pdr ir-e3 evolution bga rework system · is the thermoactive v4+ auto profi ling software suite. it...
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PDR IR-E3 EvolutionBGA Rework System
PDR’s Focused IR SMT/BGA Rework Systemfor Ultimate Performance in BGA Rework
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
Advanced features available
• FocusedIRcomponentheating PDR’spatentedtool-freeIRtechnology
• QuartzIRPCBpreheater Largearea(240mmx240mm)1600/2000wsystem Optional750w(120mmx120mm)
• AdvancedPrecisioncomponent pickandplacement Liftfromcomponentnestpluslowforcelanding androtation
• Componentnest/fluxapplicationfacility Usingfluxdiptrayorcomponentprintframe
• PrecisionX/Y/ThetaPCBtable Macro-Micromovementandmicrometer adjustment
• Auto-profileprocesscontrolpackage WithPDR’sThermoActiveV4+softwaresuite
• BGA/BGAalignment Highmagnification,CCTV/prismbasedsystem
• AuxiliaryProcessCamera(Optional) Highmagnification,CCTV/prismbasedsystem
• Non-contactcomponent temperaturesensing Realtimemeasurementofcomponent temperatures
• PrecisionPCBtemperaturesensing Contactornon-contacttemperaturesensors
• AutoLiftPick-Up(Optional) Automaticremovalofcomponent
• PCBCooling(Optional) ForfastcoolingofLED-Freeassemblies
BGAreworkwithoutthecomplications
ThePDRIR-E3SMT/BGAreworksystem,usingPDR’spatentedFocusedIRtechnology,hasbeenspecificallydesignedtocopewiththechallengesofrepairingtoday’sPCBassemblies.
Thesystemistoolfree,gasfree,instantly/preciselycontrollable,clean,modular,upgradeableandproduces100%yieldBGAreworkwithoutanycomplications.Itprovidestheextremelyhighlevelsofprofilingandprocesscontrolnecessaryfortheeffectivereworkofeventhemostadvancedpackages,includingSMDs,BGAs,CSPs,QFNs,Flipchipsandisreadyfor0201andlead-freeapplications.
TheIR-E3canbeeasilyconfiguredtoyourrequirements,withagoodrangeofadvancedfeaturestochoosefrom,allowingtheoperatortoquicklyandsafelyreworkalltypesofcomponentswithoutoverheatingthecomponent,adjacentsorthePCB.ItusesalltheprovenattributesofPDR’sFocusedIRtechnology,firstintroducedin1987andnowusedworldwidebyover4000customers.
SimpleBGAreworkprocedure
BGAreworkposestheproblemofaccessinghiddeninterconnectsinahighdensityenvironment.Consequently,itrequiresasystemthatisabletoaccessthehiddenjointswithoutaffectingneighbouringcomponents.Asystemthatissafe,gentle,adaptableand,aboveall,simpletooperate.TheIR-E3issuchasystem.ItissoeasytooperatethattechniciansareabletoinstantlyachieveexcellentprocesscontrolforBGA/SMTreworkwithoutthecomplexitiesandfrustrationsnormallyassociatedwith‘high-end’reworksystems.
Paste-Place-Reflow
Withtheaidofexcellentmechanics,opticsandcontrol,operatorscansimplypickupthefluxedBGAfromthenest,alignit,placeitontothePCB’spadsandthenreflowwiththesystem’saccuratePCbased,closedloopcomponentandPCBtemperaturecontrol.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
•AdvancedFocusedIRcomponentheating 150W,lensbasedFocusedIRheatingwithadjustableimagesystem PDRlensattachmentswithIRimagefrom4to70mmdiameter ReworksallSMDs/BGAsincluding0201s+leadfreeapplications
•QuartzIRPCBpreheating Highpower,mediumwavequartzIR Largearea,1600W,or2000W,twozone (2x800or1000Wswitchable) Twozones(inner-120mmx240mmarea)or (inner+outer-240mmx240mmarea) Or750W,singlezone(120mmx120mmarea)
•PDRlensattachments F150(Ø4-18mmspotsize)optional F200(Ø10-28mmspotsize)optional F400(Ø12-35mmspotsize)optional F700(Ø25-70mmspotsize)standard
•AdvancedProfessionalvacuumplacementsystem Withprecise‘pickandplace’action,Y/Zaxismovementand rotationsoftcomponentlandingandZ-axisstopforplacement inpaste Interchangeablepick-upheadsfordifferentapplications
•Componentnestforprecisioncomponentpick upandFluxapplication With‘componentprintframe’,diptray,orministencilpaste-head facilityforfluxandsolderpasteapplication
•Precisionmacro-microX/Y/ThetaPCBtable Precisionmicrometer(micro)X/Yandmicrorotationcontrol +/-10microns(.0004”)movementinX/Ydirections MacrooverridefacilityinX/Ydirections Upto12”X18”(300mmX450mm)capacitywith lockableX/Yaxis
•Componenttemperaturesensing Non-contact,IRsensor Manuallyadjustable,K-typenon-contactIRsensor Realtimemonitoringofcomponenttemperature throughoutprocess
•PCBtemperaturesensing Contactoroptionalnon-contactsensors Manuallyattached,K-typethermocouplecontactprobe,or manuallyadjustable,K-typenon-contactIRsensor RealtimemonitoringofPCBtemperaturethroughoutprocess
Detailsandspecificationsofadvancedfeaturesavailable
•Autoprofileprocesscontrolwith PDRThermoActivesoftwaresuite Type5,digitalcontrollerwithmultifunctionalfeatures Advanced,WindowsXP/Vista/NTThermoActiveV4+softwaresuite Twochannel,realtime,closedloopcomponentandPCB temperaturecontrol ‘Auto-profile’temperatureprofilinganddatalogging MultiK-typethermocouple(x4)capacityfortemp/timetesting
•CCTV/prismbasedBGA/uBGAalignmentsystem Splitbeamprismsystemforsimultaneous PCB/componentviewing BGA,CSPandleadlesscomponentalignment IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2”CCTVcameraand17”TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX50magnification PreciseX/Yaxismountingsystem
•Auxiliaryprocessobservationcamera(optional) IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2”CCTVcameraand17”TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX40magnification
BenchTopRequirementsTopheatpower 150WIR
Backheaterpower 1600W,or2000WIR
Voltage/frequency 220-240volts50/60Hz,upto2.4KW
Typicalcomponents CSPs,BGAs,uBGAs,QFNs,QFPs,PLCCs,SOICs,smallSMDs
Bencharea 1400mm(w)x600mm(d)
Weight 65Kg
Theabovefeaturesaremostlyoptionalandalso,PDRreservestherighttoimproveorchangespecificationswithoutgivingnotice.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
PDR–PioneersofFocusedIRtechnology
In1986,PDRpioneeredtheuseofFocusedInfra-
Redtechnologyforreworkapplications.Today,
over4000systemshavebeeninstalledaroundthe
worldatOEMsandEMSprovidersactiveinthe
defence,aerospace,automotive,avionics,telecoms
andcomputerindustries.Companiessuchas
NASA,Boeing,Nokia,Alcatel,Sony,Motorola,
Philips,Dell,IBMandEADS,tonamebutafew,
relyeverydayonPDR’sFocusedIRtechnology
todeliversimple,safeandrepeatablerework.
Withtheevolutionofincreasinglycomplex
boards,theongoingminiaturisationof
componentsandlead-freesolders,PDR’sFocused
IRtechnologyisrapidlysupersedinghotgas
astheplatformofchoiceforOEMsandEMS
providers.Highlevelsofprofilingandprocess
controlmakeFocusedIRtheperfectchoiceto
handlethenarrowerprocesswindowoflead-
freeanddeliverthe100%yieldmanufacturers
demand.
PDR’sFocusedIRdelivers100%yieldBGArework
PDR’sFocusedIRreworksystemsprovide
highqualityresultsonbothstandardand
fine-pitchcomponents,arraypackagesand
alllead-freedevices.FocusedIRisable
topinpointthesmallestcomponentina
high-densityenvironmentandprovidethe
operatorwithaclearviewofboththe
PCBandthecomponentthroughoutthe
process,makingthisthebestchoiceforall
reworkapplications.
PDR’sprocessinvolvespre-heatingthePCBfrombelowwithaback
heaterandthenheatingthecomponentfromabove.Thisreducesthe
timeandenergyrequiredfortopsideheating,therebyminimisingthe
potentialfordamagetothecomponent,thePCBoradjacentdevices.
PDR’sclosedlooptemperaturemonitoringsystem,withanon-contact
IRsensor,makestheprocesshighlycontrollableandrepeatable,
producinghighqualitysolderjointseverytime.
PDRsystems-flexible,modularandupgradeable
PDR’sversatilesystemsrangefromaFocused
IRhandtoolrightthroughtosemi-automated,
advancedreworkstations.Theyalsoinclude
systemsdesignedspecificallyforsmalltolarge
applications.EachFocusedIRsystemoffers
anexcellentlevelofstandardfeatures,plus
optionstosuiteverybudget.PDR’ssystems
aremodularandeasilyupgraded,allowingyou
toaddtheextrafunctionalityyouneedasyour
requirementschange.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
TheadvantagesofFocusedIR
FocusedIRcomponentheatingPrecisecomponentheatingeliminatestheriskofdamagetothePCB/adjacents
Nonozzles,focushoodsorshieldsAsimpleturnofthelensallowsforeasyreworkofanysize/shapecomponent
LowcostofownershipCompetitivesystempricingandnearlyzerofollow-oncosts
ModularandupgradeablesystemsEasilyconfiguredtomeetanyrequirementsasyourdemandsexpand
ExcellentcontrolsoftwareNon-contact,componenttemperaturesensingandautomaticthermalprofiling
Easytoset-upanduseClean,simpleandsafe.Easeofusedelivers100%yield
ThebestBGAreworksystemsintheworld
Forovertwentyyearswehavecontinuallypushedtheboundariesofrefinedreworksystems.Ourcleanandintuitiveheatingtechnologycombineswithitsunmatchedcontrolandsolderingability,tobecomeoneofthemosteffectiveinnovationsinourindustry.
AnotherdevelopmentfromPDRisourhighresolutionCCTV/splitbeamprism-basedBGAalignmentoption,whichallowstheoperatortoviewthePCBandcomponentsimultaneouslywithacolourvideomonitorandzoomlens.
AddtothisPDR’ssuperbprecisionmechanics,whichprovideoperatorswithvacuum-operatedpickup,macro-microZaxis,360°componentrotationandmicrometercontrolforsoftcomponentlanding,andyouhaveunbeatablereworksystemsthatprovide100%yieldonallSMT/BGAreworkapplications.
Leading-edgecontrolsoftware
AmajoradvantageinchoosingPDR’sFocusedIRreworksystemsistheThermoActiveV4+autoprofilingsoftwaresuite.Ithasbeendesignedtobeasuser-friendlyaspossible,withexcellentgraphicsandsimple,logicalcontrols.
TheoperatorsetsthetemperaturetargetandtheThermoActiveV4+softwaremanagestheheatingprocess,ensuringthattheheatappliedtothePCBandcomponentisprecise.Particularlybeneficialforthedemandsoflead-free,thermalprofilesfordifferentassembliescanbeautomaticallycreatedwithinminutesandstoredforfutureuse.
PDR
PDR-DesignandManufacturingUnit3StanleyCentre,KelvinWayCrawley,WestSussex,RH109SE,England
T:+44(0)1293614000F:+44(0)1293613600E:[email protected]
PDR America - Sales/Support Center
3869DividendDrive,ShingleSprings,CA95682,USAT:(530)6766262F:(530)6766265E:[email protected]
PDR’sproductsareavailableworldwideviaourinternationaldistributors,allofferingprofessionalsalesandsupport.Forcontact,productandcompanydetailspleasevisitwww.pdr-rework.com
www.pdr-rework.com