new product commercialization
DESCRIPTION
New Product Commercialization StrategyTRANSCRIPT
New Product New Product Commercialization Commercialization
John GlenningJohn Glenning
July 23, 2009July 23, 2009
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
• Cp & Cpk will identify the accuracy & precision problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
• Cp & Cpk will identify the accuracy & precision problems
• Precision problems must be solved before accuracy problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions
• Incoming material specifications
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made
• IBM: “It cost 10 times more to solve problems in manufacturing than in development and it cost 10 times more to solve problems in development than in R & D”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early
• Maintain high quality and low costs
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream
• Continuously track key product parameters to reduce variability, identify
problems and trends early
• Capability
• Cost
• Cycle Time
• Equipment Up-time
• WIP
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTech
End of Presentation