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Product Selection Guide

Optoelectronics & Photonics

OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM

MACOM Optoelectronics

Products to meet the growing demand for data capacity

MACOM supports a large portfolio of electronic components, lasers, and photodiodes for

optical communications from long haul core networks to FTTx access networks. The portfolio

addresses the high performance analog interfaces between electrical and optical domains,

and provides solutions to meet the demanding size, power and signal integrity requirements

of today’s high speed networks—which are expanding to meet the continuously growing

demand for data capacity. These products include high performance modulator drivers,

transimpedance amplifiers, clock/data recovery circuits, APD, PIN photodiodes, and FP and

DFB lasers, ROSAs and TOSAs for enterprise and telecom optical systems operating up to

100 Gbps and beyond. For FTTx, MACOM has the broadest portfolio of lasers, laser drivers,

limiting amplifiers, APD, PIN photodiodes, and TIAs covering systems from GPON,

EPON to XG-PON.

GPPO Module

Surface Mount

Die

TX

/RX

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MACOM Optoelectronics

Industry-leading optical portfolio drives the future of FTTx, 10G & 100G Networking

Markets> 100G DWDM> 100G Ethernet > 10G/40G/100G Datacom and Telecom> PON/FTTH> Wireless Backhaul> Beyond 100G: 200G and 400G

Technologies:> Gallium Arsenide (GaAs)> Silicon Germanium (SiGe) > Indium Phosphide (InP) > CMOS> Silicon Photonics (SiPh)

Product Lines:> Modulator Drivers> Laser Drivers > Transimpedance Amplifiers > CDRs> Limiting Amplifiers> Lasers > Crosspoint Switches> Silicon Photonic PIC> ROSAs and TOSAs (Optical Sub Assemblies)

LONG HAUL1000s Km

DATACENTER<100m-10 Km

METRO40-100s Km

For 100 Mbps to 12 Gbps SFP+/XFP and SFP/CSFP/QSFP+

Die

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4

Photonic Integrated Circuits (PICs) is an emerging technology that uses crystalline semiconductor wafers as the platform for the integration of active and passive photonic circuits along with electronic components on a singlemicro-chip. With the necessary expertise, the technology enables innovative solutions utilizing silicon optical circuits and micro-optics, while allowing the optimal integration of control electronics and system packaging.

MACOM is focused on integrated silicon microphotonics which uses fine line lithography to realize high densityfunctionality. These technologies combine high performance, low power optical devices with maximum functionality and high packing density. Silicon microphotonics, in particular, brings the benefits of high-density, low-cost and performance scalability, similar to silicon CMOS chip manufacturing.

Key Advantages

> High functionality covering a variety of devices, including switches, modulators, integrated photodetectors, couplers, biosensors, wavelength combiners and splitters, control and various optical couplers for I/O

> Monolithic integration using commercial semiconductor chip foundries enables repeatable, low cost productsat scalable volumes

> High index contrast for compact optical circuitry> Strong low power optical modulation due to the efficient plasma dispersion effect> High-speed (>50 Gbps) modulation due to speed of carrier transport in silicon diodes> Nanophotonic components - ring resonators, filters> Integrated photodetectors using monolithic germanium integration> Operates in important datacom and telecom wavelengths (O- and C-Bands at 1310 and 1550 nm)

Key Applications

> 100G/400G Datacom: datacenters and campus applications (to 10 km)> Telecom: metro and long-haul applications (to 100 and 400 km)> Ultra short reach optical interconnects and switches within routers, computers, HPC> Functional passive optical elements including AWGs, optical filters, couplers, and splitters> Radio over fiber transport and backhaul> Transceiver products including embedded optical modules, transmitters/receivers, and active optical cables (AOCs)> Optical signal processing with high performance active elements including VOAs and phase, amplitude

and frequency modulators for advanced modulation formats> Military/aerospace/scientific sensor, control, and interconnect application> Optical switch fabrics for communications and testing> Metrology and sensors> Medical applications like DNA, glucose, molecular and cellular analysis sensors> Optical engines combining optics and electronics> Emerging products like 3DICs/integrated optoelectronic chips> Consumer: easy-to-use compact cabling for desktop PC, peripherals, home media servers and networked HDTVs> Professional video, digital signage, digital cinemas, and video recording

MACOM Silicon Photonics Technology

Photonic chipset solutions for optimized power, size and cost


5

MACOM Evaluation Modules and Reference Design Kits

Enhance new product development, reduce costs and optimize time-to-market

In addition to the support of our world-class application team, MACOM offers a number of custom reference design kits, evaluation modules (EVM) and design guides which enhance the development of new products, reduce costs and optimize time-to-market.

MACOM evaluation modules provide customers with a vehicle to test product features, measure productperformance, and help design the product into their application. From backplanes to line cards and optical modules, MACOM reference design kits and EVMs are built to ease the evaluation of our latest solutionsinto the application environments of our customers and partners.

We package these offerings with our extensive GUI support as well. In addition to the EVM module and the required software and user guide—schematics of circuit boards and modules, and supporting documents are provided.

From low-speed solutions to those operating at 100G and above, MACOM offers hardware expertise and designsupport to enable innovative, next-generation optical products in a wide variety of markets.

Contact the MACOM Sales team to learn more.


Optoelectronics

6

Datacenter: QSFP28

Long Haul Metro

Driver

Driver

Driver

Driver

ElectricalOptical

DEMU

X

TIA

TIA

TIA

TIA

Driver

Driver

Driver

Driver

MUX ElectricalOptical

CDR

CDR

CDR

CDR

CDR

CDR

CDR

CDR

Quad Channel Drivers

DAC DAC DAC DAC ADC ADC ADC ADC

DSP Engine

Coherent ASIC

TIA

TIA

TIA

TIA

90%OpticalHybrid

PolarizationController

Coherent Receiver

Dual Polarization

Laser

X

Y

I

Q

I

Q

TOSA: FBT4821AG ROSA: FBR4102PB

MAOM-003427MAOM-003418 MAOM-003405 MAOM-003407 MAOM-003414MAOM-003107

MAOM-003415 MAOM-003417 MAOM-03417BM37040 M37046

MAOM-003108MAOM-002105MAOM-010567MAOM-03404AMAOM-03409B MAOM-03409D

MATA-003806

TOSA:

Lasers127D-25C-LCT11127D-25C-LCT11 131D-25C-LCT11-502133D-25C-LCT11

DriversMAOM-002301MAOM-002304

CDR M37049

ROSA:

Lasers127D-25C-LCT11127D-25C-LCT11 131D-25C-LCT11-502133D-25C-LCT11

TIAM03102

CDR M37049


Optoelectronics

7

Fiber Fronthaul CPRI

Fiber BackhaulSFP28 Long Reach

BOSA-on-Board for PON/FTTx

ElectricalOptical DDMI

PostAmp

LaserDriver

TIA

TIA

Driver

ElectricalOptical

Tx an

d Rx

CDR

GPON

Com

bo C

hipRO

SATO

SA

TIA

OpticalBidirectional

NPU/ASIC

NPU/ASIC

SFP

SFP+

XFP

QSFP+

SFP28

QSFP28

CFP24

CXP

Crosspoints

Switch CardLine Card

GPON Combo ChipM02098M02099M02100

TIAM02015M02016M02027M02029

Lasers 131D-02E-VT5TB-501131D-02E-VT5TB-502131D-02E-VT5MB-502131D-02E-VT5TB-503131A-021-AT4GR-501131P-021-ST4GP131F-021-LT5SB

DML Laser131D-25C-LCT11-502

DML Laser131D-25C-LCT11-502

Laser PDRequest more information

Laser PDRequest more information

Chipset (Laser Driver +Post Amplifier+ DDMI)M02193

Tx and Rx CDRMASC-37028MASC-37029

M02131

MAOM-002301

M03002

CDRs, SignalConditioners &Backplane Drivers

6.5 Gbps # ChannelsM21450 2M21030 4M21451 4M21452 8M21462 8M21453 12M21463 12

10 Gbps M21440 8M21441 12

28 GbpsMAXP-37161 16

Crosspoints

6.5 Gbps # ChannelsM23636 36M21148 48M21147 80M21167 160

12.5 Gbps M21024 24M21036 36M21048 48M21080 80M21601 120M21605 160

28 GbpsMAXP-37161 16

Backplane/Midplane


8

Optoelectronic & Photonic Applications

MAOM-003115 Linear EML Driver 28 1 2 10 Differential/ SMT 4 x 4 x 1.3

Differential

MAOM-004115 Quad Channel Linear EML Driver 28 4 2 10 Differential/ SMT 14 x 9.1 x 2.3

Differential

MAOM-003116 Linear Differential MZ Modulator Driver 32 1 4 15 Differential/ SMT 4 x 4 x 1.3

Differential

MAOM-003117 Linear Differential MZ Modulator Driver 32 1 2.5 9 Differential/ SMT 4 x 4 x 1.3

Single-ended

MAOM-003419 Quad Channel Linear EML Driver 28 4 2 12 Differential/ SMT 6 x 9.1 x 1.33

Single-ended

M37047 Four Channel 25G / 28G CDR with EML Driver 28 4 1.2 — Differential/ CSP 4 x 4.5 Single-ended

M37040 Quad 4 x 28G CDR 28 4 0.9 — Differential/ LFGA

Differential

M37046 Quad 4 x 28G CDR 28 4 0.9 — Differential/ CSP

Differential

MAOM-37051A Quad channel 25/28 Gbps CDR 28 4 2.5 0.1 Differential/ SMT 11 x 7 x 1.4

with EML Driver Single-ended

Drivers and Retimers for Long Reach DML/EML Datacenter Interconnect

Data Rate Max Output Max Input/Output Package TypePart Max Channels Voltage Small Signal Interface and SizeNumber Description (Gbps) (#) (Vpp) Gain (dB) (mm)

Part Max Data Rate Channels Optical Reach Input/Output Package TypeNumber Description (Gbps) (#) Interface Type (m) Interface and Size (mm)

Drivers, TIAs, and Retimers for Short Reach VCSEL for Datacenter Interconnect

MATA-37044 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3

Differential

MATA-37144 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3

Differential

MATA-37244 Quad 4 x 28G TIA and CDR 28 4 GSG 300 Single-ended/ Die 2 x 3

Differential

MALD-37045 Quad 4 x 28G VCSEL Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3

Single-ended

MALD-37145 Quad 4 x 28G VCSEL Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3

Single-ended

Data Rate Input/Output Package TypePart Max Channels Transimpedance Bandwidth Interface and SizeNumber Description (Gbps) (#) (kΩ) (GHx) (mm)

TIAs and Retimers for Long Haul, Metro, and Datacenter Interconnect

MATA-003806 Dual channel linear differential TIA 32 2 10 23 Differential/ Die 1.562 x 1.387 x 0.275

Differential

MATA-003817 Linear TIA 28 1 5 23 SIngle-ended/ Die 1.14 x 1.47 x 0.275

Differential

MO3100 TIA 28 4 2.9 21 SIngle-ended/ Die 1.52 x 2.22

Differential


Differential


Differential

M37041 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ LFGA Differential

MASC-37048 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP

Differential

M37049 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP

Differential


9


Part Max Data Rate Channels Reach Input/Output Number Description (Gbps) (#) Configuration (km) Interface Package Type

Client Side and Datacenter TOSAs

FBT4821AG 100G-BASE LR4 TOSA 25.78 4 DML + Driver 10 Flex/LC Hermetic

FBT4401NH 100G-BASE LR4, OTU4 28 4 EML 10 Flex/LC Hermetic

FBT4401NH 100G-BASE LR4, OTU4 ROSA 28 4 PIN + TIA 10 Flex/LC Hermetic

Client Side and Datacenter ROSAs

Data Rate Bias Input/Output Package TypePart Max Channels Transconductance Current Interface and SizeNumber Description (Gbps) (#) (mS) (mA) (mm)

Client Side and Datacenter DML Drivers and Retimers (LR4, CWDM, PSM4)

MAOM-002304 Quad channel 28 Gbps DML Driver 28 4 80 100 Differential/ Die 2.978 x 1.378 x 0.1

Single-ended

MAOM-002301 28 Gbps DML Driver 28 1 80 100 Differential/ Die 0.878 x 1.378 x 0.1

Single-ended

MAOM-002305 28 Gbps Linear DML Driver 28 1 65 100 Differential/ Die 0.878 x 1.378 x 0.1

Single-ended


Differential


Differential

Datacenter: 40G QSFP

Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type

127D-10G-LCT11-S Die, laser, 10G DFB, 1270 -3.5 nm / +2.5nm, chip on tape 10 1270 — Die

129D-10G-LCT11-S Die, laser, 10G DFB, 1290 -3.5 nm / +2.5nm, chip on tape 10 1290 -5 to 85 Die

131D-10G-LCT11-S Die, laser, 10G DFB, 1310 -3.5nm / +2.5nm, chip on tape 10 1310 — Die

133D-10G-LCT11-S Die, laser, 10G DFB, 1330 -3.5 nm / +2.5nm, chip on tape 10 1330 — Die

127D-25C-LCT11 Die, laser, 25G DFB, 1270 -3.5 nm / +2.5 nm, chip on tape 25 1270 0 to 70 Die




1295-25B-LCT11 Die, laser, 25G DFB, 1295.56±1 nm, chip on tape 25 1295.56 — Die




Datacenter: 100G QSFP

131F-10I-LCT11-S Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die

131D-10G-LCT11-503 Die, laser, 10G DFB, WL=±10nm, chip on tape 10 1310 -5 to 85 Die

131D-25C-LCT11-502 Die, laser, 25G DFB, WL=± 10 nm, chip on tape 25 1310 0 to 70 Die

Datacenter: PSM4 40G, 2 km

Datacenter: PSM4 40G, 10 km

Datacenter: PSM4 100G

127D-00G-LCT11-20 Die, laser, CW DFB, 20 mW, chip on tape — 1270 -5 to 85 Die




Datacenter: Silicon Photonics



10

MAOM-03404A Quad Channel 32 Gbps Limiting Differential 32 4 5 27 Differential/ SMT 14 x 9.1 x 2.3

MZ Modulator Driver Differential

MAOM-03409B Quad Channel 32 Gbps Linear Differential 32 4 4 28 Differential/ SMT 14 x 9.1 x 2.3


MAOM-03409D Quad Channel 32 Gbps Linear Differential 32 4 4 19 Differential/ SMT 14 x 9.1 x 2.3


MAOM-003415 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 5.5 27 Differential/ SMT 14 x 9.1 x 2.8

Single-ended

MAOM-003417 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 21 Differential/ SMT 13 x 9.1 x 2.3

Single-ended

MAOM-03417B Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 27 Differential/ SMT 13 x 9.1 x 2.8

Single-ended


Differential


Differential

Drivers for Metro (CFP, CFP2)

MAOM-003427 Quad Channel 46 Gbps Linear MZ Modulator Driver 46 4 5 23 Differential/ SMT 13 x 19 x 2.46

Single-ended

MAOM-003418 Quad Channel 46 Gbps Linear MZ Modulator Driver 46 4 5 21 Differential/ SMT/GPPO 41 x 29 x 6.4

Single-ended

MAOM-003405 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 7 27 Differential/ SMT 13 x 19 x 2.46

Single-ended

MAOM-003407 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 27 Differential/ SMT 13 x 19 x 2.46

Single-ended

MAOM-003414 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 21 Differential/ SMT/GPPO 41 x 29 x 6.4

Single-ended

MAOM-003107 Dual Channel 32 Gbps Limiting MZ Modulator Driver 32 2 8.2 30 Single-ended/ SMT 16.1 x 10.6 x 3.42

Single-ended

MAOM-003108 Dual Channel 32 Gbps Limiting MZ Modulator Driver 32 2 6 27 Differential/ SMT 10 x 10 x 2.3

Single-ended

MAOM-002105 32 Gbps Limiting MZ Modulator Driver 32 1 7.5 30 Single-ended/ SMT 14.4 x 7 x 2.3

Single-ended

MAOM-010567 10 Gbps Limiting MZ Modulator Driver 10 1 8 30 Single-ended/ SMT 11.4 x 8.9 x 1.4

Single-ended

Data Rate Max Output Max Input/Output Package TypePart Max Channels Voltage Small Signal Interface and SizeNumber Description (Gbps) (#) (Vpp) Gain (dB) (mm)

Drivers for Long Haul

Client Side EML Drivers and Retimers (LR4, ER4)

MAOM-37051A Quad channel 25/28 Gbps CDR 28 4 2.5 0.1 Differential/ SMT 11 x 7 x 1.4

with EML Driver Single-ended

M37047 Four Channel 25G / 28G CDR with EML Driver 28 4 1.2 — Differential/ CSP 4 x 4.5 Single-ended

MAOM-003401 Quad channel 28 Gbps EML Driver 28 4 1.8 0.7 Differential/ SMT 10 x 10 x 1.4

Single-ended

MAOM-002203 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x2.3

Single-ended

MAOM-002200 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x 1.45

Single-ended


Differential


Differential



11

M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN

M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L

M02090 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN


M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller

M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & EEPROM

Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package

M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM

M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —

M02015 AGC Pre-Amplifier 2.488 9 1.4 4 290 -26 —


M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33


M02025 CMOS TIA with AGC 3.2 20 1.45 4 120 -30 —

M02129 CMOS TIA with AGC 8.5 2 7.8 3 1200 -18 -25

M02036 Burst Mode GPON OLT TIA 1.25 3.8 0.8 2.5 170 — -35

Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

GPON TIAs and Drivers

131D-02E-VCT11-50x Die, laser, 2.5G DFB NFF, small size, chip on tape 2.5 1310 -20 to 85 Die

131D-02E-VT5TB-50x TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.6mm FL), pinout type B 2.5 1310 -20 to 85 TO-Can

131D-02E-VT5MB-502 TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.7mm FL), pinout type B 2.5 1310 -20 to 85 TO-Can

131D-02E-LCT11-50x Die, laser, 2.5G Std DFB, chip on tape 2.5 1310 -20 to 85 Die

131A-02I-ACT11 Die, APD, 2.5G, chip on tape — — — Die

131A-02I-AT4GR TO, 2.5G APD+TIA TO-46 2.5 1310 -40 to 85 TO-46

131P-10I-SCT11 Die, PIN for STIA, chip on tape 2.5 1310 -40 to 85 Die

131P-02I-ST4GP TO, PIN+STIA, 2.5G 2.5 — — TO-Can



GPON

EPON

131F-02I-KCT11 Die, laser, 2.5G FP NFF, chip on tape 2.5 1310 -40 to 85 Die

131F-02I-KT5SB TO, laser, 2.5G FP NFF, 1.5 mm ball lens (6.6 mm FL), pinout type B 2.5 1310 -40 to 85 TO-46



12





M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller

M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & EEPROM


M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —



M02038 Burst Mode GEPON OLT TIA 1.25 8.5 0.85 4 350 — -34


EPON TIAs and Drivers

M02180 Burst Mode Laser Driver/Limiting Amplifier 12.5 — CONTACT MACOM — — + Rx CDR + DDMI Controller + APD DC-DC Controller & EEPROM

M02172 EML Driver 11.3 3.3 1 2.5 5 mm QFN


M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27


10G-PON Laser Drivers and TIAs

M02097 LED Driver/Limiting Amplifier 0.5 3.3, 5 1 120 5 mm QFN

M02068 622 Mbps, Laser Driver 1 3.3 1 85 4 mm BCC+24L

M02094 VCSEL/FP Laser Driver 2 3.3, 5 1 45 4 mm QFN



M02077 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN

M02076 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller


M02171 Dual Loop VCSEL Driver 11.3 3.3 1 25 5 mm QFN

M02172 EML Driver 11.3 3.3 1 2.5 5 mm QFN

M02190 DML Laser Driver/Limiting Amplifier 12.5 3.3, 2.5 1 80 4.5 mm QFN with Integrated Tx/Rx CDR

M02193 DDMI Controller + EEPROM 13.5 3.3, 2.5 1 80 4.5 mm QFN & APD DC-DC Controller

M02095 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 1.25 3.3, 5 1 85 5 mm QFN

M02096 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 4.3 3.3, 5 1 85 5 mm QFN


Laser Drivers, Post Amplifiers, and TIAs for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET)


13


MASC-37028 Dual 28G CDR with integrated laser driver (24G to 26.5G) 28 3.3 / 1.8 2 11 5m LGA

MASC-37029 Dual 28G CDR with integrated laser driver (25.5G to 28.1G) 28 3.3 / 1.8 2 11 5m LGA


M03002 28 Gbps TIA 28 CONTACT MACOM 21 CONTACT MACOM 1.4 CONTACT MACOM


Laser Drivers and TIAs for SFP28 (Wireless Mobile, Ethernet, and FibreChannel)

M02006 AGC Pre-Amplifier 0.155 260 0.1 2.2 8 -39 —




M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —



M02036 Burst Mode GPON OLT TIA 1.25 3.8 0.8 2.5 170 — -35

M02038 Burst Mode GEPON OLT TIA 1.25 8.5 0.85 4 350 — -34

M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —



M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33



M02020 CMOS TIA with AGC 4.25 3.6 3.4 4 550 -23 -29

M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27

M02129 TIA with AGC 8.5 2 7.8 3 1200 -18 -25

M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM


Laser Drivers, Post Amplifiers, and TIAs for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET) cont’d

131F-10I-LCT11-S Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die

131F-10I-LCT11-506 Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die

131F-10I-LT5HC-50x(1) TO, laser, 10G FP, 1.5 mm ball lens with offset, pinout type C 10 1310 -40 to 85 TO-56

127D-10I-LT5AC-501 TO, laser, 10G DFB, 1270±10 nm, Asph lens, pinout type C 10 1270 -40 to 85 TO-56

133D-10I-LT5AC-501 TO, laser, 10G DFB, 1330±10 nm, Asph, lens, pinout type C 10 1330 -40 to 85 TO-56

Mobile (4G-LTE)



131F-02I-LCT11 Die, laser, 2.5G FP, chip on tape 2.5 1310 -40 to 85 Die

131F-02I-LT5LB TO, laser, 2.5G FP, 1.5 mm ball lens (6.35 mm FL), pinout type B 2.5 1310 -40 to 85 TO-56

131F-02I-LT5KB TO, laser, 2.5G FP, 1.5 mm ball lens (5.8 mm FL), pinout type B 2.5 1310 -40 to 85 TO-56

131D-10G-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C 10 1310 -5 to 85 TO-56

131D-10I-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C 10 1310 -40 to 85 TO-56

131D-25C-LCT11-502 Die, laser, 25G DFB, WL=±10 nm, chip on tape 25 1310 0 to 70 Die


M21450 2 x 2 6.5 1.2 2 No No 6 mm 40-pin QFN

M21030 4 x 4 6.5 1.2 4 No No 6 mm 40-pin QFN

M21451 4 x 4 6.5 1.2 4 No No 6 mm 40-pin QFN

M21452 8 x 8 6.5 1.2 8 No No 10 mm 72-pin QFN

M21453 12 x 12 6.5 1.2 12 No No 12 mm 88-pin QFN

M23636 36 x 36 6.5 1.2 36 No — 23 mm 484-pin BGA

M21148 48 x 48 6.5 1.2 48 No No 27 mm 676 pin BGA

M21147 80 x 80 6.5 1.2 80 No No 35 mm 1156-pin FCBGA


M21440 8 x 8 10.312 1.2 8 Yes Yes 12 mm 88-pin QFN

M21441 12 x 12 10.312 1.2 12 Yes Yes 19 mm 324-pin BGA

M20001 2 x 2 12.5 3.3 2 No No 3 mm 16-pin QFN

M21024 24 x 24 12.5 1.2 24 No No 21 mm 396-pin BGA

M21036 36 x 36 12.5 1.2 36 No No 23 mm 480-pin BGA

M21048 48 x 48 12.5 1.2 48 No No 27 mm672-pin BGA




MAXP-37161 16 x 16 28.05 1.8 16 Yes No 15 mm 196-pin BGA

Switch Max Data Rate Supply Channels Embedded EmbeddedPart Number Matrix Size (Gbps) Voltage (#) CDR SerDes Package

Line Cards

14


Single Channel 2.5G SFP

Single Channel 10G 10 km SFP

Single Channel SFP28


3 mm QFN

4 mm QFN

5 mm QFN

10 mm 72-pin QFN

Surface Mount Devices (SMD)

Modules

Optoelectronics

Photonics

ROSA & TOSA (Optical Sub Assemblies)

3 mm QFN

4 mm 24-pin QFN

6 mm 10-pin QFN

10 mm 72-pin QFN

12 mm 88-pin QFN

17 mm 252-pin BGA

19 mm 324-pin BGA

21 mm 484-pin/ 1924-pin BGA

23 mm 484-pin /1924-pin BGA

23 mm 404-pin PBGA

27 mm 676-pin BGA

34 mm PBGA

35 mm 1156-pin BGA

35 mm 676-pin TEPBGA

35 mm 1936-pin FCBGA

50 mm 2389-pin BGA

Crosspoint Switches

Die

TO-Can TO56, TO46

L PIC , PIC

Package Guide

15


Additional product information can be found on our website at www.macom.com

Contact our worldwide sales offices, authorized representatives,and industry-leading distributors to request samples, test boards,and application support.

All contacts are listed on our website at:

www.macom.com/purchases

M/A-COM Technology Solutions Inc.

Lowell, Massachusetts 01851North America 800.366.2266 • Europe +353.21.244.6400India +91.80.43537383 • China (Shanghai) +86.21.5108.6464

www.macom.com

MTS-L-032016


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