picosecond lasers: versatile, high quality · pdf filelong term partnerships. the lumera laser...

PICOSECOND LASERS:

Versatile, High Quality Micromaching

Dirk Müller, Ph.D.Bernhard Klimt

[email protected]

www. LUMERA-LASER .com

PICOSECOND LASERS: Versatile, High Quality Micromachining

Our Parent Company

http://de.wikipedia.org/w/index.php?title=Datei:Aton_(Unternehmen)_logo.svg&filetimestamp=20100130152053


LUMERA: Part of ATON Technology

Headquartered in Kaiserslautern, Germany

Corporate Overview

• Founded in 2000, LUMERA LASER has established itself as the leading picosecond laser manufacturer

• Since 2008 financially backed by the ATON Group

• Over 600 delivered Systems (>400 in 24/7 operation)

• We strive to provide our customers with: Best value in industry Knowledgable customer service

(before and after sales) Long term partnerships

The LUMERA LASER Team


• Total Head Count ~ 100 Manufacturing 25 Engineering 9 R&D 8 Process Development 5 Customer Service and Sales 8 Supply Chain, Finance, Admin 13

• Key areas of expertise Optical and Laser Physics Ultrafast Pulse Generation Process Development (over 1000 samples) Mechanical Engineering Electrical Engineering

Ultrashort Pulsed Lasers

How short is ultrashort?


Picoseconds

1 ps

1 ps 3 x thickness of hair

a picosecond is

to a second

what a day is

to the age of the

universe

or…

One millionth of one millionth of a second… 10-12


Material Ablation


Ehn = DEatom

Ehn < DEatom

absorption wavelength is material specific

absorption wavelength is material inspecific

linear absorption

works even at low intensities

nonlinear absorption

requires strong intensities

|g>

|e>

|g>

|e>

Linear vs. Nonlinear Absorption

Non-linear Ablation Threshold


ablation threshold

Gaussian beam

heat deposition

ablation

region

Intensity > ablation threshold leads to ionization and material

removal

Intensity < ablation threshold contributes to heating

0.2 to 2.0 J/cm2

Long Pulse vs. Ultrafast pulse



hatch

~30% overlapping

Process Strategy

One disk at a time- Energy density 1J / cm²- 30 µm spot => 10 … 50 µJ- One-shot ablation: 50 nm – 1 µm

Move beam and repeat- Hatch multiple lines- High repetition rate (> 500kHz)- Max out scanner speed (> 10m/s)

PS laser machining advantages- no melt- no burrs- no microcracks

Advantages of Picosecond

• No heat affected zone (HAZ), gentle machining

• High spatial precision and quality

• Machining ANY material with one tool

psns

Cr-photomask (~4 µm)



Nanosecond vs. Picosecond

Al

PVC

f 100µm,

1 mm thick

f 170µm, 0.3 mm thick

nano pico

ps-laser … in the beginning


…today



Total Cost of Ownership - 24/7 Operation

Initial Investment- 6W 100k€- 75W 200k€- 5 year amortization- 10% interest on capital

Operating cost- electricity 4k€/a- preventive service 4k€/a

Consumables- Diodes (20,000hr) 10k€/a- Chiller (15,000hr) 5k€/a- other 1k€/a

$5-$10/hr


Getting the Beam onto the Sample

Micromachining Systems



Gallery of Applications

Machining Sensitive Materials

Courtesy of VTT,

Laser Processing, FinlandPICOSECOND LASERS: Versatile, High Quality Micromachining

Complex Features in Metal

Bodhi Tree

25 µm Brass

24,000 Outlines



2.5 D Machining of any Material

glass

cost $3

removal of ~ 1,000 mm3

mammoth tusk

cost $1.50

WC

cost $6

3 cm

Ra~ 200 nm

From Drawing to Work Piece

1 mm

1 mm

CAD File

Machined Result



Circuit Board Drilling


Market Developments

Mechanical drilling- 20 holes/s per drill head- 6 drilling heads in machine (120holes/s)- Each bit lasts 2000 holes- Drill bit cost 200€/hr

CO2-lasers displaces mechanical drilling - lower cost- acceptable quality

ps-lasers start to replace CO2

- desired hole diameter shrinking below 100µm- ps-lasers penetrating market 70µm and below- up to 1000 micro vias/s with split beam


One-sided Trepanning

top diameter 70µm

bottom diameter 50µm

thickness 0.1mm532nm, 400kHz, 10W30µm focus300 holes/sec

80.000 holes/$

top

bottom

side


Two-sided Trepanning

top diameter 70µm

bottom diameter70µm

thickness 0.1mm532nm, 400kHz, 10W30µm focus300 holes/sec

80.000 holes/$

top

bottom

side


Micro-vias by Percussion

blind hole dia. 50µm

Depth 50µm

Up to 1000 hole/s


Holes in Ceramics

Diameter : 100 µm

Thickness: 1 mm

1 hole/s

Cost: 360 holes/$

10% of cost compared to

mechanical drilling

1064nm, 50W

LED Wafer Cutting

• narrow kerf

• thinner substrates

• more materials

(Sapphir, GaN, GaAs)

• 300mm/s cut speed

• more devices / wafer



Grooves and Holes in Silicon

200µm

50µm

200µm thickness

150µm diameter

5 holes/s

1500 holes/$

50 µm

150 µm round holes in Silicon


Drilling Holes in Stainless Steel

250µm

250µm

100µm

Ø=250µm

thickness: 300µm

5s / hole processing time

$0.014/hole


Slots in Metal Foils

50 µm

200 µm40 µm

20 µm

15µm slots in 20µm silver 30µm slots in 100µm tungsten

Machining Glass and Sapphire


Structuring of Sapphire

Courtesy of Ulrich Klug, LZH


Sapphire Cutting

thickness 0.5mm, 1mm/s cutting; HYPER RAPID 50, 355nm

no microcracks

1mm


Cutting Display Glass

• The reason is in your pocket

• Display glass is getting thinner for…• Leighter weight• Less material consumption• Higher flexibility – literally

• Cover glass hardened• More scratch resistant• Less likely to break

• Hardened Glass is difficult to cut


Cutting (Button) Holes into Glass


Glass wafer, 0.5mm thickness, 3mm hole diamter

50W, 1064nm

Removal rate > 1mm3/s

500µm

Cutting by Ablation: Scoring


Pros• Very high cutting speed

Cons• Two step process• Assembled stacks can‘t be cut

scoring at 2m/s through the hardened layer

hardened layer

Cutting by Ablation: Full Cut


chemically tempered region

Pros• Eliminates bending step• Allows for cutting stacks• Arbitrary cutting contour

Cons• Slow cutting process• Maximum thermal impact

200µmcutting through at 40mm/s through 200µm thick glass

Cutting by Ablation: Double Sided


chemically tempered region

Pros• Eliminates bending step• Faster cutting speed (>2x)• Arbitrary contours• Smaller kerf• Less thermal impact

Cons• Optical access from both sides

focus on surfaces focus on middleCutting through at 100mm/sthrough 200µm thick glass

PICOSECOND LASERS: A NEW LEVEL OF MICROMACHINING

Gorilla XG, 700 µm, at 500 mm/sec

Glass Scribing Using New Filazone™

bevel „perforation“

• Filaments extend through glass

• After breaking glass has laser-ground (FiLaZone™) surface

• NO MICROCRACKS

• No surface mark or debris

• Excellent bend strength

• Curved cuts possible

single pass

Courtesy of Filaser Inc.

Top

Bottom

Cutting Laminated Glass Stacks

• Multiple assembled layers can be cut • Aligned cut creates flush edge• Offset cut creates stepped layers – opening interstitial layer

Pre-cleaving


Cutting Cell Phone Glass

Outline cut within 2 secondsCurved edges possible


Drilling Glass Wafers with UV-Bursts

Entrance side: 26 µm diameter

Exit side: ~ 10 µm

6000 holes/$


Drilling Holes into Glass Wafers

500 µm thick 30–10 µm diam.

Percussion 20 holes/second

Measured diam. Variation

< 3%

Automotive and Aerospace


2.5 D – Machining of Silicon

Lens array for

IR detector in satellite


Laser Drilling of Diesel Injectors

Injector

Spray holes:

Ø ~100 µm,

P >1000 bar

1mm thick SST

60 / 120µm hole diameter

532nm, 25W

500kHz

through in 5s, ready in 15s, $0.04/hole

Courtesy of ExOnePICOSECOND LASERS: Versatile, High Quality Micromachining


Cutting Fiber Glass Composite

1mm/s with SR

1.0mm thickness

355nm

10mm/s cutting speed

3.6m/$

Thin Film Ablation



Laser Scribing for Photovoltaics

Picosecond lasers

are under evaluation

for P2 and P3

scribing.

Scribing speeds of

several m/s

Minimized damage

zone leads to higher

efficiency

Photovoltaic – Contact holes

~30ns, 355nm ~10ps, 532nm

Ablation of SiO2-or SiN-layer on Si

This application is currently under large scale

proliferation with manufacturers in Asia


Security and Fraud Protection



Marking Diamonds

355 nm

line width 5µm

dimension < 500µm

Secure Currency

16µm diameter holes

large enough to see throughtoo small to collect dust



Marking Glass Capillaries

RAPID

l=355 nm

5µm linewidth

400 characters/s

1064nm

5µm linewidth

355nm

100 characters/sec

36,000 characters/$

50µm

0 5 10 15 20 25 30 35 40 45

0

10

20

30

40

50

60

70

Stability

Roomtemperature

Te

mp

era

ture

[°

C]

Time [h]

Pow

er

[W]

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

5124 AS 2010-11-17

Picosecond Laser: 50W @ 532nm


Power fluctuation <1%

532nm Beam Performance at 50W


Mx < 1.1My < 1.1

Astigm. 1 %Asym. 0 %


Points to Take Home

• Sub-mircon resolution

• Highest level of quality

• ANY material with one laser

• Removal rate:

up to 60mm³/min with 50W

• Total Cost of Ownership in 24/7 operation:

$0.10 - 0.25/min

sapphire

The time for ultrashort pulsed lasers has begun

We have only seen the tip of the ice berg.

Thank you


picosecond lasers: versatile, high quality · pdf filelong term partnerships. the lumera laser...

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