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March, 2017 Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services

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Page 1: Industry Leading Provider of Outsourced Semiconductor ... · Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services. 2 Safe Harbor Notice This presentation

March, 2017

Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services

Page 2: Industry Leading Provider of Outsourced Semiconductor ... · Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services. 2 Safe Harbor Notice This presentation

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Safe Harbor Notice

� This presentation contains certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. These risks and uncertainties include those discussed under “Cautionary Statement Concerning Forward Looking Statements” and “Risk Factors” in the prospectus included in the registration statement on Form F-4 that ChipMOS filed with the U.S. SEC.

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ChipMOS Group Snapshot

� Founded: 1997

� Headquarters: Hsinchu, Taiwan

� Ticker Symbol: TWSE : 8150.TW

NASDAQ : IMOS

� Employees (1): Taiwan : 5,560

China : 650

Manufacturing footprint in China & Taiwan

Shanghai, ChinaChipMOS Shanghai

Hsinchu, TaiwanChipMOS Taiwan

Tainan, TaiwanChipMOS Taiwan

Overview

(1) As of December 31, 2016(2) ThaiLin was listed on OTC since Oct 2000, and was de-listed in Jun 2015(3) ChipMOS Taiwan is authorized managing ChipMOS Shanghai

Key milestones

20072000 2011 20142010 2015 2016

• Acquired LCD assets of SPIL

• SPIL became a strategic shareholder of ChipMOSTaiwan

• Started TCP package for LCD driver semiconductor and 12" wafer assembly and testing business

• Acquired 100% interest in ChipMOSTaiwan

• Set up 12” Gold bumping, Cu RDL, MCP, Cu pillar, MCB bumping and WLCSP line

• Listed ChipMOSTaiwan on TWSE

• Announced the merger between ChipMOSTaiwan and ThaiLin

• Invested in JMC and Ryowa

• ChipMOSTaiwan merged ThaiLin (2)

• Announced private placement with Tsinghua Unigroup

• ChipMOSTaiwan merged ChipMOSBermuda and issue d ADS (Nasdaq Ticker: IMOS).

2017

• ChipMOSTaiwan JV with Tsinghua Unigroup (3)

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ChipMOS – Industry Leader in Outsourced Semiconductor Assemb ly & Test

4Start to Realize Significant Financial and Operatio nal Benefits in 2017 from Now Completed Corporate Structure Streamlining

Joint-Venture to Monetize Shanghai Operation, Drive China Growth and Deliver Increased Profitability in 2017 and Bey ond

3

Focused on Growth in Key Markets, including LCD Dri ver & Memory Markets2

1 Leveraging Leadership Position and Track Record as Top Service Provider

5Robust Technology Roadmap Supports Multiple Growth Vectors, Including Finger Print Sensors, MEMS, Mixed-Signal, and Power IC Mar ket Segments

6 Proven Senior Management Team Executing on Right Bu siness Strategy

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Focused on Higher Margin Growth Markets

� Focus on specialty end markets

� Leading-edge turn-key solutions for high-growth applications

� Focused core technology drives innovation and cost-savings for customers

Flash (NOR/NAND)

DRAMLCD Driver

Logic/Mixed-Signal

CoreTechnology

ChipMOS Core Technology

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Revenue Breakdown

Consolidated Revenue

2016 Revenue Breakdown ;;;;2016 Revenue NTD $ 18,387.6 M元元元元

19,361.9 22,005.119,869.4

18,387.6

0

4,000

8,000

12,000

16,000

20,000

24,000

2013 2014 2015 2016

(M NTD $ )

(1) Since 2015, the Consolidated Revenue is not including ChipMOS Shanghai

By Manufacturing Segments By Products

Package Test

15.3%

Wafer Sort9.6%

Assembly32.0%

LCD Driver26.8%

Bumping (incl.

RDL/MEMS/PM)

16.3%

Niche DRAM17.3%

Commodity DRAM14.1%

Flash15.9%

SRAM0.8%

Logic/Mixed Signal8.9%

LCD Driver27.1%

Bumping (incl.

RDL/MEMS/PM)

15.9%

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0

200

400

600

800

1,000

Q3'16 Q4'16

Bumping(incl. RDL/MEMS/PM)(M NTD $)

Q416 Revenue Breakdown by Segment (unaudited)

7

Package Test

15.7%

Wafer Sort11.0%

Assembly31.8%

LCD Driver24.6%

Bumping (incl.

RDL/MEMS/PM)

16.9%

By Manufacturing Segments

0200400600800

1,0001,2001,400

Q3'16 Q4'16

LCD Driver

QoQ -6.0%

(M NTD $)

0

500

1,000

1,500

2,000

Q3'16 Q4'16

Assembly(M NTD $)

0

100

200

300

400

500

600

Q3'16 Q4'16

WS(M NTD $)

0

200

400

600

800

Q3'16 Q4'16

Package Test(M NTD $)

QoQ -4.8% QoQ -3.8% QoQ 10.1% QoQ 3.2%

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Q416 Revenue Breakdown by Product (unaudited)

8

By Products

Niche DRAM

16.1%

Commodity

DRAM

13.2%

Flash

18.0%

SRAM

0.8%

Logic/Mixed

Signal

10.1%

LCD Driver

25.4%

Bumping (incl.

RDL/MEMS/PM)

16.4%

0

200

400

600

800

1,000

Q3'16 Q4'16

Bumping(Incl. RDL/MEMS/PM)(M NTD $)

0200400600800

1,0001,2001,400

Q3'16 Q4'16

LCD DriverQoQ -4.9%(M NTD $)

0

100

200

300

400

500

Q3'16 Q4'16

Logic/Mixed SignalQoQ 9.1%

(M NTD $)

0

10

20

30

40

Q3'16 Q4'16

SRAMQoQ 9.0%(M NTD $)

0

200

400

600

800

1,000

Q3'16 Q4'16

FlashQoQ 14.4%(M NTD $)

0

200

400

600

800

1,000

Q3'16 Q4'16

Niche DRAM

QoQ -9.4%

(M NTD $)

0

200

400

600

800

Q3'16 Q4'16

Commodity DRAM

QoQ -9.4%

(M NTD $)

QoQ -5.8%

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Bumping /RDL Wafer Testing Assembly/Packaging Product Testing Key End Markets

LCD Driver ���� ���� ���� ����

Flash ���� ���� ���� ����

DRAM Under Development ���� ���� ����

Logic/Mixed Signal ���� ���� ���� ����

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Turnkey, High-yield, OSAT Partner of Choice

� Offer turn-key solutions for core technology produc t segments

� Dedicated OSAT capacity and strategically focused o n collaboration-driven growth

� Leverage current partnerships to capture new custom ers

� Targeting mixed-signal, finger print sensor and MEM S for expansion

Services Provided

Pro

duct

Offe

ring

����

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Well-positioned to Capture the LCD driver Outsourci ng Markets

� Global proliferation of digital broadcasting foster s adoption of LCD TVs

� Widespread use of LCD drivers in electronic product s

� High resolution / function integration to drive LCD driver growth

� ChipMOS is one of the major players in the LCD drive r bumping and test / assembly market

� Focused investment in capacity expansion in growth market based on technology advancement

� Develop bumping technology for non-driver applicati ons to capture new business and enable turn-key offerings in mixed sig nal, IoT , sensor markets

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UHD (4K2K) LCD TV Growth Drives COF Capacity Demand

UHD Panel LCDD Demand

Main Stream

Narrow Bezel

42”FHD1920x1080

SD: 960ch x 6GD: 360ch x 6

>55”FHD1920x1080

SD: 720ch x 8GD: 270ch x 8 or GOA

4K2K 120Hz

55”/65”UHD 4K2K 120Hz

3840x2160SD: 960ch x 16GD: 270ch x 24

11

2004 - 2018 UHD panel growth UHD panel LCDD demand

ChipMOS preparing capacity to capture market growth

Source: Nomura estimates ; Himax

� UHD/4K propels significant memory/storage market gr owth inset top boxes, TV, home entertainment system

� Market penetration of UHD panel accelerating, GOA(G ate On Array) affecting gate driver demand for small panel s

� Increase in LCDD COF demand driven by UHD and AMOLE D

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� 4K/UHD penetration rate at 3x faster than FHD/1080; To increase display driver output to meet both 4KTV an d AMOLED demand

� Extending core competency to capture new market of Non-driver bumping products and provide turn key solutions for: Flip Chip, RDL, Advanced Memory, RDL , WLCSP, Power IC, etc.

Universal Flash

Storage (UFS)

RDL

WLCSP

Flip Chip (CoW)

Extend B umping Core Competency to Grow New Business

�Mother Wafer

�Daughter Die

�UBM

#2

�CPB

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� By offering both LGA and COF (tape based) products, ChipMOS is uniquely positioned by providing both types of packages to support FPS market growth

� 10+ years of FPS(COF) packaging experience

� Full range of options support turn-key solutions with maximum technology extendibility COF Package

LGA Package

Source: Nomura estimates

Fingerprint sensor Demand Propelled by Mobile Produ cts

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MEMS Market Growth Leads to Turn-key Service Opport unities

� MEMS industry growth driven mainly by applications such as smartphone, mobile consumers products, medical and automotive market

� Deliver Package and Wafer based products plus compr ehensive test services, ChipMOS established itself as a turn -key OSAT provider to the growing MEMS market

� 6+ years record of executing magnetometer backend tu rn-key service for key customers

� Built capabilities to cover gyroscope, acceleromete rs & pressure sensors

MEMS Market Forecast (USD Billion)

Source: Yole Development

WLCSP Magnetometer

LGA Package

QFN Package

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China JV: Catalyst for Significant Profitability Gr owth

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� Strategic investors led by Tsinghua Unigroup have agreed to contribute US$72 millionfor a 55% stake in ChipMOS Shanghai. ChipMOS TECHNOLOGIES pl ans to re-investUS$70 million back into ChipMOS Shanghai in two tranches aft er the joint-venturecloses to fund its CapEx.

� Upon regulatory approval, the strategic partners will then contribute anotherapproximately US$75 million into ChipMOS Shanghai, of whic h approximately US$10.9million will be from two strategic customers and employees.

� All together, ChipMOS Shanghai is expected to receive a tota l approximately US$155million in funding by the end of 2017. Net net, strategic inve stors, led by TsinghuaUnigroup, will be investing a total of approximately RMB 1.1 billion into ChipMOSShanghai.

� ChipMOS TECHNOLOGIES will own 45% of ChipMOS Shanghai on a go forward basis.There will be no minority interest post the JV closure.

� ChipMOS TECHNOLOGIES will recognize 45% of the profit gener ated by ChipMOSShanghai.

� ChipMOS TECHNOLOGIES will not consolidate ChipMOS Shangha i post the JV closure.ChipMOS Shanghai will become a long-term investment of Chip MOS TECHNOLOGIES.

�ChipMOS is well positioned to capture the growth opportunit ies of the emergingsemiconductor market in China

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Post-Transaction Pro-Forma Shareholding Structure

ChipMOS BVI

45.02%

UnigroupGuowei

48.00%

Strategic Investors

+ Employees

6.98%

ChipMOS

Shanghai

China JV: Catalyst for Significant Profitability Gr owth

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� 28 Years of industry experience� IR officer, head of the finance division, and

former head of strategy development, and head of the quality lab in the firm

� B.S. of Mining and Petroleum Engineering and M.S. and Ph.D. from the School of Mining, Metallurgy, Material Science of National Cheng Kung University

ChipMOS Management Team with Deep Industry Experienc e

� 32 Years of industry experience� Former head of the back-end operation of Mosel� Former Chairman of Chantek� Former Chairman of AMCT� Former board director of Ultima Electronics Corp� MBA from Saginaw Valley State University

� 34 Years of industry experience� Former VP of Fibera� Former Senior Director at Lam Research� Former IBM's Microelectronics Senior

Engineer/ Manager� M.S. and Ph.D. from the University of

Michigan and B.S. of Science from Fu Jen University

Shih-Jye CHENG – Chairman & CEO

Dr. Shou-Kang CHEN - CFO Dr. David WANG – VP of Strategy & IR

Lafair CHO – EVP Steve CHENG – President of U.S. Paul YANG – President of Shanghai

� 23 Years of industry experience� Former President of ThaiLin� Former VP of the IC testing of ChipMOS

Taiwan� Former manager of production material

control of Mosel� M.S. of Industrial Management from National

Cheng Kung University

� 17 Years of industry experience� Former President and CFO of ChipMOS

U.S.A. � B.S. of Business Banking and Insurance from

Feng Chia University

� 17 Years of industry experience� Former VP of Test Production Group� Former VP of the deputy assistant and mix-

signal test division of ThaiLin� M.S of Electrical Engineering from National

Cheng Kung University

Peter KU – Special Assistant

� 43 Years of industry experience� Former board director of ThaiLin� Former President of Shanghai

� Former VP of ChipMOS Taiwan� Former VP of Microchip Taiwan Branch� M.S. of Electrical Engineering from National

Cheng Kung University

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Financial Highlights

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4Q16 Capital Expenditures (unaudited)

19

CapEx

3,644.63,123.3

979.9 964.0

0500

1,0001,5002,0002,5003,0003,5004,000

2015 2016 Q3'16 Q4'16

(M NTD$)

Testing21%

Assembly24%

LCD Driver13%

Bumping42%

4Q16 CapEx Breakdown

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66%74%

68% 70%

0%

20%

40%

60%

80%

100%

Q4'15 Q4'16 2015 2016

4Q16 Capacity Utilization

20

Utilization Rate

70%81%

0%

20%

40%

60%

80%

100%

Q3'16 Q4'16

Testing

69% 67%

0%

20%

40%

60%

80%

100%

Q3'16 Q4'16

Assembly

82% 79%

0%

20%

40%

60%

80%

100%

Q3'16 Q4'16

LCD Driver

78%68%

0%

20%

40%

60%

80%

100%

Q3'16 Q4'16

Bumping

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1Q17 Business Outlook

� The Company expects 1Q17 revenue to be approximately 4% to 8% lower, ascompared to 4Q16.

� The Company expects 1Q17 gross margin on a consolidated basi s to be in therange of approximately 16% to 20%.

� Operating expenses are expected to be approximately 9% to 11 % of revenues in1Q17.

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Company Website

� http://www.chipmos.com