gtk micro channel frame
DESCRIPTION
GTK Micro Channel Frame. Thermal layout. Georg Nüßle. Content. Model thermal frame (simulation) Layout channel geometry (analytical). Content. Model thermal frame (simulation) Layout channel geometry (analytical). Geometry and Boundaries. Cooling frame with sensor and chips. - PowerPoint PPT PresentationTRANSCRIPT
GTK Micro Channel Frame
Thermal layout
Georg Nüßle
GTK Cooling Meeting 2
Content
December 2, 2011
• Model thermal frame (simulation)
• Layout channel geometry (analytical)
GTK Cooling Meeting 3
Content
December 2, 2011
• Model thermal frame (simulation)
• Layout channel geometry (analytical)
GTK Cooling Meeting 4
Geometry and Boundaries
December 2, 2011
• Cooling frame with sensor and chips
GTK Cooling Meeting 5
Geometry and Boundaries
December 2, 2011
• Cooling frame with sensor and chips
• Cut through complete assembly
GTK Cooling Meeting 6
Geometry and Boundaries
December 2, 2011
• Cooling frame with sensor and chips
• Cut through complete assembly
• ASIC digital part 6mm long• That means micro channel
area 6mm wide6mm
GTK Cooling Meeting 7
Geometry and Boundaries
December 2, 2011
• Cooling frame with sensor and chips
• Cut through complete assembly
• ASIC digital part 6mm long• That means micro channel
area 6mm wide• Simplified model: half
model, slice of 1mm• Cover wafer 100µm thick• MC wafer 400µm thick• Channel height 300µm• Channel width 100µm• Wall width between
channels 100µm
GTK Cooling Meeting 9
Geometry and Boundaries
December 2, 2011
Fixed temperature on channel walls, -20°C (Junction Temperature)
Heat source: digital 4W/cm2, analog 0.5W/cm2
Glue between ASIC and mc frame, 0.3W/m/K
Bonding between cover and mc wafer
Symmetry, front, back and right side
Bump bonds, ASIC and Sensor, 0.12W/m/K • SnAG3.5 -> 33W/m/K • Pixel area 300µm x 300µm, bump diameter 20µm• Area ratio gives 0.12W/m/K for contiguous material
GTK Cooling Meeting 10
Temperature Distribution
December 2, 2011
ASIC 100µm thick
-3.2837°C
~ -12.6°C
ASIC 200µm thick
-7.0151°C
~ -14.2°C
∆T over Sensor ~ 9.3°C
∆T over Sensor ~ 7.2°C
GTK Cooling Meeting 11
Total Deformation
December 2, 2011
ASIC 200µm thick, fixed by symmetry boundary condition on the right side
Maximum Deformation ~ 3µm
ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)
Maximum Deformation ~ 32µm
Symmetry boundary conditionFixed support boundary condition
GTK Cooling Meeting 13
Thermal Stress
December 2, 2011
ASIC 200µm thick, fixed by symmetry boundary condition on the right side
Maximum Stress ~ 12.1MPa
ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)
Maximum Stress ~ 65.7MPa
Symmetry boundary conditionFixed support boundary condition
GTK Cooling Meeting 15
Content
December 2, 2011
• Model thermal frame
• Layout channel geometry (analytical)
GTK Cooling Meeting 16
Constraints
December 2, 2011
• Channel length 60mm• Width cooled area 6mm• ∆T between inlet and
outlet 5K (-> m, ∆p)• Junction temperature = ∆TJ
between wall and mean fluid temperature
• ∆TJ depends on geometry and heat flux60mm
• K takes into account the ratio between the hydraulic area and the heat exchange area in a square shaped channel
∆TJ
GTK Cooling Meeting 17
Influence of the Wall Width
December 2, 2011
wall width channel depth channel width DTJunction Dpchannel
[µm] [µm] [µm] [K] [bar]50 250 100 4,472 2,33
100 250 100 5,962 3,11200 250 100 8,943 4,66
• Smaller walls lead to more channels and more heat exchange surface• ∆Tjunction and ∆pchannel rise with the wall width
GTK Cooling Meeting 18
∆TJ and ∆p with 50µm wall
December 2, 2011
channel width [µm]
∆TJ / ∆pin_out
[K] / [bar]
0 50 100 150 200 250 3000
2
4
6
8
10
12
14
16
18
20
channel height 350µmchannel height 250µm
∆pin_out
∆TJ
GTK Cooling Meeting 19
∆TJ and ∆p with 100µm wall
December 2, 2011
channel width [µm]
0 50 100 150 200 250 3000
2
4
6
8
10
12
14
16
18
20
channel height 350µmchannel heigth 250µm
∆TJ / ∆pin_out
[K] / [bar]
∆pin_out
∆TJ
GTK Cooling Meeting 20
∆TJ and ∆p with 200µm wall
December 2, 2011
channel width [µm]
0 50 100 150 200 250 3000
2
4
6
8
10
12
14
16
18
20
channel height 350µmchannel heigth 250µm
∆TJ / ∆pin_out
[K] / [bar]
∆pin_out
∆TJ