htc vive vr - system plus · pdf fileo bom cost –display flex 1 & 2 o housing parts...

©2017 by System Plus Consulting | HTC Vive VR Headset (SAMPLE) 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

HTC Vive VR (Model 0PJT100)

Virtual Reality HeadsetSystem report by Wilfried THERONFebruary 2017


Table of Contents

Overview / Introduction 4

o Executive Summary

o Main Chipset

o Block Diagram

o Reverse Costing Methodology

Company Profile 9

o HTC Corporation

Physical Analysis 12

o Content of the Box

o Views and Dimensions of the Headset

o Headset Opening

o Fresnel Lens Details

o Display Details

o Main Electronic Board

Top Side – Global view

Top Side – High definition photo

Top Side – PCB markings

Top Side – Main components markings

Top Side – Main components identification

Top Side – Other components markings

Top Side – Other components identification

Bottom Side – High definition photo

Bottom Side – Components identification

o Photodiode Flex

o Front Camera Flex

o Microphone Flex

o Proximity Sensor Flex

o Display Flex 1 & 2

Cost Analysis 87

o Accessing the BOM

o PCB Cost

o BOM Cost – Main Electronic Board

o BOM Cost – Photodiode Flex

o BOM Cost – Front Camera Flex

o BOM Cost – Microphone Flex

o BOM Cost – Proximity Sensor Flex

o BOM Cost – Display Flex 1 & 2

o Housing Parts – Estimation

o BOM Cost - Housing

o Material Cost Breakdown by Sub-Assembly

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Board Manufacturing Flow

o Details of the Main Electronic Board AV Cost

o Details of the System Assembly AV Cost

o Added-Value Cost Breakdown

o Manufacturing Cost Breakdown

Estimated Price Analysis 123

o Estimation of the Manufacturing Price

o Estimation of the Selling Price

Company services 127


Overview / Introductiono Executive Summaryo Main Chipseto Block Diagramo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Cost Analysis

Selling Price Analysis

About System Plus

Main Chipset

The main chipset of the Headset is resumed in the following table :





Physical Analysis

Cost Analysis


About System Plus

Block Diagram

The block diagram of the Headset is described in the following schematics:





Physical Analysis

Cost Analysis


About System Plus

The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modeled with the SYScost+ software.

The assembly and tests costs are estimated.

• Production cost & selling price

Estimation of the production cost & selling price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.


Overview / Introduction


Physical Analysis o Views & Dimensionso Headset Openingo Fresnel Lenso Displayo Electronic Boardo Flex Boards

Cost Analysis


About System Plus

Views and Dimensions

Global view of the HTC Vive VR Headset.

Total Weight: 566g(without cables).

117mm





Cost Analysis


About System Plus

Headset Opening

Headset opening

IR Photodiode Flex Support

IR Photodiode Flex (x4)

Front Camera





Cost Analysis


About System Plus

Headset Opening

Details of the four IR Photodiode Flex

Each IR Photodiode Flex has a particular shape but each Flex integrates 8 IR Photodiodes.





Cost Analysis


About System Plus

Headset Opening





Cost Analysis


About System Plus

Part Collection (1/2)

Outer Shell (x2)(PC, 43g)





Cost Analysis


About System Plus

Display Details





Cost Analysis


About System Plus

Electronic Board – Top Side – Global View





Cost Analysis


About System Plus

Electronic Board – Top Side – Main Components Markings





Cost Analysis


About System Plus

Electronic Board – Top Side – Main Components Identification





Cost Analysis


About System Plus

IR Photodiode Flex – Top Side – Detailed View & Component Identification

IR Photodiode Flex details





Cost Analysis


About System Plus

Front Camera Flex – Camera Image Sensor View


C O S TANALYSIS




Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacuring Cost


About System Plus

PCB Cost




Physical Analysis



About System Plus

BOM Cost – Main Board (1/3)




Physical Analysis



About System Plus

Material Cost Breakdown by Sub-Assembly




Physical Analysis



About System Plus

Material Cost Breakdown by Component Categories


MANUFACTURINGPROCESS FLOW




Physical Analysis



About System Plus

Assessing the Added-Value (AV) Cost




Physical Analysis



About System Plus

Details of Main Board Added-Value (AV) Cost




Physical Analysis



About System Plus

Added-Value Cost Breakdown




Physical Analysis



About System Plus

Manufacturing Cost Breakdown


SELLINGP R I C E




Physical Analysis

Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

Estimation of the Manufacturing Price


COMPANYSERVICES



Physical Analysis

Manufacturing Process Flow

Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis

Manufacturing Process Flow

Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

htc vive vr - system plus · pdf fileo bom cost –display flex 1 & 2 o housing parts...

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