ohm cad system capabilities
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OHM CAD SYSTEMOHM CAD SYSTEM PCB DESIGN CAPABILITIESPCB DESIGN CAPABILITIES
PCB DesignPCB Design Schematic DevelopmentSchematic Development Library Development & maintenanceLibrary Development & maintenance SI AnalysisSI Analysis Board FabricationBoard Fabrication Board AssemblyBoard Assembly DFx AnalysisDFx Analysis
Our core ServicesOur core Services
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PCB DesignPCB Design• • Scratch to Gerber and support for manufacturingScratch to Gerber and support for manufacturing• • Constraint driven Auto-routingConstraint driven Auto-routing• • Creation of topology templates and routing rulesCreation of topology templates and routing rules
Library creationLibrary creation• • Footprint CreationFootprint Creation
Schematic entrySchematic entry• • Design and Schematics EntryDesign and Schematics Entry• • Symbol creationSymbol creation• • Conversion of Paper based into CAD basedConversion of Paper based into CAD based
CAD TranslationCAD Translation• • Conversion of PCB from one Layout tool to another tool.Conversion of PCB from one Layout tool to another tool.• • Conversion of Schematic from one tool to another tool.Conversion of Schematic from one tool to another tool.
SI / EMI AnalysisSI / EMI Analysis• • Pre-route and Post-route AnalysisPre-route and Post-route Analysis• • Timing ,reflection and crosstalk AnalysisTiming ,reflection and crosstalk Analysis• • EMI AnalysisEMI Analysis
Fabrication & AssemblyFabrication & Assembly
Our CapabilitiesOur Capabilities
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Specialized in Analog,digital,mixed & RF designs.Specialized in Analog,digital,mixed & RF designs. High density PCB : 540 pin/Sq. inchHigh density PCB : 540 pin/Sq. inch High layer count boards : 24 layersHigh layer count boards : 24 layers High speed interconnects : 10GbpsHigh speed interconnects : 10Gbps Max. Component count: >4000Max. Component count: >4000 Min BGA pitch: 0.4mmMin BGA pitch: 0.4mm Max. BGA pin count: 1156 pinsMax. BGA pin count: 1156 pins Via used: Blind, buried and microVia used: Blind, buried and micro Rule setup: Constraint managerRule setup: Constraint manager Topology definition: SigXplorerTopology definition: SigXplorer DFM,DFA & DFT Analysis for high-yield &low-cost productionDFM,DFA & DFT Analysis for high-yield &low-cost production
Extreme DesignsExtreme Designs
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PCB LayoutPCB Layout Cadence Allegro 16.6Cadence Allegro 16.6 Mentor PADS-9.5Mentor PADS-9.5
Schematic EntrySchematic Entry Concept HDLConcept HDL Orcad Capture CISOrcad Capture CIS Power logicPower logic
Signal Integrity & EMI ToolsSignal Integrity & EMI Tools Allegro SI ExpertAllegro SI Expert Mentor HyperlynxMentor Hyperlynx
CAM toolsCAM tools CAM 350CAM 350 VALOR NPIVALOR NPI
Tool ExpertiseTool Expertise
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Networking & TelecomNetworking & Telecom Consumer electronicsConsumer electronics AutomotiveAutomotive Wireless ApplicationsWireless Applications Military ApplicationsMilitary Applications Power Supply DesignsPower Supply Designs RF DesignsRF Designs Computers & PeripheralsComputers & Peripherals
Markets Markets
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Case study-1Case study-1 Ultra high density Mobile phoneUltra high density Mobile phone Consumer electronicsConsumer electronics 8 layer board8 layer board High Speed Digital & critical power High Speed Digital & critical power
requirementsrequirements
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Case study-2Case study-2 Ultra high density SBC Module – 540 Pins per sq inchUltra high density SBC Module – 540 Pins per sq inch Military ApplicationMilitary Application 20 layer20 layer High Speed DigitalHigh Speed Digital
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Case study-3Case study-3 Low layer & High Routing density Low layer & High Routing density Networking & SAN application using Networking & SAN application using Intel chipsetsIntel chipsets 8 layer8 layer High Speed Digital with DDR-II & PCIe InterfacesHigh Speed Digital with DDR-II & PCIe Interfaces
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Case study-4Case study-4 Low density Low density Wireless LAN ApplicationWireless LAN Application 4 layer – PCB Printed Antenna4 layer – PCB Printed Antenna High Speed Digital, RF DesignHigh Speed Digital, RF Design Cost effective & High volume productCost effective & High volume product
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Case study-5Case study-5 High Routing density High Routing density Networking applicationNetworking application 16 layer16 layer Used Blind, buried & through holes viaUsed Blind, buried & through holes via
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Case study-6Case study-6 Large Form factor - ATCA cardLarge Form factor - ATCA card Telecom Application – 24 layersTelecom Application – 24 layers High pin count BGA – 1156 pinsHigh pin count BGA – 1156 pins High Speed DigitalHigh Speed Digital
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Case study-7Case study-7 High density RoutingHigh density Routing Semicondutor ATE applicationSemicondutor ATE application 24 layer24 layer High Speed Digital & controlled impedanceHigh Speed Digital & controlled impedance
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Case study-8Case study-8 Networking applicationNetworking application 14 layer14 layer High Speed Digital with DDR-III,10G Ethernet,DIMM & PCIe High Speed Digital with DDR-III,10G Ethernet,DIMM & PCIe InterfacesInterfaces PCIe form factorPCIe form factor
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Business Model Business Model We work on two different model as per the requirement and convenience of We work on two different model as per the requirement and convenience of the customer.the customer.
Fixed development modelFixed development modelBased on the design input received from the customer will provide the Based on the design input received from the customer will provide the quote.quote.Assuming there will not be major ECO after the evaluation.Assuming there will not be major ECO after the evaluation.Invoice will be raised after the completion of the project for the number of Invoice will be raised after the completion of the project for the number of hours agreed. hours agreed.
Time & Material modelTime & Material modelBased on the input received we will provide the rough estimationBased on the input received we will provide the rough estimationAfter the completion of the project we will be raising the invoice for the After the completion of the project we will be raising the invoice for the actual number of hours spend.actual number of hours spend.
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