High performance nano colloid palladium andits application in horizontal PTH

Journal of the HKPCA / 2017 / Summer / Issue No. 64

12 Technical Paper

Abstract: A new kind of nano colloid palladium activator with new

additive system and improved synthesis process is introduced here.

The activator is applied to horizontal electroless plating process of

PCB, compared with the traditional activated palladium system has

high reactivity, excellent bath stability, low cost, stable back light

performance and strong process capability. It can effectively

improve and enhance the electroless copper plating binding force,

which is suitable for the horizonal electroless copper plating process,

with intelligent automation transformation demand.

(Electroless copper plating)

(Plating Through Hole)

Cu Cu PCB

PCB

2015 5 8

2025

80

PCB

2013

14.1% 2015 16% PCB

2 +

[1 ]

2.1

Sn/Pd

40-100:1

Step 1: Pd + Sn + 6Cl [PdSn ]Cl

Step 2: [PdSn ]Cl Pd + Sn + Sn + 6Cl

-

[2 ]

2 + 2 + -

4 + 2 + -

2 6

2 6

[3 ,4 ]

0 2 + - 2 X- 2 +

2.2

{(Pd )m nSn 2(n+x)Cl } XSn - RXOH

1

www.hkpca.org

13Technical Paper

(a)

(b)

Pd=100ppm SnCl2= 6g/L

2

(a)

(b)

3

7-12nm

40-90nm

Journal of the HKPCA / 2017 / Summer / Issue No. 64

14 Technical Paper

3.1

3.2

-

(AUTOLAB PGSTAT30)

-

Pt

s 6.6 7.8

7.3s 8.2s

100ml (Pd 100ppm) 100 mL

25 C 50 L/h

5

1

4

O

(

)

5*5cm

( )

a. 200ml 20ml

b. 1min

c. 100ml

DI

d. 0.4g

e. AA

3.4.1

0.2mm 0.3mm

3.3 Pd

3.4

2

2

3

3.4.2

www.hkpca.org

15Technical Paper

0.2mm

12:1

18.5/

4min

50sec

0.3mm

8:1

9.5

4

50ppm

>100ppm

0.3mm

6:1

ppm

20.2/

4min 50sec10

45

80

19.3/

4min 50sec10

Journal of the HKPCA / 2017 / Summer / Issue No. 64

16 Technical Paper

3.4.4

5

HDI 12 58 ( TCU

75/75 m,110/100 m)

(1)

µ µ

6

7

(2) IR

(3)

8 IR

9

www.hkpca.org

17Technical Paper

Journal of the HKPCA / 2017 / Summer / Issue No. 64

18 Technical Paper

(4)

10

5

50%

[1] PCB 4.0

2016 (05) 5-8

[2] PCB

2014 33 (13) 457-459

[3]

1990

[4] PCB

2014 (5) 44-47