overclocking unlocked intel core processors for … overclocking unlocked intel ® core processors...
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Overclocking Unlocked Intel® Core™ Processors for High Performance Gaming and Content Creation Michael Moen – Sr. System Engineer, Intel Corporation
Dan Ragland – Sr. System Engineer, Intel Corporation
JJ Guerrero – Sr. Technical Marketing Specialist, Asus
AIOS001
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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Risk Reminder
WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit: http://www.intel.com/consumer/game/gaming-power.htm
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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Defining Overclocking
• How is this done? – Obtain a motherboard optimized for Intel® unlocked
processors – Change unlocked ratios or platform clock frequency – Increase voltage on relevant interfaces – Improve cooling on overclocked/overvoltaged
components
• What is Overclocking (OC)? – The process of increasing clock rates beyond
specification
• Why Overclock? – Increase performance for compute intensive tasks,
e.g., transcode, gaming, rendering – Compete, Promote, Socialize
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The Rule: Maximize frequency, minimize voltage/current and maximize heat dissipation to meet personal stability requirements
Overclocking Theory General Principles
What Benefits How Processor Cores
Rendering, Music, Photo and Video editing, Transcode, Gaming Physics, AI, Compute Intensive
Increase Power Limits and Max Current
Raise Core voltage Increase active Core ratios
Processor Integrated Graphics (pGfx) †
Gaming frame rates, Media Transcode
Increase Power Limits and Max Current
Raise pGfx voltage Raise pGfx max ratio
Memory Processor Graphics performance, Sound engineering, Photo and Video editing
Increase memory ratio Raise memory IO voltage Change timings Increase system agent voltage
Platform Base Clock
All of the above Increase all domain voltages Reduce weakest domain
frequency via ratios
Increasin
g C
omp
lexity
† pGfx utilizes Intel® Iris™ Pro., Intel® Iris , or Intel® HD Graphics
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Observed Frequency Trends in OC Q: How much OC can I expect from my CPU? A: There are many factors
– Every CPU is designed to meet nominal requirements with intentional guardband – not specifically for OC
– Overclocking is the act of tapping into the intentional guardband + design conservatism + Si process conservatism
– This changes with each CPU process stepping, architecture change and overall design targets
HEDT = High End Desktop. Today this includes Socket LGA2011. This data was collected from overclocking forums and should be considered approximate for illustrative purposes only.
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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• Core Frequency – Unlocked Intel® Turbo Boost
Technology limits†
– Unlocked core ratios up to 63 in 100MHz increments†
– Programmable voltage offset
• Memory Ratio – Unlocked memory controller – Granularity in 266MHz steps – Ratios supported up to 2400Hz
• DMICLK (aka BCLK) – Fine Grain range ± 5-7% – BCLK ratios = 1.0, 1.25, 1.67
• PEG and DMI Ratios – PEG/DMI ratios = 80/50, 64/40,
48/30 – Ratio option must reflect selected
BCLK coarse ratio
PCIE
Memory Memory M
Processor 1 2
4 5 C
DMI
CK505 ~
DMI
PEG P
DM
ICLK
3
6
Example : Core Freq x 1.25 requires PEG/DMI ratios at 64/40 x 1.25 to keep at 8 GHz/5 GHz nominal
C
M
R
Intel® Core™ i7 Desktop Processors Based on Socket LGA2011 with Intel® X79 Express Chipset
P D
R
R
D
×1
DB1200
R
P D
† Only some processors enable part or all of these features. Consult processor documentation for details.
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SKU i7-4960X i7-4930K i7-4820K
Cores/Cache 6/15M 6/12M 4/10M
Turbo Ratio Overrides (100MHz Steps)† Up to 63 Up to 63 Up to 63
PL1, PL2, Tau, ICCMax Overrides √ √ √
Real-time Core Overclocking (in OS) Yes Yes Yes
DDR Frequency Overrides (266MHz Steps) Up to 2400 Up to 2400 Up to 2400
DDR Timing Overrides √ √ √
Coarse BCLK Ratios supported with PEG, DMI ratios
Enhanced Ratio Support (1.0, 1.25, 1.67)
Enhanced Ratio Support (1.0, 1.25, 1.67)
Enhanced Ratio Support (1.0, 1.25, 1.67)
† Memory ratio not fuse limited, but support above 2400 via ratio not guaranteed. Use BCLK for higher frequencies.
Intel® Core™ i7 Desktop Processors Based on Socket LGA2011 with Intel® X79 Express Chipset Feature Overview
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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COLLABORATION Work closely with Intel to understand the platform architecture and gauge hardware requirements. This helps to define customized overclocking options for different segments. POWER DESIGN Ensuring that onboard power delivery circuitry is capable of exceeding processor power requirements under extreme loading conditions. CIRCUITRY DESIGN Tuning of trace layouts and platform microcode to extend overclocking headroom for CPU and DRAM. CUSTOM SETUP Utilize customized hardware to mitigate platform overclocking obstacles. PRODUCT DEVELOPMENT Develop software and hardware solutions to provide automated overclocking features.
Overclocking Design Tips What board designers consider for unlocked Processors
These recommendations are the sole opinion of an expert overclocker based on experience. Intel does not endorse or support these recommendations. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications
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Overclocking Design Tips How enthusiast board/system designs influence overclockability
• Efficient Cooling Through Layout Design
• High Quality Components − Long-life solid polymer & MLCC Capacitors − High current MOSFETs − Low DCR inductors − Advanced digital buck controllers − More copper in power plane
• Careful Analysis of Signal Integrity: − Tight control of trace impedance on PCB, more
layers, shorter lengths & length matching − Tuning of MRC to improve signal margins and
memory compatibility
• Dedicated hardware and software solutions: − Hardware and software features that allow real-
time changes to overclocking parameters and improve system stability for smooth overclocking experience
• Intuitive UEFI − Intuitive layout with customizable menus,
overclocking profiles (presets and user configured) and extensive auto-rules for all parameters
− OC recovery with low-level UEFI flashing capabilities
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Live Demo: Optimization of Core, Memory and
BCLK to achieve visibly better performance experience on
content creation with a Intel® Core™ i7-4960X Extreme Edition
Processor
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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DM
ICLK
PCIe*
DMI ×D
DMI
PEG
PCIe
pGfx ×P
×G
DMICLK/BCLK
Memory Memory ×M
CPU 1 2
3 4 ×C
• Core Frequency – Unlocked Intel® Turbo Boost
Technology limits† – Unlocked core ratios up to 80 in
100MHz increments† – Programmable voltage via iVR
• Graphics Frequency (pGfx) – Unlocked Intel® HD Graphics limits† – Unlocked graphics ratios up to 60 in
50MHz increments – Programmable voltage via iVR
• Memory Ratio – Unlocked memory controller – Options for 200 and 266MHz steps † – Logical ratios up to 2933MHz†
• DMICLK (aka BCLK) – Unlocked PCH clock controller (1MHz
increments upwards of 200MHz)†
• PEG and DMI Ratios – Variable ratios (must reflect selected
BCLK frequency)†
×C
×G
×M
×P ×D
×D OC
BCLK
Non-OC 100MHz
Next Generation Intel Haswell Microarchitecture
† Only some processors enable part or all of these features. PCIe = PCI Express*
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OC VR Design on Legacy Platforms
• In current generation platforms, CPU VRs are on the motherboard
• Often, a separate VR exists for each rail to the CPU • Voltage margining is accomplished using platform VRs
VCORE
CPU VPLL
VGFX
VIO
VSA
External VRs External VRs
4th Generation Intel ® Core™ processor changes this dramatically with integrated
voltage regulation
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Next Generation Intel Haswell Microarchitecture Voltage Planes for Performance Tuning
DDR
Cores Last Level Cache System
Agent PCIe*
DMI pGfx
VCCIN VDDQ
• 1.5V Nom for DDR3
• <=1.65V for XMP
• 1.35V Nom for DDR3L
iVR
Core
pGfx
• VCCIN: SVID 1.8V Nom up to 2.3V+, static V up to 3.04V • VCORE: dynamic additional V, static V up to 2.0 V • VRING: dynamic additional V, static V up to 2.0 V • VGT: dynamic additional V, static V up to 2.0 V
• VSA, VIOA, VIOD: Up to 500mV Offset V from nominal
R
ing
SA
Ring
IOA,IOD
PCIe* = PCI Express*
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Next Generation Intel Haswell Microarchitecture Voltage Override Modes
non-
turb
o
freqvo
lts
turb
o
XE
Fused V/f
non-
turb
o
freq
volts
turb
o
XE
Interpolation V/f
non-
turb
o
freq
volts
turb
o
XE
Offset V/f
non-
turb
ofreq
volts
turb
o
XE
Override V/f
• Default V/f curve (SVID operation)
• Positive /
Negative offset applied to the entire curve. Important for mainstream overclocking.
• Interpolation (adaptive) in the overclocking region
• Override applied to the entire curve. Important for extreme OC.
iVR provides flexibility consistent with all margining modes generally supported by current generation external VR designs
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BCLK @100, 125 or 167 MHz +/1 5-7%
DDR
Cores
Last Level
Cache
System Agent PCIe*
DMI
pGfx
Next Generation Intel Haswell Microarchitecture Clock Tree
• Single BCLK input comes from PCH in <1MHz steps
• Acceptable input to CPU limited by PIC Express* (PCIe) and DMI PLL interface: 100MHz x ±5-7% PEG/DMI @ 5:5 125MHz x ±5-7% PEG/DMI @ 5:4 167MHz x ±5-7% PEG/DMI @ 5:3
• Frequency Relationships f(GT) = BCLK/2*GT Ratio f(Core) = BCLK*Core Ratio f(Ring) = BCLK*Ring Ratio f(DDR) = BCLK*1.33*DDR Ratio -Or- f(DDR) = BCLK*1.00*DDR Ratio
Rin
g
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Enhanced BCLK Capabilities Key Differences Between Generations
Intel® Core™ i7 processors on LGA2011
3rd Gen Intel Core processors on LGA1155
Next Gen Intel Haswell Microarchitecture
Coarse Adjustment
BCLK multipliers {1.0,1.25,1.67} input
to CPU CPU adjusts PEG/DMI ratios {5:5,5:4,5:3} based on BCLK multi
None Select CPU PEG/DMI ratios of {5:5,5:4,5:3}
depending on what clock frequency you request from PCH
Fine External clock device output adjustment ± 5-
7% over nominal 100MHz
PCH output adjustment ± 5-7%
over nominal 100MHz
PCH output ± 5-7% around frequency points 100MHz,
125MHz, 167MHz
Range Peak Observed †
168 MHz (non-continuous)
116.95 MHz >167 MHz (non-continuous)
4th Generation Intel Core processors deliver BCLK overclocking experience consistent with current
generation high-end platforms based on LGA2011
† This data was collected from overclocking forums and should be considered approximate for illustrative purposes only.
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DDR
Cores
Last Level Cache
System Agent PCIe*
DMI
pGfx
DDR Ratios Core Turbo Ratios†
Next Generation Intel Haswell Microarchitecture Available Performance Tuning Ratios
• 266MHz Steps up to 2933MHz
• 200MHz steps up to 2800MHz
• Timing Overrides
• Manual or can be automated through XMP 1.3
• Core ratios up to 80
• Unlocked Turbo Limits
• Current Limit Override
• Graphics ratios up to 60
pGfx Ratios†
PEG DMI
Ratios
Ring Ratios†
PEG, DMI Ratios
• BIOS sets based on requested BCLK f • 100MHz: 80/50 (PEG/DMI Ratios) • 125MHz: 64/40 • 167MHz: 48/30
• Ring Ratios up to 80
• Ring Ratio typically <= Core or GT
† = Changeable at OS Level
Rin
g
PCIe* = PCI Express*
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Desktop: 4th Generation Intel® Core™ i7/i5 Processors Based on Socket LGA 1150
Turbo Ratio Overrides √
DDR Frequency Overrides √ √
Fine BCLK Overrides √1 √1
Coarse BCLK Ratios √2
iVR Overvoltage √ √
PL1, PL2, Tau, ICCMax Overrides √ √
DDR Timing Overrides √ √
pGfx Ratio Overrides √ √
• Turbo ratios and power, pGfx Ratios, iVR voltages are updateable real-time in OS • Fine BCLK, DDR timings are changeable real-time over very small range • Larger changes can be made with reset. BCLK range highly limited. • DDR Frequency requires reset
Unlocked “K”
Intel H87 Express Chipset
Intel® Z87 Express Chipset
Unlocked Processors: Intel® Core™ i7 Processors 4770K Intel Core i5 Processors 4670K
† This includes Intel Core i3, Intel® Pentium™, and Intel® Celeron™ 1 Actual Fine BCLK frequency adjustments will be limited. ~5% 2 Coarse BCLK Ratios (1.0, 1.25, 1.67) are unlocked with K SKU processors only Note: Actual overclocking results will vary and capabilities are subject to change.
†Others
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Mobile: 4th Generation Intel® Core™ Processor Overclocking†
1 Requires Intel HM87 or QM87 chipsets and results will vary. † Actual overclocking results will vary and capabilities are subject to change.
Summary: • Core overclocking on select Intel® Core™ i7 SKUs • Graphics and memory overclocking on all Intel Core i7 and Core i5 based -H, -M, and -U series processors
Turbo Ratio
Overrides
iVR Over-voltage
BCLK Coarse(1)
BCLK Fine(1)
DDR Ratio & Timing
Overrides
Processor Gfx Ratio Overrides
-H and -M Series
i7-4930MX Unlimited Yes Yes Yes Yes Yes i7-4900MQ 6 bins Yes Yes Yes Yes Yes i7-4950HQ 6 bins Yes No Yes Yes Yes i7-4800MQ 4 bins Yes Yes Yes Yes Yes i7-4850HQ 4 bins Yes No Yes Yes Yes i7-4702MQ 2 bins Yes Yes Yes Yes Yes i7-4700MQ 2 bins Yes Yes Yes Yes Yes i7-4750HQ 2 bins Yes No Yes Yes Yes i5 None No No Yes Yes Yes i3 None No No No No No
-U Series i7-4600U 4 bins Yes No No Yes Yes i7-4650U 4 bins Yes No No Yes Yes i7-4558U 4 bins Yes No No Yes Yes i5 None No No No Yes Yes i3 None No No No No No
-Y Series All None No No No No No
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Live Demo: Mobile Overclocking using the
Intel® Core™ i7-4950HQ processor in the Clevo W740SU Notebook
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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Intel® Extreme Memory Profile (Intel® XMP) • Expansion of the standard DDR3 memory
specification. Enables speeds, latencies outside of JEDEC Specification. – Easy, robust, overclocking solution designed
to take advantage of the unlocked capability of Intel® Core™ Processors
– Predefined and tested Intel XMP profiles can be loaded via BIOS or a specific operating system-level tuning application
Intel® XMP compliant DIMMs available – Supports all Intel Core i7, i5 Processors † – Corsair*, G.Skil*, Kingston*, Patriot*, Crucial*
and others – XMP Ready: Module has been programmed
with an uncertified profile GOOD – XMP Certified: Module has passed supplier
test and submission process for specific CPU and motherboard BEST
– Certifications posted at:
http://www.intel.com/consumer/game/extreme-memory.htm
†CPU must support unlocked memory multiplier and be paired with correct chipset. Intel XMP is overclocking
System boots with highest supported JEDEC defined parameters by default
Select XMP profile via enabled BIOS or tuning app and profile and reset
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Intel® Extreme Tuning Utility (Intel® XTU)
• Simple-to-use Windows* application
• Exposes CPU and PCH knobs for performance tuning by user
• Real-time adjustment of key settings without rebooting1
• Version 4.2 now available for download from Intel or other motherboard suppliers †
http://www.intel.com/go/xtu
†Motherboard BIOS must be configured correctly to work with XTU. Contact your motherboard supplier for more information. 1 Available select 3rd and 4th Generation Intel® Core™ Processor SKUs.
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Intel® XTU and HWBot.org*
Combined Features • Upload/Download overclocking
settings reliably • Export/Import XTU overclocking
settings • Compare benchmark scores and
configurations with others • Link other benchmark scores to XTU
profiles • Compete with others for higher
scores • Integrated with existing social
networks: Facebook* and Twitter*
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Live Demo: Intel® Extreme Tuning Utility
v4.2 with AppTune Beta Feature using a Intel® Core™
i7-4770K Processor
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Live Demo: SSD Overclocking Technology
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• Overclocking Theory and Trends • High-end Desktop Overclocking Architecture • Overclocking Design Tips • Desktop and Mobile Overclocking Architecture • Harnessing Overclocking • Summary
Agenda
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Summary • Intel® Core™ i7 Processors based on Socket LGA2011 offer
Core, DDR and BCLK overclocking experience on processors with the highest core count and memory capacity
• Desktop and Mobile 4th Generation Intel Core processors offer select SKUs with unlocked core, memory and graphics ratios
• Real-time overclocking offers an improved user experience for content creation and gaming users
• The AppTune beta feature, in Intel® Extreme Tuning Utility v4.2, is an exciting new way to tune system performance dynamically and uniquely for each specific application
• Intel has not tested, and does not warranty, the operation of the processor beyond its specifications
• For designers wanting to develop overclocking platforms, documentation is available under NDA that details all tuning knobs. Contact your Intel field representative.
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Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Haswell and other code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user. Intel, Core, Look Inside and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others. Copyright ©2013 Intel Corporation.
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Legal Disclaimer
• Overclocking Disclaimer WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit Overclocking Intel Processors.
• Overclocked Memory Warning: Altering PC memory frequency and/or voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.
• Overspeed Protection Removed Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.
• Processor Numbering Notice: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers
• Intel® Turbo Boost Technology requires a system with Intel Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo.
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Risk Factors The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; customer acceptance of Intel’s and competitors’ products; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. Intel’s results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Form 10-Q, Form 10-K and earnings release.
Rev. 7/17/13