doping-type dependence of damage in si diodes exposed to x-ray, proton, and he + irradiation
DESCRIPTION
MURI Meeting - June 2007. Doping-type Dependence of Damage in Si Diodes Exposed to X-ray, Proton, and He + Irradiation. M. Caussanel 1 , A. Canals 2 , S. K. Dixit 3 , M. J. Beck 4 , A. D. Touboul 5 , R. D. Schrimpf 6 , D. M. Fleetwood 6 , and S. T. Pantelides 4. - PowerPoint PPT PresentationTRANSCRIPT
Doping-type Dependence of Damage in Si Diodes Exposed to X-ray, Proton, and He+
Irradiation
MURI Meeting - June 2007
M. Caussanel1, A. Canals2, S. K. Dixit3, M. J. Beck4, A. D. Touboul5, R. D. Schrimpf6, D. M. Fleetwood6, and
S. T. Pantelides41 - LP2A, Université de Perpignan Via Domitia, Perpignan, 66860, FRANCE 2 - TRAD, Labege, 31674, FRANCE 3 - Interdisciplinary Materials Science Program, Vanderbilt University, Nashville, TN 37235, USA 4 - Department of Physics and Astronomy, Vanderbilt University, Nashville, TN 37235, USA 5 - LAIN-UMR CNRS 5011, Université Montpellier II, F-34095 Montpellier cedex 5, FRANCE 6 - Department of Electrical Engineering and Computer Science, Vanderbilt University, Nashville, TN, 37235, USA
Work supported by the AFOSR MURI Program
Outline- Context- Samples & Experimental Set-up- Results and Discussion on - Lifetime measurements - I-V Characteristics- Summary
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Context: For more than 40 years n-Si ≠ p-Si under radiation (1/2)- 1962 & 1988: disparities after electron irradiation
from very low energy (a few 100 keV [1]) to high energy
[2]
1. H. Flicker et al., Phys. Rev., 128, p. 2557 (1962)
2. C. J. Dale et al., IEEE Trans. Nucl. Sci., 35, p. 1208 (1988)
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Context: For more than 40 years n-Si ≠ p-Si under radiation (2/2)
- n-Si/p-Si difference ∝ fraction of damage due to low-energy PKA [4]
3. G. P. Summers et al., IEEE Trans. Nucl. Sci., 40, p. 1372 (1993)
- 1993 [3]: for NIEL<1 keV cm2/g• in n-Si: Damage Coefficient ∝ NIEL• in p-Si: Damage Coefficient ∝ NIEL21974
1965
1990
4. J. R. Srour et al., IEEE Trans. Nucl. Sci., 50, p. 653 (2003)
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Experimental Description
Radiation Sample Type
Characterization
Type Dose/Fluence
Measurements Method
X-raysUp to 500 krad (SiO2) by steps
n+/p junctions (NA= 4×1016
cm-3 )
I-V Parameter Analyzer
1.8 MeV H+ From
5.5×1010
to 1013 cm-3
p+/n junctions
(ND= 2.7×1015 cm-3
)
Minority
carrier
lifetime
Open-Circuit Voltage Decay method (OCVD)
1.4 MeV He+
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Sample Structure - Top View(Sandia TA 629TDC)
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Sample Structure - Cross-Section
G1916A/W33 – includes 1100 C N2 Post gate anneal before poly-Si
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Sample Structure - Ion range
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Minority Carrier Lifetime Measurement Set-up
0.5
0.4
0.3
0.2
0.1
0.0
Volt
age (
V)
43210Time x10-3 (s)
p+/n Pre-irradiation 1012 H+/cm2
1013 H+/cm2
Method based on the Open-Circuit Voltage Decay method (OCVD)
Lifetime value is extracted from the linear part of the curve:
kTqdVdt
Vg removed
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Reliability of the OCVD method:Measured lifetime checked with literature data
Hole lifetime in n-Si (may be reduced by High-T post-ox anneal)
Source: IOFFE Institute
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Reliability of the OCVD method:Measured lifetime checked with literature data
Electron lifetime p-Si
Source: IOFFE Institute
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I-V Characteristics under X-ray Radiation
Evidence that carrier trapping occurs at certain surfaces within the sample.
➙ This sensitivity of the surface regions of these diodes to defect buildup is consistent with recent results obtained on VDMOSFETs [6]
6. J. A. Felix et al., IEEE Trans. Nucl. Sci., 52, p. 2378 (2005)
10-1
100
101
102
103
104
105
Post
/Pre
-irra
diat
ion
I-V ra
tio
1.21.00.80.60.40.20.0Bias (V)
010 krad 050 krad 100 krad 500 krad
Increasingdose
Series Resistance RegionIdeal Diode Region
p+/n
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0.5
0.4
0.3
0.2
0.1
0.0
Volta
ge (V
)
3210-1Time x10-3
(s)
Pre-irradiation 010 krad(SiO2) 050 krad(SiO2) 100 krad(SiO2) 500 krad(SiO2)
NB: Arrows indicate increasing doses.
n+/p p+/n
X-ray Irradiation Impact on the Voltage Drop across the Junction during Lifetime Measurement
The voltage drop across the sample is reduced after the X-ray irradiation :- the higher the dose, the higher the reduction.- n+/p reduction > p+/n reduction.
➙ Also evidence of trapped charge at a SiO2/Si interface
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Ion Irradiation Impact on the Voltage Drop across the Junction during Lifetime Measurement
-0.20
-0.15
-0.10
-0.05
0.00
Volta
ge D
rop
Redu
ctio
n (V)
1010 1011 1012 1013 1014
Fluence (H+/cm -2)
n+/p junction p+/n junction
- Like X-rays, ion irradiation lowers the closed-circuit voltage drop across the sample.
➙ trapped charge within bulk- p+/n reduction > n+/p reduction
➙ this trend is opposite to X-ray radiationConsistent with recent theoretical work [5], which demonstrated that Frenkel pairs are generally more stable in p-Si than in n-Si.(Frenkel pairs act as electron trap in n-Si)
5. M. J. Beck et al., IEEE Trans. Nucl. Sci., 53, p.
3621 (2006)
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Ion Irradiation Impact on Bulk Lifetime
Electron lifetime in p gets reduced more by both H+ & He+ irradiations than hole lifetime in n by a 2-3× factor
This is despite the n doping being ~ 13x lower than the p doping
-100
-80
-60
-40
-20
0
Lifet
ime
Redu
ctio
n %
1010 1012 1014
Fluence (He+/cm -2)
p+/n n+/p
He+ irradiation
-100
-80
-60
-40
-20
0
Lifet
ime
Redu
ctio
n %
1010 1012 1014
Fluence (H+/cm -2)
p+/n n+/p
H+ irradiation
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Summary
- Surface trapping: n+/p more sensitive than p+/n
- Bulk trapping: n+/p less sensitive than p+/n
- Agreement with recent experiments and theory
X-ray, H+ and He+ irradiation of n+/p and p+/n diodes (I-
V & lifetime measurements)