engineering guide printed circuit boards

Delivering Quality Since 1952.

TECHNICAL ENGINEERING GUIDE

PRINTEDCIRCUIT BOARDS

PRINTED CIRCUIT BOARDS

1

DELIVERING QUALITY SINCE 1952.

TECHNOLOGY OVERVIEW

ENGINEERING OVERVIEW

Epec Engineered Technologies designs and manufactures customized, built-to-print, performance-critical products for all sectors of the electronics industry.

At Epec, we have a powerful story to tell a history of great achievements, world class talent, and innovative breakthroughs, but most importantly, a story of helping our customers deliver their high quality products to market, faster.

Epec has a sixty year history of reliability, on time delivery, and financial stability. Our continuous investment in people, technology, and new ideas are making it easier for our customers to do great work.

We have built the industrys leading supply chain platform and technology team, with Epec UL certified manufacturing operations in Shenzhen, Taipei, and North America, to seamlessly manage the needs of our customers product life cycles.

With more than 100 dedicated employees throughout North America and Asia, Epec EngineeredTechnologies has become one of the fastest growing companies in the Industry.

Epec has built one of the Industrys leading global supply chain and engineering platforms.

As one of North Americas leading PCB and built-to-print engineered product companies, Epecs annual capital expenditures are consistently among the highest in the industry.

Our investments are focused on world class engineering design systems, such as EpecDFx, and on continually improving our global technology platform, to accelerate our customers time to market.

Epec's technical engineering and manufacturing solutions have helped thousands of leading companies reduce their time to market.

With 24/7 North American engineering support we provide our customers the most in-depth feedback, with exact accuracy, eliminating delays and quality problems.

Epec can provide complete engineering and design services on all our engineered products, from concept through production in a quick and efficient time frame. With over sixty years of experience and knowledge across diverse industries, Epec has the ability to think outside the box and create innovative designs and solid manufacturing solutions.

Our technical staff will work with you to generate material specifications, product renderings, complete documentation and prototypes.


2

STANDARD LEAD TIME - 20 Working DayTechnology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day

1 - 4 Layers x x x x x x

6 - 10 Layers x x x x

> 10 Layers x x

* Prototype and Production Quantities Available

Solder Mask..........Green, Blue, Red, Black, Clear

Min Solder Mask Web................................... .004

Max Board Thickness................................... .250

Maximum Board Size............................. 22 x 42

Max Copper Weight....................................... 6 oz

Standard SMD Pitch..................................... .016

PCB LEAD TIMES

PRINTED CIRCUIT BOARD CAPABILITIES

STANDARD PCB FEATURES

Materials FR-4 ALL Types CEM-1 & CEM-3 Heavy Copper RF and High Speed Materials MixedMaterials/FR-4Teflon Metal Backed Boards Polyimide

Surface Finishes ENIG HASL Pb Free HASL Immersion Silver & Tin ENEPIG Hard Body Gold Soft Bondable Gold OSP

Plating Conductive Via Fill Edge Plating Castellations Plated Slots Gold Tabs Plasma Etch Back Peelable Solder Mask

Drill & Rout Jump Score Counter Sinks / Counter Bores Control Depth & Laser Drilling 12:1 Aspect Ratio Depth Controlled Milling

Design 1 to 18 Layers 3 Mil Lines & Spaces IPC Class 2 / Class 3 Impedance Control +/-10% Down to .006 Holes Blind & Buried Vias Silver Thru Hole Via in Pad Laser Direct Imaging MicroVias

PRINTED CIRCUIT BOARD CAPABILITIESMIL-PRF-55110Sequential LaminationNet List Compare Ionic CleanlinessFree DFx File Check

Design ServicesFlex & Rigid Flex ITAR RegisteredThermal ManagementHigh Density Interconnects


3

TECHNOLOGY ROAD MAP

Standard AdvancedMechanicalMaximum Layer Count 18 26Maximum Board Thickness .250" .287"Maximum Board Size 20" x 23" 20" x 24"Smallest Hole Size (Finished) .006" .005"Aspect Ratio 11:01 12:01Minimum Component Pitch .020" (soldermask between pins) .016" (gang masked)Minimum Core Thickness .003" .002"Jump Scoring Yes YesCountersinks/Counterbores Yes YesPlated Hole Tolerance +/- .003" +/- .002Warpage 1% 0.75%

Copper WeightInner Layers 4 ounces 4 ouncesOuter Layers 6 ounces 8 ounces

TechnologyImpedance Control +/- 10% +/- 5%Via Technology Blind/Buried Blind/BuriedLaser Drilling (Microvias) Yes YesPlasma Etching Yes YesLaser Direct Imaging Yes YesVia Filling Non-Conductive Conductive

Available Surface FinishesHASL Immersion SilverENIG OSP

Pb Free HASL Immersion GoldImmersion Tin Electroplated Gold

MaterialsFR-4 (140-220 Tg) Teflon

Polyimide ThermagonCEM-1 ArlonRogers Getek

Agency QualificationsUL (File #E86319)

ISO-9001:2008 TS-16949

IPC-6012 Class 3Standard - Everyday CapabilityAdvanced - Everyday Capability with a small premium.


4

PROCESS CAPABILITIES

Standard AdvancedAnnular RingInternal Minimum Pad Size .016"largerthanfinished hole size

.014"largerthanfinished hole size with teardrop

External Minimum Pad Size .016"largerthanfinished hole size.014"largerthanfinished hole size with teardrop

Increase pad size accordingly for annular ring requirements greater than .001". Vias may use pad .010" larger than Finished Hole Size Holes requiring greater than .001" copper (i.e. 1 oz plated to 3 oz Finish) require and additional .004 pad diameter.

Plane Layer ClearancePTH & NPTH Hole Clearance to Plane .030"largerthanfinishedholesize .024"largerthanfinishedholesize

PTH & NPTH Hole to Inner Layer Trace .015" Spacing .012" Spacing

Line Width and SpaceInner Layer Line width on Hoz copper Minimum -.004" Minimum - .004"

Inner Layer Line width on 1oz copper Minimum-.005" Minimum-.005"

Inner Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"

Inner Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"

Outer Layer Line width on H ounce base copper Minimum-.004" Minimum-.004"

Outer Layer Line width on 1oz base copper Minimum -.005" Minimum - .005"

Outer Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"

Outer Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"

Inner layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"

Inner layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"

Inner layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"

Outer layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"

Outer layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"

Outer layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"

Trace to Plane Spacing Minimum -.008" Minimum -.008"

Feature to Board Edge *does not include tabs Minimum -.010" Minimum -.008"

Feature to Score Edge Minimum -.020" Minimum -.015"

Solder MaskLPI Conductor Overlap .005" Larger Than Feature Size .004" Larger Than Feature Size

LPI Mask Clearance .003" Minimum .002" Minimum

LPI Mask Web .005" Minimum .004" Minimum

Less than 4 mil web between component pins may result in loss of mask between SMT pads.

SilkscreenSilk Screen Ink .008" minimum aperture .006" minimum aperture

Copper Features (ETCHED TEXT) .010" minimum aperture .010" minimum aperture

Font Height .065" minimum height .045" minimum height

Distance from Feature (clipping) .006" minimum from feature .006" minimum from feature

Ifthespecificationsofaboarddesignfallintotheadvancedcategoryitmaybesubjecttoadditionalcharges.


5

LAMINATE INFORMATION

Arc

Res

ista

nce

Min

imum

(sec

.)

Elec

tric

al S

tren

gth

Min

imum

(vol

ts/m

il.)

Flam

mab

ility

UL9

4

Gla

ss T

rans

ition

Tem

pera

ture

Tg

(C

elsi

us)

Deg

rada

tion

Tem

pera

ture

by

TGA

(Cel

sius

)

Die

lect

ric C

onst

ant

(1 M

Hz)

Die

lect

ric C

onst

ant

(1 G

Hz)

Loss

Tan

gent

at

(1 M

Hz)

Loss

Tan

gent

at

(1 G

Hz)

Vendor Product Type IPC 4101ASHENGYI S1000 Low CTE FR4 /24 100 - V-0 175 335 4.8 - 0.013 -

S1130 FR4 /21 115 - V-0 135 - 4.6 - 0.016 -

S1141 FR4 /21 115 - V-0 140 - 4.5 - 0.016 -

S1155 FR4/Halogen Free /21 115 - V-0 135 - 4.7 - 0.01 -

S1165 FR4/Halogen Free /94 127 - V-0 170 260 4.8 - 0.007 -

S1170 FR4 /24 123 - V-0 175 340 4.6 - 0.012 -

S1600 High CTI FR4 /21 126 - V-0 135 - 4.7 - 0.016 0.008

S1860 FR4 /29 90 - V-0 210 - 3.6 - 0.008

S1440 FR4/UV Block /97 125 - V-0 140 - 4.7 - 0.0015 -

S2130 CEM-3 - 115 - V-0 132 - 4.6 - 0.0016 -

S3110 CEM-1 - 118 - V-0 110 - 4.4 - 0.022 -

HONG TAI HTE-420 FR4 - 120 - V-0 145 - 4.2-4.8 - 0.019 -HTE-740 FR4 - 120 - V-0 175 - 4.2-4.8 - 0.019 -

ISOLA ED130UV FR4 /21 100 - V-0 135 - 4.7 4.34 0.02 0.016FR406 FR4 /24, /26, /28 60 1000 - 170 295 - - - -

FR408 FR4 /24 120 1400 - 180 370 - 3.63 - 0.013

P95 Polymide /41 131 1200 V-0 260 4.4 4.2 0.016 0.014

Policlad 370HR FR4 /24, /26, /98 115 54 V-0 180 350 4.7 4.5 0.016 0.017

Getek PPO /25 >60 1200 V-0 175-185 - 3.6-4.2 - .010-.015 -

IS-410 FR4 /24, /26, /28 129 1100 V-0 180 350 - - - -

ITEQ IT140 FR4 /21 60 - V-0 135 305 5.4 - 0.035 -

IT140G FR4/Halogen Free /21 90 760 V-0 155 365 4.5 - 0.015 -

IT158 Low CTE FR4 /24 125 - V-0 155 345 4.6 - 0.016 -

IT170G FR4/Halogen Free /24 100 - V-0 180 380 4.5 - 0.009 -

IT180 FR4 /24, /99 60 760 V-0 170 340 4.4 - 0.016 -

IT600 High CTI FR4 /21 60 - V-0 140 305 4.8 - 0.018 -

NAN YA NP-140 FR4 /21 - - V-0 140 311 - 4.2 - 0.015NP-170TL FR4 /24 - - V-0 175 312 - 4.22 - 0.013

NPG-170 FR4/Halogen Free /94 90 - V-0 170 355 - 4.3 - 0.012

NP-180 FR4 /24 120 - V-0 180 359 - 4.36 - 0.019

NPG-180 FR4/Halogen Free - - - V-0 180 380 - 4.8 - 0.016


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LAMINATE INFORMATION

Arc

Res

ista

nce

Min

imum

(sec

.)

Elec

tric

al S

tren

gth

Min

imum

(vol

ts/m

il.)

Flam

mab

ility

UL9

4

Gla

ss T

rans

ition

Tem

pera

ture

Tg

(C

elsi

us)

Deg

rada

tion

Tem

pera

ture

by

TGA

(Cel

sius

)

Die

lect

ric C

onst

ant

(1 M

Hz)

Die

lect

ric C

onst

ant

(1 G

Hz)

Loss

Tan

gent

at

(1 M

Hz)

Loss

Tan

gent

at

(1 G

Hz)

Vendor Product Type IPC 4101A

NELCO N4000-13 PPE /29 123 1200 - 210-240 350 3.8 3.7 - 0.014N4000-13 SI PPE /29 123 1000 - 210-240 350 - 3.5 - 0.009

N4000-2 FR4 /21 65 1250 V-0 130-140 300 4.4 - 0.027 -

N4000-6 FR4 High Temp /24, /26 65 1300 V-0 170-175 300 4.3 4.1 0.027 -

N4000-7 FR4 /24 124 1100 V-0 155 317 4.5 4 0.017 0.017

N5000 BT /30 118 1200 - 185-220 334 3.8 3.6 - 0.014

N7000-1 Polymide /40, /41 136 1350 V-1 250-260 389 3.9 3.9 - 0.015

ROGERS 3003 PTFE - - - V-0 - 500 - 3 - 0.00134003C Ceramic - - 650 - 280 425 - 3.38 - 0.0027

4350B Ceramic - - 800 V-0 280 390 - 3.48 - 0.0037

4450B Ceramic - - 1000 V-0 >280 - - 3.54 - 0.004

TMM3 Ceramic - - 650 - >280 425 - 3.27 - 0.002

TMM4 Ceramic - - 650 - >280 425 - 4.5 - 0.002

Ultralam 2000 PTFE - 185 - V-0 - - - 2.6 - 0.0022

ARLON 25N Ceramic /10 - - - 260 - - 3.38 - 0.002525FR Ceramic /11 - - V-0 260 - - 3.58 - 0.0035

85N Polyimide /40 - - - 260 - 4.39 - 0.008 -

TACONIC TLC PTFE - >180 - V-0 - - - 3.2 - 0.003TLE PTFE - >180 - V-0 - - - 2.95 - 0.0028

TLT PTFE - >180 - V-0 - - - 2.5 - 0.0006

TLX PTFE - >180 - V-0 - - - 2.5 - 0.0019

DUPONT PYRALUX AC Polyimide - - - V-0 - - 3.7 - 0.014 -PYRALUX AP Polyimide - - - V-0 220 - 3.4 - 0.003 -

TAIFLEX 2LPSE 1005 Polyimide - - - V-0 - - 3.65 - 0.009 -THKD050513 Polyimide - - - V-0 - - 3.65 - 0.009 -

For more information on Laminates, visit the following websites.SHENG YI - www.syst.com.cn ROGERS - www.rogerscorp.com

ISOLA - www.isola-group.com ARLON - www.arlon-med.comITEQ - www.iteq.com.tw TACONIC - www.taconic-add.com

NAN YA - www.npc.com.tw DUPONT - www.dupont.comNELCO - www.parkelectro.com TAIFLEX - www.taiflex.com


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PCB DESIGN SERVICES

A Manufacturing MentalityFor more than 60 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.

We pride ourselves on providing high quality design and layout services, but it is equally important that our customers can manufacturer their parts in the most cost effective manner. Our goal is to reduce the overall cost of our customers product by designing a circuit board that can be easily manufactured by Epec or anyone else in our industry.

REVERSE ENGINEERING AND SCANNING

With the consolidation of the printed circuit board industry over the last few years, many of our customers find themselves needing to order boards but they have no electronic data. Their previous supplier may have gone out of business and the only copies of the artwork or electronic data have been discarded.

At EPEC, we can create electronic data from virtually anything, including, films, drawings (DXF), 1 to 1 paper plots, and even boards themselves.

We have over 10 years of experience in creating electronic data from all types of media using our state of the art scanning equipment and software. We have developed a systematic process to make sure that all of the board features are double checked to ensure that everything has been replicated properly. We understand how important it is to get even the smallest details right when it comes to our customers circuit boards.

Please contact your sales representative for more specific details around our design and manufacturing guidelines.

PCB DESIGN CAPABILITIES

Design Capabilities: Single and Double Sided Multi-layer (up to 20-Layers) Flex and RigidFlex High Density Surface Mount

(BGA, CGA) Analog, Digital & Mixed Designs Impedance Control Matched Line Lengths Differential Pairs Auto routing for dense

multi-layer designs

PCB Software: PADS AutoCAD CADSTAR ORCAD Accel PCAD

Design Service: Gerber completion in

as few as 5 days

PCB Layout: Complete assembly

drawings for fabrication In-Circuit Test Data Generation Pick and Place

Data Generation Panelization Drawings Gerber Editing Scanning


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EpecDFx ENGINEERING PLATFORM

EpecDFx is a whole new quality and manufacturability platform, combining the industry's latest, most advanced technology and engineering expertise.

Prototypethroughproduction Reducesoverallcosts Acceleratestime-to-market

EpecDFx IN ACTION

Typical example of a subtle, yet crucial engineering and design problem discovered before fabrication; EpecDFxandEpecsengineeringteamdetectsanddevelopsmust-fixthroughoptimalsolutions.

Experience EpecDFx, and how our engineering support gives customers the most in-depth feedback, with exact accuracy, available anywhere in the printed circuit board Industry, eliminating delays and quality problems.

EpecDFx issue shows:IsolatedconnectioncausedbyoversizedplaneclearancesnotcaughtbyCADsystemresultinginnetlistviolation.

Reducedthermalconnectionduetoproximitytolargesplitplaneline.

Impact:

Electricalintegrityofthedesignisinvalid,resultinginscrappedboard.

Compromisedthermalconnectionresultsinpoorsolderabilitytoconnectorpin.

EpecDFxCritical/Must Fix

Suggestion:Reduceplaneclearancesforholestoallowconnection.

Result:Netlistintegrityisrestored.

EpecDFx BetterSuggestion:Reduceplaneclearancesforholestoallowconnection.Plusrotatethermalrelief45degrees.

Result:Netlistintegrityisrestored,andthermalpropertiesareimproved.

EpecDFx BestSuggestion:Reduceplaneclearancesforholestoallowconnection.Plusrotatethermalrelief45degreesandreduceplaneclearanceline.

Result:Netlistintegrityisrestored,andthermalpropertiesaremaximized.


9

HEAVY COPPER PCBS

Epec has been building heavy cooper circuit boards with traces and copper planes of up to 6 ounces or over 20 years. Our expertise is in producing at a reasonable cost, heavy copper PCBs that are of proven designs. Our engineering team can work with you to review your design to make sure that they can be manufactured with the highest quality at the best overall cost.

Industries Served Using Heavy Copper:

Welding Equipment Solar Panel Manufacturers Power Supplies Automotive Electrical Power Distribution Power Converters

Heavy Copper PCB Capabilities:

Maximum Number of Layers = 16 Laminate FR-4 (All Tg Ranges), Teflon, Ceramic Finished Thickness = .020 - .275 Green, Blue, Red, Black, Clear & White Solder Masks & Legend Inks Minimum Soldermask Clearance 6 mils Minimum Solder dam Width 5.5 mils Hot Air Solder Leveling (HASL) Immersion Gold (ENIG) & Immersion Silver Blind & Buried Vias Minimum Drill Bit Hole Size = .012 Minimum Holes Size - .008 +.005/-.008 Maximum Hole Aspect Ratio = 10:1 Maximum Copper Weight = 6 oz. (UL Approved) Controlled Impedance +/- 10% Minimum Silkscreen Line Width 8 mils

Production MinimumsMeasured in Inches H oz 1 oz 2 oz 3 oz 4 oz 5 oz 6 oz

Min. Conductor Width 0.004 0.005 0.006 0.007 0.008 0.009 0.10

Min. Conductor Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. Pad to Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. Conductor-to-Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. PTH Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014

Min. VIA Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014

Min. Distance - Hole to Board Edge 0.010 0.010 0.010 0.010 0.010 0.010 0.010


10

THERMAL CLAD AND METAL BACKED PCBS

Epec offers Thermal Clad PCBs which is a dielectric metal base with a bonded copper circuit layer. This creates superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics. Thermal clad is a unique layered system comprised of the follow layers:

Circuit Layer: Printed circuit foil with thickness of 1 oz to 5 oz.

Dielectric Layer: Many different options which offer electrical isolation with minimum thermal resistance. Also used to bond the circuit layer and base material together. Each specific dielectric has its own UL recognition.

Base Layer: Most often Aluminum, but can also be copper. The most commonly used thickness is 0.040 (1.0 mm) although many thicknesses are available.

THERMAL CLAD PCB APPLICATIONS

Power Conversion: Thermal clad offers a variety of thermal performances is compatible with mechanical fasteners and is highly reliable.

LEDs: Using Thermal Clad PCBs assures the lowest possible operating temperatures and maximum brightness, color and life.

Motor Drives: Thermal Clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements.

Solid State Relays: Thermal clad offers a very thermally efficient and mechanically robust substrate.

Automotive: The automotive industry uses Thermal clad boards as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization.

Improve the durability and performance of your product by using Thermal Clad PCBs. Simple designs and low thermal impedance of the dielectric out performs all other PCB insulators for power and high-operating temperature components.

Thermal Clad PCB Materials: Bergquist Thermagon Arlon Denka

Thermal Clad PCB Specifications: 1 & 2 Layer Dielectrics HASL, ENIG & Pb Free HASL finish Up to 5 oz finished Cu Al & CU base material up

to .250 thick

Thermal Clad PCB Benefits: Lower Operating Temperatures Improved Product Durability Increased Power Density Increased Thermal Efficiency Reduced Number of Interconnects Lower Junction Temperatures Reduced PCB Size Eliminates Older Hardware Minimizes Labor Required for Assembly Wide Variety of Form Factors Minimize Thermal Impedance


11

HDI HIGH DENSITY INTERCONNECT PCB

HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boardsmay have blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards using less layer construction.

Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.

HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.

Key HDI BenefitsAs consumer demands change, so must technology. By using HDI technology, designers now have theoption to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

Via in Pad ProcessInspiration from surface mount technologies from the late 1980's has pushed the limits with BGA's, COBand CSP into smaller square surface inches. The via in pad process allows for vias to be placed within thesurface of the flat lands while using eight additional steps to complete this unique process. Specialty equipment and trained technicians follow the process closely to achieve the perfect hidden via.

Quality remains the most important factor for the consumer second to price. Using HDI technology during design, it is possible to reduce an 8 layer through-hole PCB to a 4 layer HDI microvia technology packed PCB. The wiring capabilities of a well-designed HDI 4 layer PCB can achieve the same or better functions as that of a standard 8 layer PCB.

Via-in-Pad technology shown .005 laser drill within .015 BGA capped and plated pads.

.005 via holes within .014 copper pads are filled, capped and plated over allowing for

small component placement.


12

HDI HIGH DENSITY INTERCONNECT PCB (continued)

Why Build Non-Conventional HDI BoardsWith 60 years of experience in the printed circuit board industry, Epec has always made its top focus to be our customer needs. With technology increases every day and devices get smaller, we are always increasing our capabilities to exceed the demands of our customers, ensuring we deliver the highest quality engineered products available.

With our engineering knowledge we welcome the opportunity to expand our HDI circuit board product offering to our customers helping them stay on top in their market.

Our teams of engineers are always available 24/7 to help our customers design and manufacture state of the art products for their respected industry. Whether you need a quick turn or a prototype order, design help, or require ITAR or special certifications, we will meet your schedule to get your products to market faster.

Industries That Utilize HDI: Automotive Industry Medical Industry Aerospace & Military Consumer Electronics

Products That Benefit From HDI: Portable Devices Mobile Devices Hand Held Computing Scanning Devices & Printers

Our HDI Technology Includes: Prototype & Production Size Orders Quick Turns & Standard Lead Times Blind & Buried Micro-Vias Sequential Lamination Exotic Materials Extreme Thicknesses Stacked Micro-Vias Staggered Micro-Vias Thin Lines & Spacing ITAR / Military


13

MANUFACTURING PROCESS CAPABILITIES

Category Description Sym. Capability1. Microvia Diameter 1.1

Microvia Diameter at Target Land A100 um0.004

1.2Microvia Diameter at Capture Land B

125 um0.005

1.3Microvia Target Land Size C 0.012

1.4Microvia Target Land Size D

450 um0.0177

2. Stagger & Stack 2.1Min. Staggered Via Pitch Staggered Via Pitch

A 560 um0.022

2.2RCC Thickness RCC

B 50 um0.002

2.3Blind Via Layers N 2

3. Material & Construction 3.1Finished Board Thickness H 0.012 - 0.250

3.2Min. Inner Layer Thickness H1

0.075 mm0.003

3.3Min. Dielectric Thickness H2

0.05 mm0.002

3.4Max. Inner Layer Copper T1 10 oz

3.5Max. Outer Layer Copper T2 6 oz

4. Warp

4.1Warp and Twist (Max.) A B < 0.75%

5. Pad 5.1Min. Finish Hole Size H 0.005

5.2Min. Land Size H 0.018

5.3Min. Annual Ring for Via R1 IPC Class 2

5.4Min. Annual Ring for Component R1

0.05 mm 0.002, provided designed per IPC


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Category Description Sym. Capability6. Drill

6.1Tolerance for PTH Hole A

0.08 mm0.003

6.2NPTH Hole Tolerance B

0.05 mm0.002

7. Registration for S/M7.1Registration for S/M to Pattern S1-S2 0.0024

7.2Registration for Legend to S/M NA 0.005

8. Registration for Drill 8.1Registration for Drill to Inner Layer S

0.075 mm0.003

8.2Registration for Drill to Datum S

0.05 mm0.002

8.3Registration for First Drill to Second Drill

NA 0.005

9. Registration for Layers 9.1Layer to Layer for 4 layers S

0.08 mm0.003

9.2Layer to Layer for 6 layers S

0.10 mm0.004

9.3Layer to Layer for 8 layers S

0.13 mm0.005

10. Line Width10.1I/L Min. Width (0.5 oz) W2 0.003

10.2O/L Min. Width (0.5 oz) W1 0.003


15


Category Description Sym. Capability11. Line Space

11.1I/L Min. Space S2 0.003

11.2O/L Min. Space (0.5 oz) S 0.003

12. Drill Capability 12.1Max. Aspect Ratio(Board Thickness 0.063)

H/T 12.0

12.2Min. Drill Hole Size (Board Thickness 0.063, After Plating)

H 0.0083

13. S/M Thickness13.1Max. Thickness on Copper H1

0.025 mm0.001

13.2Max. Thickness at Shoulder H2

0.0075 mm0.0003

14. S/M Capability14.1Min. SMD Space for Dam W2 0.0078

14.2Min. Dam Size W1 0.0003

15. Carbon Capability 15.1Max. Contact Resistance NA 30/sq

15.2Max. Primary Resistance NA 30

15.3Min. Thickness NA 0.0004

15.4Min. Space A 0.015

15.5Max. Space for Registration B 0.007


16


Category Description Sym. Capability16. HAL Capability 16.1

Board Thickness for HAL H20.6 mm0.0236

16.2Min. Pad Width/Space for HAL W

0.25 mm0.0098

16.3HAL Thickness for any point H1

0.001 mm ~ 0.025 mm40 micro-inch ~ 0.001

16.4Thickness on QFP Pad (0.05 Wide Quad)

A 0.015 mm ~ 0.030 mm0.0006 ~ 0.0012

17. HAL Capability

17.1Outline Tolerance-Punching AB NA

17.2Outline Tolerance-Routing AB 0.005

18. Beveling Capability18.1Beveling Angle B 200-600

18.2Tolerance for Outline of Bevel A + - 0.005

19. V-Cut Capability 19.1V-Cut Angle V-Cut C 30

19.2Range of Board Thickness H 0.030 ~ 0.125

19.3Tolerance of V-Cut Residual B

0.05 mm0.003

19.4V-Cut Off Line V-Cut D

0.125 mm0.005


17


Category Description Sym. Capability20. Test Capability 20.1

Voltage NA 5-500 VDC

20.2Isolation NA 500M

20.3Continuity NA 20~100K

20.4Min. SMD PAD Pitch SMD P

0.3 mm0.0118

21. Impedance Control Capability

21.1ImpedanceControl>50 NA +/- 10%

21.2ImpedanceControl50

NA +/- 10%

22.2Differential Impedance Control50

NA +/- 10%

22.2Coplanar Impedance Control

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