gtk micro channel frame

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GTK Micro Channel Frame Thermal layout Georg Nüßle

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GTK Micro Channel Frame. Thermal layout. Georg Nüßle. Content. Model thermal frame (simulation) Layout channel geometry (analytical). Content. Model thermal frame (simulation) Layout channel geometry (analytical). Geometry and Boundaries. Cooling frame with sensor and chips. - PowerPoint PPT Presentation

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Page 1: GTK Micro Channel Frame

GTK Micro Channel Frame

Thermal layout

Georg Nüßle

Page 2: GTK Micro Channel Frame

GTK Cooling Meeting 2

Content

December 2, 2011

• Model thermal frame (simulation)

• Layout channel geometry (analytical)

Page 3: GTK Micro Channel Frame

GTK Cooling Meeting 3

Content

December 2, 2011

• Model thermal frame (simulation)

• Layout channel geometry (analytical)

Page 4: GTK Micro Channel Frame

GTK Cooling Meeting 4

Geometry and Boundaries

December 2, 2011

• Cooling frame with sensor and chips

Page 5: GTK Micro Channel Frame

GTK Cooling Meeting 5

Geometry and Boundaries

December 2, 2011

• Cooling frame with sensor and chips

• Cut through complete assembly

Page 6: GTK Micro Channel Frame

GTK Cooling Meeting 6

Geometry and Boundaries

December 2, 2011

• Cooling frame with sensor and chips

• Cut through complete assembly

• ASIC digital part 6mm long• That means micro channel

area 6mm wide6mm

Page 7: GTK Micro Channel Frame

GTK Cooling Meeting 7

Geometry and Boundaries

December 2, 2011

• Cooling frame with sensor and chips

• Cut through complete assembly

• ASIC digital part 6mm long• That means micro channel

area 6mm wide• Simplified model: half

model, slice of 1mm• Cover wafer 100µm thick• MC wafer 400µm thick• Channel height 300µm• Channel width 100µm• Wall width between

channels 100µm

Page 8: GTK Micro Channel Frame

GTK Cooling Meeting 9

Geometry and Boundaries

December 2, 2011

Fixed temperature on channel walls, -20°C (Junction Temperature)

Heat source: digital 4W/cm2, analog 0.5W/cm2

Glue between ASIC and mc frame, 0.3W/m/K

Bonding between cover and mc wafer

Symmetry, front, back and right side

Bump bonds, ASIC and Sensor, 0.12W/m/K • SnAG3.5 -> 33W/m/K • Pixel area 300µm x 300µm, bump diameter 20µm• Area ratio gives 0.12W/m/K for contiguous material

Page 9: GTK Micro Channel Frame

GTK Cooling Meeting 10

Temperature Distribution

December 2, 2011

ASIC 100µm thick

-3.2837°C

~ -12.6°C

ASIC 200µm thick

-7.0151°C

~ -14.2°C

∆T over Sensor ~ 9.3°C

∆T over Sensor ~ 7.2°C

Page 10: GTK Micro Channel Frame

GTK Cooling Meeting 11

Total Deformation

December 2, 2011

ASIC 200µm thick, fixed by symmetry boundary condition on the right side

Maximum Deformation ~ 3µm

ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)

Maximum Deformation ~ 32µm

Symmetry boundary conditionFixed support boundary condition

Page 11: GTK Micro Channel Frame

GTK Cooling Meeting 13

Thermal Stress

December 2, 2011

ASIC 200µm thick, fixed by symmetry boundary condition on the right side

Maximum Stress ~ 12.1MPa

ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)

Maximum Stress ~ 65.7MPa

Symmetry boundary conditionFixed support boundary condition

Page 12: GTK Micro Channel Frame

GTK Cooling Meeting 15

Content

December 2, 2011

• Model thermal frame

• Layout channel geometry (analytical)

Page 13: GTK Micro Channel Frame

GTK Cooling Meeting 16

Constraints

December 2, 2011

• Channel length 60mm• Width cooled area 6mm• ∆T between inlet and

outlet 5K (-> m, ∆p)• Junction temperature = ∆TJ

between wall and mean fluid temperature

• ∆TJ depends on geometry and heat flux60mm

• K takes into account the ratio between the hydraulic area and the heat exchange area in a square shaped channel

∆TJ

Page 14: GTK Micro Channel Frame

GTK Cooling Meeting 17

Influence of the Wall Width

December 2, 2011

wall width channel depth channel width DTJunction Dpchannel

[µm] [µm] [µm] [K] [bar]50 250 100 4,472 2,33

100 250 100 5,962 3,11200 250 100 8,943 4,66

• Smaller walls lead to more channels and more heat exchange surface• ∆Tjunction and ∆pchannel rise with the wall width

Page 15: GTK Micro Channel Frame

GTK Cooling Meeting 18

∆TJ and ∆p with 50µm wall

December 2, 2011

channel width [µm]

∆TJ / ∆pin_out

[K] / [bar]

0 50 100 150 200 250 3000

2

4

6

8

10

12

14

16

18

20

channel height 350µmchannel height 250µm

∆pin_out

∆TJ

Page 16: GTK Micro Channel Frame

GTK Cooling Meeting 19

∆TJ and ∆p with 100µm wall

December 2, 2011

channel width [µm]

0 50 100 150 200 250 3000

2

4

6

8

10

12

14

16

18

20

channel height 350µmchannel heigth 250µm

∆TJ / ∆pin_out

[K] / [bar]

∆pin_out

∆TJ

Page 17: GTK Micro Channel Frame

GTK Cooling Meeting 20

∆TJ and ∆p with 200µm wall

December 2, 2011

channel width [µm]

0 50 100 150 200 250 3000

2

4

6

8

10

12

14

16

18

20

channel height 350µmchannel heigth 250µm

∆TJ / ∆pin_out

[K] / [bar]

∆pin_out

∆TJ