pcb manufacture photoresist method

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Operating Step: 1, removing film, photosensitive film is sandwiched between two layers of film, tear up the side of the first little difficult to tear, try a few on the line 2, then foil, copper clad laminates little cleaning can paste level, try not to bubble 3, stickers, ready, irons a little heat, not too hot, fixed effect 4 printed circuit board film, it is recommended that the film can achieve the highest degree of fine, if not accuracy requirements with sulfuric acid paper print. 5, exposure, circuit diagram printed on the photo plate (Note: The dry film is negative, so anti-white print, which is contrary to our usual plate) for about 30 minutes with ordinary energy-saving lamps, exposure machine 1 minute on the line, the sun never tried, it should be about 15 minutes, the exposure process obviously, because the photosensitive film will change color, from light-colored dark blue exposure. You will easily see the circuit diagram is shown in the board. 6, developing, torn off another layer of protective film and put it into the developer (developer 1:100 watered, 10 grams against 1 liter of water), developing with a cotton swab and a little harder to wipe the board 7, etching Needless to say 8, after etching, stripping, mold release agent watered one sixty or 70, the board bulb within minutes 7. Clamp the printed transparency film by the polymethyl methacrylate glass.

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This document describes the method of photoresist to manufacture PCBs.Photoresist can be bought easily from Aliexpress or Ebay online.

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Page 1: Pcb manufacture Photoresist method

Operating Step:1, removing film, photosensitive film is sandwiched between two layers of film, tear up the side of the first little difficult to tear, try a few on the line2, then foil, copper clad laminates little cleaning can paste level, try not to bubble3, stickers, ready, irons a little heat, not too hot, fixed effect

4 printed circuit board film, it is recommended that the film can achieve the highest degree of fine, if not accuracy requirements with sulfuric acid paper print.5, exposure, circuit diagram printed on the photo plate (Note: The dry film is negative, so anti-white print, which is contrary to our usual plate) for about 30 minutes with ordinary energy-saving lamps, exposure machine 1 minute on the line, the sun never tried, it should be about 15 minutes, the exposure process obviously, because the photosensitive film will change color, from light-colored dark blue exposure. You will easily see the circuit diagram is shown in the board.6, developing, torn off another layer of protective film and put it into the developer (developer 1:100 watered, 10 grams against 1 liter of water), developing with a cotton swab and a little harder to wipe the board7, etching Needless to say8, after etching, stripping, mold release agent watered one sixty or 70, the board bulb within minutes7. Clamp the printed transparency film by the polymethyl methacrylate glass.

 

8. Fasten the printed transparency film.

Page 2: Pcb manufacture Photoresist method

 

9. Begin to exposure about 90-150 seconds.

Page 3: Pcb manufacture Photoresist method

 

10. The distance between the lamp and the glass is about 10cm. 

Page 4: Pcb manufacture Photoresist method

 

11. Preparing to develop. (20g photoresist dry film developer mixes with 800ml 30℃ water)

Page 5: Pcb manufacture Photoresist method

 

12. Put the plate into the develop solution and brush it gently.

Page 6: Pcb manufacture Photoresist method

 

13. After 5 seconds, it looks like the below photo.

Page 7: Pcb manufacture Photoresist method

 

14. After 15 seconds, it looks like the below photo.

Page 8: Pcb manufacture Photoresist method

 

15. The photo of finished developing.

Page 9: Pcb manufacture Photoresist method

 

16. Magnify the photo.

Page 10: Pcb manufacture Photoresist method

 

17. Preparing the materials of etching. (200g etching powder mixes with 800ml 100℃ water)

Page 11: Pcb manufacture Photoresist method

 

18. Begin to etching. Put the plate into the etching solution. The temperature of the solution had better in 50℃ above.

Page 12: Pcb manufacture Photoresist method

 

19. Preparing the materials of remove. (50g photoresist resist remover powder mixes with 1000ml water)

Page 13: Pcb manufacture Photoresist method

 

20. Begin to remove.

Page 14: Pcb manufacture Photoresist method

 

21. Finished the remove.

Page 15: Pcb manufacture Photoresist method

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