1 Audio, Atmel TPM V1.2


n 14 USB 2.0, 4 SATA 3Gb/s, 1 SATA 6Gb/s




Q2/2011 Launch D3061-B13 GS1 ≥ R1.00 First Release

10/2011 Stuffing change D3061-B13 GS2 n.r. Core Voltage Regulator (Updated version)


D3003-S based on AMD eOntario

n Mini-ITX for Industrial Applications, up to 60°C

n Processor AMD Mobile with integrated graphics onboard- AMD Ontario Single-Core T44R (1.2GHz/9W) or- AMD Ontario Dual-Core T56N (1.6GHz/18W)

n Fanless operation possible!

n DDR3 1333/1066 SDRAM, 2 x SO socket, max. 8GB

n Integrated graphics (DX11)DVI-I & 24Bit/Dual Channel LVDS support (Single-Core version) orDVI-I & 24Bit/Dual Channel LVDS support (Dual-Core version) or DVI-I & DisplayPort support (Dual-Core version)

n 1 x PCI, 1 x PCIe x1, 8 x USB 2.01 x internal socket for USB stick2 x SATA 6001 x mSATA connector8 Bit GPIO port

n Dual LAN 10/100/1000Mbit, High Definition Audio

n Infineon TPM V1.2

n Power supply: 19-24V DC (via internal connector or external AC adapter)




Q2/2011 Launch D3003-S11 GS1D3003-S21 GS1 ≥ R1.3.0 First Release

Q2/2011 Minor change D3003-S11 GS2D3003-S21 GS2 ≥ R1.4.0 Corrective wire replaced

10/2011 PCB update, featureenhancements

D3003-S12 GS1D3003-S22 GS1 ≥ R1.5.0 See below 1) 2)

10/2011 Launch: Additional versionD3003-S3 (Dual-Core, LVDS) D3003-S32 GS1 ≥ R1.5.0 Starting with C0 stepping

1) D3003-S12:- Processor (APU) stepping change from B0 to C0 (no functional change)- Circuitry for improved “auto power on” added- Improved usage of self-powered USB devices

2) D3003-S22:- Processor (APU) stepping change from B0 to C0

à Processor (APU) frequency changed from 1.6GHz to 1.65GHzà Support for DDR3-1333 addedà DisplayPort++ supportedà 2560x1600 dual monitor resolution supported

- Circuitry for improved “auto power on” added - Improved usage of self-powered USB devices


D2963-S based on ATI M690E / SB600


n Processor AMD Mobile onboard- Sempron™ 200U (1GHz/8W) or- Athlon™ Neo X2 L325 (1.5GHz/18W)

n Fanless operation possible!

n DDR2 800/667 SDRAM, 1 x SO socket

n ATI Radeon X1250 graphics; VGA / DVI & LVDS support (up to 256MB)

n 1 x PCI, 1 x PCIe x1, 1 x CF, 8 x USB 2.01 x internal socket for USB stick2 x SATA 3001 x PCIe Mini Card connector

n Dual LAN 10/100/1000Mbit, High Definition Audio

n Power supply: 19-24V DC (via internal connector or external AC adapter)

n 100% driver compatible to D2703-S




01/2010 Launch D2963-S11 GS1D2963-S21 GS1 1) ≥ 1.18 2) First Release

09/2010 ECN 3) D2963-S11 GS2D2963-S21 GS2 n.r.

1) Available versions:D2963-S11 incl. AMD Mobile Sempron™ 200U Single Core Processor (1.0GHz; 8W) orD2963-S21 incl. AMD Mobile Athlon™ Neo L325 Dual Core Processor (1.5GHz; 18W)

2) Based on BIOS of D2703-S

3) New CF card socket with ability to fix CF card with special cover

CF socket GS1 CF socket GS2 with locking cover


D2836-S based on Intel® Q45 / ICH10DO

n ATX (designed for industrial applications)

n LGA775

n Intel® Celeron / Wolfdale / Yorkfield Processors

n 1333/1066/800 MHz FSB

n Compatible with Intel® 06 and 05A processors(max. 95W TDP, High Efficiency Core Voltage Regulator)

n Dual Channel DDR2 800/667 SDRAM (four sockets)

n Intel® GMA 4500 Graphics (up to 256MB)

n 1 PCI Express x16 (Gen.2), 1 PCIe x1, 1 PCIe x8 (1 lane),4 PCI

n Dual GbE LAN (Realtek RTL8111CP supporting ASF2.0, Teaming)



n 12 USB 2.0, 6 SATA 300 RAID, second COM (internal)





12/2008 Launch D2836-S11 GS1 ≥ 1.00 First Release

11/2009 ECN 1) D2836-S11 GS2 > 1.05

1) - new DIMM sockets with 30µinch Au

- introduction of 2nd source for MOS-FET

- updated audio controller (Realtek ALC663 stepping change from Rev. A1 to Rev. A4) for improved WHQL handling. Note: Updated BIOS required, but NO driver update!

- SystemMonitoring controller: Updated bootloader firmware (no functional change)


D2831-S based on Intel® Q45 / ICH10DO

n µATX (designed for industrial applications)

n LGA775

n Intel® Conroe / Wolfdale / Yorkfield Processors

n 1333/1066/800 MHz FSB

n Compatible with Intel® 06 and 05A processors(max. 95W TDP, High Efficiency Core Voltage Regulator)

n Dual Channel DDR2 800/667 SDRAM (four sockets)

n Intel® GMA 4500 Graphics (up to 256MB)

n 1 PCI Express x16 (Gen.2), 1 PCI Express x8 (4 lanes), 2 PCI

n Dual GbE LAN (Realtek RTL8111CP supporting ASF2.0, Teaming)



n 12 USB 2.0, 6 SATA 300 RAID, second COM (internal)






11/2009 ECN 1) D2831-S12 GS1 > 1.05

1) - new DIMM sockets with 30µinch Au

- introduction of 2nd source for MOS-FET

- updated audio controller (Realtek ALC663 stepping change from Rev. A1 to Rev. A4) for improved WHQL handling. Note: Updated BIOS required, but NO driver update!

- SystemMonitoring controller: Updated bootloader firmware (no functional change)

- USB ports: Circuitry change in order to switch off USB power after a 4-sec. power button override(currently the USB ports remain powered, even if BIOS Setup "USB at power-off" is set to "always off")


n ATX supporting Intel® Nehalem Architecture (eXtended Lifecycle)

n TPM V1.2

n LGA1366

n Intel® Xeon® 3500 / 5500 and Core™ i7 processor series

n Compatible with Intel® processors LGA1366(max. 130W TDP, High Efficiency CoreVoltage Regulator), supporting Intel® QuickPath Interconnect

n Triple Channel DDR3 800/1066/1333 SDRAM,ECC support (six sockets)

n 2 PCI Express x16 (Generation 2),2 PCI Express x8 (4 lanes), 2 PCI

n Realtek Gbit LAN incl. ASF2.0, Intel® High Definition Audio


n 10 USB 2.0, 2 FireWire™, 6 SATA 300 RAID

D2778-D based on Intel® X58 / ICH10R


D2778 detailed overview


E03/2009 Launch D2778-A12 GS1 ≥ 1.00 First Release

04/2010 Launch D2778-D14 GS1 n.r.

Updated chipset steppingincl. support for Westmere

processor series. DASH support and USB

security features.Improved onboard voltage

regulator heatsink in order toenable easy assembly of Intel

Core i7 „boxed heatsink“

10-11/2011Update of MOSFET driver

chip for improved MOSFET reliability

D2778-D14 GS2 n.r.Immediate change to avoid

possible quality issue with newMOSFET shipments

New


D2703-S based on ATI M690E / SB600


n AMD Mobile Socket S1g1

n AMD Mobile Turion™ 64 X2 / Sempron™

n Up to 35W; HyperTransport™ 1 - 800MHz

n DDR2 800/667 SDRAM, Dual Channel, 2 x SO socket

n ATI Radeon X1250 graphics; VGA / DVI & LVDS support (up to 256MB)

n 1 x PCI, 1 x PCIe x1, 1 x CF, 8 x USB 2.0,4 x SATA 300 / RAID, 1 x IDE

n Dual LAN 10/100/1000Mbit, High Definition Audio, Firewire

n Power Select : 24V DC (via internal connector or external AC adapter) or internal ATX Power Supply



1) - Updated PCB version (“S13”)- Support for 3-wire fans (voltage controlled) via Fan2-connnector added- Audio capacitors replaced by improved longlife type- Fan3 connector: Workaround in order to enable usage of fans with abnormal

low input resistance (PWM control input)- Processor throttling support (“ProcHot”) in case of processor temperature Alert added

Note: No mechanical change!

2) - new CF card socket with ability to fix CF card with special cover- change of PCB finish from Sn to Ag finish (improved availability)



M11/2008 ECN 1) D2703-S13 GS1 ≥ 1.07 PCB update

08/2009 ECN D2703-S13 GS2 ≥ 1.13Circuit change to improve

robustness against component tolerances

Q1/2011 ECN 2) D2703-S13 GS3 n.r.

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