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1 Power Matters. TM Design of High Performance Power Conversion Systems for More Electric Aircrafts Presenter and Author: Shweta Sanjeev, Aviation Requirements Specialist Microsemi Corporation, Space and Power Management Group

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Page 1: Design of High Performance Power Conversion Systems for ... · 01.04.2016 · • Hydraulic Systems • Secondary Power • Classic Bleed System (Pneumatic) • Hydraulic power for

© 2016 Microsemi Corporation. Company Proprietary. 1

Power Matters.TM

Design of High Performance Power Conversion Systems for More Electric Aircrafts

Presenter and Author: Shweta Sanjeev, Aviation Requirements Specialist

Microsemi Corporation, Space and Power Management Group

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Power Matters.TM 2© 2016 Microsemi Corporation. Company Proprietary.

▪ Electrification of Aircrafts Application Based• Requirements driving the electrification of aircraft systems

• Existing work on More Electric Aircrafts (MEA) and All Electric Aircrafts (AEA)– Challenges for Power Electronics

– Benefits of Electrification

▪ Power Core Module (PCM) Product Based• Requirements driving the power system design– Electrical Features

– Mechanical Features

– Thermal Features

– Reliability Features

▪ Future Potential

Agenda

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Power Matters.TM 3© 2015 Microsemi Corporation. Company Proprietary.

WHY ?▪ Reduce maintenance costs for electric systems

▪ Saturated technology for Hydraulic andPneumatic systems

• Develop advanced technologies with electricsystems

▪ Increase in oil prices and aircraft production

• Reduce carbon emissions and environmental impact

• Aviation contributes to ~ 20% into overallemissions

▪ Improve safety and reliability with electric systems

Introduction to More Electric Aircrafts

HOW are these metrics achieved?• Removal of Hydraulic and Pneumatic

systems• Reduced system weight and fuel consumption• Ease of maintenance and higher reliability• Reduced Costs

• Increase in electrical content• Example: up to 1 MW (B787)• Focus on Power Electronics

• Desirable characteristics of Electrical systems

• Controllability and Re-configurability• Advanced diagnostics and prognostics• More intelligent maintenance

What are MEA’s ?▪ Aircrafts with partially electrified sub systems

• Primarily Pneumatic systems

• Military applications are focused on electrification of hydraulic systems

▪ Examples: A380, B787

▪ In AEA’s, all subsystems are electrified

• Hydraulic and Pneumatic Systems

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Power Matters.TM 4© 2015 Microsemi Corporation. Company Proprietary.

Electrification of Aircraft Subsystems

CONVENTIONAL AIRCRAFT• Propulsive Power Generation

• Fixed Frequency, 400 Hz

• Power Distribution

• 115V AC

• 28V DC

• Actuation

• Hydraulic Systems

• Secondary Power

• Classic Bleed System (Pneumatic)

• Hydraulic power for secondary systems

MEA Progress• Propulsive Power Generation

• Variable Frequency 300-800Hz

• Power Distribution

• 115V AC & 230V AC

• +/- 270V DC

• 28V DC

• Actuation

• Primary Hydraulic Systems

• Electric Back-up Systems

• Secondary Power

• Bleedless System

• Bi-Directional System

MEA towards AEA• Power Generation

• Higher Density, Full Electric

• Power Distribution

• Intelligent Management Systems

• Increased Energy Density

• Actuation

• Full Electric

• Secondary Power

• Increased Energy Density

Production

Ramp

Page 5: Design of High Performance Power Conversion Systems for ... · 01.04.2016 · • Hydraulic Systems • Secondary Power • Classic Bleed System (Pneumatic) • Hydraulic power for

Power Matters.TM 5© 2015 Microsemi Corporation. Company Proprietary.

• Interaction between multiple integrated drive systems

• Centralized versus De-centralized control systems

• Increasing Functionality driven by decreasing Footprint

• Thermal Management driven by

• Higher power densities in smaller packages

• Higher switching frequencies

• Partial Discharge at higher voltages (± 270 VDC)

• Single Event Upsets (Incoming neutron radiation)

• High Dv/Dt slew rates with fast switching devices such as Silicon Carbide

• DO-254 compliance for power systems embedded with intelligence for control and monitoring

Challenges for Power Electronics

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Power Matters.TM 6© 2015 Microsemi Corporation. Company Proprietary.

Power Electronics in Commercial A/C Power Distribution Systems

Abdel-Fadil et al. (2013) Electrical distribution power systems of modern civil aircrafts, 2nd International Conference on Energy Systems and Technologies 18 – 21 Feb. 2013, Cairo, Egypt

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Power Matters.TM 7© 2016 Microsemi Corporation. Company Proprietary.

Requirements Scope

• Three Phase Inverter Design: SiC MOSFET/Si IGBT

• Data Acquisition and Communication b/w modules

• Modeling, Simulation and Control Algorithm Development

• Real-time development system for verification and validation of mission models

• Safety and Protection Features

• Perform trade-off studies, Stress analysis, FMEA, MTBF analysis for reliability

• Power Supply and filter Design

Electrical

• System integration to next level assembly

• Housing / Packaging Design

• Perform Mechanical Stress Analysis

• Comply with form and fit requirements such as space envelope and weight.

• Comply with environmental conditions such as pressure, altitude and vibration

Mechanical

• Design for effective thermal performance to improve reliability

• Validate thermal mission models such as cold start analysis, worst case analysis

Thermal

Certification• Requirements Traceability• DO-254 Certification of hardware design

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Power Matters.TM 8© 2015 Microsemi Corporation. Company Proprietary.

HIL testing to emulate COM/ MON

Intelligent Power System Architecture

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Power Matters.TM 9© 2016 Microsemi Corporation. Company Proprietary.

Power Core ModuleSiC MOSFET based Three Phase Inverter

• HVDC Input = 540 VDC

• Current/Phase = 20 A peak

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Power Matters.TM 10© 2016 Microsemi Corporation. Company Proprietary.

Portfolio for Power Core Module

▪ Key Characteristics

• SiC Power MOSFETs rated upto 40A, 1200 V for three phase inverter

• Standard Power Rating: 5 kVA , Nominal DC Bus Voltage = 540 VDC

• Operational temperature range: -55 ⁰C to 110 ⁰C

• Minimum switching frequency: 10 kHz

• Comply with mechanical and environmental requirements as per DO-160 E

• Hardware Compliance Standard: DO-254 DAL A

• Isolated and highly thermally conductive substrate with Aluminum wire bonding

• AlSiC Baseplate for higher thermal conductivity

• Speedgoat interface to validate the mission profiles using Hardware-in-the-Loop approach.

• Efficient circuit layout practices to minimize parasitics and optimize space.

• Reliability tests: FIDES analysis with HALT and HASS.

• The PCM comprises of two sub-systems:

– HPD: Three half bridges embedded in the substrate with integrated Driver PWA

– Controller PWA: comprising of A/Ds and FPGA circuits.

• Current design uses SiC power MOSFETs to ensure maximum efficiency.

• Scalable power module design from 5 kVA upto 100 kVA

• Optimized for actuator applications

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Power Matters.TM 11© 2016 Microsemi Corporation. Company Proprietary.

▪ Silicon Carbide is a wide bandgap device • Increased Efficiency– Low Rds on

– Lower switching loss compared to IGBT (specially at higher switching frequencies)– However SiC’s conduction loss dominates at higher load currents

• Lesser Thermal Challenge compared to IGBT– Lighter Cooling Systems

– Weight benefit

• Ideal for higher switching frequency applications > 10 kHz– Dv/Dt is a challenge and requires higher isolation by design

• Supports High Temperature Operation

Establishing Reliability with SiC is key to adopting this technology for MEA’s and AEA’s.

Why is SiC key to MEA?

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Power Matters.TM 12© 2016 Microsemi Corporation. Company Proprietary.

Analysis of IGBT vs. SiC

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Power Matters.TM 13© 2016 Microsemi Corporation. Company Proprietary.

▪ The Partial Discharge starts within voids, inclusions in the substrates or “bubbles” in the case of dielectric silicone gel. If the voltage stress across the bubbles is increased above the corona inception voltage (CIV) for the gas within the bubbles or the voids, then PD activity will start.

▪ So the partial discharge test objective is to detect and reject this sort of defects which gradually could results into the failure of electrical Insulation.

▪ Acceptance limits : the limits

commonly used are 10pC for

a component and 50pC for a system

as mentioned into the standards

EN 61287-1-2013-07 and CEI 60270

What is Partial Discharge?

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Power Matters.TM 14© 2016 Microsemi Corporation. Company Proprietary.

Partial Discharge Test Procedure

DIELECTRIC STRENGTH TEST :TOPOGRAPHICAL REFERENCE:

PORTE POINTE:PDT346B PROGRAMME : PDTM2

SUPPORT : MJ2093A

POTENCE : BT303-02

N° BT : LAB400

ELECTRICAL DIAGRAM: (or equivalent equipment)

TEST PARAMETERS :

Test Voltage

(Vrms,50Hz)

Partial discharge

Measurement2000V

1500V

10s 1mn 10s 30s 30s 10s

<10pC >1500V

NOTE: ALL CONNECTORS (POWER AND SIGNALS) MUST BE CONNECTED TOGETHER

VOLTAGE IS APPLIED BETWEEN ALL THE CONNECTORS AND THE BASE PLATE

This document is Microsemi® property; do not reproduce or transmit without Microsemi® approval / Ce document est la propriété de Microsemi®; ne pas dupliquer ou transmette sans l’autorisation de Microsemi®

Fait par :LR Date : Page : 1 of 1

Ext. 99 Doc. AS9666X Ed. 01CMMIMR120XM45CNMG-AS

April-01-2016

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Power Matters.TM 15© 2016 Microsemi Corporation. Company Proprietary.

▪ Analysis at -55°C, 20°C and 110°C

▪ Cold-start Analysis

▪ Heat Transfer Analysis

▪ Power Substrate Properties

▪ ‘Blocked Rotor’ Analysis

Thermal Modelling & Analysis

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Power Matters.TM 16© 2016 Microsemi Corporation. Company Proprietary.

Reliability: FIDES results

Non-Pressurized mission profile Pressurized mission profile

FIT

FIT

(Calendar

Hour)

MTBF (FH) FIT

FIT

(Calendar

Hour)

MTBF (FH)

CONTROL

PWA 376.8 1330.9 751,375 126.5 446.9 2,237,617

DRIVER PWA 332.0 1172.5 852,891 124.4 439.3 2,276,479

SUBSTRATE 243.8 861.1 1,161,303 184.4 651.3 1,535,389

TOTAL HPD

(Driver +

Substrate)

491,743 916,947

TOTAL PCM 297,223 650,415

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Power Matters.TM 17© 2016 Microsemi Corporation. Company Proprietary.

Contribution by Component to FITs

Non-Pressurised Mission Profile Pressurised Mission Profile

Reliability: FIDES results Contribution

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Power Matters.TM 18© 2016 Microsemi Corporation. Company Proprietary.

Key Benefits Goals for System Design

▪ Intelligent Hardware Testing using Speedgoat• To test communication bus from COM/MON to PCM with flexibility to implement various bus protocols

• To verify and validate the accuracy of telemetries such as current and voltage measurements

• To simulate faults in the system and study system response

▪ System level semiconductor comparison studies• Silicon Carbide versus IGBT based on system requirements such as power level, space envelope, cooling techniques, reliability

and cost

– Efficiency

– Power Density

– Switching Frequency and PWM topologies

– Gate Drive methods

▪ Can address other parts of aircraft power distribution system• Active Rectification

• Higher power topologies – Current goal: 5 kVA to 20 kVA

• Variations on Standard PCM topology – eg Regen Control, Inrush Control

• Custom solutions for power generation and distribution applications

▪ Requirements Traceability for V&V and certification• DOORS traceability for requirements to link with Mission models (Simulink) and Modelling Software (Simulink/Speedgoat)

• HDL code generation for models with effective partitioning and code coverage

• V&V models developed for DO-254 certification standard

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Power Matters.TM 19© 2016 Microsemi Corporation. Company Proprietary.

▪ Active Rectifiers for DC to AC power conversion• Variable Frequency

• Regulated Output Voltage

• Lighter due to active power conversion

– Existing Auto Transformer Rectifier Units (ATRU) use passive transformertechnology

– ATRU is preferred due to reliability and stability

• Challenge is to establish reliability and ensure stability of the power network

– Scope for advanced development

▪ Bidirectional power conversions AC DC

▪ High Temperature Power Conversion• On Engine Applications

▪ Active filtering topologies

Potential for Power Electronics in MEA’s

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Power Matters.TM 20© 2016 Microsemi Corporation. Company Proprietary.