Transcript
Page 1: Lockheed Martin diamond presentation

Lockheed-­‐Martin  Advanced  Technology  Center  J.  Michael  Pinneo,  Ph.D.,  J.D.  

September  24,  2009  

1  J.  Michael  Pinneo,  [email protected]  

Page 2: Lockheed Martin diamond presentation

Survey  

!  I.  Diamond  synthesis  and  properties  

!  II.    Aerospace  applications  

2  J.  Michael  Pinneo,  [email protected]  

Page 3: Lockheed Martin diamond presentation

CVD  Diamond  -­‐  Synthesis  ! Overall  chemistry:    deposition  occurs  in  diamond  metastability  region,  graphite  stability  region  !  i.    CxHy  +  H0  !  Cg+  Cd  (mostly  graphite)  !  ii.    Cg  +  H0  !!!  CxHy  !  iii.    Cd  +  H0  -­‐>  CxHy    (~1/400  ii.)  

! Yields  poly-­‐  and  single-­‐crystal  

3  J.  Michael  Pinneo,  [email protected]  

Page 4: Lockheed Martin diamond presentation

CVD  Diamond  –  Synthesis  Methods  ! Hot  filament,  plasmas,  combustion,  ...  

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VHF  Plasma,  8”  

Combustion,  4”  linear  

Microwave  Plasma,  4”  

RF  Plasma  Torch  

DC  Plasma  Torch  

J.  Michael  Pinneo,  [email protected]  

Page 5: Lockheed Martin diamond presentation

CVD  Diamond  -­‐  Varie7es  Scale-up ExperienceMicrowave Diamond CVD

30Kw, 915 MHzPlasma ScanningDeposition Diameter 14"Conformal 3-D CapabilityThickness Uniformity <8% over 12"

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Diamond  on  Si  Wafers  

Diamond-­‐coated  BC  wear  blocks  and  Si3N4  ball  bearing  

Diamond  heat  spreader  prototype  for  microprocessor  

Diamond-­‐coated  Si3N4  fiber  

Diamond-­‐coated  Si3N4  dome  (14”  dia  x  3.5”  deep)  

J.  Michael  Pinneo,  [email protected]  

Page 6: Lockheed Martin diamond presentation

CVD  Diamond  –  Thermal  Proper7es  

! Thermal  conductivity  @  273°K:  8  –  25  W/cm-­‐°K  ! Thermal  conductivity  peak  ~  77°K:  60  W/cm-­‐°K  ! Thermal  diffusivity:  1.16  cm2/sec  ! Thermal  conductivity  is  high  even  in  nanocrystalline  films  

! Extremely  useful  in  thermal  management  

6  J.  Michael  Pinneo,  [email protected]  

Page 7: Lockheed Martin diamond presentation

CVD  Diamond  –    Mechanical  Proper7es  

! Hardness:  10,000  kg/mm2  ! Modulus:  1,100  Gpa  ! Poisson’s  ratio:  ~  0.06  ! Thermal  Expansion  Coefficient:  ~  1  x  10-­‐6/°C  @  273°K  ! Coefficient  of  sliding  friction  (µ):  10-­‐2  to  10-­‐3    

!  Sonic  velocity:  ~  18  km/sec  

7  J.  Michael  Pinneo,  [email protected]  

Page 8: Lockheed Martin diamond presentation

CVD  Diamond    Op7cal  Proper7es  

! Transparent:  225  nm  –>  DC  !  ~  5µm  –  6µm,  intrinsic  phonon  absorption  

! Refractive  Index  ~  2.4  ! Emissivity  @  273°K  ~  0.04  

8  J.  Michael  Pinneo,  [email protected]  

Page 9: Lockheed Martin diamond presentation

CVD  Diamond  Electronic  Proper7es  

! Resistivity,  intrinsic:  >  1015  Ω-­‐cm  ! Resistivity,  B-­‐doped:  10-­‐3  Ω-­‐cm  ! Dielectric  constant:    5.7  ! Breakdown  field:  >  107  V/cm  ! P  and  N  dopants:  B,  B  &  D  plasma  

9  J.  Michael  Pinneo,  [email protected]  

Page 10: Lockheed Martin diamond presentation

Aerospace  Applica7ons  Thermal  Management  

10  J.  Michael  Pinneo,  [email protected]  

Page 11: Lockheed Martin diamond presentation

Heat  Spreaders  for  Ac7ve  Devices  

Device

Cold Plate

Diamond Heat Spreader!

K = 12 W/cm-°K

SiC Heat Spreader!

K = 2.5 W/cm-°K

T1  

T2  

Tr1  

Tr2  

Trn  

Q  ∝  (T1  –  T2)    

Q  ∝  1/(∑  Tr1…Trn)  

11  J.  Michael  Pinneo,  [email protected]  

Page 12: Lockheed Martin diamond presentation

Diamond  Microprocessor    Heat  Spreaders  

!  IR  image  of  processor  temperature  

!  Diamond  enabled  1.8x  clock  rate  increase    

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Die Temperaturew/ Copper Spreader

Die Temperaturew/ Diamond Spreader

Copper  Heat  Spreader   Diamond  Heat  Spreader  

J.  Michael  Pinneo,  [email protected]  

Page 13: Lockheed Martin diamond presentation

GaN  HEMT  

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5© 2005-2006 Group4 Labs, LLC. All Rights Reserved

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d

T0 = 23°C

TP

!T = TP–T0

zy

!"#$%&'(%)*#'(+!$,-!,$#

J.  Michael  Pinneo,  [email protected]  

Page 14: Lockheed Martin diamond presentation

Thermal  Management  Heat  Spreaders,  GaN  HEMTs  

! Attach  100µm  diamond  heat  spreader  to  GaN  device:  !  200%  increased  power  cf.  SiC  heat  spreader;  

!  1000%  increased  power  cf.  Si  heat  spreader.  

Courtesy  Group  4  Labs,  and  Jonathan  Felbinger  and  Prof.  Eastman,  Cornell  University.  

14  J.  Michael  Pinneo,  [email protected]  

Page 15: Lockheed Martin diamond presentation

!  4”  free-­‐standing  GaN  wafer  on  diamond  

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Courtesy  Group  4  Labs  

J.  Michael  Pinneo,  [email protected]  

Page 16: Lockheed Martin diamond presentation

16  J.  Michael  Pinneo,  [email protected]  

Separation  between  linear  sources  [µm]    

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GaN  HEMT  on  Diamond  ! Benefits:  

! Higher  output  power  !  Lower  operating  temperature  !  Greater  device  density  

!  System  Impact:    !  Radar  -­‐>  increased  target  acquisition  distance  !  Active  ECM  -­‐>  increased  range,  effectiveness  !  Increased  MTBF  -­‐>  reduced  maintenance  $,  time  

17  J.  Michael  Pinneo,  [email protected]  

Page 18: Lockheed Martin diamond presentation

Poten7al  Applica7on  

!  F-­‐35  thermal  issues  !  Fuel  used  as  internal  systems  heat  sink  !  Low  fuel  near  end  of  mission:  

!  Higher  fuel  temperature  !  Lower  ∆T  in  thermal  transfer  chain  !  Increased  avionics  temperature  

18  J.  Michael  Pinneo,  [email protected]  

Page 19: Lockheed Martin diamond presentation

F-­‐35  Thermal  Issue  

! Reduce  overall  thermal  resistance  between  avionics  and  fuel  !  Apply  diamond  to  thermal  transfer  path:  

!  Device  level:  diamond  heat  spreaders  !  Card/module  level:  diamond  heat  pipes  &  plates  !  Heat  exchangers:  diamond  or  diamond/SiC  composites  

19  J.  Michael  Pinneo,  [email protected]  

Page 20: Lockheed Martin diamond presentation

Op7cal  Applica7ons  

!  Important  properties  !  Broadband  transparency  

!  225  nm  -­‐>  DC  !  Intrinsic  phonon  absorption  ~  5  µm  –  6  µm  

! Hardness  !  Low  loss  tangent  (<  10-­‐4)  

20  J.  Michael  Pinneo,  [email protected]  

Page 21: Lockheed Martin diamond presentation

IR  Op7cal  Applica7ons  

Rain/dust  impact  damage  on  IR  optic  (F-­‐15E)    

21  J.  Michael  Pinneo,  [email protected]  

Page 22: Lockheed Martin diamond presentation

 IR  Op7cal  Applica7ons  

! Erosion  barrier  for  ZnS/ZnSe  IR  optics  ! Hardness,  IR  transparency  

!  Can’t  CVD  direct  on  IR  material,  but  chalcogenide  “glue”  works.  

!  AR  coatings  are  available.   V

ISIBLE

 

22  J.  Michael  Pinneo,  [email protected]  

Page 23: Lockheed Martin diamond presentation

Op7cs:  High  Power  Lasers  

! Windows/Lenses  ! High  damage  threshold  !  Physically  robust  

!  Solid  State  Lasers  !  Increased  output  !  Reduced  module  volume  

Northrop-­‐Grumman  100  Kw  laser,  Phase  3,  JHPSSL  

Advanced  Tactical  Laser  (ATL)  

23  J.  Michael  Pinneo,  [email protected]  

Page 24: Lockheed Martin diamond presentation

Op7cs:  HPM  Windows  

! DEW:  high  power  microwave  windows  (HPMW)  ! High  K,  low  loss  tangent,  low  TCE  !  >1  Gw  CW,  >  10  Gw  pulsed  @  90  GHz  ! USAF  BAA/Raytheon  2009  win  to  provide  domestic  source  

!  Current  vendors:  Europe,  Asia  !  >$100K  each    

24  J.  Michael  Pinneo,  [email protected]  

Page 25: Lockheed Martin diamond presentation

Mechanical,  Fric7on  &  Wear  

!  Important  properties  !  Low  friction  ! Hardness  ! Modulus  !  Corrosion  resistance  

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F-­‐15E  Exhaust  Flap    Mechanism  

J.  Michael  Pinneo,  [email protected]  

Page 26: Lockheed Martin diamond presentation

Machining  Opera7ons  

! Diamond-­‐coated  tooling  Increased  tool  life  Higher  machining  speeds  Better  workpiece  finish  

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Diamond  –  coated  cutting  tools  courtesy  of  Crystallume,  Inc.  

J.  Michael  Pinneo,  [email protected]  

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Bearings  and  Seals  

! Good  coating  and  performance  increases  shown  for  diamond  on  Si3N4  ball  bearings,  BC  wear  shoes,  and  SiC  pump  seals.  

! Diamond  pump  seals  in  commercial  production  by  Advanced  Diamond  Technologies,  Inc.  

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Diamond-­‐coated  pump  seals,  courtesy  of  Advanced  Diamond  Technologies,  Inc.  

J.  Michael  Pinneo,  [email protected]  

Page 28: Lockheed Martin diamond presentation

Diamond  as  a  MEMS  Material  

! Hardness  &  Modulus  !  Low  self-­‐adhesion/stiction  ! Hydrophobic  ! Tolerate  aggressive  environments  

!  Surface  can  be  functionalized  to  provide  sensing  capability  

28  J.  Michael  Pinneo,  [email protected]  

Diamond  RF  MEMS  Switch  

Page 29: Lockheed Martin diamond presentation

Diamond  for  High  Power  Lasers  !  Desirable  properties:  transparency,  K,  TCE,  damage  threshold  

!  Natural  diamond  laser  demonstrated  in  1985(1)  !  Optically  pumped  (Ar  ion  laser)  !  Lasing  medium:  H3  color  center,  530  nm    !  Tunable  due  to  coupling  with  phonon  energy  levels  !  Efficiency  13.5%  

!  Interesting,  but  natural  diamonds  too  costly  &  rare  

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(1)  Rand  &  DeShazer,  Optical  Letters,  1985  vol.  10  (10)  pp.  481-­‐483  

J.  Michael  Pinneo,  [email protected]  

Page 30: Lockheed Martin diamond presentation

Diamond  for  High  Power  Lasers  ! What’s  changed?  !  Large,  high  quality  single  crystal  diamonds  by  CVD  

!  R.  Hemley’s  group  at  Carnegie  Institute(2)  

! Microwave  plasma  CVD  followed  by  HP  or  LP  anneal  ! Highly  accessible  with  relatively  simple  equipment  !  Cost-­‐effective  technology  

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(2)  Recent  advances  in  high-­‐growth  rate  single-­‐crystal  CVD  diamond,  Qi  Liang,  et  al.,  Diamond  and  Related  Materials,  2009  vol.  18  (5-­‐8)  pp.  698-­‐703  

J.  Michael  Pinneo,  [email protected]  

Page 31: Lockheed Martin diamond presentation

Diamond  for  High  Power  Lasers  ! High  efficiency  diamond  Raman  laser(3)  

!  1.2  watt  output  @  573  nm,  532  nm  pump  !  Conversion  efficiency  63.5%  !  Slope  efficiency  75%  !  Peak  photon  conversion  efficiency  91%  

! Diode-­‐pumped  diamond  Raman  laser  shown  in  2005(4)  

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(3)  Highly  efficient  diamond  Raman  laser,  Mildren  and  Sabella,  Optics  Letters,  2009  vol.  34  (18)  pp.  2811-­‐2813  (4)  Diode  pumped  diamond  Raman  microchip  laser,  Demidovich,  et  al.,    Conference  on  Lasers  and  Electro-­‐Optics  (CLEO)  Europe,  2005,  p.  251  

J.  Michael  Pinneo,  [email protected]  

Page 32: Lockheed Martin diamond presentation

Diamond  for  Hypersonic  Flight  

! Challenge:  extreme  aeroheating  of  vehicle  and  control  surfaces  during  endoatmospheric  flight  (≥  2,500°C)  !  Constrains  thermal  solutions  to  ablative  materials  !  Ablatives  can  substantially  depart  from  nominal  aerosurface  design  during  flight  

!  Impact  on  vehicles:  !  Increased  control  authority  required  !  Increased  total  divert  energy  needed  !  Increases  vehicle  weight/size,  reduces  range  !  Introduces  weather  (rain,  dust)  as  launch  limitation  

! Resolution:  robust,  nonablative  thermal  coating  

J.  Michael  Pinneo,  [email protected]   32  

Page 33: Lockheed Martin diamond presentation

Diamond  for  Hypersonic  Flight  ! Critical  info:  diamond  does  not  bulk  graphitize  at  T  >  2,200°C  for  hours  

!  Suggests:    Anti-­‐oxidation  coating  +  thick  diamond  film  could  be  useful  as  a  robust,  nonablative  material  for  some  hypersonic  endoatmospheric  missions.  ! Oxidation  barrier:    Re/Ir  –  affordable  because  <  10µm  !  Low  diamond  TCE  –  helps  maintain  antioxidation  coating  integrity  

! Diamond  hardness/modulus  –  better  resistance  to  particle  erosion  (rain,  dust)  than  ablatives  

J.  Michael  Pinneo,  [email protected]   33  

Page 34: Lockheed Martin diamond presentation

The  End  

34  J.  Michael  Pinneo,  [email protected]  


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