intel confidential intel technology update(server)

Intel Confidential

Intel Technology Update(Server)

Intel Confidential—NDA Platform Roadmap, All Dates and Plans are Subject to Change Without Notice2

Data Center Product Lines

New

Intel® Itanium® processor9500 product family

Intel® Xeon® processorE7 family



Intel® Xeon PhiTM Coprocessors work synergistically with Intel® Xeon® Processors

Intel® AtomTM processor S-Series

Intel® Xeon PhiTM product family+

* Other names and brands may be claimed as the property of others.


Q4’13Q1’13 Q2’13 Q3’13 Q1’14

Bas

icS

tand

ard

Adv

ance

dE5-4650

E5-4640

E5-4607

E5-4603

E5-4620

E5-4617

E5-4610

E5-4650

E5-4640

E5-4607

E5-4603

E5-4620

E5-4617

E5-4610

Intel® Xeon® processor E5-4600 product family(Sandy Bridge-EP 4S)

E5-4650

E5-4640

E5-4607

E5-4603

E5-4620

E5-4617

E5-4610

WW05 Intel® Xeon® Processor E5-4600 Product Family

E5-4650

E5-4640

E5-4607

E5-4603

E5-4620

E5-4617

E5-4610Efficient Performance Four Socket

Intel® Xeon® processor

E5-4600 v2

product family

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Click http://www.intel.com/products/processor_number for details

Intel® Xeon® processor E5-4600 v2 product family(Ivy Bridge-EP 4S)


Bas

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ard

Adv

ance

d

Q4’13Q1’13 Q2’13 Q3’13 Q1’14


Intel® Xeon® processor E5-2600 product family (Sandy Bridge-EP)

* “Workstation–ONLY SKU”

E5-2690

E5-2680

E5-2670

E5-2660

E5-2650

E5-2640

E5-2630

E5-2620

E5-2609

E5-2603

E5-2665

E5-2667

E5-2643

E5-2637

E5-2687W*

E5-2690

E5-2680

E5-2670

E5-2660

E5-2650

E5-2640

E5-2630

E5-2620

E5-2609

E5-2603

E5-2665

E5-2667

E5-2643

E5-2637

E5-2687W*

Efficient Performance Two Socket

Intel® Xeon® processor E5-2600 v2 product family (Ivy Bridge-EP)


E5-2600 v2

product family


E5-2600 v2

product family


E5-2600 v2

product family



Bas

icS

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ard

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Q4’13Q1’13 Q2’13 Q3’13 Q1’14


Intel® Xeon® processor E5-2400 product family (Sandy Bridge-EN)

E5-2470

E5-2450

E5-2440

E5-2430

E5-2420

E5-2407

E5-2403

E5-2470

E5-2450

E5-2440

E5-2430

E5-2420

E5-2407

E5-2403

E5-2470

E5-2450

E5-2440

E5-2430

E5-2420

E5-2407

E5-2403

EntryTwo Socket


E5-2400 v2

product family


E5-2470

E5-2450

E5-2440

E5-2430

E5-2420

E5-2407

E5-2403


Denlow PlatformIntel® Xeon® processor E3-1200 v3 product family

• Intel® AVX enhancements

• Processor Graphics with DX11.1 & OCL1.2

• Quad Core & Dual Core SKUs

• Memory speed – 1600MHz @ 2DPC

Intel® C220 series chipset delivers faster I/O connectivity

• Up to 6 ports of SuperSpeed™ USB @ 5.0 Gb/s

• Up to 6 ports of SATA 3 @ 6Gb/s

CPU Efficiency and Power Management

• Improved idle power for CPU and PCH

• DDR3 and DDR3L* support

• Low power CPU SKUs at higher frequencies

• IVR technology simplifies platform power delivery

AMT 9 or SPS FW

Intel RSTe

Node Manager

Leadership IO

Continued focus on Energy Efficiency

Performance & Graphics

Improvements

VGA

NVRAM OFI 3

‘Clarkville’ 10/100/1000

PHY

6x SATA @ 6Gb/s

DMI 2.0

SM B

us

LPC

SPI

Intel® C220 series

chipset

FDI

HD

Aud

io

3.0

x16/2x8

pGfx

2.0 8 Ports

Continued Advancements in

Server Technologies

*DDR3L support at 1.35V for servers; 1.5V only for Workstations All timeframes, products and dates are subject to change without notification

4 DDR3 ECC UDIMM

Intel® Xeon® processor E3-1200 v3 product family

NOTE: For all 6 SATA ports at 6Gb/s, Intel® C226 chipset is required.

Gen3

Gen2

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.


Q2’13 Q3’13Q4’13Q1’13 Q2’13 Q3’13 Q1’14

WW05 Intel® Xeon® Processor E3-1200 product family

Intel® Xeon® processor E3-1200 v3 product family (Haswell LGA1150)

Intel® Xeon® processor E3-1200 v2 product family (Ivy Bridge-H2)

E3-1280 v2

E3-1270 v2

E3-1240 v2

E3-1230 v2

E3-1220 v2

EntryOne Socket

E3-1220 v3

E3-1285L v3

E3-1285 v3

E3-1280 v3

E3-1270 v3

E3-1240 v3

E3-1230 v3

SKU has Intel® HD Graphics P4700 for server graphics usages

E3-1220 v3

E3-1285L v3

E3-1285 v3

E3-1280 v3

E3-1270 v3

E3-1240 v3

E3-1230 v3

E3-1220 v3

E3-1285L v3

E3-1285 v3

E3-1280 v3

E3-1270 v3

E3-1240 v3

E3-1230 v3

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.Optimized Intel® HD Graphics P3000 only available on select models of the Intel® Xeon® processor E3 family. To learn more about Intel Xeon processors for workstation visit www.intel.com/go/workstation.

E3-1220 v3

E3-1285L v3

E3-1285 v3

E3-1280 v3

E3-1270 v3

E3-1240 v3

E3-1230 v3


Q4’13Q1’13 Q2’13 Q3’13 Q1’14

WW05 Low Power & Ultra Dense Server Processor Roadmap

Intel® Xeon® processor E5 family


Intel® Itanium® processor 9500 product family


Intel® Xeon® processor E7-8800 product family (WSM-EX)

Intel® Xeon® processor E3-1200 v3 product family (HSW-H2)

Intel® Xeon® processor E5-2600 product family (SNB-EP)

Intel® Xeon® processor E3-1200 v2 product family (Ivy Bridge-H2);

E5-26XXL v2

E5-26XXL v2

Intel® Xeon® processor E5-2400 product family (SNB-EN)

E7-8867L

E5-2650L

E5-2630L

E5-2450L

E5-2430L

E7-8867L

E5-2650L

E5-2630L

E5-2450L

E5-2430L

Intel® Itanium® processor (Poulson)

E3-1265L v2

E3-1220L v2

E3-1265L v3

E3-1220L v3

E5-4650L E5-4650L E5-4650L

Intel® Xeon® processor E5-4600 product family (SNB-EP 4S)

E7-8867L

E5-2650L

E5-2630L

9520

E3-1265L v2

E3-1220L v2

E5-4650L

SKU has Intel® HD Graphics 2500 (IVB)

E5-2450L

E5-2430L

Intel® AtomTM

processor S-series

S1260

Intel® AtomTM processor S1200 series (CTN)

9520 9520 9520

Intel® Xeon® processor E5-2600 v2 product family (IVB-EP)

S1240

S1220

E7-88XXL v2

E5-26XXL v2

E5-26XXL v2

E5-24xxL v2

E5-24xxL v2

E5-46XXL v2

9520

E3-1230L v3

E3-1265L v3

E3-1220L v3

E3-1230L v3

E3-1265L v3

E3-1220L v3

E3-1230L v3

S1260

S1240

S1220

S1260

S1240

S1220

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Optimized Intel® HD Graphics P3000 only available on select models of the Intel® Xeon® processor E3 family. To learn more about Intel Xeon processors for workstation visit www.intel.com/go/workstation.

E7-88XXL v2

S1260

S1240

S1220

S1260

S1240

S1220

E5-2450L

E5-2430L

INTEL CONFIDENTIALIntel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other names and brandsmay be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2012, Intel Corporation.9

Xeon PHI POR

FPO

INTEL CONFIDENTIAL

Intel® Xeon Phi™ Coprocessor (Knights Corner)PCIe 2.0 Adapter Card• Up to 61 cores, 244 threads

• Up to 8GB Gigabytes of GDDR5 memory

• Up to 352GB/s Memory Bandwidth

• 32KB L1 I/D cache, 512KB L2 cache (per core)

• Active and Passive SKU’s (225 to 300W)

Uses Standard Software Development tools (from Intel and others)

Target Production: Q4 ‘2012

Intel® MIC ArchitectureFor Highly Parallel Workloads

10

Shipping Now Intel® Xeon Phi™ Coprocessor 5110P

11

Ideal for memory bandwidth and memory capacity bound workloads

Performance Programmability Applications

C, C++, FortranIntel and 3rd party tools

Up to 1 TFLOP ofdouble-precision (peak)1

Memory Bandwidth / Capacity Bound workloads

Intel and 3rd party tools

More MemoryMore Bandwidth

Ideal for Molecular Modeling,

Digital Content Creation, and Energy

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 1. Claim based on calculated theoretical peak double precision performance capability for a single coprocessor. 16 DP FLOPS/clock/core * 60 cores * 1.053GHz = 1.0108 TeraFlop/s.

http://www.intel.com/performance


Stay Tuned in 2013 Intel® Xeon Phi™ Coprocessor 3100 Product Family under $2000 RCP

12

Performance Programmability Applications

Ideal for compute bound workloads

Intel and 3rd party tools

6GB GDDR5 240 GB/s Bandwidth

Active and passive form factors at 300W TDP

DNA Sequencing

Ideal for MonteCarlo, Black-Scholes,

Life Sciences

C, C++, FortranIntel and 3rd party tools

Compute Bound workloads

Up to 1 TFLOP ofdouble-precision (peak)1

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 1. Claim based on calculated theoretical peak double precision performance capability for a single 3100 family coprocessor = 1.0032 TeraFlop/s.



Intel Confidential

Intel Technology Update(Desktop)

Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice.14

Sugar Bay

Platform

Sandy BridgeProcess

or


1 Not all features are available on every processor SKU.

2nd Generation Intel® Core™ Processor (“Sandy Bridge”)

Sandy Bridge Processor• 2nd Generation Hi-K+metal gate process processor core

Key Features1:• 32nm Sandy Bridge Microarchitecture

• Intel® Turbo Boost Technology 2.0

• Integrated Memory Controller (IMC) – 2ch DDR3, 2 DIMMs/ch, up to 1333. Support for SO-DIMM

• Intel® HD Graphics 2000/3000 or discrete graphics support (1x16, 2x8)

• Advanced Encryption Standard (AES) acceleration

• Intel® Quick Sync Video Technology

Power:• 95W/65W/45W/35W TDP Options

Socket:• LGA 1155

Platform Compatibility: • Intel® 6 Series and 7 Series Chipset Family

Discrete Graphics

or Intel® HD Graphics 2000/3000

DMIIntel®

FDI

Intel® FDI: Intel Flexible Display Interface

Intel® 6 Series Express Chipset(Cougar Point)

DDR3

Sandy BridgeProcessor

Platform compatibility details. Click here


Maho Bay

Platform

Ivy Bridge

Processor


1. Not all features are available on every processor SKU.2. Ivy Bridge on Sugar Bay (6-series) based platforms will require firmware (ME8), BIOS and graphics driver updates. Ivy Bridge not

compatible with Q65, Q67 and B65 based platforms.3: SO-DIMM supports DDR3-1333 2 DIMMS per channel

3rd Generation Intel® Core™ Processor (“Ivy Bridge”)

Ivy Bridge Processor• 3rd Generation Hi-K+metal gate process processor core

Key Features1:• 22nm Sandy Bridge Microarchitecture

• Socket LGA 1155

• 16 lanes PCI-Express* Gen 3.0

• Intel® Turbo Boost Technology 2.0

• Integrated Memory Controller (IMC) – 2ch DDR3, 2 DIMMs/ch, up to 16003. Support for SO-DIMM

• Next gen Intel® HD Graphics with DX11 or discrete graphics support (1x16, 2x8)

• Next gen Intel® Quick Sync Video Technology

• Enhanced AVX acceleration

Power:quad-core: 77W/65W/45W (1); dual-core: 55W/35W (1)

Note: to maintain compatibility with Sandy Bridge processors the FMB specifications will not change for Ivy Bridge. Intel thermal specifications require the use of same thermal solution meeting the TTV Thermal Profiles for these Ivy Bridge Processors.

(1) Tested TDP

Platform Compatibility: • Intel® 7 Series Family and select 6 Series Chipsets2

• Sugar Bay & Maho Bay platform compatibility details. Click here

or discrete graphics

DMIIntel® FDI

Intel® FDI: Intel Flexible Display Interface

Intel® 7 Series Chipset

(“Panther Point”)

DDR3

Ivy BridgeProcessor

*Other names and brands may be claimed as the property of others

next gen Intel® HD Graphics

Intel Confidential -- NDA Platform Roadmap, All dates and plans are subject to change without notice

Shark Bay

Q2 2013

4th Generation

Intel® Core™ Processor

Family(Haswell)

Intel® 8 Series

Chipset


4th Generation Intel® Core™ ProcessorNew Features and Benefits

New architecture on 22nm process• Improved CPU performance• Enhanced overclocking• Fully Integrated voltage regulator (FIVR)

New 4th Generation Intel® Core™ Processor Family instructions

• New advanced vector extension (AVX) instructions• Improved AES-NI performance

Intel processor graphics with DX11.1 & OCL1.2

• Digital display repartition• VGA support (via Lynx Point)• Up to 3 independent displays: HDMI 1.4, DVI, DP, VGA

2013/2014 platform compatibility• LGA 1150 socket (2013 / 2014 desktop processors)• 2 Channel DDR3/DDR3L @ 1.5V (up to 4 DIMMs at

1600MHz)

• Quad Core:84W/65W/45W/35W (1); Dual Core: 54W, 35W(1)

*Other names and brands may be claimed as the property of others(1) Tested TDP

DMI Intel® FDI

Intel® 8 Series Chipset Family(Lynx Point)

DDR3DDR3L(1.5V)

4th Gen Intel® Core™ Processor (“Haswell”)

PCI Express(Gen 3)

Digital Display

VGA

PCI Express(Gen 2)

USB3/2

SATA(Gen3)

ClarkvilleLAN

Not all features are available on every processor SKU

http://www.usb.org/developers/ssusb


Desktop Shark Bay Platform Value Proposition

Performance

Responsiveness Visuals Security

CPU up 10% for Increased Productivity

More Overclocking Flexibility for

Enthusiasts

Low Power CPUs

Enable Slimmer Sleeker Form

Factors

Up and Ready in <3 Seconds

Applications Load up to 2x

Faster

Email and Apps Always

Updated

6 Minute HD Video

Ready to Share

In 12 Seconds

3D Graphics 2.6X Better1

means more top games are playable

Made for 4k and Collage

Display

*

Intel® Password Guard

for SBAProtects End-User Passwords when

logging in remotely

Protect Against Data Theft

with Haswell New Instructions: faster

& better encryption

* Names and brands maybe be claimed as the property of others1Comparing 3D and video conversion of 3rd Gen Core i5 vs 4th Gen Core i5

Intel ConfidentialNDA only

21All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.Not all features available on all SKUs *Other names and brands may be claimed as the property of others.

Product Positioning only, Not End User Messaging

Display 3 Independent Symmetrical Display Pipes DP1.2 Support with MST (Multi Stream Transport for

daisy chaining displays) and up-to 4K resolutions w/HBR2

HDMI with 4K in addition to x.v.Color, Deep Color, and 3D

Media U pt 2x Faster1 AVC transcode Full HW Encode MVC (S3D) and MPEG-2 JPEG & MJPEG HW Decode Additions to Intel® Clear Video HD Technology: Image

Stabilization, Gamut Mapping, Frame Rate Conversion

3D Graphics & GPGPU New API Support: DX11.1, OpenCL 1.2, OpenGL 4.x Up to 3x improvement in 3D performance1

Enhanced gaming experience & GPGPU throughput

Haswell Processor Graphics – New Features

1Faster 3D and video conversion comparing IVB GT1 vs. HSW GT2 desktop SKUs


Desktop Platform: Roadmap

NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance

Extreme

MainstreamPerformance

PremiumPerformance

XE

Q1 ’14Q1 ’13 Q2 ’13 Q3 ’13

MS2

MS1

P1

P2

Sandy Bridge-EIvy Bridge

Q4 ’13

Haswell Ivy Bridge-E

i5-4570

i7-3970X

i7-3930K

i7-3820

i7-3770

i5-3570K

i5-3470

i7-3770K

i5-3570i5-3550

i7-3970X

i7-3930K

i7-3820

3rd Gen Intel® Core™

Processor (“Ivy Bridge-E”)

i7-3960X i7-3960X

i7-4770K

i7-4770

i5-4670K

i5-4670

i5-4570

≥ i7-4770K

i7-4770

≥ i5-4670K

i5-4670

≥ i7-4770K

i7-4770

≥ i5-4670K

i5-4670

i5-4570

≥ i7-4770K

i7-4770

≥ i5-4670K

i5-4670

i5-4570

http://www.intel.com/products/processor_number


Desktop Platform: Roadmap


TransactionalT2

T1

L3

L2

V2

Legacy

A3

Value

Sandy Bridge

L1

V1

A2


Intel Atom BGA (Cedarview) with NM10 chipset

Ivy Bridge

Q1 ’13 Q2 ’13 Q3 ’13 Q1’14 Q4 ’13

G1620

G1610

G470

D2550

i3-3250

G2140

G2130

i3-3240

A1D2500

G1620

G1610

G465

i3-3240

G2130

G2120

i3-3220

D2550

D2500

≥ G1620

≥ G1610

≥ G470

≥ D2550

≥ D2500

847

807

847

807

Value BGA

Intel Celeron BGA (Sandy Bridge) with NM70 chipset

i3-3225 i3-3245

G2030G2020

≥ G1620

≥ G1610

≥ G470

≥ D2550

≥ D2500

≥ 847

≥ 807

4th Gen Intel® Core™ Processor

Intel® Pentium®

Processor

Haswell

≥ 847

≥ 807

≥ G470

Intel® Celeron®

Processor

Bay Trail-DSOC*

(* Feb’14-Apr’14)


2013 Entry DT

StackBay Trail-D SOC

2014

Bay Trail Provides More Performance and Improved Graphics

SOC platform (2 chip to 1 chip)

NEW: Quad Core CPU option with Intel Burst

Technolgy

NEW: Intel® Gen7 Graphics with DX*11

NEW: Win* 8 Support HW Media Acceleration –

Decode / Encode

Targeted RTS within Feb – April’14

Bay Trail Platform Transition

Intel NM10 Exp

3X

3D Performance

Productivity Workload

UP TO

2X*as compare with Intel Atom Processor

D2XXX / N2XXX

Intel® AtomTM ProcessorD2XXX / N2XXX

Intel® Celeron Processor807 / 847

For Placeholder

only


Desktop Processor: Lifestyle Roadmap



MainstreamPerformance

PremiumPerformance

Q1 ’14Q1 ’13 Q2 ’13 Q3 ’13

MS2

MS1

P1

Ivy Bridge

Q4 ’13

Haswell

i7-3770S

i5-3570S

i5-3570T

i7-3770T

i5-3470T

i5-3470S

i5-3475S

i5-4670S

i5-4670T

i5-4570T

i5-4570S

i5-4670S

i5-4670T

i5-4570T

i5-4570S

i7-4770S

i7-4770T

i5-4670S

i5-4670T

i5-4570T

i5-4570S

i7-4765T

i7-4770S

i7-4770T

i7-4765T

i7-4770S

i7-4770T

i7-4765T

i5-4670S

i5-4670T

i5-4570T

i5-4570S

i7-4770S

i7-4770T

i7-4765T

i5-3550S

http://www.intel.com/products/processor_number


Intel® All-in-one Platform

Stylish, Responsive, now with TOUCH

Multi-media HD Entertainment

Ergonomic & Tilt-flat Design

Space Saving & Clutter Free

InteractiveExperience

Swivel ReclinableLay flat

One wire design - Built-in keyboard, mouse, & speaker

Multi-Touch Screen for Multi-user

Collaboration

Large 27”Fast boot & resume

HD GraphicsBuilt-in TV Tuner

Smart Computing power, All-in-one Simplicity, Powered by Intel

Intel Confidential

Intel Technology Update(Mobile)


Haswell Platform Value Proposition

** Post TTM POR pending

Breakthrough Performance

• New Haswell Architecture delivers great CPU, Graphics, and Media Performance

• Targeting up to 15% faster CPU1, upto 2x faster graphics with GT31,2, Up to 12X real-time transcode on GT3 for QC3 and ~9-10x on GT3 1 Chip3 and GT2 (QC and 1 Chip)

• New TDPs for amazing power efficient performance in Sleek Innovative Form Factors

Amazing Battery Life

• All Day Battery Life with Power Optimizer

• > 10 days of Connected Standby on Windows* 8

Best in Class Security

• More Secure online PC experience through better encryption, BIOS/FW protection, Malware detection, and Security Services

Haswell will reinvigorate the notebook experience and accelerate Ultrabook™ category

Innovative User Experiences

• Awesome Responsiveness including Faster Resume times

• Stay up to date with Connected Standby and Intel® Smart Connect

• Reinventing the PC with Sensors• New and improved connected capabilities

powered by Intel Wireless, ThunderboltTM, and NFC solutions

Note1: Performance estimates are preliminary based on pre-silicon projections and subject to change .Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchase, including the performance of that product when combined with other products. Note2: Projected performance based on 3DMark Vantage Performacne Profile Scores. Note3 : Intel ® Architecture Projections

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PerformanceUp to 1.15x CPU Performance1 vs. 3rd Gen Intel Core™ Processors

Targeting 80% of 2-chip dual core CPU performance with ~50% lower average power2 and upto 3.5x lower Idle power2

VisualsUp to 2x Graphics performance1 & 1.25x transcode 1 vs. 3rd

Gen Intel Core™ ProcessorsUp to 2x graphics performance 1 vs. 2nd Gen Intel® Core™ “ULV” processors and 1.3-1.4x vs. 3rd Gen Intel® Core™ U-Processor Line

SecurityBest-in-class security with hardened protection against malware, data & identity theft

2 chip platform offerings plus additional Security features (Anchor Cove, Platform Trust Technology) for Windows 8 Connected Standby platforms

ResponsivenessGreat Responsiveness with Intel Smart Connect, Rapid Start, and Smart Response Technologies

Intel Smart Connect, Rapid Start, and Smart Response Technologies, Instant On, Always Updated with Windows* 8 Connected Standby

Battery LifeUp to 70% more battery life compared to equivalent 3rd Gen Intel Core™ Processors

Significant advances in battery life savings (both Idle & Active conditions) with up to 20x better Idle battery life vs. 3rd Gen Intel Core™ ProcessorsU-Processor Line3

Form Factor Enabling innovative designs with thinner BGA package ~25% lower design power (TDP) vs. 3rd gen Intel® Core™ U-Processor Line + chipset, enabling thinner and innovative form-factor capabilities

User ExperiencePremium creation and enthusiast gaming notebooks with exceptional CPU, Graphics & Media performance

Platform support for Sensors, Touch, Intel® WiDi, NFC and Common Connectivity Framework (CCF) enable new & compelling user experience

Haswell PlatformValue Proposition

2-ChipPlatfor

m

4th Gen Intel® Core™

Processors(Haswell)

Intel® 8-Series

Chipset

DD

R3

L

4th Gen Intel® Core™ Processors (U-Processor Line

with Integrated I/O) L

P-D

DR

3D

DR

3L

1-ChipPlatfor

m

Optimized for Ultrabooks™

Note 1: Projection. Not based on actual silicon measurements; Note2: Average power comparison based on Windows 7 MM07 Office productivity suite. Idle power based on Win8 Idle display on; Note3: Comparison based on Win8 Idle Display Off

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance


Mobile Processor Roadmap WW05'13U-Processor Line

32nm processors ( “Sandy Bridge”)

Q1’13

U-MS3

U-MS1

Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance.

U-V1

22nm 3rd Gen Intel Core™ processors ( “Ivy Bridge”)

1H’14

i7-3687U

i5-3437U

i7-3687U

i5-3437U

Note 2: ICP 847 with Controllable TDP* support can be paired with NM70 Express Chipset starting Q4’12 for 10”-12” Entry Clamshell PCs

8472 8472

Q2’13 Q3’13

8472

1: Exact launch timeline/granularity for 4th Gen Intel Core™ processors will be available via ILU . Please refer to platform dashboard for engineering milestones/RTS dates. Exact SKU details and price point TBD

22nm 4th Gen Intel Core™ processors (“Haswell”)

1037U 1037U 1037U

U-V2

1007U 1007U 1017U

Q4’13

≥ 8472

U-MS3+

i7-4650U

Intel ® Celeron®

Processors

U-MS1+

i5-4350U

i5-3437U

i7-3687U 4th Gen Intel® Core™ Processors1

i7-4650U ≥ i7-4650U

i5-4350U ≥ i5-4350U

Broadwell

Broadwell4th Gen Intel®

Core™ Processors1

14nm based “Broadwell”


Mobile Processor Roadmap ww05'13Y-Processor Line

Q1’13

Y-MS3

Y-MS1


1H’14Q2’13 Q3’13


Processors1

Note 1: Exact launch timeline/granularity for 4th Gen Intel® Core™ processors will be available via ILU at a later date. Please refer to platform dashboard for engineering milestones/RTS dates. Exact SKU details and price point TBD.

22nm 4th Gen Intel Core™ processors (“Haswell”)

Q4’13

i7-3689Y

i5-3439Y

22nm 3rd Gen Intel Core™ processors ( “Ivy Bridge”)

i7-3689Y

i5-3439Y

i7-3689Y

i5-3439Y

Y-V2

1019Y 1019Y ≥ 1019Y ≥ 1019Y

Broadwell

14nm based “Broadwell”


22nm 4th Gen Intel Core™ Processor (Haswell)

Mobile Processor Roadmap ww05'13 H-Processor Line


QC2+ (GT3e)

QC1+ (GT3e)

Q2’13 1H’14

2 Available in BGA Only

Qu

ad

Core

Q1’13

1 Exact launch timeline/granularity for 4th Gen Intel Core™ processors will be available via ILU at a later date. Please refer to platform dashboard for engineering milestones/RTS dates. Exact SKU details and price point TBD.

Q3’13 Q4’13

4th Gen Intel® Core™ Processors2

Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice.3322nm 3rd Gen Intel Core™ processors (codenamed “Ivy Bridge”)

= Box SKU

22nm 4th Gen Intel Core™ Processor (Haswell)

Mobile Processor Roadmap ww05'13 M-Processor Line

Power Optimized

Performance

Power Optimized

Performance

Roadmap not reflective of exact launch granularity and timing –please refer to ILU guidance.

QC2

QC1

XE

MS2

MS3

MS1

Q2’13

Du

al C

ore

1H’14

i5-3380M

i5-3340M

Qu

ad

Core

Du

al C

ore

i7-3540M i7-3540M

i7-3940XM

i7-3840QM

i7-3740QM

i5-3380M

i5-3340M

Q1’13

1 Exact launch timeline/granularity for 4th Gen Intel® Core™ processors will be available via ILU. Please refer to platform dashboard for engineering milestones/RTS dates. Exact SKU details and price point TBD.

2 Available in rPGA Only

Q3’13

i7-3540M

i5-3380M

i5-3340M

Q4’13

i7-4930MX2

i7-4900MQ2

i7–4800MQ2


Processors1

i7-4900MQ2

i7–4800MQ2

i7-4930MX2

i7-4900MQ2

i7–4800MQ2

i7-4930MX2 ≥ i7-4930MX2

≥ i7-4900MQ2

≥ i7–4800MQ2


Mobile Processor Roadmap ww05'13M-Processor Line

Q3’13 1H’14


Q1’13

V1

V2

Q2’13

*Other names and brands may be claimed as the property of others.

Q4’13

1020M 1020M 1020M

1000M 1000M 1005M

Intel® Celeron® Processors2

22nm Intel® Celeron® Processors based on ‘Haswell’

2 Exact launch timeline/granularity for the processors will be available via ILU. Please refer to platform dashboard for engineering milestones/RTS dates. Exact SKU details and price point TBD.

≥ 1005M

22nm Intel® Celeron® Processors based on “Ivy Bridge”

≥ 1005M

Intel Confidential

SSD Roadmap

Non-Volatile Memory Solutions Group36

Intel Confidential—NDA Platform RoadmapAll dates and plans are subject to change

without notice.

Intel® SSD Solutions•Data

Center, Server, Storage, & Embedded SSD Solutions

•SATA & PCIe solutions, multiple endurance levels, and enterprise class RAS features

Intel® SSD Data Center

Family

•Corporate, SMB Client, & Embedded SSD Solutions

•Stable platform solution with Industry leading TCO, superior manageability and security features

Intel® SSD Professional

Family

•Enthusiast, Consumer, & Embedded SSD Solutions

•Performance-optimized SSDs for enthusiasts

•The best performance at an affordable price

Intel® SSD Consumer

Family

Intel is designing, optimizing and validating SSD solutions for target market segments



without notice.37

Intel® Solid-State Drive - 5Q Roadmap

300G, 200G, & 100G 2.5” SATA 3Gb/s

710 Series

480G, 240G, 180G,

120G & 60G 2.5” SATA 6Gb/s

600G, 300G1, 160G1,

120G, 80G1, & 40G

2.5” SATA 3Gb/s

320 Series

Updated ww04’13

910 Series

800G & 400G AIC

Available Now

Q1‘13

StandardEndurance

520 Series

Q2’13

Q4’13

Q3’13

HighEndurance(HET)

Data Center

HighEndurance(HET)

PCIe

SATA

1- Also available in 1.8” Form Factor

S3700 Series800G, 400G, 200G, & 100G

2.5” SATA 6Gb/s

400G & 200G1.8” SATA 6Gb/s

S3700 Series (Feb)

Q1‘14

800G, 480G, 300G, 240G, & 120G

2.5” SATA 6Gb/s

S3500 Series (Mar) 2.5”: 160G & 80G1.8”: 800G, 400G,

240G, & 80GSATA 6Gb/s

S3500 Series

P3700 Series

1.6TB2.5” SATA 6Gb/s

S3500 Series

2TB, 1TB, 500G& 250G

2.5 “& AIC

P3500 Series

2TB, 1.6TB, 800G, 400G, & 200G

2.5“ & AIC

StandardEndurance

25nm MLC25nm MLC HET 20nm MLC 20nm MLC HET



without notice.38


480G, 240G, 180G,

120G & 60G 2.5” SATA 6Gb/s

600G, 300G1, 160G1,

120G, 80G1, & 40G

2.5” SATA 3Gb/s

320 Series

Available Now

Q1‘13

520 Series

Q2’13

Q4’13

Q3’13

Corporate Client


525 Series240G, 180G,

120G, 90G, 60G, & 30G

mSATA 6Gb/s

Q1’14

Pro 1500 Series

360G, 240G, 180G & 80G80mm M.2

SATA 6Gb/s with OPAL

Capacities TBDSATA 6Gb/s(Planning)

Pro 2500 SeriesPro 1500 Series


480G, 360G,240G, & 180GmSATA & 2.5”

SATA 6Gb/s with OPAL

ProFamily

500 Series

300 Series

ConsumerFamily

Updated ww04’13



without notice.39


480G, 240G, 180G,

120G & 60G 2.5” SATA 6Gb/s

600G, 300G1, 160G1,

120G, 80G1, & 40G

2.5” SATA 3Gb/s

320 Series

240G, 180G, 120G & 60G

2.5” SATA 6Gb/s

330 Series

Available Now

335 Series

Continued Product Optimizations 240G2.5” SATA 6Gb/s

Consumer Client

520 Series

500 Series

300 Series

ConsumerFamily


180G & 80G2.5” SATA 6Gb/s

335 Series (Mar)

525 Series360G, 240G, 180G & 80G

80mm M.2 SATA & mSATA 6Gb/s

530 Series 530 Series

Q1‘13 Q2’13

Q4’13

Q3’13

Q1’14

240G, 180G, 120G, 90G, 60G,

& 30GmSATA 6Gb/s

480G, 360G, 240G, 180G

2.5” SATA 6Gb/s


Updated ww04’13

INTEL CONFIDENTIAL40

Intel® SSDs: Enterprise SSD Comparison

Intel® SSD

910 Series (“Ramsdale”)

Taylorsville 710 Series 320 Series

Interface PCIe* gen2 x8 SATA 6Gb/s ATA8 SATA 3Gb/s ATA8 SATA 3Gb/s ATA8

Form factor ½ height ½ length 1.81, 2.5 inch 2.5 inch 1.8, 2.5 inch

Capacities (GB) 800, 400GB 800, 400, 200, 100GB 300, 200, 100GB 600, 300, 160, 120, 80, 40GB

Random Performance (IOPs, 4KB files)

R: up to 180KW: up to 75K


R: up to 38.5KW: up to 2.7K

R: up to 39.5K2

W: up to 6002

Sustained Sequential Performance (MB/s)

R: up to 2.0GB/sW: up to 1.0GB/s

R: up to 525MB/sW: up to 500MB/s

R:up to 270MB/sW:up to 210MB/s

R:up to 270MB/s3

W:up to 200MB/s3

Power 25W Max, 8W stdby 8W typ, 600mW4 idle 3.7 typ. 700mW idle 4W active, 95mW idle

Latency R, W: <65µs R: 60µs, W: 66µs R: 75µs, W: 85µs R: 75µs, W: 95µs

Endurance5 Up to 14PB Up to 8PB Up to 1.8PB Up to 60TB

Reliability 1 sector/1016 bits read, max (UBER5)

2.0M Hrs MTBF 2.0M Hrs MTBF 1.2M Hrs MTBF

Security No AES-256 bit encryption AES-128 bit encryption

Data path protection Yes LBA tag checking

Pwr safe Write cache Yes

Temperature sensor Yes No

Current in-rush limiter Yes

1. 1.8 inch version planned for launch approx 3 months after 2.5 inch version2. IOPs for 160GB other capacities may vary3. Transfer rate for 300GB; other capacities may vary. Measurements are performed on 100-percent span of the drive (enterprise workload)4. Without DIPM.5. Endurance claims are “up to” using 4KB transfer sizes. 6. Uncorrectable Bit Error Rate

INTEL CONFIDENTIAL41

Intel® SSDs: Client SSD Comparison

Intel® SSD

520 Series 330 Series 320 Series 313 Series 310 Series

Position vs. other Intel SSDs

Overall client performance

Mainstream client value

Mainstream client value, quality of service

Optimized for Intel® Smart Response Technology

Optimized for small form factor clients

Interface SATA 6Gb/s SATA 6Gb/s SATA 3Gb/s SATA 3Gb/s SATA 3Gb/s

Form factor 2.5 inch 2.5 inch 1.8, 2.5 inch 2.5 inch, mSATA mSATA

Capacities (GB) 480, 240, 180, 120, 60GB

180, 120, 60GB 600, 300, 160, 120, 80, 40GB

24, 20GB 80, 40GB

Max. random perf. (IOPs)

R: up to 60KW: up to 80K1

R: up to 22.5KW: up to 33K

R: up to 39.5KW: up to 23K


R: up to 35KW: up to 6.6K

Max. sequential perf. (MB/s)



R: up to 270MB/sW:up to 220 MB/s



AES Encryption 256 bit 256 bit 128 bit 128 bit No

Data reliability Surplus NAND array, end-to-end

Surplus NAND array

Surplus NAND array

No No

Endurance(min. useful life)

5 yrs, up to 20GB written per day

3 yrs, up to 20GB written per day

5 years with up to 20GB written per day

Warranty 5 year 3 year 5 year 3 year 3 year

1. Random 4 KB write performance measured using out-of-box SSD on compressible workloads."Client Intel SSD IOPs and endurance specs are for client-based workloads.Performance values vary by capacity. See the specific Intel® SSD product specifications for performance specifications of each capacity drive.* Warranties for OEM box version of 520 Series and 320 Series are subject E9 SMART attribute (wear indicator).

Intel Confidential

Reference List

intel confidential intel technology update(server)

Documents

details e5

product family e5

socket intel xeon processor

workstationonly sku

processor family

intel processor numbers

intel c226 chipset

different processor