1. An Easy to Use Approach to Thin Film Patterning:The isishape Process TechnologyIngo Koehler, Senior Manager R&D, Structuring Solutions LC Division, Merck KGaA, Darmstadt / Germany

2. Structuring Solutions Strategic Intent:As an innovative andreliable partner of thephotovoltaicand display industrieswe provideenvironmentally friendlystructuring solutionsfor improved productperformance andproduction speed. xx/xx/xxxx Editor: Presentation name here Page 2 3. Table of Contents1 MOTIVATION 2 TECHNOLOGY & PROCESSES 3 CONCEPT & PERFORMANCE 4 ENVIRONMENTAL IMPACT 5 SUMMARY & CLOSING REMARKSxx/xx/xxxx Editor: Presentation name here Page 3 4. One Thing In Common Monitors OLEDs Layer structuring ofTVssemiconductors, passivation-, AR- coatings, TCOs LCD TVs SometimesSolar cellsselectively! (no impact to the Touch layer underneath) PanelsFlexible Displaysxx/xx/xxxx Editor: Presentation name herePage 4 5. Possibilities of StructuringPhoto Lithography Apply of Photoresistisishape Exposure (special Layout)Hiper Etch & SolarEtch DevelopingEASY & FAST ENVIRONMENTALLY FRIENDLY Rinsing Etching Screen printing / Dispensing Rinsing Heating minus 50% Stripping Cleaning Screen printing / Dispensing Drying Drying Cleaning minus 63%Dryingisishape PROCESSES xx/xx/xxxx Editor: Presentation name herePage 5 6. Table of Contents1 MOTIVATION 2 TECHNOLOGY & PROCESSES 3 CONCEPT & PERFORMANCE 4 ENVIRONMENTAL IMPACT 5 SUMMARY & CLOSING REMARKSxx/xx/xxxx Editor: Presentation name here Page 6 7. The isishape structuring process Screen Cleaning Structured SubstrateHeatingPrint & Drying Substrate EASY, FAST & ENVIRONMENTALLY FRIENDLY xx/xx/xxxxEditor: Presentation name here Page 7 8. Printing Step: Screen PrintingScreen Printer Application Laboratory Darmstadt Key Features Using regular screen printer (low investment) Wet film height: 5-40m Non-aggressive formulation (no Cl2, no HF) Common acid resistance screens (stainless steel or polymer) Safe working environment Excellent cleaning of equipmentJust print your etch structure on and screens with waterFormulation for other printing techniques available xx/xx/xxxx Editor: Presentation name here Page 8 9. Etching Step: HeatingLaboratory: Hot Plate Production: Belt Furnace xx/xx/xxxx Editor: Presentation name here Page 9 10. Cleaning Step: Rinsing CLEANING WITHOUT ORGANIC DETERGENT DI water only According to requirements:a) Spray nozzleb) Ultra Sonic bathc) Rinse water neutralisation by 1N KOH (17ml per 1litre DI water)Carbon filter or combinations Rotary pumpxx/xx/xxxx Editor: Presentation name herePage 10 11. Table of Contents1 MOTIVATION 2 TECHNOLOGY & PROCESSES 3 CONCEPT & PERFORMANCE 4 ENVIRONMENTAL IMPACT 5 SUMMARY & CLOSING REMARKSxx/xx/xxxx Editor: Presentation name here Page 11 12. isishape ConceptPRINTABLE STRUCTURING SOLUTIONSFunctional and SemiconductorsTCO Layers(wafers and layers) Metal LayersAntireflective LayersITO SiO2c-Si AlIZO SiNxa-Si Ag AZOThe chemical concept enables selective etching of layer systems.Other structuring solutions upon request.ZnOxx/xx/xxxx Editor: Presentation name here Page 12 13. Selectivity is Possible Different pastes usedSiO2 MetalPrintingITOSubstrate SiO2 MetalHeating ITOSubstrate SiO2 MetalITOCleaningSubstrate xx/xx/xxxx Editor: Presentation name here Page 13 14. isishape HiperEtch 04S 130 nm ITO / GLASS Key Features Screen-printable Paste ITO etching at 100-180C (oven) smallest line width