radiation tolerant source interface unit for the alice experiment

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Radiation Tolerant Radiation Tolerant Source Interface Unit Source Interface Unit for the ALICE Experiment for the ALICE Experiment E. D E. D énes énes et al. et al. LECC 2005 LECC 2005 12- 16 September 2005, 12- 16 September 2005, Heidelberg Heidelberg

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Radiation Tolerant Source Interface Unit for the ALICE Experiment. E. D énes et al. LECC 2005 12- 16 September 2005,  Heidelberg. Outline. Introduction DLL Radtol Project Component test FPGA tests Actel SIU tests Radtol SIU status Conclusions. Introduction: ALICE DAQ. Detector. - PowerPoint PPT Presentation

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Page 1: Radiation Tolerant Source Interface Unit for the ALICE Experiment

Radiation Tolerant Source Radiation Tolerant Source Interface Unit for the Interface Unit for the

ALICE Experiment ALICE Experiment E. DE. Dénesénes et al.et al.

LECC 2005LECC 200512- 16 September 2005,  Heidelberg12- 16 September 2005,  Heidelberg

Page 2: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 22

OutlineOutline

• IntroductionIntroduction• DLL Radtol ProjectDLL Radtol Project• Component testComponent test• FPGA testsFPGA tests• Actel SIU testsActel SIU tests• Radtol SIU statusRadtol SIU status• ConclusionsConclusions

Page 3: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 33

Introduction: ALICE DAQIntroduction: ALICE DAQ

HLT Farm

H-RORC H-RORC

FEP FEP

D-RORC D-RORC

LDC LDC

D-RORC D-RORC

LDC LDC

DIU

DIU

DIU

DIU

DIU

DIU

DIU

DIU

SIU

SIU

SIU

SIU

Event Building Network

Readout Electronics

Detector

D-RORC D-RORC

LDC LDC

DIU

DIU

SIU

SIU

Readout Electronics

Detector

DIU

SIU

DIU

SIU

Source Interface Unit

Duplex, multimode opticalfiber

Destination Interface Unit

DAQ Readout Receiver Card

Local Data Concentrator

Detector Data Link

GDCGDC GDCGlobal Data Collector

123

DD

Ls

262

DD

Ls

10 D

DLs

Page 4: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 44

Introduction: Detector Introduction: Detector Data LinkData Link

• Simple, yet efficient standard interface Simple, yet efficient standard interface between the detectors and the data-between the detectors and the data-acquisition systemacquisition system– User provided clock signal; flexible readout speedUser provided clock signal; flexible readout speed– Simple FIFO-like front-end interfaceSimple FIFO-like front-end interface– Data-push architectureData-push architecture– Full-duplex flow controlFull-duplex flow control

• Bi-directional, high-speed optical linkBi-directional, high-speed optical link– Sustained data rate up to 200 MB/sSustained data rate up to 200 MB/s– Backward channel (towards the detectors) supports Backward channel (towards the detectors) supports

front-end electronics control or bulk downloadfront-end electronics control or bulk download

• Radiation tolerant Source Interface UnitRadiation tolerant Source Interface Unit

Page 5: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 55

Radiation Levels in ALICERadiation Levels in ALICE

DetectorDetector Dose [rad / Dose [rad / Gy]Gy]

n-n-ΦΦ [n x cm [n x cm--

22]]n-n-ΦΦ [cm [cm-2-2]]1 MeV n-1 MeV n-

equ.equ.

h-h-ΦΦ [cm [cm-2-2]]1 MeV n-1 MeV n-

equequ

TPC (inner)TPC (inner) 1600 / 161600 / 16 3.3.77 x 10 x 101111 1.4 x 101.4 x 101111 1.5 x 101.5 x 101111

TPC (outer)TPC (outer) 220 / 2.2220 / 2.2 2.5 x 102.5 x 101111 4.4 x 104.4 x 101010 4.5 x 104.5 x 101010

TRDTRD 180 / 1.8180 / 1.8 1.6 x 101.6 x 101111 2.5 x 102.5 x 101010 2.6 x 102.6 x 101010

TOFTOF 120 / 1.2120 / 1.2 1.1 x 101.1 x 101111 1.9 x 101.9 x 101010 2.0 x 102.0 x 101010

HMPIDHMPID//PHOSPHOS

50 / 0.550 / 0.5 8.6 x 108.6 x 101010 1.7 x 101.7 x 101010 1.7 x 101.7 x 101010

• Detectors listed have the SIU’s directly installed on the Detectors listed have the SIU’s directly installed on the front-end electronicsfront-end electronics

• The other detectors have the SIU’s in shoeboxes close to The other detectors have the SIU’s in shoeboxes close to TPC or in racks in the UX area or in one of the counting TPC or in racks in the UX area or in one of the counting roomsrooms

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LECC 2005, HeidelbergLECC 2005, Heidelberg 66

DDL Radtol ProjectDDL Radtol Project

• Collaboration between CERN, RMKI - KFKI and its Collaboration between CERN, RMKI - KFKI and its partners in Hungary (Cerntech, TU Budapest)partners in Hungary (Cerntech, TU Budapest)

• Several tests were carried out to test Several tests were carried out to test components that were going to be used on the components that were going to be used on the DDL SIU cardDDL SIU card

• Several reports and publications have been Several reports and publications have been presentedpresented

• Further tests of the SIU cards are being Further tests of the SIU cards are being performedperformed

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LECC 2005, HeidelbergLECC 2005, Heidelberg 77

SIU ComponentsSIU Components

PLD SERDES OpticalTransceiver

Data path

(Serial)

Data path(2x16 bits)+ control

FE

E in

terf

ace

Powermonitor

PowerRegulator

PowerRegulator

Power

Xtal

IDprom

TX

CL

K

RX

CL

K

RX

CL

K

TX

CL

K

Data path(32 bits)+ control

Page 8: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 88

ComponentsComponents Tests (1/2)Tests (1/2)• Crystal oscillatorsCrystal oscillators

– Four oscillators from four manufacturers Four oscillators from four manufacturers (Pletronics, Saronix, CFP, Ecliptek) have been (Pletronics, Saronix, CFP, Ecliptek) have been passed the testpassed the test• TID: 100 krad (req. 5 krad)TID: 100 krad (req. 5 krad)• Neutron: 10Neutron: 101212 n/cm n/cm22 (req. 4x10 (req. 4x101111))

• Voltage regulatorsVoltage regulators– Two different device family have been testedTwo different device family have been tested

• TID: 100 krad (req. 5 krad)TID: 100 krad (req. 5 krad)• Neutron: 10Neutron: 101212 n/cm n/cm2 2 (req. 4x10(req. 4x101111))

– Micrel’s Micrel’s MIC5209MIC5209 family (1.8V and 2.5V) family (1.8V and 2.5V) failedfailed– Linear Technology’s Linear Technology’s LT1963LT1963 family (1.8V and 2.5V) family (1.8V and 2.5V)

passedpassed

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ComponentsComponents Tests (2/2)Tests (2/2)• SERDESSERDES

– TI TLK 2501 have been passed the testsTI TLK 2501 have been passed the tests• Neutron: 10Neutron: 101212 n/cm n/cm22 (req. 4x10 (req. 4x101111))

• Optical transceiversOptical transceivers– Two different device family (Agilent HFBR5910ETwo different device family (Agilent HFBR5910E andand

Infineon V23818-K305-L57) have been passed the Infineon V23818-K305-L57) have been passed the teststests• TID: 22.8 krad (req. 5 krad)TID: 22.8 krad (req. 5 krad)• Neutron: 10Neutron: 101212 n/cm n/cm22 (>20 yrs of ALICE) (>20 yrs of ALICE)

– 2.125 Gbps SFP (2.125 Gbps SFP (HFBR5720LHFBR5720L and and V23818-M305-V23818-M305-B57B57) version of those transceivers were tested as ) version of those transceivers were tested as part of the DDL prototype cardpart of the DDL prototype card• TID: tested up to 10 krad (no damage)TID: tested up to 10 krad (no damage)• SEU: Only a few errors may be accounted to the optical SEU: Only a few errors may be accounted to the optical

transceivers when tested with neutrons up to 10transceivers when tested with neutrons up to 101111 n/cm n/cm22

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SRAM-based SRAM-based FPGA TestsFPGA Tests• Earlier tests show that the required TID values are Earlier tests show that the required TID values are

toleratedtolerated• Many experiences show that SRAM-based devices are Many experiences show that SRAM-based devices are

sensitive to SEU effectssensitive to SEU effects

Two SRAM-based FPGA devices have been testedTwo SRAM-based FPGA devices have been tested• Altera APEX-E device (EP20K60E, used on SIU prototypes) Altera APEX-E device (EP20K60E, used on SIU prototypes)

was tested with p and n in 2003was tested with p and n in 2003– Embedded memory testEmbedded memory test– Logic cell testLogic cell test

• Xilinx Virtex II device was tested with p in 2004Xilinx Virtex II device was tested with p in 2004– Logic cell testLogic cell test

Special test firmware and software has been developed to Special test firmware and software has been developed to capture SEU induced bit errors and configuration losscapture SEU induced bit errors and configuration loss

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1111

Results of the FPGA TestsResults of the FPGA Tests

Beam typeBeam type ProtonProton NeutronNeutron

Energy [MeV]Energy [MeV] 180 180 100100 5 – 145 – 14

TestTest Logic CellLogic Cell Memory CellMemory Cell Logic CellLogic Cell Memory CellMemory Cell

σσ[10[10-13-13 cm cm22/bit]/bit]

7.087.08± 1.1± 1.1

5.865.86± 0.9± 0.9

0.3660.366

± ± 0.060.06

0.5250.525

± ± 0.060.06

0.4880.488

± ± 0.220.22

0.2930.293

± ± 0.170.17

0.2440.244

± ± 0.080.08

0.2930.293

± ± 0.090.09

0.0370.037

± ± 0.010.01

0.0430.043

± ± 0.010.01

Beam typeBeam type ProtonProton

Energy [MeV]Energy [MeV] 171171 9494 4848

TestTest Logic CellLogic Cell

σσ[10[10-13-13 cm cm22/bit]/bit]

66..7575± ± 22..33

77.8.822± ± 22..44

88..1111

± ± 22..66

Altera APEX-E test resultsAltera APEX-E test results

Xilinx Virtex II test resultsXilinx Virtex II test results

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ConsequencesConsequencesPrototype DDL cardsPrototype DDL cards• FPGA: FPGA: Altera APEX-EAltera APEX-E (EP20K60E, 160 kgates - 0.18 (EP20K60E, 160 kgates - 0.18 m)m)• Amongst all consequences of radiation, one is really problematic:Amongst all consequences of radiation, one is really problematic:

the loss (or corruption) of the device configuration (= configuration the loss (or corruption) of the device configuration (= configuration cell changes its state due to high-energy particle interacting with the cell changes its state due to high-energy particle interacting with the device)device)

• Radiation tests have shown that we should expect 1 loss of Radiation tests have shown that we should expect 1 loss of configuration in 1 of the 400 DDL SIUs every hourconfiguration in 1 of the 400 DDL SIUs every hour

New DDL card is neededNew DDL card is needed• 44 different solutions have been discussed (Altera Cyclon, Xilinx different solutions have been discussed (Altera Cyclon, Xilinx

Virtex, Actel ProASIC+, Custom ASIC)Virtex, Actel ProASIC+, Custom ASIC)• The one based on The one based on Actel ProASIC+Actel ProASIC+ has been selected has been selected

– 0.22 0.22 m flash-based CMOS processm flash-based CMOS process

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1313

Actel ProASIC+Actel ProASIC+Bright sideBright side• Irradiation tests are encouragingIrradiation tests are encouraging• Capacity: no problem to fit the DDL SIU in. (PQFP 208 pins 75k to Capacity: no problem to fit the DDL SIU in. (PQFP 208 pins 75k to

1Mgates)1Mgates)• Lower power consumptionLower power consumption• Instant-on device (no configuration at power-on)Instant-on device (no configuration at power-on)• No external device needed for storing the configurationNo external device needed for storing the configuration

Not so bright…Not so bright…• Lot of design work was needed because of different architectureLot of design work was needed because of different architecture

– Learn the peculiarities of the ALearn the peculiarities of the Actelctel software tools software tools– Timing-critical modules to be re-engineered (framing/de-framing @ 110 Timing-critical modules to be re-engineered (framing/de-framing @ 110

MHz)MHz)– Less internal resources (e.g. high-speed global network)Less internal resources (e.g. high-speed global network)– Less complex logic elementsLess complex logic elements

• Special voltage (+16 V and -13.8 V) required to reload configurationSpecial voltage (+16 V and -13.8 V) required to reload configuration– remote configuration is not supportedremote configuration is not supported

Page 14: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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Radtol SIU Block DiagramRadtol SIU Block Diagram

ActelAPA150

TITLK2501

AgilentHFBR-5720L

Data path

(Serial)

Data path(2x16 bits)+ control

FEE interface

106.25 MHz

+3.3V

LVTTL

2125 Mbps

LVPECL

50 MHz

+3.3V

LVTTLPowermonitor2.5V2.5V

+3.3V

XtalIDprom

TX

CL

K

RX

CL

K

Data path(32 bits)+ control

2125 MBd

850 nm

optical

Optical interface

RX

CL

K

TX

CL

K

Notes: Notes: • PCB design is compatible for APA150 (ProASIC+) and A3P250 (ProASIC3) devicesPCB design is compatible for APA150 (ProASIC+) and A3P250 (ProASIC3) devices• Four prototype boards have been manufacturedFour prototype boards have been manufactured

Csaba Soos
Modify it this slide!
Page 15: Radiation Tolerant Source Interface Unit for the ALICE Experiment

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1515

Radtol SIU FirmwareRadtol SIU Firmware

ACTEL APA 150 versionACTEL APA 150 version

• Modules have been ported from the ALTERA DDL firmwareModules have been ported from the ALTERA DDL firmware• Timing critical modules have been reengineered and Timing critical modules have been reengineered and

optimizedoptimized• Complete firmware is being simulated and then tested on Complete firmware is being simulated and then tested on

real hardwarereal hardware• DDL transactions are being tested using the RORC utilitiesDDL transactions are being tested using the RORC utilities

((both in CERN and inboth in CERN and in RMKI-KFKI, Budapest) RMKI-KFKI, Budapest)• Long term tests are being executed using DATELong term tests are being executed using DATE

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Actel Actel ProASIC+ProASIC+ Test Results Test Results (1/2)(1/2)

May 2004, TSL, Uppsala, SwedenMay 2004, TSL, Uppsala, Sweden• Tests were done using the evaluation board (APA075)Tests were done using the evaluation board (APA075)• Proton beam @ 171, 94 and 48 MeVProton beam @ 171, 94 and 48 MeV• No configuration lossNo configuration lossJune 2004, ATOMKI, Debrecen, HungaryJune 2004, ATOMKI, Debrecen, Hungary• Tests were done using the evaluation board (APA075)Tests were done using the evaluation board (APA075)• TID tests with CoTID tests with Co6060, dose rate of approx. 20 krad/h, dose rate of approx. 20 krad/h• No problem up to 12 krad, when the device stopped functioningNo problem up to 12 krad, when the device stopped functioning• After 1 hour at room temperature the device started to work After 1 hour at room temperature the device started to work

(annealing)(annealing)March 2005, ATOMKI, Debrecen, HungaryMarch 2005, ATOMKI, Debrecen, Hungary• Tests were done using both the evaluation board and the new SIU Tests were done using both the evaluation board and the new SIU

(APA150)(APA150)• Neutron beam with the energy < 15 MeVNeutron beam with the energy < 15 MeV• No errors have been detected on the evaluation board (5*10No errors have been detected on the evaluation board (5*101010 n/cm n/cm22))• One error on the SIU provoked link down after the equivalent of 5 yrsOne error on the SIU provoked link down after the equivalent of 5 yrs

(10(101111 n/cm n/cm22). It could be fixed by cycling the power of the card). It could be fixed by cycling the power of the card

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1717

Actel Actel ProASIC+ProASIC+ Test Results Test Results (2/2)(2/2)

May 2005, ATOMKI, Debrecen, Hungary, May 2005, ATOMKI, Debrecen, Hungary, Neutron beam with the energy Neutron beam with the energy < 15 MeV< 15 MeV

• Tests were done using the new SIU; short data block were circulated Tests were done using the new SIU; short data block were circulated through the loop-back implemented in the SIU firmwarethrough the loop-back implemented in the SIU firmware

• Neutron beam with the energy < 15 MeVNeutron beam with the energy < 15 MeV• Few errors have been detected; during initialization the SIU stuck in Few errors have been detected; during initialization the SIU stuck in

power-on reset state (link initialization error has been fixed remotely)power-on reset state (link initialization error has been fixed remotely)May 2005, TSL, Uppsala, Sweden, May 2005, TSL, Uppsala, Sweden, Neutron beam with energy 95 MeVNeutron beam with energy 95 MeV• Combined test of the TPC Readout Electronics (FECs + RCU) and the new Combined test of the TPC Readout Electronics (FECs + RCU) and the new

SIU performed by the TPC groupSIU performed by the TPC group• SIU contribution to transmission errors: 0 (preliminary)SIU contribution to transmission errors: 0 (preliminary)June 2005, ATOMKI, Debrecen, Hungary, June 2005, ATOMKI, Debrecen, Hungary, Neutron beam with the energy Neutron beam with the energy

< 15 MeV< 15 MeV• Tests were done using the new SIU; long data block were received from Tests were done using the new SIU; long data block were received from

FEE emulator and send to DIU and RORCFEE emulator and send to DIU and RORC• Data errors have been detected; tests have shown that we should expect Data errors have been detected; tests have shown that we should expect

1 bit error every 4 hour in the DAQ system containing 400 DDL SIUs1 bit error every 4 hour in the DAQ system containing 400 DDL SIUs

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1818

Project StatusProject Status• Prototype boards have been manufacturedPrototype boards have been manufactured• Firmware is extensively tested using the RORC utilitiesFirmware is extensively tested using the RORC utilities

(both in CERN and in RMKI(both in CERN and in RMKI -- KFKI, Budapest)KFKI, Budapest)• Long term tests are being executed using DATE Long term tests are being executed using DATE • Many radiation tolerance test have been made, results Many radiation tolerance test have been made, results

are promisingare promising• Production Readiness Review (PRR) successfully held in Production Readiness Review (PRR) successfully held in

JuneJune• Tests recommended by the PRR referees has been Tests recommended by the PRR referees has been

startedstarted• ACTEL released the ProASIC3 device, test board ordered ACTEL released the ProASIC3 device, test board ordered • Everything is prepared for series productionEverything is prepared for series production

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LECC 2005, HeidelbergLECC 2005, Heidelberg 1919

The FutureThe Future• Actel ProASIC3 (3Actel ProASIC3 (3rdrd generation) generation)

– Pin compatible with existing ProASIC+ devices Pin compatible with existing ProASIC+ devices – Higher performance, lower power consumptionHigher performance, lower power consumption– Improved global network supporting up to 18 global signalsImproved global network supporting up to 18 global signals

• We continue the radiation tolerant tests We continue the radiation tolerant tests – To find out the reason of data errorsTo find out the reason of data errors

• SEU produced in memory or register cells?SEU produced in memory or register cells?• Special test firmware developedSpecial test firmware developed

– Develop error correcting firmwareDevelop error correcting firmware

• We continue tests recommended by the PRR refereesWe continue tests recommended by the PRR referees • 12 DDLs for TPC tests at Point 2 will be available in 12 DDLs for TPC tests at Point 2 will be available in

OctoberOctober

Page 20: Radiation Tolerant Source Interface Unit for the ALICE Experiment

Thank you!Thank you!